Multilayer Ceramic Chip Capacitors Kyocera's series of Multilayer Ceramic Chip Capacitors are designed to meet a wide variety of needs. We offer a complete range of products for both general and specialized applications, including CM series for generalpurpose, CT series for low profile, CA series for arrays, CL series for ICs, CF series for high-voltage, and DM series for automotive. Features * We have factories worldwide in order to supply our global customer bases quickly and efficiently and to maintain our reputation as one of the highest-volume producers in the industry. * All our products are highly reliable due to their monolithic structure of high-purity and superfine uniform ceramics and their integral internal electrodes. * By combining superior manufacturing technology and materials with high dielectric constants, we produce extremely compact components with exceptional specifications. * Our stringent quality control in every phase of production from material procurement to shipping ensures consistent manufacturing and super quality. * Kyocera components are available in a wide choice of dimensions, temperature characteristics, rated voltages, and terminations to meet specific configurational requirements. RoHS Compliant DM CM series Automotive CF series High-Voltage series General Multilayer Ceramic Chip Capacitors CL CT series Low Profile CA series ICs series Arrays Structure External Termination Electrodes Internal Electrodes (Pd, Pd/ Ag or Ni) Dielectric Ceramic Layer Temperature compensation: Titanate family Zirconate family High dielectric constant: Barium Titanate family Tape and Reel Nickel Barrier Termination Products Ag or Cu or CuNi Ni Plating Sn or Au Plating Bulk Case Please contact your local AVX, Kyocera sales office or distributor for specifications not covered in this catalog. Our products are continually being improved. As a result, the capacitance range of each series is subject to change without notice. Please contact an sales representative to confirm compatibility with your application. Multilayer Ceramic Chip Capacitors Kyocera Ceramic Chip Capacitors are available for different applications as classified below: Series Dielectric Options Typical Applications Features Terminations Available Size CM C0G (NP0) X5R X7R X6S X7S Y5V General purpose Wide cap range Nickel barrier 01005, 0201, 0402 0603, 0805, 1206 1210, 1812 CT X5R X7R Y5V IC card (Decoupling) Low profile Nickel barrier 0201, 0402, 0603 0805, 1206, 1210 CA C0G (NP0) X5R, X7R Digital signal Pass line Reduction in placing cost Nickel barrier 0405, 0508 CL X7S ICs (Decoupling) Low inductance Nickel barrier 0204, 0306 CF C0G (NP0) X7R High voltage & Power circuits High voltage 250VDC, 630VDC 1000VDC, 2000VDC 3000VDC, 4000VDC Nickel barrier 0805, 1206, 1210 1812, 2208, 1808 2220 DM X7R Automotive Thermal shock Resistivity High reliability Nickel barrier 0603,0805,1206 Option Negative temperature coefficient dielectric types are available on request. Multilayer Ceramic Chip Capacitors Dimensions , 7 4 0 00 0 Dimensions and Packaging Quantities Size 02 JIS Code EIA 0402 01005 Dimension Code L W A 0.40.02 0.20.02 0.60.03 0.30.03 A 03 0603 0201 05 1005 0.60.05 0.30.05 1.00.05 0.50.05 0.50.05 D 0.35 max. 1.00.10 0603 1.00.15 0.50.15 21 316 2012 3216 0805 1206 32 3225 1210 42 4520 1808 43 4532 1812 52 5720 2208 55 5750 2220 0.20 0.20 0.13 0.23 0.19 0.15 0.35 0.30 0.20 0.60 0.50 0.20 0.75 0.70 0.30 0.85 1.40 0.30 1.00 1.40 0.15 0.85 2.60 0.30 1.10 2.00 0.15 0.85 4.20 0.30 1.40 2.50 0.50.15 0.55 max. 1.60.10 0.80.10 1.60.15 0.80.15 0.80.10 0.55 max. D E 0.10 0.50.10 C A B C D E F G H J K L M A B C D E F G H J A B C D E F G A B A B C D E F A A B C 0.13 0.50.10 A 1608 0.14 0.35 max. C B 0.07 0.25 max. E 105 0.30.05 0402 F P to P min. 0.30.03 A B 0.20.02 P max. 0.22 max. B C Dimensions (mm) T P min. 0.80.15 1.60.2 2.00.10 0.80.2 1.250.10 2.00.15 1.250.15 2.00.20 1.250.20 3.20.20 1.60.15 3.20.20 1.60.20 3.20.20 2.50.20 4.50.20 2.00.20 4.50.30 3.20.20 5.70.40 2.00.20 5.70.40 5.00.40 Note: Taping denotes the quantity packaged per reel (kp means 1000 pieces). 0.55 max. 0.55 max. 0.95 max. 1.00 max. 0.60.10 0.850.10 1.050.10 1.250.10 0.55 max. 0.95 max. 1.250.15 0.95 max. 1.250.20 0.850.10 0.95 max. 1.00 max. 1.150.10 1.250.10 1.60.15 0.95 max. 1.00 max. 1.60.20 1.00 max. 1.40 max. 1.60 max. 1.60.15 2.20 max. 2.00.2 2.50.2 1.6 max. 2.2 max. 2.0 max. 2.00.2 2.5 max. 2.50.2 2.8 max. 2.80.2 2.2 max. 2.0 max. 2.5 max. 2.8 max. Maximum quantity per reel 180 Reel 330 Reel - 40kp (P8/1) 20kp (P8/2) 50kp (P8/2) - 35kp (P8/1) 15kp (P8/2) 50kp (P8/2) - 35kp (P8/1) 15kp (P8/2) 50kp (P8/2) - 35kp (P8/1) 15kp (P8/2) 50kp (P8/2) - 30kp (P8/1) 10kp (P8/2) 50kp (P8/2) - 30kp (P8/1) 10kp (P8/2) 50kp (P8/2) - 30kp (P8/1) 10kp (P8/2) 50kp (P8/2) - 30kp (P8/1) 10kp (P8/2) 50kp (P8/2) - 30kp (P8/1) 10kp (P8/2) 50kp (P8/2) - 30kp (P8/1) 10kp (P8/2) 50kp (P8/2) 4kp (P8/4) 10kp (P8/4) 8kp (P8/2) 20kp (P8/2) 4kp (P8/4) 10kp (P8/4) 8kp (P8/2) 20kp (P8/2) 4kp (P8/4) 10kp (P8/4) 8kp (P8/2) 20kp (P8/2) 4kp (P8/4) 10kp (P8/4) 8kp (P8/2) 20kp (P8/2) 4kp (P8/4) 10kp (P8/4) 4kp (P8/4) 10kp (P8/4) 4kp (P8/4) 10kp (P8/4) 4kp (E8/4) 10kp (E8/4) 4kp (P8/4) 10kp (P8/4) 4kp (P8/4) 10kp (P8/4) 3kp (E8/4) 10kp (E8/4) 3kp (E8/4) 10kp (E8/4) 4kp (P8/4) 10kp (P8/4) 4kp (P8/4) 10kp (P8/4) 3kp (E8/4) 10kp (E8/4) 4kp (P8/4) 10kp (P8/4) 3kp (E8/4) 10kp (E8/4) 4kp (P8/4) 10kp (P8/4) 4kp (P8/4) 10kp (P8/4) 4kp (E8/4) 10kp (E8/4) 3kp (E8/4) 10kp (E8/4) 3kp (E8/4) 10kp (E8/4) 2.5kp (E8/4) 5kp (E8/4) 4kp (P8/4) 10kp (P8/4) 4kp (E8/4) 10kp (E8/4) 2.5kp (E8/4) 5kp (E8/4) 4kp (E8/4) 10kp (E8/4) 3kp (E8/4) 10kp (E8/4) 2.5kp (E8/4) 5kp (E8/4) 2.5kp (E8/4) 5kp (E8/4) 2kp (E8/4) 5kp (E8/4) 2kp (E8/4) 5kp (E8/4) 1kp (E8/4) 4kp (E8/4) - 2kp (E12/4) - 2kp (E12/4) - 1kp (E12/4) - 1kp (E12/4) - 0.5kp (E12/4) - 0.5kp (E12/4) - 0.5kp (E12/4) - 0.5kp (E12/4) - 2kp (12/4) - 1kp (E12/4) - 0.5kp (E12/4) - 0.5kp (E12/4) Multilayer Ceramic Chip Capacitors Ordering Information KYOCERA PART NUMBER CM 21 X7R 104 SERIES CODE = = = CM CT CA General Purpose Low Profile Arrays CL CF DM = = = ICs High Voltage Automotive SIZE CODE SIZE 02 = 03 = 05 = 105 = 21 = 316 = EIA (JIS) 01005 (0402) 0201 (0603) 0402 (1005) 0603 (1608) 0805 (2012) 1206 (3216) SIZE 32 = 42 = 43 = 52 = 55 = EIA (JIS) 1210 (3225) 1808 (4520) 1812 (4532) 2208 (5720) 2220 (5750) SIZE EIA (JIS) D11 = 0405 (1014)/ 2 cap F12 = 0508 (1220)/ 4 cap DIELECTRIC CODE CODE EIA CODE CG = C0G (NPO) X7S = X7S (Option) X5R = X5R X6S = X6S (Option) X7R = X7R Y5V = Y5V Negative temperature coefficient dielectric types are available on request. CAPACITANCE CODE Capacitance expressed in pF. Two significant digits plus number of zeros. For Values < 10pF, Letter R denotes decimal point, = 1R5 eg. 100000pF = 104 1.5pF = 104 = R50 0.1F 0.5pF = 107 4700pF = 472 100F TOLERANCE CODE A = 0.05pF (option) B = 0.1pF C = 0.25pF D = 0.5pF F = 1pF G = 2% (option) J = 5% K = 10% M = 20% Z = -20 to +80% VOLTAGE CODE 04 06 10 16 25 35 50 = = = = = = = 4VDC 6.3VDC 10VDC 16VDC 25VDC 35VDC 50VDC 100 250 400 630 = = = = 100VDC 250VDC 400VDC 630VDC 1000 2000 3000 4000 = = = = 1000VDC 2000VDC 3000VDC 4000VDC TERMINATION CODE A = Nickel Barrier/ Tin K = Nickel Barrier/ Au PACKAGING CODE B C T Q = = = = Bulk Bulk Cassette (option) 7" Reel Taping & 4mm Cavity pitch 7" Reel Taping & 1mm Cavity pitch OPTION Thickness max. value is indicated in CT series EX. 125 1.25mm max. 095 0.95mm max. L = 13" Reel Taping & 4mm Cavity pitch H = 7" Reel Taping & 2mm Cavity pitch N = 13" Reel Taping & 2mm Cavity pitch K 50 A T Multilayer Ceramic Chip Capacitors Temperature Characteristics and Tolerance Temperature Compensation Type Dielectric Value (pF) C0G (NPO) 0 ppm/ C 0.5 to 2.7 CK U (N750) SL -750 ppm/ C +350 to -1000ppm/ C UK SL 3.0 to 3.9 CJ UJ SL 4.0 to 9.0 CH UJ SL 10 CG UJ SL K = 250ppm/ C, J = 120ppm/ C, H = 60ppm/ C, G = 30ppm/ C e.g. CG = 030ppm/ C Note: All parts of C0G will be marked as "CG" but will conform to the above table. High Dielectric Constant Type EIA Dielectric Temperature Range X5R -55 to 85C X7R X7S -55 to 125C X6S -55 to 105C Y5V -30 to 85C -55 to 125C C max. 15% 22% -82 to +22% option Available Tolerances E Standard Number Dielectric materials, capacitance values and tolerances are available in the following combinations only: EIA Dielectric Tolerance E3 Capacitance E6 1 <10pF <0.5pF B=0.1pF 5pF J=5% K=10% 3 X6S 3 X7S X5R X7R Y5V 2 K=10% M=20% Z=-20% to +80% 1.0 1.1 1.2 1.2 1.3 1.5 1.5 1.6 1.8 1.8 2.0 2.2 2.2 2.4 2.7 2.7 3.0 3.3 3.3 3.6 3.9 3.9 4.3 4.7 4.7 5.1 5.6 5.6 6.2 6.8 6.8 7.5 8.2 8.2 9.1 1.5 3 A=0.05pF 3 G=2% 1.0 1.0 F=1pF C0G E24 (Option) 1.0 C=0.25pF D=0.50pF E12 10pF 2.2 2.2 E12 Series 3.3 4 E3 Series 4.7 E3 Series Note: 1 Nominal values below 10pF are available in the standard values of 0.5pF, 1.0pF, 1.5pF, 2.0pF, 3.0pF, 4.0pF, 5.0pF, 6.0pF, 7.0pF, 8.0pF, 9.0pF 2 J = 5% for X7R (X5R) is available on request. 3 option 4 E6 series is available on request. 4.7 6.8 CM Series [RoHS Compliant Products] Features Applications We offer a diverse product line ranging from ultra-compact (0.4x0.2mm) to large (4.5x3.2mm) components configured for a variety of temperature characteristics, rated voltages, and packages. We offer the choice and flexibility for almost any applications. This standard type is ideal for use in a wide range of applications, from commercial to industrial equipment. Temperature Compensation Dielectric Size (EIA Code) Temperature CM02 (01005) C1 Rated Voltage (VDC) Capacitance (pF) R20 R50 1R0 1R5 100 120 101 121 102 122 103 123 * 0.2 0.5 1.0 1.5 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10000 12000 15000 18000 16 CM03 (0201) U2 C1 25 50 16 25 SL C1 CM05 (0402) U2 25 50 50 50 C C 50 100 CM21 (0805) C1 16 25 50 100 B A B B B B B C D B D E E G G E24 sereis is available on request. Optional Spec. 1: CG,CH,CJ,CK 2: UJ,UK Alphabets in capacitance chart denote dimensions. Please refer to the below table for detail. (Example) In case of "B" for CM03; L : 0.60.03mm W : 0.30.03mm T : 0.30.03mm SL CM105 (0603) C1 Dimension (mm) Size Size Code L W T 02 A 0.40.02 0.20.02 0.20.02 03 B 0.60.03 0.30.03 0.30.03 05 C 1.00.05 0.50.05 0.50.05 B 1.60.10 0.80.10 105 21 0.80.10 D 0.60.10 E 2.00.10 1.250.10 0.850.10 G 1.250.10 CM Series [RoHS Compliant Products] X5R Dielectric Size (EIA Code) Rated Voltage (VDC) Capacitance (pF) 101 151 102 152 103 153 104 105 106 107 100 150 220 330 470 680 1000 1500 2200 3300 4700 6800 10000 15000 22000 33000 47000 68000 100000 220000 470000 1000000 2200000 4700000 10000000 22000000 47000000 100000000 CM02 (01005) 6.3 10 105 106 107 220000 470000 1000000 2200000 4700000 10000000 22000000 47000000 100000000 6.3 10 CM05 (0402) 16 25 4 6.3 10 16 CM105 (0603) 25 50 6.3 10 16 CM21 (0805) 25 50 4 6.3 10 16 25 50 B3 A8 C1 B3 A8 B4 C3 D1 E1 B1 C3 B7 B3 G1 C8 E8 F9 C5 C8 C7 C8 C8 G3 B3 B4 B8 D8 B5 C8 D5 D8 D8 G8 G3 B8 G5 M5 G4 M8 K8 M8 M8 M7 Size (EIA Code) Rated Voltage (VDC) Capacitance (pF) CM03 (0201) CM316 (1206) 6.3 10 16 CM32 (1210) 25 50 4 6.3 10 16 E6 series is standard. E3 series is standard for the size 316 and larger. * E12 series is available on request. Optional Spec. * CM43 (1812) 25 50 B3 B1 F1 6.3 * 50 D1 D3 F3 F5 J5 F4 J8 F3 J8 J8 G5 F4 G4 C3 F3 G3 G3 G8 D1 G5 F5 Two digits alphanumerics in capacitance chart denote dimensions and tan . Please refer to the below table for detail. (Example) In case of "B2" for CM03; L : 0.60.03mm W : 0.30.03mm T : 0.30.03mm Tan : 3.5% max. Dimension (mm) Size Size Code L W T 02 A 0.40.02 0.20.02 0.20.02 03 05 105 21 Size 316 Dimension (mm) Tan Code Tan 1.60.15 1.150.10 1 2.5% max. 3.20.20 1.60.15 1.60.15 2 3.5% max. 3.20.20 1.60.20 1.60.20 3 5.0% max. Size Code L D 3.20.20 F J W T B 0.60.03 0.30.03 0.30.03 C 0.60.05 0.30.05 0.30.05 C 1.00.05 0.50.05 0.50.05 B 3.20.20 2.50.20 1.40 max. 4 7.0% max. E 1.00.10 0.50.10 0.50.10 C 3.20.20 2.50.20 1.60 max. 5 7.5% max. F 1.00.15 0.50.15 0.50.15 F 3.20.20 2.50.20 2.00.2 7 10.0% max. 32 B 1.60.10 0.80.10 0.80.10 G 3.20.20 2.50.20 2.50.2 8 12.5% max. D 1.60.15 0.80.15 0.80.15 D 4.50.30 3.20.20 2.50.2 9 20.0% max. D 2.00.10 1.250.10 0.60.10 F 4.50.30 3.20.20 2.80.2 E 2.00.10 1.250.10 0.850.10 G 2.00.10 1.250.10 1.250.10 K 2.00.15 1.250.15 1.250.15 M 2.00.20 1.250.20 1.250.20 43 CM Series [RoHS Compliant Products] X7R Dielectric Size CM02 (EIA Code) (01005) Rated Voltage (VDC) Capacitance (pF) 101 151 102 152 103 153 104 105 106 100 150 220 330 470 680 1000 1500 2200 3300 4700 6800 10000 15000 22000 33000 47000 68000 100000 220000 470000 1000000 2200000 4700000 10000000 22000000 10 CM03 (0201) 10 16 104 105 106 47000 100000 220000 470000 1000000 2200000 4700000 10000000 22000000 25 16 25 CM105 (0603) 50 6.3 10 16 25 CM21 (0805) 50 100 6.3 10 16 25 50 100 B2 B2 A8 C1 B3 B1 C2 D1 E1 C2 D1 E1 B1 B2 C8 C8 B2 G1 B3 G2 G2 D8 B8 B8 G3 D8 M8 M8 Size (EIA Code) Rated Voltage (VDC) Capacitance (pF) CM05 (0402) CM316 (1206) 6.3 10 16 D2 CM32 (1210) 25 50 100 16 J8 50 100 F1 B1 F1 B2 F2 F3 J8 25 D1 A1 D1 D2 F2 10 CM43 (1812) J8 B1 F1 G1 G2 G8 G8 J8 G8 Optional Spec. Two digits alphanumerics in capacitance chart denote dimensions and tan . Please refer to the below table for detail. (Example) In case of "B3" for CM03; L : 0.60.03mm W : 0.30.03mm T : 0.30.03mm Tan : 5.0% max. Dimension (mm) Size Size Code L W T Tan Code Tan 02 A 0.40.02 0.20.02 0.20.02 1 2.5% max. 03 B 0.60.03 0.30.03 0.30.03 2 3.5% max. 05 C 1.00.05 0.50.05 0.50.05 3 5.0% max. B 1.60.10 0.80.10 0.80.10 8 12.5% max. D 1.60.15 0.80.15 105 21 316 0.60.10 E 2.00.10 1.250.10 0.850.10 G 1.250.10 M 2.00.20 1.250.20 1.250.20 A 0.850.10 D 3.20.20 1.60.15 1.150.10 F J 1.60.15 3.20.20 1.60.20 B 32 F B D 1.60.20 1.40 max. 3.20.20 2.50.20 G 43 0.80.15 D 2.00.2 2.50.2 4.50.30 3.20.20 2.00.2 2.50.2 50 100 B1 D1 D1 G8 M8 G8 M8 G1 CM Series [RoHS Compliant Products] Y5V Dielectric Size (EIA Code) Rated Voltage (VDC) Capacitance (pF) 102 472 103 473 104 474 105 475 106 476 1000 2200 4700 10000 22000 47000 100000 220000 470000 1000000 2200000 4700000 10000000 22000000 47000000 CM03 (0201) 6.3 10 CM05 (0402) 10 16 25 CM105 (0603) 50 10 16 CM21 (0805) 25 50 10 CM316 (1206) 16 25 50 E6 D3 E3 G3 G4 E3 G3 10 CM32 (1210) 16 25 D6 D4 10 16 25 C6 C6 B8 C3 C3 B8 B3 C6 B3 C8 B4 B6 B8 G8 G9 Two digits alphanumerics in capacitance chart denote dimensions and tan . Please refer to the below table for detail. (Example) In case of "B8" for CM03; L : 0.60.03mm W : 0.30.03mm T : 0.30.03mm Tan : 12.5% max. Dimension (mm) Size Size Code L W T Tan Code Tan 03 B 0.60.03 0.30.03 0.30.03 3 5.0% max. 05 C 1.00.05 0.50.05 0.50.05 4 7.0% max. 105 B 1.60.10 0.80.10 0.80.10 6 9.0% max. D 2.00.10 1.250.10 0.60.10 8 12.5% max. E 2.00.10 1.250.10 0.850.10 9 16.0% max. G 2.00.10 1.250.10 1.250.10 D 3.20.20 1.60.15 1.150.10 21 316 32 F 3.20.20 1.60.15 C 3.20.20 2.50.20 1.60 max. 1.60.15 F 3.20.20 2.50.20 2.00.2 G6 F8 F9 F6 F8 Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test Conditions and Specifications for Temperature Compensation Type (C to U * SL Characteristics) CM/ CT/ CF/ CA Series Test Items Specifications Capacitance Value (C) Within tolerance Q C30pF : Q1000 C<30pF : Q400+20C Test Conditions Capacitance Frequency C1000pF C>1000pF Volt 1MHz10% 0.5 to 5Vrms 1kHz10% Over 10000M or 500M * F, whichever is less Measured after the rated voltage is applied for 1 minute at room ambient. For the rated voltage of over 630V, apply 500V for 1 minute at room ambient. The charge and discharge current of the capacitor must not exceed 50mA. Dielectric Resistance No problem observed Apply 3 times of the rated voltage for 1 to 5 seconds. Apply 1.5 times when the rated voltage is 250V or over. Apply 1.2 times when the rated voltage is 630V or over. The charge and discharge current of the capacitor must not exceed 50mA. Appearance No problem observed Microscope (10x magnification) Termination Strength No problem observed Apply a sideward force of 500g (5N) to a PCBmounted sample. Apply 2N for 0201, and 1N for 01005 size. Bending Strength No significant damage at 1mm bent Glass epoxy PCB: Fulcrum spacing: 90mm, duration time 10 seconds. Vibration Test Appearance No problem observed C Within Tolerance Q C30pF : Q1000 C<30pF : Q400+20C Appearance No problem observed C Within 2.5% or 0.25pF, whichever is larger Q C30pF : Q1000 C<30pF : Q400+20C IR Over 10000M or 500M * F whichever is less Insulation Resistance (IR) Soldering Heat Resistance Withstanding Resist without problem Voltage Vibration frequency: 10 to 55 (Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/ 1 minute in X, Y and Z Directions: 2 hours each, 6 hours total. Soak the sample in 260C5C solder for 100.5 seconds and place in room ambient, and measure after 242 hours. (Pre-heating conditions) Order 1 2 Temperature 80 to 100C 150 to 200C Time 2 minutes 2 minutes The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. Soaking condition Solderablity Temperature Cycle Solder coverage : 90% min. Appearance No problem observed C Within 2.5% or 0.25pF, whichever is larger Q C30pF : Q1000 C<30pF : Q400+20C IR Over 10000M or 500M * F, whichever is less Sn63 Solder Sn-3Ag-0.5Cu 2355C 2455C 20.5 sec. 30.5 sec. (Cycle) Room temperature (3min.) Lowest operation temperature (30min.) Room temperature (3min.) Highest operation temperature(30min.) After 5 cycles, measure after 242 hours. Withstanding Resist without problem Voltage Load Humidity Test (Except CF Series) Appearance No problem observed C Within 7.5% or 0.75pF, whichever is larger Q C30pF : Q200 C<30pF : Q100+10C/ 3 IR Over 500M or 25M * F, whichever is less HighAppearance Temperature C with Loading No problem observed. Within 3% or 0.3pF, whichever is larger Q C30pF : Q350 10pF<C<30pF : Q275+5C/ 2 C<10pF : Q200+10C IR Over 1000M or 50M * F, whichever is less The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. After applying rated voltage for 500+12/ -0 hours in pre-condition at 40C2C, humidity 90 to 95%RH, allow parts to stabilize for 242 hours, at room temperature before measurement. The charge and discharge current of the capacitor must not exceed 50mA for IR measurement. After applying twice the rated voltage at the temperature of 1253C for 1000+12/ -0 hours, measure the sample after 242 hours. Apply 1.5 times when the rated voltage is 250V or over. Apply 1.2 times when the rated voltage is 630V or over. The charge and discharge current of the capacitor must not exceed 50mA for IR measurement. Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test Conditions and Specifications for High Dielectric Type (X5R, X7R) CM/ CT/ CA Series Test Items Specifications Capacitance Value (C) Within tolerance Tan (%) Refer to capacitance chart Insulation Resistance (IR) Over 10000M or 500M * F, whichever is less Dielectric Resistance No problem observed Appearance No problem observed Test Conditions Measure after heat treatment Capacitance Frequency Termination Strength No problem observed Bending Strength No significant damage at 1mm bent Vibration Test Appearance C No problem observed Tan (%) Within tolerance Appearance C Tan (%) IR No problem observed Soldering Heat Resistance Within tolerance Within 7.5% Within tolerance Over 10000M or 500M * F, whichever is less Withstanding Resist without problem Voltage Solderablity Temperature Cycle Solder coverage : 90% min. Appearance C Tan (%) IR No problem observed Within 7.5% Within tolerance Over 10000M or 500M * F, whichever is less Withstanding Resist without problem Voltage Load Humidity Test HighTemperature with Loading Appearance C Tan (%) No problem observed IR Over 500M or 25M * F, whichever is less Appearance C Tan (%) No problem observed IR Over 1000M or 50M * F, whichever is less Heat Voltage Pretreatment Within 12.5% 200% max. of initial value Within 12.5% 200% max. of initial value C10F C>10F Volt 1kHz10% 1.00.2Vrms 120Hz10% 0.50.2Vrms Measured after the rated voltage is applied for 1 minute at room ambient. The charge and discharge current of the capacitor must not exceed 50mA. Apply 2.5 times of the rated voltage for 1 to 5 seconds. The charge and discharge current of the capacitor must not exceed 50mA. Microscope (10x magnification) Apply a sideward force of 500g (5N) to a PCB-mounted sample. note : 2N for 0201 size in for 01005 size. Exclude CT series with thickness of less than 0.66mm. Glass epoxy PCB: Fulcrum spacing: 90mm, duration time 10 seconds. Exclude CT series with thickness of less than 0.66mm. Take the initial value after heat treatment. Vibration frequency: 10 to 55 (Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/ 1 minute in X, Y and Z Directions: 2 hours each, 6 hours total. Take the initial value after heat treatment. Soak the sample in 260C5C solder for 100.5 seconds and place in room ambient, and measure after 242 hours. (Pre-heating conditions) Order 1 2 Temperature 80 to 100C 150 to 200C Time 2 minutes 2 minutes The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. Soaking condition Sn63 Solder Sn-3Ag-0.5Cu 2355C 2455C 20.5 sec. 30.5 sec. Take the initial value after heat treatment. (Cycle) Room temperature (3min.) Lowest operation temperature (30min.) Room temperature (3min.) Highest operation temperature(30min.) After 5 cycles, measure after 242 hours. The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. Take the initial value after voltage treatment. After applying rated voltage for 500+12/ -0 hours in pre-condition at 40C2C, humidity 90 to 95%RH, allow parts to stabilize for 242 hours, at room temperature before measurement. The charge and discharge current of the capacitor must not exceed 50mA for IR measurement. Take the initial value after voltage treatment. After applying twice the rated voltage at the highest operation temperature for 1000+12/ -0 hours, measure the sample after 242 hours. The charge and discharge current of the capacitor must not exceed 50mA for IR measurement. Apply 1.5 times when the rated voltage is 10V or less. Applied voltages for respective products are indicated in the below chart. Keep specimen at 150+0/ -10 for 1 hour, leave specimen at room ambient for 242 hours. Apply the same test condition for 1 hour, then leave the specimen at room ambient for 242 hours. High-temperature with Loading Applied Voltage (Rated Voltage x ) Applied Voltage Rated Voltage x1.3 6.3V 16V x1.5 25V 50V Products CM105X5R475, CM316X5R476 CT05X5R104, CT21X5R106 CM105X7R474-105, CM21X7R105-475, CM316X7R475-106, CM32X7R106-226, CM05X5R224, CM105X5R225, CM21X5R475-106, CM316X5R226 CT105X5R105, CT21X5R225-475, CT316X5R106 CM105X7R474, CM21X7R105-225, CM316X7R475, CM32X7R106, CM105X5R474-105, CM21X5R225-106, CM316X5R106, CM32X5R106-226 CT316X5R225-106 CM21X5R105 CT21X5R225, CT316X5R225-475 Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test Conditions and Specifications for High Dielectric Type (Y5V) CM/ CT/ CA Series Test Items Specifications Test Conditions Measure after heat treatment Capacitance Value (C) Within tolerance Tan (%) Refer to capacitance chart Insulation Resistance (IR) Over 10000M or 500M * F, whichever is less Measured after the rated voltage is applied for 1 minute at room ambient. Dielectric Resistance No problem observed Apply 2.5 times of the rated voltage for 1 to 5 seconds. The charge and discharge current of the capacitor must not exceed 50mA. Appearance No problem observed Microscope (10x magnification) Termination Strength No problem observed Apply a sideward force of 500g (5N) to a PCBmounted sample. note : 2N for 0201 size in for 01005 size. Exclude CT series with thickness of less than 0.66mm. Bending Strength No significant damage at 1mm bent Glass epoxy PCB: Fulcrum spacing: 90mm, duration time 10 seconds. Exclude CT series with thickness of less than 0.66mm. Vibration Test Appearance No problem observed C Within tolerance Tan (%) Within tolerance Appearance No problem observed C Within 20% Tan (%) Within tolerance IR Over 10000M or 500M * F, whichever is less Soldering Heat Resistance Withstanding Resist without problem Voltage Frequency Volt 1kHz10% 1.00.2Vrms Take the initial value after heat treatment. Vibration frequency: 10 to 55 (Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/ 1 minute in X, Y and Z Directions: 2 hours each, 6 hours total. Take the initial value after heat treatment. Soak the sample in 260C5C solder for 100.5 seconds and place in room ambient, and measure after 242 hours. (Pre-heating conditions) Order 1 2 Temperature 80 to 100C 150 to 200C Time 2 minutes 2 minutes The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. Soaking condition Solderablity Temperature Cycle Solder coverage : 90% min. Appearance No problem observed C Within 20% Tan (%) Within tolerance IR Over 10000M or 500M * F, whichever is less Withstanding Resist without problem Voltage Load Humidity Test HighTemperature with Loading Pretreatment Appearance No problem observed C Within 30% Tan (%) 150% max. of initial value IR Over 500M or 25M * F, whichever is less Appearance No problem observed C Within 30% Tan (%) 150% max. of initial value IR Over 1000M or 50M * F, whichever is less Heat Voltage Sn63 Solder Sn-3Ag-0.5Cu 2355C 2455C 20.5 sec. 30.5 sec. Take the initial value after heat treatment. (Cycle) Room temperature (3min.) Lowest operation temperature (30min.) Room temperature (3min.) Highest operation temperature(30min.) After 5 cycles, measure after 242 hours. The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. Take the initial value after voltage treatment. After applying rated voltage for 500+12/ -0 hours in pre-condition at 40C2C, humidity 90 to 95%RH, allow parts to stabilize for 242 hours, at room temperature before measurement. The charge and discharge current of the capacitor must not exceed 50mA for IR measurement. Take the initial value after voltage treatment. After applying twice the rated voltage at the highest operation temperature for 1000+12/ -0 hours, measure the sample after 242 hours. The charge and discharge current of the capacitor must not exceed 50mA for IR measurement. Keep specimen at 150+0/ -10 for 1 hour, leave specimen at room ambient for 242 hours. Apply the same test condition for 1 hour, then leave the specimen at room ambient for 242 hours. Multilayer Ceramic Chip Capacitors Test Conditions and Standards Test Conditions and Specifications for High Dielectric Type (X7R) CF Series Test Items Specifications Capacitance Value (C) Within tolerance Tan (%) Within 2.5% Test Conditions Measure after heat treatment Capacitance Frequency C10F 1kHz10% Volt 1.00.2Vrms Over 10000M or 500M * F, whichever is less Over 100M * F for CF316X7R104/ 250V and CF43X7R474/ 250V CF55X7R105/ 250V and CF55X7R224/ 630V Measured after the rated voltage is applied for 1 minute at room ambient. Measured after the 500V is applied for 1 minute at room ambient for the rated voltage over 630V. The charge and discharge current of the capacitor must not exceed 50mA. Dielectric Resistance No problem observed Apply 1.5 times when the rated voltage is 250V or over, apply 1.2 times when the rated voltage is 630V or over for 1 to 5 seconds. The charge and discharge current of the capacitor must not exceed 50mA. Appearance No problem observed Microscope (10x magnification) Termination Strength No problem observed Apply a sideward force of 500g (5N) to a PCB-mounted sample. Bending Strength No significant damage at 1mm bent Glass epoxy PCB: Fulcrum spacing: 90mm, duration time 10 seconds. Vibration Test Appearance No problem observed C Within tolerance Tan (%) Within tolerance Appearance No problem observed C Within 7.5% Tan (%) Within tolerance IR Over 10000M or 500M * F, whichever is less Over 100M * F for CF316X7R104/ 250V and CF43X7R474/ 250V CF55X7R105/ 250V and CF55X7R224/ 630V Insulation Resistance (IR) Soldering Heat Resistance Withstanding Resist without problem Voltage Take the initial value after heat treatment. Vibration frequency: 10 to 55 (Hz) Amplitude: 1.5mm Sweeping condition: 105510Hz/ 1 minute in X, Y and Z Directions: 2 hours each, 6 hours total. Take the initial value after heat treatment. Soak the sample in 260C5C solder for 100.5 seconds and place in room ambient, and measure after 242 hours. (Pre-heating conditions) Order 1 2 Temperature 80 to 100C 150 to 200C Time 2 minutes 2 minutes The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. Soaking condition Solderablity Temperature Cycle Solder coverage : 90% min. Appearance No problem observed C Within 7.5% Tan (%) Within tolerance IR Over 10000M or 500M * F, whichever is less Over 100M * F for CF316X7R104/ 250V and CF43X7R474/ 250V CF55X7R105/ 250V and CF55X7R224/ 630V Withstanding Resist without problem Voltage HighTemperature with Loading Pretreatment Appearance No problem observed C Within 12.5% Tan (%) 200% max. of initial value IR Over 1000M or 50M * F, whichever is less Heat Voltage Sn63 Solder Sn-3Ag-0.5Cu 2355C 2455C 20.5 sec. 30.5 sec. Take the initial value after heat treatment. (Cycle) Room temperature (3min.) Lowest operation temperature (30min.) Room temperature (3min.) Highest operation temperature(30min.) After 5 cycles, measure after 242 hours. The charge and discharge current of the capacitor must not exceed 50mA for IR and withstanding voltage measurement. Take the initial value after voltage treatment. After applying specified voltage at the highest operation temperature for 1000+12/ -0 hours, then measure the sample after 242 hours. The applied voltage shall be; 1.5 times the rated voltage when the rated voltage is 250V or over. 1.2 times when the rated voltage is 630V or over. The charge and discharge current of the capacitor must not exceed 50mA for IR measurement. Keep specimen at 150+0/ -10 for 1 hour, leave specimen at room ambient for 242 hours. Apply the same test condition for 1 hour, then leave the specimen at room ambient for 242 hours. Multilayer Ceramic Chip Capacitors Test Conditions and Standards Substrate for Electrical Tests (Unit: mm) C A B Substrate for Bending Test (Unit: mm) Size (EIA Code) a b c 02 (01005) 0.15 0.50 0.20 03 (0201) 0.26 0.92 0.32 05 (0402) 0.4 1.4 0.5 105 (0603) 1.0 3.0 1.2 21 (0805) 1.2 4.0 1.65 316 (1206) 2.2 5.0 2.0 32 (1210) 2.2 5.0 2.9 42 (1808) 3.5 7.0 3.7 43 (1812) 3.5 7.0 3.7 52 (2208) 4.5 8.0 5.6 55 (2220) 4.5 8.0 5.6 Substrate for Adhesion Strength Test D F A E 5 3UHVVXUH /RDG 6ROGHULQJ PP 7HVWLQJ%RDUG 6XSSRUWPP 7HVWLQJ7DEOH 7HVWLQJ%RDUG *ODVV(SR[\%RDUG &(RU)5 7HVWLQJ%RDUG7KLFNQHVVPP &LUFXLW7KLFNQHVV PP 02, 03, 05 and array: 0.80.1mm C B Multilayer Ceramic Chip Capacitors Packaging Options Tape and Reel Reel * Reel W2 E C B D R A (Paper) D A C F 02 Type: 0.4 max. 03 Type: 0.5 max. 05 Type: 0.75 max. H F=2mm (03, 05, 105 Type) Punched rectangular hole to hold capacitor J Feed Hole (Paper) E A D C B H F 03 Type: 0.5 max. 05 Type: 0.75 max. 105 Type: 1.1 max. 60 min. 3302.0 1001.0 E W1 C D 130.5 210.8 W2 R 16.5 max. 1.0 10.01.5 2.00.5 9.51.0 (Plastic) Punched rectangular hole to hold capacitor J (Unit: mm) A B F 0.250.03 0.370.03 0.650.1 1.00.2 1.50.2 2.00.2 2.90.2 2.40.2 3.60.2 2.40.2 5.30.2 1.150.2 1.50.2 0.450.03 0.670.03 1.150.1 1.80.2 2.30.2 3.60.2 3.60.2 4.90.2 4.90.2 6.00.2 6.00.2 1.550.2 2.30.2 2.00.05 2.00.05 2.00.05 4.00.1 4.00.1 4.00.1 4.00.1 4.00.1 8.00.1 4.00.1 8.00.1 4.00.1 4.00.1 Option : A : 0.390.03, B : 0.690.03 F=4mm (105, D11, F12, 21, 316, 32, 42, 52 Type) Feed Hole 180 +0 -2.0 Size (EIA Code) 02 (01005) 03 (0201) 05 (0402) 105 (0603) 21 (0805) 316 (1206) 32 (1210) 42 (1808) 43 (1812) 52 (2208) 55 (2220) D11 (0405) F12 (0508) B F B Carrier Tape Parts insertion cavity J E F A Carrier tape width 8mm. For size 42 (1808) or over, Tape width 12mm and W1: 141.5, W2: 18.4mm max. W1 F=1mm (02, 03, 05 Type) Feed Hole (Unit: mm) Code Reel 7-inch Reel (CODE: T, H, Q) 13-inch Reel (CODE: L, N) Code Reel 7-inch Reel (CODE: T, H, Q) 13-inch Reel (CODE: L, N) (Paper) 2.8 max. (Unit: mm) E A F Carrier Tape C 1.0 1mm 8.0 0.05 +0.3/ -0.1 Paper D C B F H G 0.6 max. Holes only for plastic carrier tape. F0.3 min. 1.1 max. 2.0 0.05 8mm Paper F=8mm (43, 55 Type) (Plastic) 3.0 max. Punched rectangular hole to hold capacitor Feed Hole J E 4.0 0.1 8.0 0.3 D 3.5 0.05 8mm Plastic A D C B F Holes only for plastic carrier tape. F0.3 min. H G 8.0 0.1 0.6 max. 12mm Plastic 12.0 0.3 5.5 0.05 E G 1.75 0.1 2.0 0.05 H 4.0 0.05 J 1.5 4.0 +0.1/ -0 0.1 Multilayer Ceramic Chip Capacitors Packaging Options Detail of leader and trailer Empty Pockets Leader Components End Start 160mm min. 100mm min. 400mm min. Adhesive tape 1) The exfoliative strength when peeling off the top tape from the carrier tape by the method of the following figure shall be 0.1-0.7N. 2) When the top tape is peeled off, the adhesive stays on the top tape. 3) Chip capacitors will be in a state free without being stuck on the thermal adhesive tape. Exfoliating angle: 165 to 180 degrees to the carrier tape. Exfoliating speed: 300 mm/min. Peeling Direction Top Tape 165n to 180n Carrier Tape Unrolling Direction Bulk Case Package quantity (Unit: mm) 12 36 Slider Shutter Size Code Thickness (mm) Package quantity (pcs.) 05 0.5 50,000 105 0.8 15,000 21 1.25 5,000 Note: Please check us for bulk case applicable products. 110 Connection Area Bulk Case Dimensions Dimensions (mm) Size Code EIA CODE JIS CODE 05 0402 1005 1.00.05 0.50.05 0.50.05 0.15 0.35 0.30 105 0603 1608 1.60.07 0.80.07 0.80.07 0.20 0.60 0.50 21 0805 2012 2.00.1 1.250.1 1.250.1 0.20 0.75 0.70 L W T P min. W L P max. P to P min. T P P to P P Note: Regarding support for Bulk cases, please contact us for further information. Dimensions External Electrode Multilayer Ceramic Chip Capacitors Surface Mounting Information Dimensions for recommended typical land Since the amount of solder (size of fillet) to be used has direct influence on the capacitor after mounting, the sufficient consideration is necessary. When the amounts of solder is too much, the stress that a capacitor receives becomes larger. It may become the cause of a crack in the capacitor. When the land design of printed wiring board is considered, it is necessary to set up the form and size of land pattern so that the amount of solder is suitable. (General, High-Voltage, Automotive) Land Pattern Sample capacitor c b D11 F12 a c c c c a b LxW 02 (01005) 0.4x0.2 0.13 to 0.20 0.12 to 0.18 0.20 to 0.23 03 (0201) 0.6x0.3 0.20 to 0.30 0.25 to 0.35 0.30 to 0.40 05 (0402) 1.0x0.5 0.30 to 0.50 0.35 to 0.45 0.40 to 0.60 105 (0603) 1.6x0.8 0.70 to 1.00 0.80 to 1.00 0.60 to 0.80 2.0x1.25 1.00 to 1.30 1.00 to 1.20 0.80 to 1.10 3.2x1.6 2.10 to 2.50 1.10 to 1.30 1.00 to 1.30 32 (1210) 3.2x2.5 2.10 to 2.50 1.10 to 1.30 1.90 to 2.30 42 (1808) 4.5x2.0 2.50 to 3.20 1.80 to 2.30 1.50 to 1.80 43 (1812) 4.5x3.2 2.50 to 3.20 1.80 to 2.30 2.60 to 3.00 52 (2208) 5.7x2.0 4.20 to 4.70 2.00 to 2.50 1.50 to 1.80 55 (2220) 5.7x5.0 4.20 to 4.70 2.00 to 2.50 4.20 to 4.70 (Unit: mm) LxW a b d 1.6x0.8 0.60 to 0.90 0.80 to 1.00 0.70 to 1.00 21 (0805) 2.0x1.25 0.90 to 1.20 0.80 to 1.20 0.90 to 1.40 316 (1206) 3.2x1.6 1.40 to 1.90 1.00 to 1.30 1.30 to 1.80 (Unit: mm) a b c d F12 (0508) 0.5 0.5 0.3 0.5 D11 (0405) 0.69 0.28 0.3 0.64 Ideal Solder Height Design of printed circuit and Soldering T/ 3 to T/ 2 T Solder The recommended fillet height shall be 1/2 to 1/3 of the thickness of capacitors. When mounting two or more capacitors in the common land, it is necessary to separate the land with the solder resist strike so that it may become the exclusive land of each capacitor. Not recommended example PCB Recommended example/ Separated by solder Solder resist Multiple parts mount Solder resist Mount with leaded parts Leaded parts Leaded parts Soldering iron Solder resist Wire soldering after mounting Wire Solder resist Overview c 105 (0603) Chip Capacitor Item c Arrays a d b 21 (0805) b a a 316 (1206) Size (EIA Code) (Arrays) c (Unit: mm) Size (EIA Code) Automotive a Soldering resist c General, High-Voltage Solder resist Multilayer Ceramic Chip Capacitors Surface Mounting Information Mounting Design The chip could crack if the PCB warps during processing after the chip has been soldered. Recommended chip position on PCB to minimize stress from PCB warpage (Not recommended) (Ideal) Actual Mounting 1) If the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking. 2) During mounting, set the nozzle pressure to a static load of 100 to 300 gf. 3) To minimize the shock of the vaccum nozzle, provide a support pin on the back of the PCB to minimize PCB flexture. (Ideal) (Not recommended) Crack Support pin 4) Bottom position of pick up nozzle should be adjusted to the top surface of a substrate which camber is corrected. 5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case. 6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips capacitors. Resin Mold 1) If a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low shrinkage resin. 2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin. 3) Check carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such gases may crack the chip capacitor or damage the device itself. Multilayer Ceramic Chip Capacitors Surface Mounting Information Soldering Method 1) Ceramic is easily damaged by rapid heating or cooling. If some heat shock is unavoidable, preheat enough to limit the temperature difference (Delta T) to within 130 degree Celsius. 2) The product size 1.0x0.5mm to 3.2x1.6mm can be used in reflow and wave soldering, and the product size of bigger than 3.2x1.6mm, or smaller than 1.0x0.5mm, and capacitor arrays can be used in reflow. Circuit shortage and smoking can be created by using capacitors which are used neglecting the above caution. 3) Please see our recommended soldering conditions. 4) In case of using Sn-Zn Solder, please contact us in advance. 5) The following condition is recommended for spot heater application. * Recommended spot heater condition Item Condition Distance 5mm min. Angle 45 How to point spot heater Projection Temp. 400C max. Flow rate Set at the minimum Nozzle diameter 2 to 4 (Single hole type) Application time 10 sec. max. (1206 and smaller) 30 sec.max. (1210 and larger) Single hole nozzle Angle 45 Recommended Temperature Profile (62Sn Solder) Reflow Recommended Temperature Profile (Sn-3Ag-0.5Cu) Reflow Peak temperature 230C5C 15 seconds maximum 300 Preheat 300 Cool at normal room temperature after removing from furnace. 250 T 150 100 More than180C, 40 seconds maximum 1 to 3C/ sec. 170 to 180C 150 100 50 0 0 220C max. 90 sec. max. 60 seconds 9030 sec. Minimize soldering time. Ensure that the temperature difference (T) does not exceed 150C. Ensure that the temperature difference (T) does not exceed 130C for 3.2x2.5mm size or larger. MLCC can withstand the above reflow conditions up to 3 times. Minimize soldering time. Ensure that allowable temperature difference does not exceed 150C. Ensure that allowable temperature difference does not exceed 130C for 3.2x2.5mm size or larger. Wave 300 Preheat 300 Peak Temperature 230C to 260C Preheat Peak Temperature 245C to 260C 250 250 T 200 Temperature (C) Temperature (C) 200 50 Wave 150 100 Cool at normal room temperature 50 T 200 150 100 Cool at normal room temperature 50 0 0 60 to 120 sec. Preheat 250 Temperature Temperature 200 60 seconds 250C5C 5 to 10 sec. max. 5 sec. max. Ensure that the chip capacitor is preheated adequately. Ensure that the temperature difference (T) does not exceed 150C. Cool naturally after soldering. Wave soldering is not applicable for chips with size of 3.2x2.5mm or larger of 0.6x0.3mm or smaller. 60 to 120 sec. 5 sec. max. Ensure that the chip capacitor is preheated adequately. Ensure that the temperature difference (T) does not exceed 150C. Cool naturally after soldering. Wave soldering is not applicabel for chips with size of 3.2x2.5mm or larger of 0.6x0.3mm or smaller. Sodering iron 1) Temperature of iron chip 2) Wattage 3) Tip shape of soldering iron 4) Soldering Time 1206 and smaller 350C max. 5) Cautions 1210 and larger 280C max. a) Pre-heating is necessary rapid heating must be avoided. 80W max. Delta T150C 3.0mm max. b) Avoid direct touching to capacitors. 3 sec. max. c) Avoid rapid cooling after soldering. Natural cooling is recommended. Consult as if it is difficult to keep the temperature 280C max. for 1210 and larger MLCC'S. Multilayer Ceramic Chip Capacitors Precautions Circuit Design 1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or cause a short, open, smoking, or flaming to occur, etc. 2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical devices; devices which are highly public orientated; and devices which demand a high standard of liability. Accident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate grave consequence with respect to human lives or, possibly, a portion of the public. Capacitors used in these devices may require high reliability design different from that of general purpose capacitors. 3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications. Be especially cautious not to exceed the maximum temperature. In the situation the maximum temperature set forth in both the catalog and specifications is exceeded, the capacitor's insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur. The capacitor has a loss, and may self-heat due to equivalent series resistance when alternating electric current is passed therethrough. As this effect becomes especially pronounced in high frequency circuits, please exercise caution. When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for usage. Also, please make certain temperature rises remain below 20C. 4. Please keep voltage under the rated voltage which is applied to the capacitor. Also, please make certain the peak voltage remains below the rated voltage when AC voltage is super-imposed to the DC voltage. In the situation where AC or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage. Exceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations, may cause the capacitor to smoke or flame. 5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage, even though it is within the rated voltage, please inquire to the manufacturer. In the situation the capacitor is to be employed using a high frequency AC voltage or a extremely fast rising pulse voltage, even though it is within the rated voltage, it is possible capacitor reliability will deteriorate. 6. It is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of DC voltage. Due caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load voltage at the time of operation. 7. Do not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in the catalog and specifications. In addition, it is a common piezo phenomenon of high dielectric products to have some voltage due to vibration or to have noise due to voltage change. Please contact sales in such case. 8. If the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the respective product in order that the assembled product function appropriately. 9. Please contact us upon using conductive adhesives. Storage 1. If the component is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has been opened, reseal it or store it in a desiccator. 2. Keep storage place temperature +5 to +35 degree C, humidity 45 to 70% RH. 3. The storage atmosphere must be free of gas containing sulfur and chlorine. Also, avoid exposing the product to saline moisture. If the product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected. 4. Precautions 1) to 3) apply to chip capacitors packaged in carrier tapes and bulk cases. 5. The solderability is assured for 12 months from our shipping date (six months for silver palladium) if the above storage precautions are followed. 6. Chip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas. Safety application guideline and detailed information of electrical properties are also provided in Kyocera home page; URL: http://www.kyocera.co.jp/electronic/