GP2S700HCP
GP2S700HCP
■ Outline Dimensions (Unit : mm)
4
(2.7)
(1)
1.2
1.1
4.5
3.5
(1)
(0.25) (0.25)
0.4
(0.8)
(0.8)
(2.3)
(1.5)
(0.93) 2
(0.93) 3
1
1
2
2
3
3
4
4
Recommended circuit pattern
Pattern wiring is not allowed on oblique line portion not to cause
short-circuit.
Detecter center
Emitter center
Optical center
1
2
3
4
Anode
Emitter
Collector
Cathode
Note)
1) Unspecified tolerance:±0.3mm
2) ( ):Reference dimensions
3) There are cases that the oblique line portions
may not be filled with epoxy resin.
Note 3)
Long Focal Distance,
Subminiature Photointerrupter
■ Absolute Maximum Ratings (Ta=25˚C)
*1 For 5s
Parameter Symbol Rating Unit
Input
Forward current IF50 mA
Reverse voltage VR6V
Power dissipation PD75 mW
Output
Collector-emitter voltage VCEO 35 V
Emitter-collector voltage VECO 6V
Collector current IC20 mA
mW
Topr −25 to +85 ˚C
Storage temperature Tstg −40 to +100 ˚C
Soldering temperature Tsol 260 ˚C
Collector power dissipation
PC75 mW
Operating temperature
Total power dissipation Ptot 100
*1
1. Copiers
2. Facsimiles
3. Printers
■ Features
■ Applications
1. Ultra compact SMD package
2. Long focal distance type (focal distance:3mm)
3. Effective detection distance:1.2 to 5.5mm
Notice In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Internet Internet address for Electronic Components Group http://sharp-world.com/ecg/
GP2S700HCP
■ Electro-optical Characteristics
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Forward voltage
Collector current
Reverse current
Collector dark current
VF−
1
−
−
−
−
−
−
1.2
20
20
V
IR
ICEO
IC
VR=6V
VCE=20V
VCE=2V, IC=100µA
RL=1 000Ω, d=4mm
VCE=2V, IF=4mA
IF=20mA 10
100
410
100
100
1.4
60
nA
*3
*2
Response time
µA
µA
Leak current −
ILEAK VCE=2V, IF=4mA 700−nA
µs
µs
tr
tf
Rise time
Fall time
Input
Output
Transfer
charac-
teristics
(Ta=25°C)
∗2 No reflective object
∗3 “d” is glass thickness of reflective mirror
Fig.1 Measuring Configulation of Collector
Current
Glass plate
Aluminum
evaporation
glass
d=Thickness:4.0mm
Fig.2 Test Circuit for Response Time
10%
Output
Input
90%
trtf
VCC
Test
terminal
RL
Reflective object
−25 0 25 50 75 100
0
10
20
30
40
50
60
85
Forward current IF (mA)
Ambient temperature Ta (˚C)
0
20
40
60
Power dissipation P (mW)
100
120
Ptot
P, Pc
80
75
−25 0 25 50 75 10085
Ambient temperature Ta (˚C)
Fig.3 Forward Current vs. Ambient
Temperature Fig.4 Power Dissipation vs. Ambient
Temperature
GP2S700HCP
IF=4mA
VCE=2V
Ta=25˚C
0
20
40
60
80
100
246 108
Distance d (mm)
Relative collector current (%)
Aluminum
evaporation
glass
d
Fig.5 Relative Collector Current vs.
Distance (Reference)
NOTICE
●The circuit application examples in this publication are provided to explain representative applications of SHARP
devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes
no responsibility for any problems related to any intellectual property right of a third party resulting from the use of
SHARP's devices.
●Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP
reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents
described herein at any time without notice in order to improve design or reliability. Manufacturing locations are
also subject to change without notice.
●Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage
caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used
specified in the relevant specification sheet nor meet the following conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when
SHARP devices are used for or in connection with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of
reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
●If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign
Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices.
●This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright
laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or
mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written
permission is also required before any use of this publication may be made by a third party.
●Contact and consult with a SHARP representative if there are any questions about the contents of this publication.
