1 of 43 REV: 022207
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FEATURES
80C52 Compatible
8051 Pin- and Instruction-Set Compatible
Four 8-Bit I/O Ports
Three 16-Bit Timer/Counters
256 Bytes Scratchpad RAM
Large On-Chip Memory
16kB Program Memory
1kB Extra On-Chip SRAM for MOVX
ROMSIZE Feature
Selects Internal ROM Size from 0 to 16kB
Allows Access to Entire External Memory Map
Dynamically Adjustable by Software
Useful as Boot Block for External Flash
High-Speed Architecture
4 Clocks/Machine Cycle (8051 = 12)
Runs DC to 33MHz Clock Rates
Single-Cycle Instruction in 121ns
Dual Data Pointer
Optional Variable Length MOVX to Access
Fast/Slow RAM/Peripherals
Power Management Mode
Programmable Clock Source to Save Power
CPU Runs from (crystal/64) or (crystal/1024)
Provides Automatic Hardware and Software Exit
EMI Reduction Mode Disables ALE
Two Full-Duplex Hardware Serial Ports
High Integration Controller Includes:
Power-Fail Reset
Early-Warning Power-Fail Interrupt
Programmable Watchdog Timer
13 Interrupt Sources with Six External
Available in 40-pin PDIP, 44-Pin PLCC, 44-Pin
TQFP, and 40-Pin Windowed CERDIP
Factory Mask DS83C520 or EPROM (OTP)
DS87C520
PIN CONFIGURATIONS
DS87C520/DS83C520
EPROM/ROM High-Speed Microcontroller
s
www.maxim-ic.com
TOP VIEW
The High-Speed Microcontroller User’s Guide must be used in
conjunction with this data sheet. Download it at:
www.maxim-ic.com/microcontrollers.
DS87C520/DS83C520 EPROM/ROM High-Speed Microcontrollers
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ORDERING INFORMATION
PART TEMP RANGE
MAX CLOCK
SPEED (MHz) PIN-PACKAGE
DS87C520-MCL 0˚C to +70˚C 33 40 Plastic DIP
DS87C520-MCL+ 0˚C to +70˚C 33 40 Plastic DIP
DS87C520-QCL 0˚C to +70˚C 33 44 PLCC
DS87C520-QCL+ 0˚C to +70˚C 33 44 PLCC
DS87C520-ECL 0˚C to +70˚C 33 44 TQFP
DS87C520-ECL+ 0˚C to +70˚C 33 44 TQFP
DS87C520-MNL -40˚C to +85˚C 33 40 Plastic DIP
DS87C520-MNL+ -40˚C to +85˚C 33 40 Plastic DIP
DS87C520-QNL -40˚C to +85˚C 33 44 PLCC
DS87C520-QNL+ -40˚C to +85˚C 33 44 PLCC
DS87C520-ENL -40˚C to +85˚C 33 44 TQFP
DS87C520-ENL+ -40˚C to +85˚C 33 44 TQFP
DS87C520-WCL* 0˚C to +70˚C 33 40 Windowed CERDIP
DS83C520-MCL 0˚C to +70˚C 33 40 Plastic DIP
DS83C520-MCL+ 0˚C to +70˚C 33 40 Plastic DIP
DS83C520-QCL 0˚C to +70˚C 33 44 PLCC
DS83C520-QCL+ 0˚C to +70˚C 33 44 PLCC
DS83C520-ECL 0˚C to +70˚C 33 44 TQFP
DS83C520-ECL+ 0˚C to +70˚C 33 44 TQFP
DS83C520-MNL -40˚C to +85˚C 33 40 Plastic DIP
DS83C520-MNL+ -40˚C to +85˚C 33 40 Plastic DIP
DS83C520-QNL -40˚C to +85˚C 33 44 PLCC
DS83C520-QNL+ -40˚C to +85˚C 33 44 PLCC
DS83C520-ENL -40˚C to +85˚C 33 44 TQFP
DS83C520-ENL+ -40˚C to +85˚C 33 44 TQFP
+ Denotes a lead(Pb)-free/RoHS-compliant device.
* The windowed ceramic DIP package is intrinsically lead(Pb) free.
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DESCRIPTION
The DS87C520/DS83C520 EPROM/ROM high-speed microcontrollers are fast 8051-compatible
microcontrollers. They feature a redesigned processor core without wasted clock and memory cycles. As
a result, the devices execute every 8051 instruction between 1.5 and 3 times faster than the original for
the same crystal speed. Typical applications will see a speed improvement of 2.5 times using the same
code and the same crystal. The DS87C520/DS83C520 offer a maximum crystal speed of 33MHz,
resulting in apparent execution speeds of 82.5MHz (approximately 2.5X).
The DS87C520/DS83C520 are pin compatible with all three packages of the standard 8051, and include
standard resources such as three timer/counters, serial port, and four 8-bit I/O ports. They feature 16kB of
EPROM or mask ROM with an extra 1kB of data RAM. Both OTP and windowed packages are
available.
Besides greater speed, the microcontroller includes a second full hardware serial port, seven additional
interrupts, programmable Watchdog Timer, Brownout Monitor, and Power-Fail Reset. The device also
provides dual data pointers (DPTRs) to speed block data memory moves. It also can adjust the speed of
MOVX data memory access from two to nine machine cycles for flexibility in selecting external memory
and peripherals.
A new Power Management Mode (PMM) is useful for portable applications. This feature allows software
to select a lower speed clock as the main time base. While normal operation has a machine cycle rate of 4
clocks per cycle, the PMM runs the processor at 64 or 1024 clocks per cycle. For example, at 12MHz,
standard operation has a machine cycle rate of 3MHz. In Power Management Mode, software can select
either 187.5kHz or 11.7kHz machine cycle rate. There is a corresponding reduction in power
consumption when the processor runs slower.
The EMI reduction feature allows software to select a reduced emission mode. This disables the ALE
signal when it is unneeded.
The DS83C520 is a factory mask ROM version of the DS87C520 designed for high-volume, cost-
sensitive applications. It is identical in all respects to the DS87C520, except that the 16kB of EPROM is
replaced by a user-supplied application program. All references to features of the DS87C520 will apply to
the DS83C520, with the exception of EPROM-specific features where noted. Please contact your local
Dallas Semiconductor sales representative for ordering information.
DS87C520/DS83C520 EPROM/ROM High-Speed Microcontrollers
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Figure 1. Block Diagram
PIN DESCRIPTION
PIN
DIP PLCC TQFP
NAME FUNCTION
40 44 38 VCC Positive Supply Voltage. +5V
20 1, 22, 23 16, 17, 39 GND Digital Circuit Ground
9 10 4 RST
Reset Input. The RST input pin contains a Schmitt voltage input
to recognize external active high Reset inputs. The pin also
employs an internal pulldown resistor to allow for a combination
of wired OR external reset sources. An RC is not required for
power-up, as the device provides this function internally.
18 20 14 XTAL2
19 21 15 XTAL1
Crystal Oscillator Pins. XTAL1 and XTAL2 provide support for
parallel-resonant, AT-cut crystals. XTAL1 acts also as an input if
there is an external clock source in place of a crystal. XTAL2
serves as the output of the crystal amplifier.
29 32 26 PSEN
Program Store-Enable Output. This active-low signal is
commonly connected to optional external ROM memory as a chip
enable. PSEN provides an active-low pulse and is driven high
when external ROM is not being accessed.
DS87C520/
DS83C520
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PIN DESCRIPTION (continued)
PIN
DIP PLCC TQFP NAME FUNCTION
30 33 27 ALE
Address Latch Enable Output. The ALE functions as a clock to
latch the external address LSB from the multiplexed address/data bus
on Port 0. This signal is commonly connected to the latch enable of an
external 373 family transparent latch. ALE has a pulse width of 1.5
XTAL1 cycles and a period of four XTAL1 cycles. ALE is forced
high when the DS87C520/DS83C520 are in a reset condition. ALE
can also be disabled and forced high by writing ALEOFF = 1
(PMR.2). ALE operates independently of ALEOFF during external
memory accesses.
39 43 37 P0.0 (AD0)
38 42 36 P0.1 (AD1)
37 41 35 P0.2 (AD2)
36 40 34 P0.3 (AD3)
35 39 33 P0.4 (AD4)
34 38 32 P0.5 (AD5)
33 37 31 P0.6 (AD6)
32 36 30 P0.7 (AD7)
Port 0 (AD0–7), I/O. Port 0 is an open-drain, 8-bit, bidirectional I/O
port. As an alternate function Port 0 can function as the multiplexed
address/data bus to access off-chip memory. During the time when
ALE is high, the LSB of a memory address is presented. When ALE
falls to a logic 0, the port transitions to a bidirectional data bus. This
bus is used to read external ROM and read/write external RAM
memory or peripherals. When used as a memory bus, the port
provides active high drivers. The reset condition of Port 0 is tri-state.
Pullup resistors are required when using Port 0 as an I/O port.
1 2 40 P1.0
2 3 41 P1.1
3 4 42 P1.2
4 5 43 P1.3
5 6 44 P1.4
6 7 1 P1.5
7 8 2 P1.6
8 9 3 P1.7
Port 1, I/O. Port 1 functions as both an 8-bit, bidirectional I/O port
and an alternate functional interface for Timer 2 I/O, new External
Interrupts, and new Serial Port 1. The reset condition of Port 1 is with
all bits at a logic 1. In this state, a weak pullup holds the port high.
This condition also serves as an input state; a weak pullup holds the
port high. This condition also serves as an input mode, since any
external circuit that writes to the port will overcome the weak pullup.
When software writes a 0 to any port pin, the DS87C520/DS83C520
will activate a strong pulldown that remains on until either a 1 is
written or a reset occurs. Writing a 1 after the port has been at 0 will
cause a strong transition driver to turn on, followed by a weaker
sustaining pullup. Once the momentary strong driver turns off, the
port again becomes the output high (and input) state. The alternate
modes of Port 1 are out-lines as follows.
Port Alternate Function
P1.0 T2 External I/O for Timer/Counter 2
P1.1 T2EX EX Timer/Counter 2 Capture/Reload Trigger
P1.2 RXD1 Serial Port 1 Input
P1.3 TXD1 Serial Port 1 Output
P1.4 INT2 External Interrupt 2 (Positive Edge Detect)
P1.5 INT3 External Interrupt 3 (Negative Edge Detect)
P1.6 INT4 External Interrupt 4 (Positive Edge Detect)
P1.7 INT5 External Interrupt 5 (Negative Edge Detect)
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PIN DESCRIPTION (continued)
PIN
DIP PLCC TQFP
NAME FUNCTION
21 24 18 P2.0 (A8)
22 25 19 P2.1 (A9)
23 26 20 P2.2 (A10)
24 27 21 P2.3 (A11)
25 28 22 P2.4 (A12)
26 29 23 P2.5 (A13)
27 30 24 P2.6 (A14)
28 31 25 P2.7 (A15)
Port 2 (A8–15), I/O. Port 2 is a bidirectional I/O port. The reset
condition of Port 2 is logic high. In this state, a weak pullup holds
the port high. This condition also serves as an input mode, since
any external circuit that writes to the port will overcome the weak
pullup. When software writes a 0 to any port pin, the
DS87C520/DS83C520 will activate a strong pulldown that
remains on until either a 1 is written or a reset occurs. Writing a 1
after the port has been at 0 will cause a strong transition driver to
turn on, followed by a weaker sustaining pullup. Once the
momentary strong driver turns off, the port again becomes both the
output high and input state. As an alternate function Port 2 can
function as MSB of the external address bus. This bus can be used
to read external ROM and read/write external RAM memory or
peripherals.
10 11 5 P3.0
11 13 7 P3.1
12 14 8 P3.2
13 15 9 P3.3
14 16 10 P3.4
15 17 11 P3.5
16 18 12 P3.6
17 19 13 P3.7
Port 3, I/O. Port 3 functions as both an 8-bit, bidirectional I/O
port and an alternate functional interface for External Interrupts,
Serial Port 0, Timer 0 and 1 Inputs, and RD and WR strobes. The
reset condition of Port 3 is with all bits at a logic 1. In this state, a
weak pullup holds the port high. This condition also serves as an
input mode, since any external circuit that writes to the port will
overcome the weak pullup. When software writes a 0 to any port
pin, the DS87C520/DS83C520 will activate a strong pulldown that
remains on until either a 1 is written or a reset occurs. Writing a 1
after the port has been at 0 will cause a strong transition driver to
turn on, followed by a weaker sustaining pullup. Once the
momentary strong driver turns off, the port again becomes both the
output high and input state. The alternate modes of Port 3 are
outlined below.
Port Alternate Mode
P3.0 RXD0 Serial Port 0 Input
P3.1 TXD0 Serial Port 0 Output
P3.2 INT0 External Interrupt 0
P3.3 INT1 External Interrupt 1
P3.4 T0 Timer 0 External Input
P3.5 T1 Timer 1 External Input
P3.6 WR External Data Memory Write Strobe
P3.7 RD External Data Memory Read Strobe
31 35 29 EA
External Access Input, Active Low. Connect to ground to force
the DS87C520/DS83C520 to use an external ROM. The internal
RAM is still accessible as determined by register settings. Connect
EA to VCC to use internal ROM.
12, 34 6, 28 N.C. Not Connecte d. These pins should not be connected. They are
reserved for use with future devices in this family.
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COMPATIBILITY
The DS87C520/DS83C520 are fully static CMOS 8051-compatible microcontrollers designed for high
performance. In most cases, the DS87C520/DS83C520 can drop into an existing socket for the 8xc51
family to improve the operation significantly. While remaining familiar to 8051 family users, the devices
have many new features. In general, software written for existing 8051-based systems works without
modification on the DS87C520/DS83C520. The exception is critical timing since the high-speed
microcontrollers performs instructions much faster than the original for any given crystal selection. The
DS87C520/DS83C520 run the standard 8051 family instruction set and are pin compatible with DIP,
PLCC, or TQFP packages.
The DS87C520/DS83C520 provide three 16-bit timer/counters, full-duplex serial port (2), 256 bytes of
direct RAM plus 1kB of extra MOVX RAM. I/O ports have the same operation as a standard 8051
product. Timers will default to a 12-clock per cycle operation to keep their timing compatible with
original 8051 family systems. However, timers are individually programmable to run at the new four
clocks per cycle if desired. The PCA is not supported.
The DS87C520/DS83C520 provide several new hardware features implemented by new special function
registers. A summary of these SFRs is provided below.
PERFORMANCE OVERVIEW
The DS87C520/DS83C520 feature a high-speed 8051-compatible core. Higher speed comes not just from
increasing the clock frequency but also from a newer, more efficient design.
This updated core does not have the dummy memory cycles that are present in a standard 8051. A
conventional 8051 generates machine cycles using the clock frequency divided by 12. In the
DS87C520/DS83C520, the same machine cycle takes 4 clocks. Thus the fastest instruction, 1 machine
cycle, executes three times faster for the same crystal frequency. Note that these are identical instructions.
The majority of instructions on the DS87C520/DS83C520 will see the full 3-to-1 speed improvement.
Some instructions will get between 1.5 and 2.4 to 1 improvement. All instructions are faster than the
original 8051.
The numerical average of all opcodes gives approximately a 2.5 to 1 speed improvement. Improvement of
individual programs will depend on the actual instructions used. Speed-sensitive applications would make
the most use of instructions that are three times faster. However, the sheer number of 3 to 1 improved
opcodes makes dramatic speed improvements likely for any code. These architecture improvements
produce a peak instruction cycle in 121ns (8.25 MIPs). The Dual Data Pointer feature also allows the user
to eliminate wasted instructions when moving blocks of memory.
INSTRUCTION SET SUMMARY
All instructions perform the same functions as their 8051 counterparts. Their effect on bits, flags, and
other status functions is identical. However, the timing of each instruction is different. This applies both
in absolute and relative number of clocks.
For absolute timing of real-time events, the timing of software loops can be calculated using a table in the
High-Speed Microcontroller User’s Guide. However, counter/timers default to run at the older 12 clocks
per increment. In this way, timer-based events occur at the standard intervals with software executing at
higher speed. Timers optionally can run at 4 clocks per increment to take advantage of faster processor
operation.
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The relative time of two instructions might be different in the new architecture than it was previously. For
example, in the original architecture, the “MOVX A, @DPTR” instruction and the “MOV direct, direct”
instruction used two machine cycles or 24 oscillator cycles. Therefore, they required the same amount of
time. In the DS87C520/DS83C520, the MOVX instruction takes as little as two machine cycles or eight
oscillator cycles but the “MOV direct, direct” uses three machine cycles or 12 oscillator cycles. While
both are faster than their original counterparts, they now have different execution times. This is because
the DS87C520/DS83C520 usually use one instruction cycle for each instruction byte. The user concerned
with precise program timing should examine the timing of each instruction for familiarity with the
changes. Note that a machine cycle now requires just 4 clocks, and provides one ALE pulse per cycle.
Many instructions require only one cycle, but some require five. In the original architecture, all were one
or two cycles except for MUL and DIV. Refer to the High-Speed Microcontroller User’s Guide for
details and individual instruction timing.
SPECIAL FUNCTION REGISTERS
Special Function Registers (SFRs) control most special features of the DS87C520/DS83C520. This
allows the DS87C520/DS83C520 to have many new features but use the same instruction set as the 8051.
When writing software to use a new feature, an equate statement defines the SFR to an assembler or
compiler. This is the only change needed to access the new function. The DS87C520/DS83C520
duplicate the SFRs contained in the standard 80C52. Table 1 shows the register addresses and bit
locations. The High-Speed Microcontroller User’s Guide describes all SFRs.
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Table 1. Special Function Register Locations
REGISTER BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 ADDRESS
P0 P0.7 P0.6 P0.5 P0.4 P0.3 P0.2 P0.1 P0.0 80h
SP 81h
DPL 82h
DPH 83h
DPL1 84h
DPH1 85h
DPS 0 0 0 0 0 0 0 SEL
86h
PCON SMOD_0 SMOD0 — — GF1 GF0 STOP IDLE 87h
TCON TF1 TR1 TF0 TR0 IE1 IT1 IE0 IT0 88h
TMOD GATE C/T M1 M0 GATE C/T M1 M0 89h
TL0 8Ah
TL1 8Bh
TH0 8Ch
TH1 8Dh
CKCON WD1 WD0 T2M T1M T0M MD2 MD1 MD0 8Eh
PORT1 P1.7 P1.6 P1.5 P1.4 P1.3 P1.2 P1.1 P1.0 90h
EXIF IE5 IE4 IE3 IE
XT/RG RGMD RGSL BGS 91h
SCON0 SM0/FE_0 SM1_0 SM2_0 REN_0 TB8_0 RB8_0 TI_0 RI_0 98h
SBUF0 99h
P2 P2.7 P2.6 P2.5 P2.4 P2.3 P2.2 P2.1 P2.0 A0h
IE EA ES1 ET2 ES0 ET1 EX1 ET0 EX0 A8h
SADDR0 A9h
SADDR1 AAh
P3 P3.7 P3.6 P3.5 P3.4 P3.3 P3.2 P3.1 P3.0 B0h
IP — PS1 PT2 PS0 PT1 PX1 PT0 PX0 B8h
SADEN0 B9h
SADEN1 BAh
SCON1 SM0/FE_1 SM1_1 SM2_1 REN_1 TB8_1 RB8_1 TI_1 R1_1 C0h
SBUF1 SB7 SB6 SB5 SB4 SB3 SB2 SB1 SB0
C1h
ROMSIZE RMS2 RMS1 RMS0 C2h
PMR CD1 CD0 SWB — XTOFF ALEOFF DME1 DME0
C4h
STATUS PIP HIP LIP XTUP SPTA1 SPTA1 SPTA0 SPRA0
C5h
TA
C7h
T2CON TF2 EXF2 RCLK TCLK EXEN2 TR2 C/T2 C/RL2 C8h
T2MOD T2OE DCEN C9h
RCAP2L CAh
RCAP2H CBh
TL2 CCh
TH2 CDh
PSW CY AC F0 RS1 RS0 OV FL P D0h
WDCON SMOD_1 POR EPFI PFI WDIF WTRF EWT RWT D8h
ACC E0h
EIE EWDI EX5 EX4 EX3 EX2 E8h
B F0h
EIP PWDI PX5 PX4 PX3 PX2 F8h
Note: New functions are in bold.
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MEMORY RESOURCES
Like the 8051, the DS87C520/DS83C520 use three memory areas. The total memory configuration of the
DS87C520/DS83C520 is 16kB of ROM, 1kB of data SRAM and 256 bytes of scratchpad or direct RAM.
The 1kB of data space SRAM is read/write accessible and is memory mapped. This on-chip SRAM is
reached by the MOVX instruction. It is not used for executable memory. The scratchpad area is 256 bytes
of register mapped RAM and is identical to the RAM found on the 80C52. There is no conflict or overlap
among the 256 bytes and the 1kB as they use different addressing modes and separate instructions.
OPERATIONAL CONSIDERATION
The erasure window of the windowed CERDIP should be covered without regard to the
programmed/unprogrammed state of the EPROM. Otherwise, the device may not meet the AC and DC
parameters listed in the data sheet.
PROGRAM MEMORY ACCESS
On-chip ROM begins at address 0000h and is contiguous through 3FFFh (16kB). Exceeding the
maximum address of on-chip ROM will cause the device to access off-chip memory. However, the
maximum on-chip decoded address is selectable by software using the ROMSIZE feature. Software can
cause the DS87C520/DS83C520 to behave like a device with less on-chip memory. This is beneficial
when overlapping external memory, such as Flash, is used. The maximum memory size is dynamically
variable. Thus a portion of memory can be removed from the memory map to access off-chip memory,
and then restored to access on-chip memory. In fact, all of the on-chip memory can be removed from the
memory map allowing the full 64kB memory space to be addressed from off-chip memory. ROM
addresses that are larger than the selected maximum are automatically fetched from outside the part via
Ports 0 and 2. A depiction of the ROM memory map is shown in Figure 2.
The ROMSIZE register is used to select the maximum on-chip decoded address for ROM. Bits RMS2,
RMS1, RMS0 have the following effect.
RMS2 RMS1 RMS0 MAXIMUM ON-CHIP ROM ADDRESS
0 0 0 0kB
0 0 1 1kB/03FFh
0 1 0 2kB/07FFh
0 1 1 4kB/0FFFh
1 0 0 8kB/1FFFh
1 0 1 16kB (default)/3FFFh
1 1 0 Invalid—reserved
1 1 1 Invalid—reserved
The reset default condition is a maximum on-chip ROM address of 16kB. Thus no action is required if
this feature is not used. When accessing external program memory, the first 16kB would be inaccessible.
To select a smaller effective ROM size, software must alter bits RMS2–RMS0. Altering these bits
requires a Timed-Access procedure as explained later.
Care should be taken so that changing the ROMSIZE register does not corrupt program execution. For
example, assume that the DS87C520/DS83C520 are executing instructions from internal program
memory near the 12kB boundary (~3000h) and that the ROMSIZE register is currently configured for a
DS87C520/DS83C520 EPROM/ROM High-Speed Microcontrollers
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16kB internal program space. If software reconfigures the ROMSIZE register to 4kB (0000h–0FFFh) in
the current state, the device will immediately jump to external program execution because program code
from 4kB to 16kB (1000h–3FFFh) is no longer located on-chip. This could result in code misalignment
and execution of an invalid instruction. The recommended method is to modify the ROMSIZE register
from a location in memory that will be internal (or external) both before and after the operation. In the
above example, the instruction which modifies the ROMSIZE register should be located below the 4kB
(1000h) boundary, so that it will be unaffected by the memory modification. The same precaution should
be applied if the internal program memory size is modified while executing from external program
memory.
Off-chip memory is accessed using the multiplexed address/data bus on P0 and the MSB address on P2.
While serving as a memory bus, these pins are not I/O ports. This convention follows the standard 8051
method of expanding on-chip memory. Off-chip ROM access also occurs if the EA pin is a logic 0. EA
overrides all bit settings. The PSEN signal goes active (low) to serve as a chip enable or output enable
when Ports 0 and 2 fetch from external ROM.
Figure 2. ROM Memory Map
DATA MEMORY ACCESS
Unlike many 8051 derivatives, the DS87C520/DS83C520 contain on-chip data memory. They also
contain the standard 256 bytes of RAM accessed by direct instructions. These areas are separate. The
MOVX instruction accesses the on-chip data memory. Although physically on-chip, software treats this
area as though it was located off-chip. The 1kB of SRAM is between address 0000h and 03FFh.
Access to the on-chip data RAM is optional under software control. When enabled by software, the data
SRAM is between 0000h and 03FFh. Any MOVX instruction that uses this area will go to the on-chip
RAM while enabled. MOVX addresses greater than 03FFh automatically go to external memory through
Ports 0 and 2.
ROM SIZE IGNORED
ROM SIZE ADJUSTABLE
DEFAULT = 16kB
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When disabled, the 1kB memory area is transparent to the system memory map. Any MOVX directed to
the space between 0000h and FFFFh goes to the expanded bus on Ports 0 and 2. This also is the default
condition. This default allows the DS87C520/DS83C520 to drop into an existing system that uses these
addresses for other hardware and still have full compatibility.
The on-chip data area is software selectable using 2 bits in the Power Management Register at location
C4h. This selection is dynamically programmable. Thus access to the on-chip area becomes transparent to
reach off-chip devices at the same addresses. The control bits are DME1 (PMR.1) and DME0 (PMR.0).
They have the following operation:
Table 2. Data Memory Access Control
DME1 DME0 DATA MEMORY ADDRESS MEMORY FUNCTION
0 0 0000h–FFFFh
External data memory (default condition)
0000h–03FFh Internal SRAM data memory
0 1 0400h–FFFFh External data memory
1 0 Reserved Reserved
0000h–03FFh Internal SRAM data memory
0400h–FFFBh Reserved—no external access
FFFCh Read access to the status of lock bits
1 1
FFFDh–FFFFh Reserved—no external access
Notes on the status byte read at FFFCh with DME1, 0 = 1, 1: Bits 2–0 reflect the programmed status of
the security lock bits LB2–LB0. They are individually set to a logic 1 to correspond to a security lock bit
that has been programmed. These status bits allow software to verify that the part has been locked before
running if desired. The bits are read only.
Note: After internal MOVX SRAM has been initialized, changing the DME0/1 bits has no effect on the
contents of the SRAM.
STRETCH MEMORY CYCLE
The DS87C520/DS83C520 allow software to adjust the speed of off-chip data memory access. The
microcontrollers can perform the MOVX in as few as two instruction cycles. The on-chip SRAM uses
this speed and any MOVX instruction directed internally uses two cycles. However, the time can be
stretched for interface to external devices. This allows access to both fast memory and slow memory or
peripherals with no glue logic. Even in high-speed systems, it may not be necessary or desirable to
perform off-chip data memory access at full speed. In addition, there are a variety of memory-mapped
peripherals such as LCDs or UARTs that are slow.
The Stretch MOVX is controlled by the Clock Control Register at SFR location 8Eh as described below.
It allows the user to select a Stretch value between 0 and 7. A Stretch of 0 will result in a two-machine
cycle MOVX. A Stretch of 7 will result in a MOVX of nine machine cycles. Software can dynamically
change this value depending on the particular memory or peripheral.
On reset, the Stretch value will default to a 1, resulting in a three-cycle MOVX for any external access.
Therefore, off-chip RAM access is not at full speed. This is a convenience to existing designs that may
not have fast RAM in place. Internal SRAM access is always at full speed regardless of the Stretch
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setting. When desiring maximum speed, software should select a Stretch value of 0. When using very
slow RAM or peripherals, select a larger Stretch value. Note that this affects data memory only and the
only way to slow program memory (ROM) access is to use a slower crystal.
Using a Stretch value between 1 and 7 causes the microcontroller to stretch the read/write strobe and all
related timing. Also, setup and hold times are increased by 1 clock when using any Stretch greater than 0.
This results in a wider read/write strobe and relaxed interface timing, allowing more time for
memory/peripherals to respond. The timing of the variable speed MOVX is in the Electrical
Specifications section. Table 3 shows the resulting strobe widths for each Stretch value. The memory
Stretch uses the Clock Control Special Function Register at SFR location 8Eh. The Stretch value is
selected using bits CKCON.2–0. In the table, these bits are referred to as M2 through M0. The first
Stretch (default) allows the use of common 120ns RAMs without dramatically lengthening the memory
access.
Table 3. Data Memory Cycle Stretch Values
CKCON.2-0
M2 M1 M0
MEMORY CYCLES RD OR WR STROBE
WIDTH IN CLOCKS STROBE WIDTH
TIME at 33MHz (ns)
0 0 0 2 (forced internal) 2 60
0 0 1 3 (default external) 4 121
0 1 0 4 8 242
0 1 1 5 12 364
1 0 0 6 16 485
1 0 1 7 20 606
1 1 0 8 24 727
1 1 1 9 28 848
DUAL DATA POINTER
The timing of block moves of data memory is faster using the Dual Data Pointer (DPTR). The standard
8051 DPTR is a 16-bit value that is used to address off-chip data RAM or peripherals. In the
DS87C520/DS83C520, this data pointer is called DPTR0, located at SFR addresses 82h and 83h. These
are the original locations. Using DPTR requires no modification of standard code. The new DPTR at SFR
84h and 85h is called DPTR1. The DPTR Select bit (DPS) chooses the active pointer. Its location is the
lsb of the SFR location 86h. No other bits in register 86h have any effect and are 0. The user switches
between data pointers by toggling the lsb of register 86h. The increment (INC) instruction is the fastest
way to accomplish this. All DPTR-related instructions use the currently selected DPTR for any activity.
Therefore it takes only one instruction to switch from a source to a destination address. Using the Dual
Data Pointer saves code from needing to save source and destination addresses when doing a block move.
The software simply switches between DPTR0 and 1 once software loads them. The relevant register
locations are as follows:
DPL 82h Low byte original DPTR
DPH 83h High byte original DPTR
DPL1 84h Low byte new DPTR
DPH1 85h High byte new DPTR
DPS 86h DPTR Select (lsb)
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POWER MANAGEMENT
Along with the standard Idle and power down (Stop) modes of the standard 80C52, the
DS87C520/DS83C520 provide a new Power Management Mode. This mode allows the processor to
continue functioning, yet to save power compared with full operation. The DS87C520/DS83C520 also
feature several enhancements to Stop mode that make it more useful.
POWER MANAGEMENT MODE (PMM)
Power Management Mode offers a complete scheme of reduced internal clock speeds that allow the CPU
to run software but to use substantially less power. During default operation, the DS87C520/DS83C520
use four clocks per machine cycle. Thus the instruction cycle rate is Clock/4. At 33MHz crystal speed,
the instruction cycle speed is 8.25MHz (33/4). In PMM, the microcontroller continues to operate but uses
an internally divided version of the clock source. This creates a lower power state without external
components. It offers a choice of two reduced instruction cycle speeds (and two clock sources - discussed
below). The speeds are (Clock/64) and (Clock/1024).
Software is the only mechanism to invoke the PMM. Table 4 illustrates the instruction cycle rate in PMM
for several common crystal frequencies. Since power consumption is a direct function of operating speed,
PMM 1 eliminates most of the power consumption while still allowing a reasonable speed of processing.
PMM 2 runs very slow and provides the lowest power consumption without stopping the CPU. This is
illustrated in Table 5.
Note that PMM provides a lower power condition than Idle mode. This is because in Idle mode, all
clocked functions such as timers run at a rate of crystal divided by 4. Since wake-up from PMM is as fast
as or faster than from Idle, and PMM allows the CPU to operate (even if doing NOPs), there is little
reason to use Idle mode in new designs.
Table 4. Machine Cycle Rate
CRYSTAL SPEED
(MHz)
FULL OPERATION
(4 CLOCKS)
(MHz)
PMM1
(64 CLOCKS)
(kHz)
PMM2
(1024 CLOCKS)
(kHz)
11.0592 2.765 172.8 10.8
16 4.00 250.0 15.6
25 6.25 390.6 24.4
33 8.25 515.6 32.2
Table 5. Typical Operating Current in PMM
CRYSTAL SPEED
(MHz)
FULL OPERATION
(4 CLOCKS)
(mA)
PMM1
(64 CLOCKS)
(mA)
PMM2
(1024 CLOCKS)
(mA)
11.0592 13.1 5.3 4.8
16 17.2 6.4 5.6
25 25.7 8.1 7.0
33 32.8 9.8 8.2
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CRYSTAL-LESS PMM
A major component of power consumption in PMM is the crystal amplifier circuit. The
DS87C520/DS83C520 allow the user to switch CPU operation to an internal ring oscillator and turn off
the crystal amplifier. The CPU would then have a clock source of approximately 2MHz to 4MHz, divided
by either 4, 64, or 1024. The ring is not accurate, so software cannot perform precision timing. However,
this mode allows an additional saving of between 0.5mA and 6.0mA, depending on the actual crystal
frequency. While this saving is of little use when running at 4 clocks per instruction cycle, it makes a
major contribution when running in PMM1 or PMM2.
PMM OPERATION
Software invokes the PMM by setting the appropriate bits in the SFR area. The basic choices are divider
speed and clock source. There are three speeds (4, 64, and 1024) and two clock sources (crystal and ring).
Both the decisions and the controls are separate. Software will typically select the clock speed first. Then,
it will perform the switch to ring operation if desired. Lastly, software can disable the crystal amplifier if
desired.
There are two ways of exiting PMM. Software can remove the condition by reversing the procedure that
invoked PMM or hardware can (optionally) remove it. To resume operation at a divide-by-4 rate under
software control, simply select 4 clocks per cycle, then crystal-based operation if relevant. When
disabling the crystal as the time base in favor of the ring oscillator, there are timing restrictions associated
with restarting the crystal operation. Details are described below.
There are three registers containing bits that are concerned with PMM functions. They are Power
Management Register (PMR; C4h), Status (STATUS; C5h), and External Interrupt Flag (EXIF; 91h).
Clock Divider
Software can select the instruction cycle rate by selecting bits CD1 (PMR.7) and CD0 (PMR.6) as
follows:
CD1 CD0 CYCLE RATE
0 0 Reserved
0 1 4 clocks (default)
1 0 64 clocks
1 1 1024 clocks
The selection of instruction cycle rate will take effect after a delay of one instruction cycle. Note that the
clock divider choice applies to all functions including timers. Since baud rates are altered, it will be
difficult to conduct serial communication while in PMM. There are minor restrictions on accessing the
clock selection bits. The processor must be running in a 4-clock state to select either 64 (PMM1) or 1024
(PMM2) clocks. This means software cannot go directly from PMM1 to PMM2 or visa versa. It must
return to a 4-clock rate first.
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Switchback
To return to a 4-clock rate from PMM, software can simply select the CD1 and CD0 clock control bits to
the 4 clocks per cycle state. However, the DS87C520/DS83C520 provide several hardware alternatives
for automatic Switchback. If Switchback is enabled, then the device will automatically return to a 4-clock
per cycle speed when an interrupt occurs from an enabled, valid external interrupt source. A Switchback
will also occur when a UART detects the beginning of a serial start bit if the serial receiver is enabled
(REN = 1). Note the beginning of a start bit does not generate an interrupt; this occurs on reception of a
complete serial word. The automatic Switchback on detection of a start bit allows hardware to correct
baud rates in time for a proper serial reception. A switchback will also occur when a byte is written to
SBUF0 or SBUF1 for transmission.
Switchback is enabled by setting the SWB bit (PMR.5) to a 1 in software. For an external interrupt,
Switchback will occur only if the interrupt source could really generate the interrupt. For example, if
INT0 is enabled but has a low priority setting, then Switchback will not occur on INT0 if the CPU is
servicing a high priority interrupt.
Status
Information in the Status register assists decisions about switching into PMM. This register contains
information about the level of active interrupts and the activity on the serial ports.
The DS87C520/DS83C520 support three levels of interrupt priority. These levels are Power-fail, High,
and Low. Bits STATUS.7-5 indicate the service status of each level. If PIP (Power-fail Interrupt Priority;
STATUS. 7) is a 1, then the processor is servicing this level. If either HIP (High Interrupt Priority;
STATUS.6) or LIP (Low Interrupt Priority; STATUS.5) is high, then the corresponding level is in
service.
Software should not rely on a lower priority level interrupt source to remove PMM (Switchback) when a
higher level is in service. Check the current priority service level before entering PMM. If the current
service level locks out a desired Switchback source, then it would be advisable to wait until this condition
clears before entering PMM.
Alternately, software can prevent an undesired exit from PMM by entering a low priority interrupt service
level before entering PMM. This will prevent other low priority interrupts from causing a Switchback.
Status also contains information about the state of the serial ports. Serial Port 0 Receive Activity
(SPRA0;STATUS.0) indicates a serial word is being received on Serial Port 0 when this bit is set to a 1.
Serial Port 0 Transmit Activity (SPTA0; STATUS.1) indicates that the serial port is still shifting out a
serial transmission. STATUS.2 and STATUS.3 provide the same information for Serial Port 1,
respectively. These bits should be interrogated before entering PMM1 or PMM2 to ensure that no serial
port operations are in progress. Changing the clock divisor rate during a serial transmission or reception
will corrupt the operation.
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Crystal/Ring Operation
The DS87C520/DS83C520 allow software to choose the clock source as an independent selection from
the instruction cycle rate. The user can select crystal-based or ring oscillator-based operation under
software control. Power-on reset default is the crystal (or external clock) source. The ring may save
power depending on the actual crystal speed. To save still more power, software can then disable the
crystal amplifier. This process requires two steps. Reversing the process also requires two steps.
The XT/ RG bit (EXIF.3) selects the crystal or ring as the clock source. Setting XT/ RG = 1 selects the
crystal. Setting XT/ RG = 0 selects the ring. The RGMD (EXIF.2) bit serves as a status bit by indicating
the active clock source. RGMD = 0 indicates the CPU is running from the crystal. RGMD = 1 indicates it
is running from the ring. When operating from the ring, disable the crystal amplifier by setting the
XTOFF bit (PMR.3) to 1. This can only be done when XT/ RG = 0.
When changing the clock source, the selection will take effect after a one-instruction cycle delay. This
applies to changes from crystal to ring and vise versa. However, this assumes that the crystal amplifier is
running. In most cases, when the ring is active, software previously disabled the crystal to save power. If
ring operation is being used and the system must switch to crystal operation, the crystal must first be
enabled. Set the XTOFF bit to 0. At this time, the crystal oscillation will begin. The
DS87C520/DS83C520 then provide a warm-up delay to make certain that the frequency is stable.
Hardware will set the XTUP bit (STATUS.4) to a 1 when the crystal is ready for use. Then software
should write XT/ RG to 1 to begin operating from the crystal. Hardware prevents writing XT/ RG to 1
before XTUP=1. The delay between XTOFF = 0 and XTUP = 1 will be 65,536 crystal clocks in addition
to the crystal cycle startup time.
Switchback has no effect on the clock source. If software selects a reduced clock divider and enables the
ring, a Switchback will only restore the divider speed. The ring will remain as the time base until altered
by software. If there is serial activity, Switchback usually occurs with enough time to create proper baud
rates. This is not true if the crystal is off and the CPU is running from the ring. If sending a serial
character that wakes the system from crystal-less PMM, then it should be a dummy character of no
importance with a subsequent delay for crystal startup.
Figure 3 illustrates a typical decision set associated with PMM. Table 6 is a summary of the bits relating
to PMM and its operation.
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Table 6. PMM Control and Status Bit Summary
BIT LOCATION FUNCTION RESET WRITE ACCESS
XT/RG EXIF.3 Control. XT/RG = 1, runs from crystal or external
clock; XT/RG = 0, runs from internal ring oscillator. X
0 to 1 only when
XTUP = 1 and
XTOFF = 0
RGMD EXIF.2
Status. RGMD = 1, CPU clock = ring; RGMD = 0,
CPU clock = crystal. 0 None
CD1, CD0 PMR.7,
PMR.6
Control. CD1, 0 = 01, 4 clocks; CS1, 0 = 10, PMM1;
CD1, 0 = 11, PMM2. 0, 1
Write CD1, 0 = 10
or 11 only from
CD1, 0 = 01
SWB PMR.5
Control. SWB = 1, hardware invokes switchback to 4
clocks, SWB = 0, no hardware switchback. 0 Unrestricted
XTOFF PMR.3
Control. Disables crystal operation after ring is
selected. 0 1 only when
XT/RG = 0
PIP STATUS.7
Status. 1 indicates a power-fail interrupt in service. 0 None
HIP STATUS.6 Status. 1 indicates high priority interrupt in service. 0 None
LIP STATUS.5 Status. 1 indicates low priority interrupt in service. 0 None
XTUP STATUS.4 Status. 1 indicates that the crystal has stabilized. 1 None
SPTA1 STATUS.3 Status. Serial transmission on serial port 1. 0 None
SPRA1 STATUS.2 Status. Serial word reception on serial port 1. 0 None
SPTA0 STATUS.1 Status. Serial transmission on serial port 0. 0 None
SPRA0 STATUS.0 Status. Serial word reception on serial port 0. 0 None
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Figure 3. Invoking and Clearing PMM
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IDLE MODE
Setting the lsb of the Power Control register (PCON;87h) invokes the Idle mode. Idle will leave internal
clocks, serial ports and timers running. Power consumption drops because the CPU is not active. Since
clocks are running, the Idle power consumption is a function of crystal frequency. It should be
approximately one-half the operational power at a given frequency. The CPU can exit the Idle state with
any interrupt or a reset. Idle is available for backward software compatibility. The system can now reduce
power consumption to below Idle levels by using PMM1 or PMM2 and running NOPs.
STOP MODE ENHANCEMENTS
Setting Bit 1 of the Power Control register (PCON; 87h) invokes the Stop mode. Stop mode is the lowest
power state since it turns off all internal clocking. The ICC f a standard Stop mode is approximately 1A
(but is specified in the Electrical Specifications). The CPU will exit Stop mode from an eternal interrupt
or a reset condition. Internally generated interrupts (timer, serial port, Watchdog) are not useful since they
require clocking activity.
The DS87C520/DS83C520 provide two enhancements to the Stop mode. As documented below, the
device provides a bandgap reference to determine Power-Fail Interrupt and Reset thresholds. The default
state is that the bandgap reference is off while in Stop mode. This allows the extremely low-power state
mentioned above. A user can optionally choose to have the bandgap enabled during Stop mode. With the
bandgap reference enabled, PFI and Power-fail Reset are functional and are a valid means for leaving
Stop mode. This allows software to detect and compensate for a brownout or power supply sag, even
when in Stop mode. In Stop mode with the bandgap enabled, ICC will be approximately 50A compared
with 1A with the bandgap off. If a user does not require a Power-fail Reset or Interrupt while in Stop
mode, the bandgap can remain disabled. Only the most power-sensitive applications should turn off the
bandgap, as this results in an uncontrolled power-down condition.
The control of the bandgap reference is located in the Extended Interrupt Flag register (EXIF; 91h).
Setting BGS (EXIF.0) to a 1 will keep the bandgap reference enabled during Stop mode. The default or
reset condition is with the bit at a logic 0. This results in the bandgap being off during Stop mode. Note
that this bit has no control of the reference during full power, PMM, or Idle modes.
The second feature allows an additional power saving option while also making Stop easier to use. This is
the ability to start instantly when exiting Stop mode. It is the internal ring oscillator that provides this
feature. This ring can be a clock source when exiting Stop mode in response to an interrupt. The benefit
of the ring oscillator is as follows.
Using Stop mode turns off the crystal oscillator and all internal clocks to save power. This requires that
the oscillator be restarted when exiting Stop mode. Actual startup time is crystal-dependent, but is
normally at least 4ms. A common recommendation is 10 ms. In an application that will wake up, perform
a short operation, then return to sleep, the crystal startup can be longer than the real transaction. However,
the ring oscillator will start instantly. Running from the ring, the user can perform a simple operation and
return to sleep before the crystal has even started. If a user selects the ring to provide the startup clock and
the processor remains running, hardware will automatically switch to the crystal once a power-on reset
interval (65,536 clocks) has expired. Hardware uses this value to assure proper crystal start even though
power is not being cycled.
The ring oscillator runs at approximately 2MHz to 4MHz but will not be a precise value. Do not conduct
real-time precision operations (including serial communication) during this ring period. Figure 3 shows
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how the operation would compare when using the ring, and when starting up normally. The default state
is to exit Stop mode without using the ring oscillator.
The RGSL - Ring Select bit at EXIF.1 (EXIF; 91h) controls this function. When RGSL = 1, the CPU will
use the ring oscillator to exit Stop mode quickly. As mentioned above, the processor will automatically
switch from the ring to the crystal after a delay of 65,536 crystal clocks. For a 3.57MHz crystal, this is
approximately 18ms. The processor sets a flag called RGMD-Ring Mode, located at EXIF.2, that tells
software that the ring is being used. The bit will be a logic 1 when the ring is in use. Attempt no serial
communication or precision timing while this bit is set, since the operating frequency is not precise.
Figure 4. Ring Oscillator Exit from Stop Mode
EMI REDUCTION
One of the major contributors to radiated noise in an 8051-based system is the toggling of ALE. The
microcontroller allows software to disable ALE when not used by setting the ALEOFF (PMR.2) bit to 1.
When ALEOFF = 1, ALE will still toggle during an off-chip MOVX. However, ALE will remain in a
static mode when performing on-chip memory access. The default state of ALEOFF = 0 so ALE toggles
at a frequency of XTAL/4.
STOP MODE WITH RING STARTUP
STOP MODE WITHOUT RING STARTUP
NOTE: DIAGRAM ASSUMES THAT THE OPERATION FOLLOWING STOP REQUIRES
LESS THAN 18ms TO COMPLETE.
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PERIPHERAL OVERVIEW
The DS87C520/DS83C520 provide several of the most commonly needed peripheral functions in micro-
computer-based systems. These new functions include a second serial port, power-fail reset, power-fail
interrupt, and a programmable watchdog timer. These are described in the following paragraphs. More
details are available in the High-Speed Microcontroller User’s Guide.
SERIAL PORTS
The DS87C520/DS83C520 provide a serial port (UART) that is identical to the 80C52. In addition it
includes a second hardware serial port that is a full duplicate of the standard one. This port optionally
uses pins P1.2 (RXD1) and P1.3 (TXD1). It has duplicate control functions included in new SFR
locations.
Both ports can operate simultaneously but can be at different baud rates or even in different modes. The
second serial port has similar control registers (SCON1 at C0h, SBUF1 at C1h) to the original. The new
serial port can only use Timer 1 for timer generated baud rates.
TIMER RATE CONTROL
There is one important difference between the DS87C520/DS83C520 and 8051 regarding timers. The
original 8051 used 12 clocks per cycle for timers as well as for machine cycles. The
DS87C520/DS83C520 architecture normally uses four clocks per machine cycle. However, in the area of
timers and serial ports, the DS87C520/DS83C520 will default to 12 clocks per cycle on reset. This allows
existing code with real-time dependencies such as baud rates to operate properly.
If an application needs higher speed timers or serial baud rates, the user can select individual timers to run
at the 4-clock rate. The Clock Control register (CKCON;8Eh) determines these timer speeds. When the
relevant CKCON bit is a logic 1, the DS87C520/DS83C520 use 4 clocks per cycle to generate timer
speeds. When the bit is a 0, the DS87C520/DS83C520 use 12 clocks for timer speeds. The reset condition
is a 0. CKCON.5 selects the speed of Timer 2. CKCON.4 selects Timer 1 and CKCON.3 selects Timer 0.
Unless a user desires very fast timing, it is unnecessary to alter these bits. Note that the timer controls are
independent.
POWER-FAIL RESET
The DS87C520/DS83C520 use a precision bandgap voltage reference to decide if VCC is out of tolerance.
While powering up, the internal monitor circuit maintains a reset state until VCC rises above the VRST
level. Once above this level, the monitor enables the crystal oscillator and counts 65,536 clocks. It then
exits the reset state. This power-on reset (POR) interval allows time for the oscillator to stabilize.
A system needs no external components to generate a power-related reset. Anytime VCC drops below
VRST, as in power failure or a power drop, the monitor will generate and hold a reset. It occurs
automatically, needing no action from the software. Refer to the Electrical Specifications section for the
exact value of VRST.
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POWER-FAIL INTERRUPT
The voltage reference that sets a precise reset threshold also generates an optional early warning Power-
Fail Interrupt (PFI). When enabled by software, the processor will vector to program memory address
0033h if VCC drops below VPFW. PFI has the highest priority. The PFI enable is in the Watchdog Control
SFR (WDCON–D8h). Setting WDCON.5 to a logic 1 will enable the PFI. Application software can also
read the PFI flag at WDCON.4. A PFI condition sets this bit to a 1. The flag is independent of the
interrupt enable and software must manually clear it.
WATCHDOG TIMER
To prevent software from losing control, the DS87C520/DS83C520 include a programmable Watchdog
Timer. The Watchdog is a free-running timer that sets a flag if allowed to reach a preselected timeout. It
can be (re)started by software.
A typical application is to select the flag as a reset source. When the Watchdog times out, it sets its flag,
which generates reset. Software must restart the timer before it reaches its timeout or the processor is
reset.
Software can select one of four timeout values. Then, it restarts the timer and enables the reset function.
After enabling the reset function, software must then restart the timer before its expiration or hardware
will reset the CPU. Both the Watchdog Reset Enable and the Watchdog Restart control bits are protected
by a “Timed Access” circuit. This prevents errant software from accidentally clearing the Watchdog.
Timeout values are precise since they are a function of the crystal frequency as shown in Table 7. For
reference, the time periods at 33MHz also are shown.
The Watchdog also provides a useful option for systems that do not require a reset circuit. It will set an
interrupt flag 512 clocks before setting the reset flag. Software can optionally enable this interrupt source.
The interrupt is independent of the reset. A common use of the interrupt is during debug, to show
developers where the Watchdog times out. This indicates where the Watchdog must be restarted by
software. The interrupt also can serve as a convenient time-base generator or can wake-up the processor
from power saving modes.
The Watchdog function is controlled by the Clock Control (CKCON-8Eh), Watchdog Control (WDCON-
D8h), and Extended Interrupt Enable (EIE-E8h) SFRs. CKCON.7 and CKCON.6 are WD1 and WD0
respectively and they select the Watchdog timeout period as shown in Table 7.
Table 7. Watchdog Timeout Values
WD1 WD2 INTERRUPT
TIMEOUT TIME (33 MHz) RESET TIMEOUT TIME (33 MHz)
0 0 217 clocks 3.9718 ms 217 + 512 clocks 3.9874 ms
0 1 220 clocks 31.77 ms 220 + 512 clocks 31.79 ms
1 0 223 clocks 254.20 ms 223 + 512 clocks 254.21 ms
1 1 226 clocks 2033.60 ms 226 + 512 clocks 2033.62 ms
As shown in Table 7, the Watchdog Timer uses the crystal frequency as a time base. A user selects one of
four counter values to determine the timeout. These clock counter lengths are 217 = 131,072 clocks;
220 = 1,048,576; 223 = 8,388,608 clocks; and 226 = 67,108,864 clocks. The times shown in Table 7 are
with a 33MHz crystal frequency. Once the counter chain has completed a full interrupt count, hardware
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will set an interrupt flag. Regardless of whether the user enables this interrupt, there are then 512 clocks
left until the reset flag is set. Software can enable the interrupt and reset individually. Note that the
Watchdog is a free running timer and does not require an enable.
There are 5 control bits in special function registers that affect the Watchdog Timer and two status flags
that report to the user. WDIF (WDCON.3) is the interrupt flag that is set at timer termination when there
are 512 clocks remaining until the reset flag is set. WTRF (WDCON.2) is the flag that is set when the
timer has completely timed out. This flag is normally associated with a CPU reset and allows software to
determine the reset source.
EWT (WDCON.1) is the enable for the Watchdog timer reset function. RWT (WDCON.0) is the bit that
software uses to restart the Watchdog Timer. Setting this bit restarts the timer for another full interval.
Application software must set this bit before the timeout. Both of these bits are protected by Timed
Access. As mentioned previously, WD1 and 0 (CKCON .7 and 6) select the timeout. The Reset
Watchdog Timer bit (WDCON.0) should be asserted prior to modifying the Watchdog Timer Mode
Select bits (WD1, WD0) to avoid corruption of the watchdog count. Finally, the user can enable the
Watchdog Interrupt using EWDI (EIE.4). The Special Function Register map is shown above.
INTERRUPTS
The DS87C520/DS83C520 provide 13 interrupt sources with three priority levels. The Power-Fail
Interrupt (PFI) has the highest priority. Software can assign high or low priority to other sources. All
interrupts that are new to the 8051 family, except for the PFI, have a lower natural priority than the
originals.
Table 8. Interrupt Sources and Priorities
NAME FUNCTION VECTOR
NATURAL
PRIORITY 8051/DALLAS
PFI Power-Fail Interrupt 33h 1 DALLAS
INT0 External Interrupt 0 03h 2 8051
TF0 Timer 0 0Bh 3 8051
INT1 External Interrupt 1 13h 4 8051
TF1 Timer 1 1Bh 5 8051
SCON0 TI0 or RI0 from serial port 0 23h 6 8051
TF2 Timer 2 2Bh 7 8051
SCON1 TI1 or RI1 from serial port 1 3Bh 8 DALLAS
INT2 External Interrupt 2 43h 9 DALLAS
INT3 External Interrupt 3 4Bh 10 DALLAS
INT4 External Interrupt 4 53h 11 DALLAS
INT5 External Interrupt 5 5Bh 12 DALLAS
WDTI Watchdog Timeout Interrupt 63h 13 DALLAS
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TIMED-ACCESS PROTECTION
It is useful to protect certain SFR bits from an accidental write operation. The Timed Access procedure
stops an errant CPU from accidentally changing these bits. It requires that the following instructions
precede a write of a protected bit.
MOV 0C7h, #0Aah
MOV 0C7h, #55h
Writing an AAh then a 55h to the Timed Access register (location C7h) opens a 3-cycle window for write
access. The window allows software to modify a protected bit(s). If these instructions do not immediately
precede the write operation, then the write will not take effect. The protected bits are:
EXIF.0 BGS Bandgap Select
WDCON.6 POR Power-On Reset flag
WDCON.1 EWT Enable Watchdog Reset
WDCON.0 RWT Restart Watchdog
WDCON.3 WDIF Watchdog Interrupt Flag
ROMSIZE.2 RMS2 ROM Size Select 2
ROMSIZE.1 RMS1 ROM Size Select 1
ROMSIZE.0 RMS0 ROM Size Select 0
EPROM PROGRAMMING
The DS87C520 follows standards for a 16kB EPROM version in the 8051 family. It is available in a UV-
erasable, ceramic-windowed package and in plastic packages for one-time user-programmable versions.
The part has unique signature information so programmers can support its specific EPROM options.
ROM-specific features are described later in this data sheet.
Most commercially available device programmers will directly support Dallas Semiconductor
microcontrollers. If your programmer does not, please contact the manufacturer for updated software.
PROGRAMMING PROC EDURE
The DS87C520 should run from a clock speed between 4MHz and 6MHz when being programmed. The
programming fixture should apply address information for each byte to the address lines and the data
value to the data lines. The control signals must be manipulated as shown in Table 9. The diagram in
Table 5 shows the expected electrical connection for programming. Note that the programmer must apply
addresses in demultiplexed fashion to Ports 1 and 2 with data on Port 0. Waveforms and timing are
provided in the Electrical Specifications section.
Program the DS87C520 as follows:
1) Apply the address value,
2) Apply the data value,
3) Select the programming option from Table 9 using the control signals,
4) Increase the voltage on VPP from 5V to 12.75V if writing to the EPROM,
5) Pulse the PROG signal five times for EPROM array and 25 times for encryption table, lock bits, and
other EPROM bits,
6) Repeat as many times as necessary.
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Table 9. EPROM Programming Modes
MODE RST
PSEN ALE/PROG EA/VPP P2.6 P2.7 P3.3 P3.6 P3.7
Program Code Data H L PL 12.75V L H H H H
Verify Code Data H L H H L L L H H
Program Encryption Array
Address 0-3Fh H L PL 12.75V L H H L H
LB1 H L PL 12.75V H H H H H
LB2 H L PL 12.75V H H H L L
Program Lock Bits
LB3 H L PL 12.75V H L H H L
Program Option Register
Address FCh H L PL 12.75V L H H L L
Read Signature or Option
Registers 30, 31, 60 FCh H L H H L L L L L
Table 10. DS87C520 EPROM Lock Bits
LOCK BITS
LEVEL LB1 LB2 LB3 PROTECTION
1 U U U
No program lock. Encrypted verify if encryption table was
programmed.
2 P U U
Prevent MOVC instructions in external memory from reading
program bytes in internal memory. EA is sampled and latched on
reset. Allow no further programming of EPROM.
3 P P U
Level 2 plus no verify operation. Also, prevent MOVX
instructions in external memory from reading SRAM (MOVX) in
internal memory.
4 P P P Level 3 plus no external execution.
SECURITY OPTIONS
The DS87C520 employs a standard three-level lock that restricts viewing of the EPROM contents. A 64-
byte Encryption Array allows the authorized user to verify memory by presenting the data in encrypted
form.
Lock Bits
The security lock consists of three lock bits. These bits select a total of four levels of security. Higher
levels provide increasing security but also limit application flexibility. Table 10 shows the security
settings. Note that the programmer cannot directly read the state of the security lock. User software has
access to this information as described in the Memory section.
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Encryption Array
The Encryption Array allows an authorized user to verify EPROM without allowing the true memory to
be dumped. During a verify, each byte is Exclusive NORed (XNOR) with a byte in the Encryption Array.
This results in a true representation of the EPROM while the Encryption is unprogrammed (FFh). Once
the Encryption Array is programmed in a non-FFh state, the verify value will be encrypted.
For encryption to be effective, the Encryption Array must be unknown to the party that is trying to verify
memory. The entire EPROM also should be a non-FFh state or the Encryption Array can be discovered.
The Encryption Array is programmed as shown in Table 9. Note that the programmer cannot read the
array. Also note that the verify operation always uses the Encryption Array. The array has no impact
while FFh. Simply programming the array to a non-FFh state will cause the encryption to function.
OTHER EPROM OPTIONS
The DS87C520 has user selectable options that must be set before beginning software execution. These
options use EPROM bits rather than SFRs.
Program the EPROM selectable options as shown in Table 9. The Option Register sets or reads these
selections. The bits in the Option Control Register have the following function:
Bits 7 to 4 Reserved, program to a 1.
Bit 3 Watchdog POR default. Set = 1; watchdog reset function is disabled on power-up.
Set = 0; watchdog reset function is enabled automatically.
Bits 2 to 0 Reserved. Program to a 1.
SIGNATURE
The Signature bytes identify the product and programming revision to EPROM programmers. This
information is at programming addresses 30h, 31h, and 60h.
ADDRESS VALUE MEANING
30h DAh Manufacturer
31h 20h Model
60h 01h Extension
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Figure 5. EPROM Programming Configuration
ROM-SPECIFIC FEATURES
The DS83C520 supports a subset of the EPROM features found on the DS87C520.
SECURITY OPTIONS
Lock Bits
The DS83C520 employs a lock that restricts viewing of the ROM contents. When set, the lock will
prevent MOVC instructions in external memory from reading program bytes in internal memory. When
locked, the EA pin is sampled and latched on reset. The lock setting is enabled or disabled when the
devices are manufactured according to customer specifications. The lock bit cannot be read in software,
and its status can only be determined by observing the operation of the device.
Encryption Array
The DS83C520 Encryption Array allows an authorized user to verify ROM without allowing the true
memory contents to be dumped. During a verify, each byte is Exclusive NORed (XNOR) with a byte in
the Encryption Array. This results in a true representation of the ROM while the Encryption is
unprogrammed (FFh). Once the Encryption Array is programmed in a non-FFh state, the Encryption
Array is programmed (or optionally left unprogrammed) when the devices are manufactured according to
customer specifications.
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DS83C520 ROM VERIFICATION
The DS83C520 memory contents can be verified using a standard EPROM programmer. The memory
address to be verified is placed on the pins shown in Figure 5, and the programming control pins are set to
the levels shown in Table 9. The data at that location is then asserted on port 0.
DS83C520 SIGNATURE
The Signature bytes identify the DS83C520 to EPROM programmers. This information is at
programming addresses 30h, 31h, and 60h. Because mask ROM devices are not programmed in device
programmers, most designers will find little use for the feature, and it is included only for compatibility.
ADDRESS VALUE MEANING
30h DAh Manufacturer
31h 21h Model
60h 01h Extension
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ABSOLUTE MAXIMUM RATINGS
Voltage Range on Any Pin Relative to Ground………………… …………………………………….-0.3V to (VCC + 0.5V)
Voltage Range on VCC Relative to Ground..………… ……………………………………………… ……….-0.3V to +6.0V
Operating Temperature Range…………………………………………………… ………………………….-40°C to +85° C
Storage Temperature…… ……………………………………………… ……………………………………-55°C to +12 C
Soldering Temperature..………………………………………………………..See IPC/JEDEC J-STD-020 Specification
This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = 4.5V, TA = -40°C to +85°C.) (Note 1)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Supply Voltage VCC 4.5 5.0 5.5 V 2
DS87C520 4.25 4.38 4.5
Power-Fail Warning DS83C520 VPFW 4.25 4.38 4.55 V 2
DS87C520 4.0 4.13 4.25 Minimum Operating
Voltage DS83C520 VRST 4.0 4.13 4.275 V 2
Supply Current Active Mode
at 33MHz ICC 30 45 mA 3
Supply Current Idle Mode at 33MHz IIDLE 15 25 mA 4
Supply Current Stop Mode, Bandgap
Disabled
(0°C to +70°C)
1 100
A 5
Supply Current Stop Mode, Bandgap
Disabled
(-40°C to +85°C)
ISTOP
1 150
A 5
Supply Current Stop Mode, Bandgap
Enabled
(0°C to +70°C)
50 170 μA 5
Supply Current Stop Mode, Bandgap
Enabled
(-40°C to +85°C)
ISPBG
50 195
A 5
Input Low Level VIL -0.3 +0.8 V 2
Input High Level
(except XTAL1 and RST) VIH 2.0 VCC + 0.3 V 2
Input High Level XTAL1 and RST VIH2 3.5 VCC + 0.3 V 2
Output Low Voltage, Ports 1 and 3
at IOL = 1.6mA VOL1 0.15 0.45 V 2
Output Low Voltage Ports 0 and 2,
ALE, PSEN at IOL = 3.2mA VOL2 0.15 0.45 V 2
Output High Voltage Ports 1, 2, 3,
ALE, PSEN at IOH = -50μA VOH1 2.4 V 2, 7
Output High Voltage Ports 1, 2, 3
at IOH = -1.5mA VOH2 2.4 V 2, 8
Output High Voltage Port 0, 2,
ALE, PSEN in Bus Mode at IOH = -8mA VOH3 2.4 V 2, 6
Input Low Current Ports 1, 2, 3 at 0.45V IIL -70 μA 12
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DC ELECTRICAL CHARACTERISTICS (continued)
(VCC = 4.5V, TA = -40°C to +85°C.)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Transition Current from 1 to 0 Ports 1, 2, 3
at 2V ITL -800 μA 9
Input Leakage Port 0, and EA pins, I/O
Mode IL -10 +10 μA 11
Input Leakage Port 0, Bus Mode IL -300 +300 μA 10
RST Pulldown Resistance RRST 50 200
k
Note 1: All parameters apply to both commercial and industrial temperature operation, unless otherwise noted.
Note 2: All voltages are referenced to ground.
Note 3: Active current measured with 33MHz clock source on XTAL1, VCC = RST = 5.5V, other pins disconnected.
Note 4: Idle mode current measured with 33MHz clock source on XTAL1, VCC = 5.5V, RST at ground, other pins
disconnected.
Note 5: Stop mode current measured with XTAL1 and RST grounded, VCC = 5.5V, all other pins disconnected.
Note 6: When addressing external memory. This specification only applies to the first clock cycle following the transition.
Note 7: RST = VCC. This condition mimics operation of pins in I/O mode. Port 0 is tri-stated in reset and when at a logic high
state during I/O mode.
Note 8: During a 0-to-1 transition, a one-shot drives the ports hard for t wo clock cycles. This measurement reflects port in
transition mode.
Note 9: Ports 1, 2, and 3 source transition current when being pulled down externally. It reaches its maximum at approximately
2V.
Note 10: 0.45 < VIN < VCC. Not a high-impedance input. This port is a weak address holding l atch in Bus Mode. Peak current
occurs near the input transition point of the latch, approximately 2V.
Note 11: 0.45 < VIN < VCC. RST = VCC. This condition mimics operation of pins in I/O mode.
Note 12: This is the current required from an external circuit to hold a logic low level on an I/O pin while the corresponding port
latch bit is set to 1. This is only the current required to hold the low level; transitions from 1 to 0 on an I/O pin will also
have to overcome the transition current.
TYPICAL ICC vs. FREQUENCY
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AC ELECTRICAL CHARACTERISTICS (Note 1)
33 MHz VARIABLE CLOCK
PARAMETER SYMBOL MIN MAX MIN MAX UNITS
External Oscillator 0 33 0 33
Oscillator
Frequency External Crystal 1/tCLCL 1 33 1 33
MHz
ALE Pulse Width tLHLL 40 1.5tCLCL-5 ns
Port 0 Address Valid to ALE Low tAVLL 10 0.5tCLCL-5 ns
Address Hold after ALE Low tLLAX1 (Note 2) (Note 2) ns
ALE Low to Valid Instruction In tLLIV 43 2.5tCLCL-33 ns
ALE Low to PSEN Low tLLPL 4 0.5tCLCL-11 ns
PSEN Pulse Width tPLPH 55 2tCLCL-5 ns
PSEN Low to Valid Instruction In tPLIV 37 2tCLCL-24 ns
Input Instruction Hold after PSEN tPXIX 0 0 ns
Input Instruction Float after PSEN tPXIZ 26 tCLCL-5 ns
Port 0 Address to Valid Instruction In tAVIV1 59 3tCLCL-32 ns
Port 2 Address to Valid Instruction In tAVIV2 68 3.5tCLCL-38 ns
PSEN Low to Address Float tPLAZ (Note 2) (Note 2) ns
Note 1: All parameters apply to both commercial and industrial temperature range operation unless otherwise noted.
Specifications to -40°C are guaranteed by design and are not production tested. AC electrical characteristics are not
100% tested, but are characterized and guar antee d by desi gn. All si gnals charac ter ized with lo ad c apacitance of 80p F
except Port 0, ALE, PSEN, RD, and WR with 100pF. Interfacing to memory devices with float times (turn off times)
over 25ns may cause contention. This will not damage the parts, but will cause an increase in operating current.
Specifications assume a 50% duty cycle for the oscillator. Port 2 and ALE timing will change in relation to duty cycle
variation.
Note 2: Address is driven strongly until ALE falls, and is then held in a weak latch until overdriven externally.
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MOVX CHARACTERISTICS
VARIABLE CLOCK
PARAMETER SYMBOL
MIN MAX
UNITS STRETCH
1.5tCLCL-5 tMCS=0
Data Access ALE Pulse Width tLHLL2 2tCLCL-5 ns tMCS>0
0.5tCLCL-5 tMCS=0
Port 0 Address Valid to ALE Low tAVLL2 tCLCL-5 ns tMCS>0
0.5tCLCL-10 tMCS=0
Address Hold after ALE Low for
MOVX Write tLLAX2 tCLCL-7 ns tMCS>0
2tCLCL-5 tMCS=0
RD Pulse Width tRLRH tMCS-10 ns tMCS>0
2tCLCL-5 tMCS=0
WR Pulse Width tWLWH tMCS-10 ns tMCS>0
2tCLCL-22 tMCS=0
RD Low to Valid Data In tRLDV t
MCS-24 ns tMCS>0
Data Hold After Read tRHDX 0 ns
t
CLCL-5 tMCS=0
Data Float after Read tRHDZ 2tCLCL-5 ns tMCS>0
2.5tCLCL-31 tMCS=0
ALE Low to Valid Data In tLLDV t
MCS+tCLCL-26 ns tMCS>0
3tCLCL-29 tMCS=0
Port 0 Address to Valid Data In tAVDV1
tMCS+2tCLCL-
29
ns
tMCS>0
3.5tCLCL-37 tMCS=0
Port 2 Address to Valid Data In tAVDV2
tMCS+2.5tCLCL-
37
ns
tMCS>0
0.5tCLCL-10 0.5tCLCL+5 tMCS=0
ALE Low to RD or WR Low tLLWL tCLCL-5 tCLCL+5 ns tMCS>0
tCLCL-9 tMCS=0
Port 0 Address to RD or WR Low tAVWL1 2tCLCL-7 ns tMCS>0
1.5tCLCL-17 tMCS=0
Port 2 Address to RD or WR Low tAVWL2 2.5tCLCL-16 ns tMCS>0
Data Valid to WR Transition tQVWX -6 ns
tCLCL-5 tMCS=0
Data Hold after Write tWHQX 2tCLCL-6 ns tMCS>0
RD Low to Address Float tRLAZ (Note 2) ns
-4 10 tMCS=0
RD or WR High to ALE High tWHLH tCLCL-5 tCLCL+5 ns tMCS>0
Note 1: tMCS is a time period related to the Stretch memory cycle selection. The following table shows the value of tMCS for
each Stretch selection.
Note 2: Address is driven strongly until ALE falls, and is then held in a weak latch until overdriven externall y.
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MOVX CHARACTERISTICS (continued)
M2 M1 M0 MOVX CYCLES tMCS
0 0 0 2 machine cycles 0
0 0 1 3 machine cycles (default) 4 tCLCL
0 1 0 4 machine cycles 8 tCLCL
0 1 1 5 machine cycles 12 tCLCL
1 0 0 6 machine cycles 16 tCLCL
1 0 1 7 machine cycles 20 tCLCL
1 1 0 8 machine cycles 24 tCLCL
1 1 1 9 machine cycles 28 tCLCL
EXTERNAL CLOCK CHARACTERISTICS
PARAMETER SYMBOL MIN TYP MAX UNITS
Clock High Time tCHCX 10 ns
Clock Low Time tCLCX 10 ns
Clock Rise Time tCLCL 5 ns
Clock Fall Time tCHCL 5 ns
SERIAL PORT MODE 0 TIMING CHARACTERISTICS
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SM2 = 0, 12 clocks per cycle 12tCLCL
Serial Port Clock Cycle
Time tXLXL
SM2 = 1, 4 clocks per cycle 4tCLCL
ns
SM2 = 0, 12 clocks per cycle 10tCLCL
Output Data Setup to
Clock Rising tQVXH
SM2 = 1, 4 clocks per cycle 3tCLCL
ns
SM2 = 0, 12 clocks per cycle 2tCLCL
Output Data Hold from
Clock Rising tXHQX
SM2 = 1, 4 clocks per cycle tCLCL
ns
SM2 = 0, 12 clocks per cycle tCLCL
Input Data Hold after
Clock Rising tXHDX
SM2 = 1, 4 clocks per cycle tCLCL
ns
SM2 = 0, 12 clocks per cycle 11tCLCL
Clock Rising Edge to
Input Data Valid tXHDV
SM2 = 1, 4 clocks per cycle 3tCLCL
ns
DS87C520/DS83C520 EPROM/ROM High-Speed Microcontrollers
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EXPLANATION OF AC SYMBOLS
In an effort to remain compatible with the original 8051 family, the DS87C520 and DS83C520 specify
the same parameters as such devices, using the same symbols. For completeness, the following is an
explanation of the symbols.
t Time
A Address
C Clock
D Input data
H Logic level high
L Logic level low
I Instruction
P PSEN
Q Output data
R RD signal
V Valid
W WR signal
X No longer a valid logic
level
Z Tri-State
POWER-CYCLE TIMING CHARACTERISTI CS
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Cycle Startup Time tCSU 1.8 ms 1
Power-On Reset Delay tPOR 65,536 tCLCL 2
Note 1: Startup time for crystals varies with load capacitance and manufacturer. Time shown is for an 11.0592MHz crystal
manufactured by Fox.
Note 2: Reset de lay is a synchronous counter of crystal oscillations after crystal startup. Counting begins when the level
on the XTAL1 pin meets the V IH2 criteria. At 33MHz, this time is 1.99ms.
EPROM PROGRAMMING AND VERIFICATION
(VCC = 4.5V to 5.5V, TA = +21C to +27°C.)
PARAMETER SYMBOL MIN TYP MAX UNITS NOTES
Programming Voltage VPP 12.5 13.0 V 1
Programming Supply Current IPP 50 mA
Oscillator Frequency 1/tCLCL 4 6 MHz
Address Setup to PROG Low tAVGL 48tCLCL
Address Hold after PROG tGHAX 48 tCLCL
Data Setup to PROG Low tDVGL 48 tCLCL
Data Hold after PROG tGHDX 48 tCLCL
Enable High to VPP tEHSH 48 tCLCL
VPP Setup to PROG Low tSHGL 10 μs
VPP Hold after PROG tSHGL 10 μs
PROG Width tGLGH 90 110 μs
Address to Data Valid tAVQV 48 tCLCL
Enable Low to Data Valid tELQV 48 tCLCL
Data Float after Enable tEHQZ 0 48 tCLCL
PROG High to PROG Low tGHGL 10 μs
Note 1: All voltages are referenced to ground.
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DS87C520/DS83C520 EPROM/ROM High-Speed Microcontrollers
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EXTERNAL PROGRAM MEMORY READ CYCLE
EXTERNAL DATA MEMORY READ CYCLE
tAVLL2
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EXTERNAL DATA MEMORY WRITE CYCLE
DATA MEMORY WRITE WITH STRETCH = 1
2
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DATA MEMORY WRITE WITH STRETCH = 2
FOUR CYCLE DATA MEMORY WRITE
STRETCH VALUE=2
EXTERNAL CLOCK DRIVE
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SERIAL PORT MODE 0 TIMING
SERIAL PORT 0 (SYNCHRONOUS MODE)
HIGH SPEED OPERATION SM2=1=>TXD CLOCK=XTAL/4
DS87C520/DS83C520 EPROM/ROM High-Speed Microcontrollers
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POWER-CYCLE TIMING
EPROM PROGRAMMING AND VERIFICATION WAVEFORMS
DS87C520/DS83C520 EPROM/ROM High-Speed Microcontrollers
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PACKAGE INFORMATION
For the latest package outline information, go to www.maxim-ic.com/packages.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
44 TQFP C44+3 21-0293
40 CDIP J40-5 21-0384
40 PDIP P40+4 21-0044
44 PLCC Q44+9 21-0049
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DATA SHEET REVISION SUMMARY
REVISION DESCRIPTION
110195 Preliminary release.
022097
1) Update ALE pin description.
2) Add note pertaining to erasure window.
3) Add note pertaining to internal MOVX SRAM.
4) Change Note 10 from RST = 5.5V to RST = VCC.
5) Change serial port mode 0 timing diagram label from tQVXL to tQVXH.
070698
1) Update PMM operating current estimates
2) Added note to clarify IIL specification.
3) Added note to prevent accidental corruption of Watchdog Timer count while changing counter length.
4) Changed minimum oscillator frequency to 1MHz when using external crystal.
5) Changed RST pulldown resistance from 170kto 200kmaximum.
6) Corrected “Data memory write with stretch” diagrams to show falling edge of ALE coincident with
rising edge of C3 clock.
070300 1) Corrected P0 pinout description for TQFP package.
2) Clarified point at which reset delay begins.
040104
1) Removed “Preliminary” status.
2) Soldering temperature parameter now references JEDEC specification.
3) Added note to absolute maximums clarifying voltages referenced to ground.
4) Updated ICC, IIDLE, ISTOP, ISPBG, IIL, and ITL to incorporate errata conditions.
5) Added note clarifying DC electrical test conditions.
6) Added note clarifying VOH3 specification applies to first clock cycle following the transition.
7) Updated AC and MOVX electrical characteristics with final characterization values.
Added tAVLL2 specification and corrected MOVX timing diagrams to show tAVLL2 instead of tAVLL.
070505 1) Added Pb-free/RoHS-compliant part numbers to Ordering Information table.
2) Deleted the “A” from the IPC/JEDEC J-STD-020 specification in the Absolute Maximum Ratings.
091605 1) In DC Electrical Characteristics table, added separate specification for DS83C520 VPFW.
2) Changed VRST max to from 4.25V to 4.275V for DS83C520 value.
022207
1) (Page 30) In the Absolute Maximum Ratings table, changed the operating range from 0C to +70C to
-40C to +85C (correction for typographical error; this does not reflect a change in the device or device
testing).
2) (Page 33) In the MOVX Characteristics table, added Note 2 and changed tRLAZ max from Note 1 to
Note 2.
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