NOTICE OF REVISION (NOR) 1. DATE (YYMMDD) This revision described below has been authorized for the document listed. 95-01-25 Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Department of Defense, Washingtion Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office of Management and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503. PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EITHER OF THESE ADDRESSED. RETURN COMPLETED FORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM. b. ADDRESS (Street, City, State, Zip Code) 4. ORIGINATOR Defense Electronics Supply Center 1507 Wilmington Pike Dayton, OH 45444-5270 a. TYPED NAME (First, Middle Initial, Last) 5. CAGE CODE 67268 7. CAGE CODE 67268 9. TITLE OF DOCUMENT Microcircuit, Linear, 12-Bit A/D Converter with Microprocessor Interface, Monolithic Silicon. 10. REVISION LETTER a. CURRENT C b. NEW Form Approved OMB No. 07040188 2. PROCURING ACTIVITY NO. 3. DODAAC 6. NOR NO. 5962-R060-95 8. DOCUMENT NO. 5962-91690 11. ECP NO. No registered users D 12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES 13. DESCRIPTION OF REVISION Sheet 1: Revisions ltr column; add "D". Revisions description column; add "Changes in accordance with NOR 5962-R060-95". Revisions date column; add "95-01-25". Revision level block; add "D". Rev status of sheets; For sheets 1 and 10, add "D". Sheet 10: Figure 1, Terminal connections; Terminal symbol columns, Change column for device types "01 and 02" to device types "01, 02, and 04". Change column for device types "03 and 04" to device type "03". Revision level block; add "D". 14. THIS SECTION FOR GOVERNMENT USE ONLY a. (X one) X (1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this change. (3) Custodian of master document shall make above revision and furnish revised document. b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT c. TYPED NAME (First, Middle Initial, Last) DESC-ELDS Michael A. Frye d. TITLE Chief, Microelectronics Branch e. SIGNATURE Michael A. Frye f. DATE SIGNED (YYMMDD) 95-01-25 15a. ACTIVITY ACCOMPLISHING REVISION b. REVISION COMPLETED (Signature) DESC-ELDS Sandra Rooney c. DATE SIGNED (YYMMDD) 95-01-25 DD Form 1695, APR 92 Previous editions are obsolete 1. DATE (YYMMDD) NOTICE OF REVISION (NOR) 95-01-17 Form Approved OMB No. 07040188 This revision described below has been authorized for the document listed. Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Department of Defense, Washingtion Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office of Management and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503. PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EITHER OF THESE ADDRESSED. RETURN COMPLETED FORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM. b. ADDRESS (Street, City, State, Zip Code) 4. ORIGINATOR Defense Electronics Supply Center 1507 Wilmington Pike Dayton, OH 45444-5270 a. TYPED NAME (First, Middle Initial, Last) 5. CAGE CODE 67268 7. CAGE CODE 67268 2. PROCURING ACTIVITY NO. 3. DODAAC 6. NOR NO. 5962-R017-95 8. DOCUMENT NO. 5962-91690 9. TITLE OF DOCUMENT Microcircuit, Linear, 12-Bit A/D converter with 10. REVISION LETTER 11. ECP NO. microprocessor interface, Monolithic Silicon. a. CURRENT registered users B b. NEW C 12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES 13. DESCRIPTION OF REVISION Sheet 1: Revisions ltr column; add "C". Revisions description column; add "Changes in accordance with NOR 5962-R017-95". Revisions date column; add "95-01-17". Revision level block; add "C". Rev status of sheets; For sheets 1 and 6, add "C". Sheet 6: Table I, Internal reference voltage test, VREF; For device type 04, change minimum limit from "9.97 V" to "9.9 V" and change maximum limit from "10.03 V" to "10.1 V". Revision level block; add "C". 14. THIS SECTION FOR GOVERNMENT USE ONLY a. (X one) X (1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this change. (3) Custodian of master document shall make above revision and furnish revised document. b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT c. TYPED NAME (First, Middle Initial, Last) DESC-ELDS Michael A. Frye d. TITLE Chief, Microelectronics Branch e. SIGNATURE Michael A. Frye f. DATE SIGNED (YYMMDD) 95-01-17 15a. ACTIVITY ACCOMPLISHING REVISION b. REVISION COMPLETED (Signature) DESC-ELDS Sandra Rooney c. DATE SIGNED (YYMMDD) 95-01-17 DD Form 1695, APR 92 Previous editions are obsolete No REVISIONS LTR B DESCRIPTION APPROVED DATE (YR-MO-DA) Redrawn with changes. Add device type 04. Add vendor CAGE 33256 94-09-01 M.A. Frye THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV B B B B B SHEET 15 16 17 18 19 REV STATUS OF SHEETS PMIC N/A STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REV B B B B B B B B B B B B B B SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PREPARED BY Sandra Rooney DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 CHECKED BY Charles E. Besore APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, 12-BIT A/D CONVERTER WITH MICROPROCESSOR INTERFACE, MONOLITHIC SILICON DRAWING APPROVAL DATE 92-05-14 SIZE REVISION LEVEL B A SHEET DESC FORM 193 JUL 94 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. CAGE CODE 5962-91690 67268 1 OF 19 5962-E396-94 1. SCOPE 1.1 Scope. This drawing forms a part of a one part - part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 | | | Federal stock class designator \ | | | RHA designator (See 1.2.1) 01 | | 91690 Device type (See 1.2.2) / M | | | Device class designator (See 1.2.3) X | | | Case outline (See 1.2.4) X | | | Lead finish (See 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. Device classes M RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number 01 674ZA 02 674ZB 03 04 674BT 674AT Circuit function High performance, 12-bit A/D converter with microprocessor interface and S/H Medium performance, 12-bit A/D converter with microprocessor interface and S/H 12-bit A/D converter with microprocessor interface 12-bit A/D converter with microprocessor interface 1.2.3 Device class designator. The device class designator shall be a single letter identifying the product assurance level as follows: Device class M Q or V Device requirements documentation Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Certification and qualification to MIL-I-38535 1.2.4 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter X 3 Descriptive designator GDIP1-T28 or CDIP2-T28 CQCC1-N28 Terminals 28 28 Package style dual-in-line square chip carrier package 1.2.5 Lead finish. The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for classes M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 2 1.3 Absolute maximum ratings. 1/ VCC to digital common - - - - - - - - - - - - - - - - - - - - - - VEE to digital common 2/ - - - - - - - - - - - - - - - - - - - - VLOGIC to digital common - - - - - - - - - - - - - - - - - - - Analog common to digital common: Device types 01 and 02 - - - - - - - - - - - - - - - - - - - Device type 03 - - - - - - - - - - - - - - - - - - - - - - - - - - Control inputs (CE, CS, Ao, 12/8, R/C) to digital common - - - - - - - - - - - - - - - - - - - - - - - - - - Analog inputs (REF IN, BIP OFF, 10 VIN) to analog common - - - - - - - - - - - - - - - - - - - - - - - - - 20 VIN analog input voltage to analog common - - - - VREF OUT - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - momentary short to VCC Power dissipation (PD): Device types 01 and 02 (TA = +25(C) - - - - - - - - - - Device type 03 (TA = +25(C) - - - - - - - - - - - - - - - - Lead temperature (soldering, 10 seconds) - - - - - - - - Storage temperature - - - - - - - - - - - - - - - - - - - - - - Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - Thermal resistance, junction-to-case (JC) - - - - - - - Thermal resistance, junction-to-ambient (JA): Device types 01 and 02 case X - - - - - - - - - - - - - - Device type 03 case X - - - - - - - - - - - - - - - - - - - - Device type 04 case X - - - - - - - - - - - - - - - - - - - - - Case 3 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 0 V dc to +16.5 V dc 0 V dc to -16.5 V dc 0 V dc to +7 V dc -0.5 V dc to +1 V dc 1 V dc -0.5 V dc to VLOGIC + 0.5 V dc 16.5 V dc 24 V dc Indefinite short to common 1000 mW 470 mW +300(C -65(C to +150(C +175(C See MIL-STD-1835 48(C/W 60(C/W 50(C/W 48(C/W 1.4 Recommended operating conditions. Logic supply voltage (VLOGIC) - - - - - - - - - - - - - - - - Positive supply voltage (VCC) - - - - - - - - - - - - - - - - Negative supply voltage (VEE) 2/ - - - - - - - - - - - - - - Ambient operating temperature range (TA) - - - - - - - - - +4.5 V dc to +5.5 V dc +11.4 V dc to +16.5 V dc -11.4 V dc to -16.5 V dc -55(C to +125(C 2. APPLICABLE DOCUMENTS 2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATIONS MILITARY MIL-I-38535 - Integrated Circuits, Manufacturing, General Specification for. - Test Methods and Procedures for Microelectronics. Configuration Management. Microcircuit Case Outlines. STANDARDS MILITARY MIL-STD-883 MIL-STD-973 MIL-STD-1835 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ VEE is not required for operation of devices 01 and 02, and 04. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 3 BULLETIN MILITARY MIL-BUL-103 - List of Standardized Military Drawings (SMD's). - Standardized Military Drawings. HANDBOOK MILITARY MIL-HDBK-780 (Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device class M shall be in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein. The individual item requirements for device classes Q and V shall be in accordance with MIL-I-38535, the device manufacturer's Quality Management (QM) plan, and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-STD-883 (see 3.1 herein) for classes M and MIL-I-38535 for device classes Q and V and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Block or logic diagram. The block or logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are described in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein). In addition, the manufacturer's PIN may also be marked as listed in MIL-BUL-103. Marking for device classes Q and V shall be in accordance with MIL-I-38535. 3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a "C" as required in MIL-STD-883 (see 3.1 herein). The certification mark for device classes Q and V shall be a "QML" as required in MIL-I-38535. 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.2 herein). For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.1 herein). The certificate of compliance submitted to DESC-ECS prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device class M the requirements of MIL-STD-883 (see 3.1 herein), or for device classes Q and V, the requirements of MIL-I-38535 and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein) or for device classes Q and V in MIL-I-38535 shall be provided with each lot of microcircuits delivered to this drawing. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 4 TABLE I. Electrical performance characteristics. Test Power supply current from VLOGIC 2/ Power supply current from VCC 2/ Power supply current from VEE Symbol ILOGIC Conditions 1/ -55C TA +125C VCC = +15 V, VLOGIC = +5 V, unless otherwise specified Group A subgroups Three-state outputs 1, 2, 3 ICC 1, 2, 3 IEE ILE Limits Min Resolution Integral linearity error Device type Unipolar 10 V span Bipolar 20 V span Max 01,02 04 +1.0 03 +7.0 01,02 04 +9.0 03 +7.0 1, 2, 3 03 -14 1 All 12 2, 3 All -0.5 +0.5 All -1.0 +1.0 1, 2, 3 All 12 DLE Unipolar offset voltage error VIO 10 V span 1 All -2.0 +2.0 Unipolar offset voltage ddrift wVIO ------wT 10 V span Using internal reference 2, 3 All -1.0 +1.0 Bipolar zero offset error BZ 20 V span 1 01,02 04 -4.0 +4.0 03 -3.0 +3.0 02,03 04 -2.0 +2.0 01 -1.0 +1.0 Gain error wB Z ------wT AE 20 V span Using internal reference 2, 3 Bipolar 20 V span 50 resistor from REF OUT to REF IN 1 6 01,02 04 mA Bits Differential linearity error (minimum resolution for which no missing codes are guaranteed) Bipolar zero offset drift Unit LSB Bits LSB %FSR 03 See footnotes at end of table. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Gain error drift Symbol wA E w-------T Conditions 1/ -55C TA +125C VCC = +15 V, VLOGIC = +5 V, unless otherwise specified Group A subgroups Bipolar 20V span Using internal reference 2, 3 Device type Limits Min Unit Max 01 12.5 02,04 25.0 03 17.5 ppm/C Power supply sensitivity to VCC 3/ 4/ +PSS1 1, 2, 3 All -1.0 +1.0 Power supply sensitivity to VLOGIC 3/ 5/ +PSS2 1, 2, 3 All -0.5 +0.5 Power supply sensitivity to VEE 3/ 6/ -PSS3 1, 2, 3 03 -1.0 +1.0 Input impedence 2/ ZIN 1, 2, 3 01,02 04 3.75 6.25 03 3.0 7.0 01,02 04 15 25 03 6 14 01,02 04 9.97 10.03 03 9.9 10.1 10 V span 20 V span Internal reference voltage 7 VREF 1, 2, 3 IREFOUT = 2 mA 1, 2, 3 LSB k 6 V Logic input high voltage (CE, CS, 12/8, R/C, AO) 2/ 8/ VIH Logic "1" 1, 2, 3 All +2.0 +5.5 V Logic input low voltage (CE, CS, 12/8, R/C, AO) 2/ 8/ VIL Logic "0" 1, 2, 3 All -0.5 +0.8 V See footnotes at end of table. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Logic input current 2/ Symbol IIN(LOG) Conditions 1/ -55C TA +125C VCC = +15 V, VLOGIC = +5 V, unless otherwise specified Group A subgroups 0 to +5.5 V input 1, 2, 3 Device type Limits Min 0 to + 5.0 V input 01,02 Max +1.0 04 -20 +20 03 -10 +10 Logic low output voltage 2/ (DB11-DB0) VOL Logic "0" Isink = 1.6 mA 1, 2, 3 All Logic high output voltage 2/ (DB11-DB0) VOH Logic "1" Isource = 500 A 1, 2, 3 All +2.4 Three-state output leakage current IZ High-Z state (DB11 - DB0 only) Vapplied = 5.0 V 1, 2, 3 01,02 -5.0 +5.0 03 -10 +10 04 -20 +20 Functional tests 2/ Low R/C pulse width 9/ tHRL STS delay from R/C tDS See section 4.4.1b 7, 8 All See figure 4 9, 10, 11 All +0.4 50 01,02 04 200 03 225 All 25 STS delay after data valid tHS 01,02 04 300 1000 03 30 600 Data access time 12/ tDDR All V A ns tHDR tHRH A V Data valid after R/C low 11/ High R/C pulse width 9/ Unit 150 150 See footnotes at end of table. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 7 TABLE I. Electrical performance characteristics - Continued. Test Symbol tDSC STS delay from CE 10/ CE pulse width 9/ Conditions 1/ -55C TA +125C VCC = +15 V, VLOGIC = +5 V, unless otherwise specified Group A subgroups See figure 5 1, 2, 3 tSSC Conversion time 13/ tC Limits Min tHEC CS to CE setup Device type 200 03 225 50 8-bit cycle, see figure 5 9, 10, 11 All See figure 5 9, 10, 11 10 9 15 tHSC R/C to CE setup tSRC 50 R/C low during CE high tHRC 50 A0 to CE setup tSAC 0 A0 valid during CE high tHAC 50 Access time (from CE) 12/ tDD Data valid after CE low 11/ tHD See figure 6 9, 10, 11 11 All 6 CS low during CE tHL 9, 10, 11 s 50 All 150 01,02 04 25 03 15 9, 10 11/ ns 50 12-bit cycle, see figure 5 Output float delay Max 01,02 All Unit ns 25 All 150 CS to CE setup tSSR All 50 R/C to CE setup tSRR All 0 Sample and hold 14/ acquisition time tacq TA = +25C 9 01,02 04 1.2 A0 to CE setup tSAR See figure 6 9, 10, 11 All 50 2.0 s ns See footnotes at end of table. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 8 TABLE I. Electrical performance characteristics - Continued. Test Symbol CS valid after CE low tHSR R/C high after CE low A0 valid after CE low Conditions 1/ -55C TA +125C VCC = +15 V, VLOGIC = +5 V, unless otherwise specified Group A subgroups Device type Limits Min See figure 6 9, 10, 11 All 0 tHRR All 0 tHAR All 50 Unit Max ns 1/ 12/8 connected to VLOGIC, Ao and CS at logic "0", CE at logic "1". 10 V unipolar: 506 registor pin 8 to pin 10, 506 resistor pin 12 to ground. Analog input connected to pin 13. 20 V bipolar: 506 resistor pin 8 to pin 12, 50 resistor pin 8 to pin 10. Analog input connected to pin 14. Unless otherwise noted, these conditions apply. 2/ Device types are tested to the conditions stated in table I, but are guaranteed to the specified limits for the following variations in the supply voltage ranges. VLOGIC = +5 V to +5%, VCC = +12 V +5% and +15V to +10%, VEE = -12 V +5% and -15 V +10%. (VEE not required for operation of devices 01, 02, and 04). For device type 03, VLOGIC = +5 V to 10%. 3/ Maximum change in full scale calibration due to supply voltage shifts. Full scale calibration to be measured at minimum and maximum voltage settings for each individual supply. 4/ +13.5 V < VCC < +16.5 V, VLOGIC = 5 V, VEE = -15 V and +11.4 V < VCC < +12.6 V, VLOGIC = 5 V, VEE = -12 V. (VEE not required for operation of devices 01, 02 and 04). 5/ 4.5 V < VLOGIC < 5.5 V, VCC = 15V, VEE = -15V. (VEE not required for operation of devices 01, 02, and 04). 6/ -16.5 V < VEE < -13.5 V, VLOGIC = 5 V, VCC = +15 V and -12.6 V < VEE < -11.4 V, VLOGIC = 5 V, VCC = +12 V. 7/ Reference should be buffered for operation on +12 V supplies. External load should not change during conversion. 8/ For devices types 01, 02, and 04, 12/8 is not TTL compatible, must be hard-wired to VLOGIC or digital common. 9/ Pulse width is measured at the Schottky TTL input logic threshold voltage (1.3 V). 10/ tDS and tDSC are measured from the point when the input signal crosses the Schottky TTL logic threshold voltage (1.3 V) to when the STS output reaches 2.4 V. No external loading is applied to STS. 11/ tHDR, tHD, and tHL are measured from the point when the input signal crosses the Schottky TTL logic threshold voltage (1.3 V), to when the output voltage has moved 0.5 V in the direction of its final high impedance output voltage. Each individual data bit (DBO - DB11) is measured for both logic one to "high Z" and logic zero to "high Z" transitions. External loading is as shown on figure 7. 12/ tDDR and tDD are measured from the point when the input signal crosses the Schottky TTL logic threshold voltage (1.3 V), to when the output crosses either 2.4 V for a logic one, or 0.4 V for a logic zero. Each individual data bit (DBO - DB11) is measured for both "high Z" to logic zero transitions. External loading is as shown on figure 8. 13/ tC is measured as the time from when the STS line crosses the 1.0 V level, going positive, to when it crosses the 1.0 V level going negative. No external loading is applied to STS. 14/ Guaranteed by design. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 9 Device types 01 and 02 Case outlines X and 3 Terminal number 03 and 04 X Terminal symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 +5 V supply (VLOGIC) Data mode select (12/8 ) Chip select (CS) Byte address/short cycle (AO) Read/convert (R/C) Chip enable (CE) +12 V/+15 V supply (VCC) +10 V reference (REF OUT) Analog common (AGND) Reference input (REF IN) -12 V/-15 V supply (VEE) Bipolar offset (BIP OFF) 10 V span input (10 VIN) 20 V span input (20 VIN) Digital common (DGND) DB0 (LSB) DB1 DB2 DB3 DB4 DB5 DB6 DB7 DB8 DB9 DB10 DB11 (MSB) Status (STS) +5 V supply (VLOGIC) Data mode select (12/8 ) Chip select (CS) Byte address/short cycle (AO) Read/convert (R/C) Chip enable (CE) +12 V/+15 V supply (VCC) +10 V reference (REF OUT) Analog common (AGND) Reference input (REF IN) -12 V/-15 V supply (VEE) Bipolar offset (BIP OFF) 10 V span input (10 VIN) 20 V span input (20 VIN) Digital common (DGND) DB0 (LSB) DB1 DB2 DB3 DB4 DB5 DB6 DB7 DB8 DB9 DB10 DB11 (MSB) Status (STS) FIGURE 1. Terminal connections. CE CS R/C 12/8 AO Operation 0 X X 1 X X X X X X None None 1 1 0 0 0 0 X X 0 1 Initiate 12-bit conversion Initiate 8-bit conversion 1 0 1 1 X Enable 12-bit parallel output 1 1 0 0 1 1 0 0 0 1 Enable 8 most significant bits Enable 4 LSBs + 4 trailing zeros FIGURE 2. Truth table. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 10 FIGURE 3. Block diagram. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 11 FIGURE 4. High/low pulse for R/C. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 12 FIGURE 5. Convert start diagram. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 13 FIGURE 6. Read cycle timing. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 14 FIGURE 8. Load circuit for access time test. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 15 3.8 Notification of change for device class M. For device class M, DESC, DESC's agent, and the change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973. 3.9 Verification and review for device class M. For device class M, DESC, DESC's agent and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device classes M. Device classes M devices covered by this drawing shall be in microcuiruit group number 93 (see MIL-M-38535, appendix A). 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device class M, sampling and inspection procedures shall be in accordance with MIL-STD883 (see 3.1 herein). For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-I-38535 and the device manufacturer's QM plan. 4.2 Screening. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. For device classes Q and V, screening shall be in accordance with MIL-I-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for device classes M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1015. (2) TA = +125(C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-M-38535. The burn-in test shall be submitted to DESC-ECS with the certificate of compliance and shall be under the control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-I-38535. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in appendix B of MIL-I-38535. 4.3 Qualification inspection. 4.3.1 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-I-38535. Inspections to be performed shall be those specified in MIL-I-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Quality conformance inspection for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein) and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). Technology conformance inspection for classes Q and V shall be in acccordance with MIL-I-38535 including groups A, B, C, D, and E inspections and as specified herein except where option 2 of MIL-I-38535 permits alternate in-line control testing. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 16 TABLE II. Electrical test requirements. Test requirements Subgroups (in accordance with MIL-STD-883, TM 5005, table I) Subgroups (in accordance with MIL-I-38535, table III) Device class M Device class Q Device class V Interim electrical parameters (see 4.2) 1 1 1 Final electrical parameters (see 4.2) 1,2,3, 1/ 1,2,3 1/ 1,2,3, 2/ 1,2,3,7 8,9,10,11 2/ 1,2,3,7, 8,9,10,11 2/ 1,2,3,7, 8,9,10,11 2/ Group C end-point electrical parameters (see 4.4) 1 1 1 Group D end-point electrical parameters (see 4.4) 1 1 1 Group A test requirements (see 4.4) 1/ PDA applies to subgroup 1. 2/ PDA applies to subgroups 1 and 7. 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. For device class M, subgroups 7 and 8 tests shall be sufficient to verify the truth table. For device classes Q and V, subgroups 7 and 8 shall include verifying the functionality of the device; these tests shall have been fault graded in accordance with MIL-STD-883, test method 5012 (see 1.5 herein). c. Subgroups 4, 5, and 6 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shallbe as specified in table II herein. 4.4.2.1 Additional criteria for device classes M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005. b. TA = +125(C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-I-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB, in accordance with MIL-I38535, and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test method 1005. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 17 4.4.5 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). RHA levels for device class Q shall be M, D, R, and H and for device class M shall be M and D. a. End-point electrical parameters shall be as specified in table II herein. b. For device class M, the devices shall be subjected to radiation hardness assured tests as specified in MIL-M-38535, appendix A, for RHA level being tested. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as specified in MIL-I-38535 for RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25(C 5 percent, after exposure, to the subgroups specified in table II herein.. c. When specified in the purchase order or contract, a copy of the RHA delta limits shall be supplied. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-STD-883 (see 3.1 herein) for device class M and MIL-I-38535 for device classes Q and V. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.1.2 Substitutability. Device class Q devices will replace device class M devices. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users shall inform Defense Electronics Supply Center when a system application requires configuration control and which SMD's are applicable to that system. DESC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DESC-ECS, telephone (513) 296-6047. 6.4 Comments. Comments on this drawing should be directed to DESC-ECS, Dayton, Ohio 45444, or telephone (513) 296-5377. 6.5 Abbreviations, symbols, and definitions. 6.6 One part - one part number system. The one part - one part number system described below has been developed to allow for transitions between identical generic devices covered by the threemajor microcircuit requirements documents (MIL-H-38534, MIL-I-38535, and 1.2.1 of MIL-STD-883) without the necessity for the generation of unique PIN's. The three military requirements documents represent different class levels, and previously when a device manufacturer upgraded military product from one class level to another, the benefits of the upgraded product were unavailable to the Original Equipment Manufacturer (OEM), that was contractually locked into the original unique PIN. By establishing a one part number system covering all three documents, the OEM can acquire to the highest class level available for a given generic device to meet system needs without modifying the original contract parts selection criteria. Military documentation format Example PIN under new system Manufacturing source listing Document listing New MIL-H-38534 Standardized Military Drawings 5962-XXXXXXX(H or K)YY QML-38534 MIL-BUL-103 New MIL-I-38535 Standardized Military Drawings 5962-XXXXXXX(Q or V)YY QML-38535 MIL-BUL-103 New 1.2.1 of MIL-STD-883 Standardized Military Drawings 5962-XXXXXXX(M)YY MIL-BUL-103 MIL-BUL-103 STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 18 6.7 Sources of supply. 6.7.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DESC-ECS and have agreed to this drawing. 6.7.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-BUL-103. The vendors listed in MIL-BUL-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DESC-ECS. STANDARDIZED MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 5962-91690 A REVISION LEVEL B DESC FORM 193A JUL 94 SHEET 19 STANDARDIZED MILITARY DRAWING SOURCE APPROVAL BULLETIN DATE: 94-09-01 Approved sources of supply for SMD 5962-91690 are listed below for immediate acquisition only and shall be added to MIL-BUL-103 during the next revision. MIL-BUL-103 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DESC-ECS. This bulletin is superseded by the next dated revision of MIL-BUL-103. Standard microcircuit drawing PIN Vendor CAGE number Vendor similar PIN 1/ 5962-9169001MXX 5962-9169001M3X 0H9K9 0H9K9 HADC674ZAMD/883 HADC674ZAMC/883 M38510/14005BXX --- 5962-9169002MXX 5962-9169002M3X 0H9K9 0H9K9 HADC674ZBMD/883 HADC674ZBMC/883 M38510/14006BXX --- 5962-9169003MXX 5962-9169003M3X 24355 24355 AD674BTD/883B AD674BTE/883B M38510/14006BXX --- 5962-9169004MXX 33256 SP674AT/B M38510/14006BXX Replacement military specification PIN 1/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number Vendor name and address 0H9K9 Signal Processing Technologies, Incorporated 1510 Quail Lake Loop Colorado Springs, CO 80906 24355 Analog Devices 804 Woburn Street Wilmington, MA 01887 33256 Sipex Corporation 22 Linnell Circle Billerica, MA 01821-3985 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.