EClamp2357NQ
Final Datasheet Rev 2.1
11/27/2017
www.semtech.com Page 1
Semtech
EClamp2357NQ
PROTECTION PRODUCTS
Features
• EMI/RFI lter with integrated ESD protection
• ESD protection to IEC 61000-4-2 (ESD) Level 4, ±20kV
(air), ±12kV (contact)
• Filter performance: >30dB attenuation at 1.8GHz
• TVS working voltage: 5V
• Resistor: 100Ω +/− 15%
• Capacitance: 10pF typ. (VR = 0V for non lter pins)
• EMI & ESD protection for six lines
• Dedicated ESD protection for four lines
• Solid-state technology
• AEC-Q100 Grade 1 Qualied
Mechanical Characteristics
• SLP3030P16 package
• Pb-Free, Halogen Free, RoHS/WEEE compliant
• Nominal Dimensions: 3.0 x 3.0 x 0.6 mm
• Lead Pitch: 0.5mm
• Lead Finish: Matte Tin
• Marking: Marking Code
• Packaging: Tape and Reel per EIA 481
Applications
• Touch Screen Display Interfaces
• Secure Digital (SD) Memory Card Interfaces
• Multimedia Card Interfaces (MCI)
• Color LCD Panel Protection
• Cell Phone Handsets and Accessories
• Automotive Applications
Nominal Dimensions (in mm)
Package Dimensions Schematic & Pin Conguration
EMIClamp®
EMI Filter and ESD Protection
For SD Card Interfaces
Description
The EClamp®2357NQ is a low pass lter array with
integrated TVS diodes. It is designed to suppress
unwanted EMI/RFI signals and provide electrostatic
discharge (ESD) protection in portable electronic
equipment. They have been optimized for protection of
touch screen displays, secure digital (SD) card interfaces,
and color LCD panels in cellular phones and other
portable electronics.
The device consists of six π lter circuits comprised of
TVS diodes for ESD protection, and a resistor capacitor
network for EMI/RFI ltering. A series resistor value of
100Ω and a component capacitance value of 10pF are
used to achieve 20dB minimum attenuation from 1.0GHz
to 3GHz. The device also includes 4 discrete TVS diodes
for dedicated ESD protection. All of the TVS diodes
provide eective suppression of ESD voltages in excess
of ±20kV (air discharge) and ±12kV (contact discharge)
per IEC 61000-4-2, level 4.
The EClamp2357NQ is qualied to AEC-Q100 Grade 1 for
automotive use.
16
1
0.60
3.00
3.00
0.50
0.30
100Ω
OUTIN
GND
10pF 10pF
6x {R = 100Ω, C = 10pF (max)}
IN/OUT
GND
IN/OUT
2x 5V TVS
EClamp2357NQ-1-R0
EClamp2357NQ
Final Datasheet Rev 2.1
11/27/2017
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Semtech
Parameter Symbol Conditions Min. Typ. Max. Units
Reverse Stand-O Voltage VRWM -40OC to 125OC, any I/O to GND 5 V
Reverse Breakdown Voltage VBR It = 1mA, any I/O to GND -40OC to 125OC 6 8 10 V
Reverse Leakage Current IRVRWM = 3.3V, any I/O to GND -40OC to 125OC 0.5 μA
Total Series Resistance R Each line, T = -40 OC to 125 OC 85 100 115 Ω
Total Capacitance CIN Input to Gnd, each Line, f = 1 MHz VR = 0V 20 22 pF
VR = 2.5V 12 15
Notes:
(1): ESD Gun return path to Ground Reference Plane (GRP)
Absolute Maximum Ratings
Electrical Characteristics (T=25OC unless otherwise specied)
Rating Symbol Value Units
ESD per IEC 61000-4-2 (Contact)(1)
ESD per IEC 61000-4-2 (Air)(1) VESD
±12
±20 kV
Junction Temperature TJ125 OC
Operating Temperature TOP -40 to +125 OC
Storage Temperature TSTG -55 to +150 OC
EClamp2357NQ
Final Datasheet Rev 2.1
11/27/2017
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Semtech
Typical Characteristics
Typical Insertion Loss -S21 (Each Filter) Analog Crosstalk (Each Line)
ESD Clamping (+8kV Contact per IEC 61000-4-2)
Capacitance vs. Temperature
-50
0
50
100
150
-10 10 30 50 70
Clamping Voltage - V
C
(V)
Time (ns)
TA = 25OC
Corrected for 40dB attenuation.
Measured with 50Ω, 40dB attenuator;
50Ω Scope Input Impedance.
AR_ESD_+8
0
5
10
15
20
25
-50 0 50 100 150
Junction Capacitance - CJ (pF)
Temperature (
O
C)
No Filter VR = 0V
No Filter VR = 2.5V
Filter VR = 0V
Filter VR = 2.5V
AR_CAPvT
-150
-100
-50
0
50
-10 10 30 50 70
Clamping Voltage - V
C
(V)
Time (ns)
T
A
= 25
O
C
Corrected for 40dB attenuation.
Measured with 50Ω, 40dB attenuator;
50Ω Scope Input Impedance.
AR_ESD_-8
100
101
102
103
104
105
-50 0 50 100 150
Series Resistance - R
S
(Ω)
Temperature (
O
C)
Test Current = 1mA
AR_RSvT
-50
-40
-30
-20
-10
0
10 100 1000 10000
Insertion Loss -I
L
(dB)
Frequency (MHz)
TA = 25OC
Filter Input to Output
AR_ILvF
-120
-100
-80
-60
-40
-20
0
10 100 1000 10000
Crosstalk - C
T
(dB)
Frequency (MHz)
T
A
= 25
O
C
ESD Clamping (-8kV Contact per IEC 61000-4-2)
Series Resistance vs. Temperature
EClamp2357NQ
Final Datasheet Rev 2.1
11/27/2017
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Semtech
Typical Characteristics (Continued)
Breakdown Voltage vs. Temperature Capacitance vs. Reverse Voltage
TLP Characteristics (Positive)
Leakage Current vs. Temperature
-5
0
5
10
15
20
25
30
0 5 10 15 20 25
TLP Current (A)
TLP Voltage (V)
TA = 25OC
TLP Parameters:
tp = 100ns; tr = 200ps
RDYN = 0.466Ω
Best Fit 4A to 16A
AR_TLP+
0
10
20
30
40
-50 0 50 100 150
Leakage Current - IR (nA)
Temperature (
O
C)
Non-Filter Pins
Filter Pins
VR = 3.3V
Pin 6, 8, 13 or 15 to GND
VR = 3.3V
Pin to GND
Filter Pins are
1, 2, 3 ,4, 5, 7, 9, 10,
11, 12, 14 and 16
Non-Filter Pins are:
6, 8, 13 and 15.
AR_IRvT
-30
-25
-20
-15
-10
-5
0
5
-12 -10 -8 -6 -4 -2 0
TLP Current (A)
TLP Voltage (V)
TA = 25OC
TLP Parameters:
tp = 100ns; tr = 200ps
RDYN = 0.248Ω
Best Fit 4A to 16A
AR_TLP-
7.0
7.2
7.4
7.6
7.8
8.0
-50 0 50 100 150
Breakdown Voltage - V
BR
(V)
Temperature (
O
C)
IBR = 1mA
Pin 6, 8, 13 or 15 to GND
AR_VBRvT
IBR = 1mA
Any Pin to GND
0
5
10
15
20
25
0.0 0.5 1.0 1.5 2.0 2.5
Capacitance - C
J
(pF)
Reverse Voltage - V (V)
Filter Pins
Non Filter Pins
TA = 25OC
f = 1 MHz
AR_CAPvV
TLP Characteristics (Negative)
EClamp2357NQ
Final Datasheet Rev 2.1
11/27/2017
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Semtech
Application Information
Pin Identication and Conguration (Top Side View)
EClamp2357NQ-3-R0
131415
16
4
3
2
1
9
10
11
12
5 6 7 8
Top View
Device Connection
The EClamp2357NQ is comprised of six circuits each
consisting of a low pass lter for EMI/RFI suppression
and dual TVS diodes for ESD protection. It also includes
4 lines of TVS diodes for ESD protection of power lines
or high speed I/O lines. The device is housed in a 16-pin
Quad Flat No-Lead (QFN) package. Electrical connection
is made via 16 pins located at the bottom of the device.
A center tab serves as the ground connection. Pin
connections are noted in the table to the right. The
device is designed for easy PCB routing as shown in the
application examples. All path lengths should be kept
as short as possible to minimize the eects of parasitic
inductance in the board traces.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead nishes. A matte tin nish is
composed of 100% tin solder with large grains. Since
the solder volume on the leads is small compared to the
solder paste volume that is placed on the land pattern of
the PCB, the reow prole will be determined by the
requirements of the solder paste. Therefore, these
devices are compatible with both lead-free and SnPb
assembly techniques. In addition, unlike other lead-free
compositions, matte tin does not have any added alloys
that can cause degradation of the solder joint.
GND
3
LOW PASS FILTER
GND
2
GND
4
LOW PASS FILTER
GND
1
GND
5
LOW PASS FILTER
GND
16
GND
156
GND
7
LOW PASS FILTER
GND
14
GND
9
LOW PASS FILTER
GND
12
GND
10
LOW PASS FILTER
GND
11
GND
138
EClamp2357NQ-4-R0
Pin Identication
3, 4, 5, 7, 9, 10 Input EMI/ESD Protected Lines
1, 2, 11, 12, 14, 16 Output EMI/ESD Protected Lines
6, 8, 13, 15 Input/Output ESD Protected Lines
Center Tab Ground
Pin Conguration and Schematic
EClamp2357NQ
Final Datasheet Rev 2.1
11/27/2017
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Semtech
Application Information
EClamp2357NQ-5-R0
SD Memory Connector
SD
Controller
Baseband
Controller
DAT2
DAT3
CMD
VCC
CLK
SD_DET
DAT0
DAT1
13
14
15
16
43 2 1
9 10 11 12
5
6
8
GND
7
CMD
DAT3
DAT2
VCC
CLK
SD_DET
DAT0
DAT1
Top Side Trace Bottom Side Trace ViaKey
EClamp2357NQ SD Memory
EClamp2357NQ-6-R0
LCD Module Connector
Baseband Controller
13
14
15
16
43 2 1
9 10 11 12
5
6
8
GND
7
EClamp2357NQ LCD and Touch Pad
4-Wire Touchscreen
Connector
Bottom Side Trace
Via
Top Side Trace
Key:
EClamp2357NQ
Final Datasheet Rev 2.1
11/27/2017
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Semtech
Outline Drawing - SLP3030P16
Land Pattern - SLP3030P16
3.002.90 3.10
NOTES:
bbb C AB
aaa C
0.08
16
1.40
-
0.00
0.55
1.601.50
-
0.05
0.65
(0.15)
0.02
0.60
0.10
2.90 3.00 3.10
0.50 BSC
0.35 0.40 0.45
A
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
2.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
1.
DIMENSIONS
e
bbb
aaa
A1
A2
D1
E1
DIM
N
L
E
D
A
MILLIMETERS
MAXMIN NOM
E
B
D
e/2
e
1
2
N
PIN 1
INDICATOR
(LASER MARK)
A1
C
SEATING
PLANE
E/2
b 0.20 0.25 0.30
bxN
D/2
D1
LxN
A
A2
1.40 1.601.50
0.450
R0.20
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
NOTES:
1.
C
Z
P
Y
X
G
H
3.50
0.30
0.70
0.50
1.60
2.10
DIM
(2.80)
MILLIMETERS
DIMENSIONS
DO NOT PLACE VIAS BETWEEN THE CORNER LEADS INSIDE THE
3X3MM PACKAGE FOOTPRINT.
2.
K1.60
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
3.
Y
Z
P/2
P
X
H
KG
(C)
EClamp2357NQ
Final Datasheet Rev 2.1
11/27/2017
www.semtech.com Page 8
Semtech
Marking Code
EClamp2357NQ-8-R0
2357N
YYWW
13
14
15
16
4
3
2
1
9
10
11
12
5 6 78
13 14 15 16
4
3
2
1
9
10
11
12
56
7
8
Top View Showing
Device Marking
Bottom View Showing
Pin1 Identifier
Tape and Reel Specication - Plastic Tape
Ordering Information
Part Number Qty per Reel Reel Size
EClamp2357NQTLT 3000 13 Inch
EMIClamp and EClamp are trademarks of Semtech Corporation.
2357N
YYWW
2357N
YYWW
User Direction of Feed
Pin 1 Location
(Toward Sprocket Holes)
Notes:
1. YYWW = Alphanumeric character Date Code
2. Pin 1 indicated by “Mouse Bite“ on the ground pad
EClamp2357NQ
Final Datasheet Rev 2.1
11/27/2017
Page 9
Semtech
Proprietary & Condential
Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
Important Notice
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as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves
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