
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-LCA129-R04 1
LCA129
Single-Pole, Normally Open
OptoMOS® Relay
e3
Pb
Part # Description
LCA129 6-Pin DIP (50/Tube)
LCA129S 6-Pin Surface Mount (50/Tube)
LCA129STR 6-Pin Surface Mount (1,000/Reel)
Parameter Ratings Units
Blocking Voltage 250 VP
Load Current 170 mArms / mADC
Input Control Current 2 mA
On-Resistance (max) 20
Applications
Features
Description
Ordering Information
Pin Configuration
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook,
Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
• Low Input Control Current: 2mA
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Version Available
Switching Characteristics of
Normally Open Devices
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate: B 09 07 49410 004
1
3
2
4
5
6
+ Control
– Control
Do Not Use
Load
Do Not Use
Load
AC/DC Configuration
1
3
2
4
5
6
+ Control
– Control
Do Not Use
+ Load
– Load
DC Only Configuration
Form-A
IF
ILOAD
10%
90%
ton toff
LCA129 is a 250V, 170mA, 20, normally open
(1-Form-A) solid state relay featuring high sensitivity
with enhanced peak load current capability. It uses
optically coupled MOSFET technology to provide
3750Vrms of input to output isolation.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
The LCA129 can be used to replace mechanical
relays, and offers the superior reliability associated
with semiconductor devices. Because it has no moving
parts, it offers faster, bounce-free switching in a more
compact surface mount or thru-hole package.