MSP
Precision Surface Mount Resistors Wirewound or
Metal Film Technologies Vishay Sfernice
Document Number: 50003 For technical questions, contact: sfer@vishay.com www.vishay.com
Revision: 01-May-06 2
MSP B - Wirewound Technology
MSP C - Metal Film Technology
SURFACE MOUNTING
Soldering cycle: 2 minutes at 215 °C or 10 seconds at 260 °C or with an iron 40 W: 3 seconds at 350 °C.
Soldering is possible by wave, reflow and vapor phase.
NON INDUCTIVE WINDING
Non inductive (Ayrton Perry) winding available.
Please consult VISHAY SFERNICE.
PERFORMANCE
TESTS CONDITIONS
Wirewound Metal Film
REQUIREMENTS
Wirewound NF C 83-210 Metal Film NF C 83-230 TEST RESULTS
Dielectric w/s Voltage 500 V RMS ± (0.1 % + 0.05) ± 0.25 % ± 0.05 %
Short Time Overload 5 Pr/5 s ± (0.25 % + 0.05) ± 0.25 % ± 0.15 %
Climatic Sequence 5 cycles
- 55 °C + 200 °C - 55 °C + 125 °C
± (0.5 % + 0.05)
Ins. resistance > 100M
± 0.5 %
Ins. resistance > 100M
± 0.2 %
Ins. resistance > 103M
Humidity
(Steady State)
56 days
95 % RH
10 days
low load
± (0.5 % + 0.05)
Ins. resistance > 100M
± 1 %
Ins. resistance > 100M
± 0.3 %
Ins. resistance > 103M
Vibration 10/
2000 Hz
10/
500 Hz ± (0.25 % + 0.05) ± 0.25 % ± 0.05 %
Load Life Pr + 25 °C
2000 h
1000 h Pr + 25 °C
90/30 cycle
± (0.5 % + 0.05)
Ins. resistance 1G ± 1 % ± 0.5 %
Thermal Shock 260 °C 10 s ± (0.25 % + 0.05) ± 0.25 % + 0.05 ± 0.2 %
TEMPERATURE COEFFICIENT IN THE TEMPERATURE RANGE - 55°C + 200°C
OHMIC RANGE NF C 83-210
LIMITS TYPICAL VALUE
< 1 ± 100 ppm/°C ± 50 pm/°C
1 to < 10 ± 50 ppm/°C
10 ± 25 ppm/°C + 0 to - 20 ppm/°C
TEMPERATURE COEFFICIENT IN THE TEMPERATURE RANGE - 55 °C + 155 °C
OHMIC RANGE MSP 1C MSP 2C
10 to 332K K3: ± 50ppm/°C
K4: ± 25ppm/°C
> 332K - K3: ± 50 ppm/°C