(0.635 mm) .025" QMS SERIES
Increased
insertion depth for
rugged applications
QMS–026–06.75–L–D–A
QMS–032–06.75–L–D–DP–A
Integral metal plane
for power or ground
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
Board Mates:
QFS
Cable Mates:
6QCD
Standoffs:
SO, JSOM
ALSO AVAILABLE
(MOQ Required)
• Other platings
• Guide Posts
• Without PCB
Alignment Pins
(05.75 and 06.75 only)
• Hot Pluggable
• 64 (-DP) and 104 positions per row
RUGGED GROUND PLANE HEADER
(1.60 mm)
.063"
NOMINAL
WIPE
Requires Standoff
SO-1524-03-01-01-L or
JSOM-1524-02 for 15.24 mm
or SO-2215-02-01-01-L for 22 mm
board spacing. Connectors designed
to not fully seat when mated.
QMS PINS PER ROW
NO. OF PAIRS
PLATING
OPTION
–026, –052, –078
(52 total pins per bank = –D)
–016, –032, –048
(16 pairs per bank = –D–DP)
(–078 & –048 Not available
with –09.75 lead style)
–D
= Single-Ended
–D–DP
= Differential Pair
LEAD
STYLE TYPE AOTHER
OPTION
–K
= (5.50 mm)
.217" DIA
Polyimide
film
Pick &
Place Pad
Specify
LEAD
STYLE
from
chart
–L
(–05.75 and –06.75 lead style only)
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
–SL
(–09.75 lead style only)
= 10 µ" (0.25 µm) Gold on Signal
Pins and Ground Plane
(Tin on Signal Pin tails, and
Ground Plane tails)
MATED HEIGHT*
LEAD
STYLE AQFS LEAD STYLE
–04.25 –06.25
–05.75 (5.38) .212 10 mm 12 mm
–06.75 (6.35) .250 11 mm 13 mm
–09.75 (9.35) .368 14 mm 16 mm
*Processing conditions will affect mated height.
See SO Series for board space tolerances.
(0.44)
.017
STACK
HEIGHT
02
01
(21.34) .840
(0.23)
.009
(7.26)
.286
(No. of Banks) x (21.34) .840 - (0.51) .020
(0.635)
.025
(2.29)
.090
(0.25)
.010
(6.35)
.250
(7.52)
.296
A
–D –D–DP
For complete specifications and
recommended PCB layouts see
www.samtec.com?QMS
Insulator Material:
Liquid Crystal Polymer
Terminal & Ground
Plane Material:
Phosphor Bronze
Plating:
Au over 50 µ" (1.27 µm) Ni
(Tin on Ground Plane Tail)
Current Rating:
Contact:
2.6 A per pin
(2 pins powered)
Ground Plane:
15.7 A per ground plane
(1 ground plane powered)
Operating Temp:
-55 °C to +125 °C
Voltage Rating:
300 VAC mated with QFS
RoHS Compliant:
Ye s
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
PROCESSING
SPECIFICATIONS
Lead–Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max (026-052)
(0.15 mm) .006" max (078)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
Board Stacking:
For applications requiring more
than two connectors per board,
contact ipg@samtec.com
FILE NO. E111594
Gbps
25
HIGH-SPEED CHANNEL PERFORMANCE
QMS-DP/QFS-DP @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
APPLICATION
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
POWER/SIGNAL
APPLICATION
F-219
INDUSTRY
STANDARD
INTERCONNECTS
TERMINAL SOCKET BANKS STACK
HEIGHT
SUMIT™ASP-129637-01 ASP-129646-01 115.24 mm
PCI/104-Express™ASP-129637-03 ASP-129646-03 315.24 mm
PCI/104-Express™ASP-129637-13 ASP-129646-22 115.24 mm
PCI/104-Express™ASP-142781-01 ASP-129646-01 122 mm
PCI/104-Express™ASP-142781-02 ASP-129646-02 222 mm
PCI/104-Express™ASP-142781-03 ASP-129646-03 322 mm
STANDARDS
• SUMIT™
• PCI/104-Express™
• PCI/104-Express™ OneBank
Visit www.samtec.com/standards
for more information.
