QMS-032-06.75-L-D-DP-A F-219 QMS-026-06.75-L-D-A (0.635 mm) .025" QMS SERIES RUGGED GROUND PLANE HEADER Integral metal plane for power or ground Board Mates: QFS Cable Mates: 6QCD Standoffs: SO, JSOM SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?QMS Insulator Material: Liquid Crystal Polymer Terminal & Ground Plane Material: Phosphor Bronze Plating: Au over 50 " (1.27 m) Ni (Tin on Ground Plane Tail) Current Rating: Contact: 2.6 A per pin (2 pins powered) Ground Plane: 15.7 A per ground plane (1 ground plane powered) Operating Temp: -55 C to +125 C Voltage Rating: 300 VAC mated with QFS RoHS Compliant: Yes ALSO AVAILABLE POWER/SIGNAL APPLICATION (MOQ Required) * Other platings * Guide Posts * Without PCB Alignment Pins (05.75 and 06.75 only) * Hot Pluggable * 64 (-DP) and 104 positions per row HIGH-SPEED CHANNEL PERFORMANCE QMS-DP/QFS-DP @ 10 mm Mated Stack Height Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact SIG@samtec.com Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (026-052) (0.15 mm) .006" max (078)* *(.004" stencil solution may be available; contact IPG@samtec.com) Board Stacking: For applications requiring more than two connectors per board, contact ipg@samtec.com For complete scope of recognitions see www.samtec.com/quality PINS PER ROW NO. OF PAIRS QMS 25 -026, -052, -078 (52 total pins per bank = -D) -016, -032, -048 LEAD STYLE PLATING OPTION Specify LEAD STYLE from chart -L (16 pairs per bank = -D-DP) -SL (No. of Banks) x (21.34) .840 - (0.51) .020 (21.34) .840 01 (7.26) .286 STANDARDS (2.29) .090 (0.635) .025 (-09.75 lead style only) = 10 " (0.25 m) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) 02 (0.23) .009 MATED HEIGHT* LEAD STYLE A -05.75 -06.75 -09.75 QFS LEAD STYLE -04.25 -06.25 (5.38) .212 10 mm 12 mm (6.35) .250 11 mm 13 mm (9.35) .368 14 mm 16 mm *Processing conditions will affect mated height. See SO Series for board space tolerances. (7.52) .296 -D = Single-Ended -D-DP = Differential Pair APPLICATION STACK HEIGHT (0.44) .017 INTERCONNECTS INDUSTRY STANDARD TERMINAL SOCKET SUMIT PCI/104-ExpressTM PCI/104-ExpressTM PCI/104-ExpressTM PCI/104-ExpressTM PCI/104-ExpressTM ASP-129637-01 ASP-129637-03 ASP-129637-13 ASP-142781-01 ASP-142781-02 ASP-142781-03 ASP-129646-01 ASP-129646-03 ASP-129646-22 ASP-129646-01 ASP-129646-02 ASP-129646-03 TM Due to technical progress, all designs, specifications and components are subject to change without notice. WWW.SAMTEC.COM -K = (5.50 mm) .217" DIA Polyimide film Pick & Place Pad Requires Standoff SO-1524-03-01-01-L or JSOM-1524-02 for 15.24 mm or SO-2215-02-01-01-L for 22 mm board spacing. Connectors designed to not fully seat when mated. A -D-DP OTHER OPTION A TYPE (0.25) .010 (6.35) .250 -D Note: Some lengths, styles and options are non-standard, non-returnable. (-05.75 and -06.75 lead style only) = 10 " (0.25 m) Gold on Signal Pins and Ground Plane (Tin on Signal Pin tails, and Ground Plane tails) (-078 & -048 Not available with -09.75 lead style) FILE NO. E111594 * SUMITTM * PCI/104-ExpressTM * PCI/104-ExpressTM OneBank Visit www.samtec.com/standards for more information. Compatible with UMPT/UMPS for flexible two-piece power/signal solutions G b p s PROCESSING RECOGNITIONS (1.60 mm) .063" NOMINAL WIPE Increased insertion depth for rugged applications All parts within this catalog are built to Samtec's specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply. STACK BANKS HEIGHT 1 3 1 1 2 3 15.24 mm 15.24 mm 15.24 mm 22 mm 22 mm 22 mm