3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnector.com
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3M™ MetPak™ 2-FB Stacking Socket
2 mm 4/5-Row, Vertical, Solder or Press-Fit Tail MP2 Series
TS-1118-B
Sheet 3 of 4
Table 1 - Connector & Row Lengths
Pin Count Dim. “A”
mm [inch]
Dim “B”
mm [inch] Rows Block
Count
024 11.95 [0.471] 10.00 [0.394] 4 1
048 23.95 [0.943] 22.00 [0.866] 4 2
072 35.95 [1.415] 34.00 [1.339] 4 3
096 47.95 [1.889] 46.00 [1.811] 4 4
120 59.95 [2.36] 58.00 [2.283] 4 5
144 71.95 [2.833] 70.00 [2.756] 4 6
168 83.95 [3.305] 82.00 [3.228] 4 7
192 95.95 [3.778] 94.00 [3.701] 4 8
030 11.95 [0.471] 10.00 [0.394] 5 1
060 23.95 [0.943] 22.00 [0.866] 5 2
090 35.95 [1.415] 34.00 [1.339] 5 3
120 47.95 [1.888] 46.00 [1.811] 5 4
150 59.95 [2.361] 58.00 [2.283] 5 5
180 71.95 [2.833] 70.00 [2.756] 5 6
210 83.95 [3.305] 82.00 [3.228] 5 7
240 95.95 [3.778] 94.00 [3.701] 5 8
Table 2 - Tail Length Options
Contact-to-PC Board Tail
Termination Option No. Dim. “C”
Solder Press-Fit*
1 1 3.53 [0.139]
*Compliant-Pin Tail
Table 3 - Plating & Regulatory
Plating Suffix Press-Fit Tails* Solder Tails Plating Composition
TG30 RIA E2 & C2 apply RIA E3 & C2 apply
0.76 µm [30 µ"] Min. Au Contact Area
2.54 µm [100 µ"] Min. SnPb Tail Area
1.27 µm [50 µ"] Min. Ni all over
TR30 RIA E2 & C2 apply RIA E3 & C2 apply
0.08 µm [3 µ"] Min. Au Contact Area
0.67 µm [27 µ"] Min. PdNi Contact Area
2.54 µm [100 µ"] Min. SnPb Tail Area
1.27 µm [50 µ"] Min. Ni all over
KR RIA E1 & C1 apply RIA E1 & C1 apply
0.76 µm [30 µ"] Min. Au Contact Area
2.54 µm [100 µ"] Min. Matt Whisker Mitigating Sn Tail Area
1.27 µm [50 µ"] Min. Ni all over
LR RIA E1 & C1 apply RIA E1 & C1 apply
0.08 µm [3 µ"] Min. Au Contact Area
0.67 µm [27 µ"] Min. PdNi Contact Area
2.54 µm [100 µ"] Min. Matt Whisker Mitigating Sn Tail Area
1.27 µm [50 µ"] Min. Ni all over
*Compliant-Pin Tail