SLUS184A – FEBRUARY 1999 – REVISED OCTOBER 2001
1
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FEATURES
DIntegrated 0.15-Ω Power MOSFET
D7-V to 15-V Operation
DDigital Programmable Current Limit
from 0 A to 3 A
DProgrammable On-Time
DProgrammable Start Delay
DFixed 2% Duty Cycle
DThermal Shutdown
DFault Output Indicator
DPower SOIC and TSSOP, Low Thermal-
Resistance Packaging
DESCRIPTION
The UCC39151 programmable hot swap power
manager provides complete power management,
hot swap capability, and circuit breaker functions.
The only external component required to operate
the device, other than power supply bypassing, is
the fault timing capacitor, CT. All control and
housekeeping functions are integrated, and
externally programmable. These include the fault
current level, maximum output sourcing current,
maximum fault time, and start-up delay. In the
event o f a constant fault, the internal fixed 2% duty
cycle ratio limits average output power.
The internal 4-bit DAC allows programming of the
fault level current from 0 A to 3 A with 0.25 A
resolution. The IMAX control pin sets the
maximum sourcing current to 1 A above the trip
level or t o a full 4 A of output current for fast output
capacitor charging.
TYPICAL APPLICATION
SHTDWN
14
15
10
1
2
16
11
VOUT
CT
VIN
FAULT
B0
GND
RL
CIN
513124
GNDGNDGND
COUT
CSD
RSD VIN
S6
6789 VIN
S4S3S2 S5
B1 B2 B3 IMAX
S1
CT
3 VIN
VIN
HEATSINK GROUND PINS
DIP SWITCH
}
D1 VOUT
+5V
LEDR1
UDG–98176
UCC39151 (16-Pin Package)
Copyright 2001, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
SLUS184A – FEBRUARY 1999 – REVISED OCTOBER 2001
2www.ti.com
description (continued)
When the output current is below the fault level, the output MOSFET is switched on with a nominal on-resistance
of 0.15 Ω. When the output current exceeds the fault level, but is less than the maximum sourcing level, the
output remains switched on but the fault timer starts, charging CT. Once CT charges to a preset threshold, the
switch is turned off, and remains o ff for 50 times the programmed fault time. When the output current reaches
the maximum sourcing level, the MOSFET transitions from a switch to a constant current source.
absolute maximum ratings†
Input voltage, VIN 15.5 V. . . . . . . . . . . . . . . . . . . .
(VOUT – VIN) 0.3 V. . . . . . . . . . . . . . . . . . . . . . . . .
FAULT sink current 50 mA. . . . . . . . . . . . . . . . . . .
FAULT voltage –0.3 to 8 V. . . . . . . . . . . . . . . . . . .
Output current, VOUT Self limiting. . . . . . . . . . . .
TTL input voltage –0.3 to VIN
. . . . . . . . . . . . . . . .
Storage temperature –65°C to 150°C. . . . . . . . .
Junction temperature –55°C to 150°C. . . . . . . .
Lead temperature (soldering 10 seconds) 300°C
†Stresses beyond those listed under “absolute maximum ratings”
may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any
other conditions beyond those indicated under “recommended
operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may
affect device reliability. Currents are positive into, negative out of the
specified terminal.
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
SHTDWN
VIN
VIN
NC
GND*
GND*
GND*
GND*
EGND*
B3
B2
B1
FAULT
VOUT
VOUT
NC
GND*
GND*
GND*
GND*
NC
CT
IMAX
B0
PWP PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SHTDWN
VIN
VIN
GND*
EGND*
B3
B2
B1
FAULT
VOUT
VOUT
GND*
GND*
CT
IMAX
B0
DIL (N) or SOIC (DP)
PACKAGE
(TOP VIEW)
NC = no connection
* Pin 5 on the N and DP packages (and pin 9 on the PWP package)
serves as the lowest impedance to the electrical ground. Pins 4, 12
and 13 on the DP package (and pins 5, 6, 7, 8, 17, 18, 19, and 20 on
the PWP package) serve as heatsink/ground. These pins should be
connected to large etch areas to help dissipate heat. On the N
package, pins 4, 12 and 13 are not connected.
AVAILABLE OPTIONS
TA
PACKAGES
TASOIC (DP){DIL (N) TSSOP (PWP){
0°C to 70°C UCC39151DP UCC39151N UCC39151PWP
†The DP and PWP packages are available taped and reeled. Add TR suffix to
device type (e.g. UCC39151DPTR) to order quantities of 2500 (DP) or 2000
(PWP) devices per reel.
SLUS184A – FEBRUARY 1999 – REVISED OCTOBER 2001
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electrical characteristics over recommended operating virtual junction temperature range,
TA = 0°C to 70°C, VIN = 12 V, IMAX = 0.4 V, SHTDWN = 2.4 V, TA = TJ (unless otherwise noted)
supply
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Input voltage range 7.0 15.0 V
Supply current 1.0 2.0 mA
Sleep mode current SHTDWN = 0.2 V, No load 100 150 µA
Output leakage SHTDWN = 0.2 V 20 mA
output
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
IOUT = 1 A, 10 V ≤ VIN ≤ 12 V 0.15 0.3
IOUT = 2 A, 10 V ≤ VIN ≤ 12 V 0.3 0.6
Voltage drop
IOUT = 3 A, 10 V ≤ VIN ≤ 12 V 0.45 0.9
V
Voltage drop IOUT = 1 A, 7 V ≤ VIN ≤ 15 V 0.2 0.4 V
IOUT = 2 A,, 7 V ≤ VIN ≤ 15 V 0.4 0.8
IOUT = 3 A, , 7 V ≤ VIN ≤ 12 V(max) 0.6 1.2
Initial startup time See Note 1 100 µs
Short circuit response time See Note 1 100 ns
Thermal shutdown temperature See Note 1 165
°C
Thermal hysteresis See Note 1 10 °C
DAC
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Code = 0000 to 0011, (device off)
Code = 0100 0.07 0.25 0.45
Code = 0101 0.32 0.50 0.7
Code = 0110 0.50 0.75 0.98
Code = 0111 0.75 1.00 1.3
Code = 1000 1.0 1.25 1.6
Trip current Code = 1001 1.25 1.50 1.85
Tri
current
Code = 1010 1.5 1.75 2.15
A
Code = 1011 1.70 2.00 2.4
A
Code = 1100 1.90 2.25 2.7
Code = 1101 2.1 2.50 2.95
Code = 1110 2.30 2.75 3.25
Code = 1111 2.50 3.0 3.5
Maximum output current over trip level
(current source mode) Code = 0100 to 1111, IMAX = 0 V 0.35 1.0 1.65
Maximum output current (current source mode) Code = 0100 to 1111, IMAX = 2.4 V 3.0 4.0 5.2
open drain output (FAULT)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
High-level output current FAULT = 5 V 250 µA
Low-level output voltage IOUT = 5 mA 0.2 0.8 V
NOTE 1: Ensured by design. Not production tested.
SLUS184A – FEBRUARY 1999 – REVISED OCTOBER 2001
4www.ti.com
electrical characteristics over recommended operating virtual junction temperature range,
TA = 0°C to 70°C, VIN = 12 V, IMAX = 0.4 V, SHTDWN = 2.4 V, TA = TJ (unless otherwise noted)
fault timer
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
CT charge current VCT = 1.0 V –83 –62 –47
A
CT discharge current VCT = 1.0 V 0.8 1.2 1.8 µA
Output duty cycle VOUT = 0 V 1.0% 1.9% 3.3%
CT fault threshold voltage 1.2 1.5 1.7
V
CT reset threshold voltage 0.4 0.5 0.6 V
SHTDWN
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Shutdown threshold voltage 1.1 1.5 1.9 V
Shutdown hysteresis 150 mV
Input current 100 500 nA
TTL input dc characteristics
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
TTL high-level input voltage 2.0 V
TTL low-level input voltage 0.8 V
TTL high-level input current VIH = 2.4 V 3 10 µA
TTL low-level input current VIL = 0.4 V 1µA
block diagram (16–pin package)
UDG–01044
Pin numbers refer to N and DP packages.
10IMAX
4 A
H = 4 A
4
0A
TO 3 A
0.25
RES
6 7 8 9
+
1 A ABOVE
FAULT
MAXIMUM
CURRENT
LEVEL
+
CURRENT FAULT LEVEL
0A TO 3 A OVERCURRENT
COMPARATOR
ON–TIME
CONTROL
2% DUTY
CYCLE
13 12
B3 B2 B1 B0 EGND
4–BIT DAC
11
CHARGE PUMP REVERSE
VOLTAGE
COMPARATOR
+
+
LINEAR CURRENT
AMPLIFIER
VOUT
30 mV
THERMAL
SHUTDOWN
INTERNAL
BIAS
16
CT FAULT
+
1 SHTDWN
1.5 V
5
2
3
14
15
POWER
FET
VIN
VIN
VOUT
VOUT
CURRENT
SENSE
HEATSINK/GROUND
GND GND GND
SLUS184A – FEBRUARY 1999 – REVISED OCTOBER 2001
5
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Terminal Functions
TERMINAL
NAME PACKAGE I/O DESCRIPTION
DP N PWP
I/O
DESCRIPTION
B0 9 9 13 I
B1 8 8 12 I Provides di
g
ital input to the DAC, which sets the fault current threshold. These
B2 7 7 11 I
Provides
digital
in ut
to
the
DAC
,
which
sets
the
fault
current
threshold
.
These
can be used to provide a digital soft-start and adaptive current limiting.
B3 6 6 10 I
gg
CT 11 11 15 I/O Capacitor connects to ground and sets the maximum fault time.
EGND 5 5 9 –Serves as lowest impedance to the electrical ground.
FAULT 16 16 24 O Open-drain output, which pulls low upon any fault or interrupt condition, or
thermal shutdown.
GND 4, 12, 13 –5, 6, 7, 8,
17, 18, 19,
20
–Heat sink/ground pins. These pins should be connected to large etch areas to
help dissipate heat.
IMAX 10 10 14 I When this pin is set low, the maximum sourcing current is 1 A above the
programmed fault level. When set high, the maximum sourcing current is a
constant 4 A for applications which require fast charging of load capacitance.
SHTDWN 1 1 1 I When this pin is brought low, the device is put into a sleep mode drawing
typically less than 100 µA of ICC (with VOUT unloaded). The input threshold is
hysteretic, allowing the user to program a start-up delay with an external RC
circuit.
VIN 2, 3 2, 3 2, 3 IInput voltage. The recommended voltage range is 7 V to 15 V. Both VIN pins
should be connected together and connected to power source.
VOUT 14, 15 14, 15 22, 23 OOutput voltage.VOUT must not exceed VIN by more than 0.3 V.
detailed pin descriptions
CT: A capacitor connected to ground sets the maximum fault time. The maximum fault time must be more than
the time required to charge the external capacitance in one cycle. The maximum fault time is defined as:
tFAULT +16.1 103 CT
Once the fault time is reached the output shuts down for a time given by:
tSD +833 103 CT
This equates to a 1.9% duty cycle.
VOUT: Output voltage from the UCC39151. Both VOUT pins should be connected together and connected to
the load. When switched:
VOUT ^VIN *ǒ0.15 W IOUTǓ
VOUT must not exceed VIN by more than 0.3V.
(1)
(2)
(3)
SLUS184A – FEBRUARY 1999 – REVISED OCTOBER 2001
6www.ti.com
APPLICATION INFORMATION
protecting the UCC39151 from voltage transients
The parasitic inductance associated with the power distribution can cause a voltage spike at VIN if the load
current is suddenly interrupted by the UCC39151. It is important to limit the peak of this spike to less than 15 V
to prevent damage to the UCC39151. This voltage spike can be minimized by:
•Reducing the power distribution inductance (e.g., twist the positive (+) and negative (–) leads of the
power supply feeding VIN, locate the power supply close to the UCC39151 or use PCB power and
ground planes).
•Decoupling VIN with a capacitor, CIN (refer to Typical Application diagram), located close to the VIN
pins. This capacitor is typically 1 µF or less to limit the inrush current.
•Clamping the voltage at VIN below 15 V with a Zener diode, D1 (refer to Typical Application diagram),
located close to the VIN pins.
estimating maximum load capacitance
For hot swap applications, the rate at which the total output capacitance can be charged depends on the
maximum output current available and the nature of the load. For a constant-current, current-limited application,
the output comes up if the load asks for less than the maximum available short-circuit current.
To guarantee recovery of a duty-cycle from a short-circuited load condition, there is a maximum total output
capacitance which can be charged for a given unit on-time (fault-time). The design value of on-time or fault-time
can be adjusted by changing the timing capacitor CT.
UDG–94138
Figure 1. Output Waveforms Under Fault Conditions
SLUS184A – FEBRUARY 1999 – REVISED OCTOBER 2001
7
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APPLICATION INFORMATION
For worst-case constant-current load of value just less than the trip limit; COUT(max) can be estimated from:
COUT(max) [ǒIMAX *ILOADǓ ǒ16.1 103 CT
VOUT Ǔ
Where VOUT is the output voltage.
For a resistive load of value RL, the value of COUT(max) can be estimated from:
COUT(max) [
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ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȧ
ȡ
Ȣ
16.1 103 CT
RL ȏnȧ
ȧ
ȡ
Ȣ
1
1*VOUT
IMAX RL
ȧ
ȧ
ȣ
Ȥ
ȧ
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Long CT times must consider the maximum temperature. Thermal shutdown protection may be the limiting
fault-time.
safety recommendations
Although the UCC39151 is designed to provide system protection for all fault conditions, all integrated circuits
can ultimately fail short. For this reason, if the UCC39151 is intended for use in safety critical applications where
UL or some other safety rating is required, a redundant safety device such as a fuse should be placed in series
with the device. The UCC39151 prevents the fuse from blowing for virtually all fault conditions, increasing
system reliability and reducing maintenance cost, in addition to providing the hot swap benefits of the device.
(4)
(5)
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