PC123XNNSZ0F Series
1
Sheet No.: D2-A09501EN
Date Sep. 1. 2006
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confi rmation by device specifi cation sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specifi cation sheets before using any SHARP device.
PC123XNNSZ0F
Series
DIP 4pin Reinforced Insulation Type
Photocoupler
■Description
PC123XNNSZ0F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4-pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5kV.
CTR is 50% to 400% at input current of 5mA
■Features
1. 4-pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. Current transfer ratio (CTR : MIN. 50% at IF=5 mA,
VCE=5V)
4. Several CTR ranks available
5. Reinforced insulation type (Isolation distance : MIN.
0.4mm)
6. Long creepage distance type (wide lead-form type
only : MIN. 8mm)
7. High isolation voltage between input and output
(Viso(rms) : 5kV)
8. Lead-free and RoHS directive compliant
■Agency approvals/Compliance
1. Recognized by UL1577 (Double protection isolation),
fi le No. E64380 (as model No. PC123)
2. Approved by BSI, BS-EN60065, file No. 7087, BS-
EN60950 fi le No. 7409, (as model No. PC123)
3. Approved by SEMKO, EN60065, EN60950, (as mod-
el No. PC123)
4. Approved by DEMKO, EN60065, EN60950, (as mod-
el No. PC123)
5. Approved by NEMKO, EN60065, EN60950, (as mod-
el No. PC123)
6. Approved by FIMKO, EN60065, EN60950, (as model
No. PC123)
7. Recognized by CSA fi le No. CA95323, (as model No.
PC123)
8. Approved by VDE, DIN EN60747-5-2(∗) (as an op-
tion), fi le No. 40008087 (as model No. PC123)
9. Package resin : UL fl ammability grade (94V - 0)
(∗) DIN EN60747-5-2 : successor standard of DIN VDE0884.
■Applications
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
4. Over voltage detection
2
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
■Internal Connection Diagram
■Outline Dimensions (Unit : mm)
Product mass : approx. 0.23g
Anode
Cathode
Emitter
Collector
11
2
3
4
2
4
3
1. Through-Hole [ex. PC123XNNSZ0F]
PC123
4.58±0.30
0.6±0.2
1.2±0.3
2.54±0.25
6.5±0.3
7.62±0.30
0.26±0.10
4.58±0.30
3.5±0.5
3.0±0.5
2.7±0.5
0.5TYP.
Anode mark
0.5±0.1
θθ
θ : 0 to 13˚
Epoxy resin
1
2
4
3
Rank mark
Factory identification mark
Date code
Product mass : approx. 0.23g
2. Through-Hole (VDE option)
[ex.
PC123XNYSZ0F]
Product mass : approx. 0.23g Product mass : approx. 0.23g
3. Wide Through-Hole Lead-Form
[ex.
PC123XNNFZ0F]
4.
Wide Through-Hole Lead-Form (VDE option)
[ex.
PC123XNYFZ0F]
PC123
4.58±0.30
0.6±0.2
1.2±0.3
2.54±0.25
6.5±0.3
7.62±0.30 4.58±0.30
3.5±0.5
3.0±0.5
2.7±0.5
0.5TYP.
Anode mark
0.5±0.1
θθ
θ : 0 to 13˚
Epoxy resin
1
2
4
3
Rank mark
Factory identification mark
Date code
SHARP mark "S"
VDE idenfication mark
0.26±0.10
4
PC123
1.2
±0.3
0.6
±0.2
2.54
±0.25
4.58
±0.30
3.5
±0.5
1.0
±0.1
6.5
±0.3
7.62
±0.30
Epoxy resin
4.58
±0.30
0.26
±0.10
10.16
±0.50
2.7
MIN.
Anode mark
1
23
4
0.5
±0.1
Rank mark Factory identification mark
Date code
PC123
1.2
±0.3
0.6
±0.2
2.54
±0.25
4.58
±0.30
3.5
±0.5
1.0
±0.1
6.5
±0.3
7.62
±0.30
Epoxy resin
4.58
±0.30
0.26
±0.10
10.16
±0.50
2.7
MIN.
Anode mark
1
23
4
0.5
±0.1
Rank mark Factory identification mark
Date code
SHARP mark "S"
VDE idenfication mark
4
3
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
(Unit : mm)
Product mass : approx. 0.22g
5. SMT Gullwing Lead-Form (VDE option)
[ex.
PC123XNYIP0F]
0.6±0.2
1.2±0.3
6.5±0.3
7.62±0.30
0.26±0.10
4.58±0.30
2.54±0.25
Epoxy resin
3.5±0.5
4.58±0.30
2.54±0.25
4
3
Anode mark
Rank mark Factory identification mark
Date code
1.0+0.4
−0.0
1.0+0.4
−0.0
10.0+0.0
−0.5
1
2PC123
0.35±0.25
SHARP mark "S"
VDE
idenfication mark
4
Product mass : approx. 0.22g
6. Wide SMT Gullwing Lead-Form
[ex.
PC123XNNUP0F]
Product mass : approx. 0.22g
7.
Wide SMT Gullwing Lead-Form (VDE option)
[ex.
PC123XNYUP0F]
PC123
0.6±0.2
1.2±0.3
1.0±0.1
6.5±0.3
10.16±0.50 0.75±0.25
0.75±0.25
4.58±0.30
2.54±0.25
Anode mark
Rank mark
Factory identification mark
Date code
4
3
7.62±0.30
12MAX
4.58±0.30
Epoxy resin
3.5±0.5
0.26±0.10
0.5±0.1
0.25±0.25
1
2
PC123
0.6
±0.2
1.2
±0.3
1.0
±0.1
6.5
±0.3
10.16
±0.50
0.75
±0.25
0.75
±0.25
4.58
±0.30
2.54
±0.25
Anode mark
Rank mark
Factory identification mark
Date code
4
3
7.62
±0.30
12
MAX
4.58
±0.30
Epoxy resin
3.5
±0.5
0.26
±0.10
0.5
±0.1
0.25
±0.25
1
2
SHARP mark "S"
VDE
idenfication mark
4
4
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
repeats in a 20 year cycle
1st digit 2nd digit
Year of production Month of production
A.D. Mark A.D. Mark Month Mark
1990 A 2002 P January 1
1991 B 2003 R February 2
1992 C 2004 S March 3
1993 D 2005 T April 4
1994 E 2006 U May 5
1995 F 2007 V June 6
1996 H 2008 W July 7
1997 J 2009 X August 8
1998 K 2010 A September 9
1999 L 2011 B October O
2000 M 2012 C November N
2001 N : : December D
Date code (2 digit)
Rank mark
Refer to the Model Line-up table.
Factory identifi cation Mark Country of origin Plating material
no mark
Japan SnCu (Cu : TYP. 2%)
or Indonesia SnBi (Bi : TYP. 2%)
or
China
SnCu (Cu : TYP. 2%)*
SnCu (Cu : TYP. 2%)
* Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%).
** This factory marking is for identifi cation purpose only.
Please contact the local SHARP sales representative to see the actural status of the production.
Factory identifi cation mark and Plating material
5
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
(Ta=25C)
Parameter Symbol Rating Unit
Input
Forward current IF50 mA
*1 Peak forward current IFM 1A
Reverse voltage VR6V
Power dissipation P 70 mW
Output
Collector-emitter voltage VCEO 70 V
Emitter-collector voltage VECO 6V
Collector current IC50 mA
Collector power dissipation
PC150 mW
Total power dissipation Ptot 200 mW
*2 Isolation voltage Viso(rms) 5 kV
Operating temperature Topr −30 to +100 C
Storage temperature Tstg −55 to +125 C
*2 Soldering temperature Tsol 260 C
*1 Pulse width≤100ms, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1 minute, f = 60Hz
*3 For 10s
■Absolute Maximum Ratings
■Electro-optical Characteristics (Ta=25C)
Parameter Symbol Condition MIN. TYP. MAX. Unit
Input
Forward voltage VFIF=20mA −1.2 1.4 V
Reverse current IRVR=4V −−
10 μA
Terminal capacitance CtV=0, f=1kHz −30 250 pF
Output
Collector dark current ICEO VCE=50V, IF=0 −−
100 nA
Collector-emitter breakdown voltage
BVCEO IC=0.1mA, IF=0 70 −−V
Emitter-collector breakdown voltage
BVECO IE=10μA, IF=0 6 −−
nA
Transfer
charac−
teristics
Collector current ICIF=5mA, VCE=5V 2.5 −20 mA
Collector-emitter saturation voltage VCE(sat) IF=20mA, IC=1mA −0.1 0.2 V
Isolation resistance RISO DC500V, 40 to 60%RH 5×1010 1×1011 −Ω
Floating capacitance CfV=0, f=1MHz −0.6 1 pF
Cut-off frequency fCVCE=5V, IC=2mA, RL=100Ω, −3dB −80 −kHz
Response time Rise time
trVCE=2V, IC=2mA, RL=100Ω−418
μs
Fall time tf−318
μs
6
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
■Model Line-up
Lead Form Through-Hole Wide Through-Hole
Rank mark
IC[mA]
(IF=5mA,
VCE=5V,
Ta=25˚C)
Package Sleeve
100pcs/sleeve
DIN
EN60747-5-2
−
Approved
−
Approved
Model No.
PC123XNNSZ0F PC123XNYSZ0F PC123XNNFZ0F PC123XNYFZ0F
With or without 2.5 to 20
PC123X1NSZ0F PC123X1YSZ0F PC123X1NFZ0F PC123X1YFZ0F L 2.5 to 7.5
PC123X2NSZ0F PC123X2YSZ0F PC123X2NFZ0F PC123X2YFZ0F M 5 to 12.5
PC123X5NSZ0F PC123X5YSZ0F PC123X5NFZ0F PC123X5YFZ0F N 10 to 20
PC123X8NSZ0F PC123X8YSZ0F PC123X8NFZ0F PC123X8YFZ0F E 5 to 10
Lead Form SMT Gullwing Wide SMT Gullwing
Rank mark
IC[mA]
(IF=5mA,
VCE=5V,
Ta=25˚C)
Package Taping
2 000pcs/reel
DIN
EN60747-5-2
−
Approved
−
Approved
Model No.
−
PC123XNYIP0F PC123XNNUP0F PC123XNYUP0F
With or without 2.5 to 20
PC123X1YIP0F PC123X1NUP0F PC123X1YUP0F L 2.5 to 7.5
PC123X2YIP0F PC123X2NUP0F PC123X2YUP0F M 5 to 12.5
PC123X5YIP0F PC123X5NUP0F PC123X5YUP0F N 10 to 20
PC123X8YIP0F PC123X8NUP0F PC123X8YUP0F E 5 to 10
Please contact a local SHARP sales representative to inquire about production status.
7
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 Diode Power Dissipation vs.
Ambient Temperature
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Fig.5 Peak Forward Current vs. Duty Ratio Fig.6 Forward Current vs. Forward Voltage
50˚C25˚C
0˚C
0 0.5 1 1.5 2 2.5 3 3.5
10
100
1
−25˚C
Ta=75˚C
Forward current IF (mA)
Forward voltage VF (V)
Duty ratio
Pulse width≤100μs
Ta=25˚C
10
100
10−310−210−1
Peak forward current IFM (mA)
10 000
1 000
1
Forward current IF (mA)
Ambient temperature Ta (˚C)
0
50
40
30
20
10
−30 0 25 50 55 75 100 125
Diode power dissipation P (mW)
Ambient temperature Ta (˚C)
0
100
80
70
60
40
20
−30 0 25 50 55 75 100 125
Collector power dissipation PC (mW)
Ambient temperature Ta (˚C)
0
250
200
150
100
50
−30 0 25 50 75 100 125
Total Power dissipation Ptot (mW)
Ambient temperature Ta (˚C)
0
250
200
150
100
50
−30 0 25 50 75 100 125
8
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
Fig.7 Current Transfer Ratio vs.
Forward Current
Fig.8 Collector Current vs.
Collector-emitter Voltage
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig.10
Collector - emitter Saturation Voltage
vs. Ambient Temperature
Fig.11 Collector Dark Current vs.
Ambient Temperature
Fig.12 Response Time vs.
Load Resistance
Response time (μs)
0.01 0.1 1 10 100
0.1
1
10
100
VCE=2V
IC=2mA
Ta=25˚C
tr
tf
td
ts
1 000
Load resistance (kΩ)
Ambient temperature Ta (˚C)
Collector dark current ICEO (A)
−30 0 20406080100
10−11
10−10
10−9
10−8
10−7
10−6
10−5
VCE=50V
Forward current IF (mA)
Current transfer ratio CTR (%)
0.1 1 10 100
0
50
100
150
200
250
300
VCE=5V
Ta=25˚C
Collector-emitter voltage VCE (V)
012345678910
0
6
12
18
24
30
36
42
48
54
60 Ta=25˚C
I
F
=30mA
I
F
=20mA
I
F
=10mA
I
F
=5mA
Collector current IC (mA)
PC (MAX.)
50
0
100
150
0 255075100
Relative current transfer ratio (%)
−30
IF=5mA
VCE=5V
Ambient temperature Ta (˚C) Ambient temperature Ta (˚C)
Collector-emitter saturation voltage VCE (sat) (V)
−30 0 20406080100
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
0.16 IF=20mA
IC=1mA
9
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
Fig.13 Test Circuit for Response Time Fig.14 Frequency Response
Fig.15 Collector-emitter Saturation Voltage vs.
Forward Current
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
VCC
90%
10%
Output
Input
RL
Input Output
VCE
RD
tf
tr
ts
td
Please refer to the conditions in Fig.12.
Frequency (kHz)
Voltage gain Av (dB)
0.1 10 100
−20
1
−15
−10
−5
0
5VCE=5V
IC=2mA
Ta=25˚C
RL=10kΩ1kΩ100Ω
1 000
Forward current IF (mA)
Collector-emitter saturation voltage VCE (sat) (V)
0 2 4 6 8 101214161820
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5Ta=25˚C
IC=0.5mA
1mA
3mA
7mA
5mA
10
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
■Design Considerations
●Design guide
While operating at IF<1mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
●Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
●Recommended foot print (reference)
SMT Gullwing lead-form Wide SMT Gullwing lead-form
8.2
2.54
1.7
2.2
10.2
2.54
1.7
2.2
(Unit : mm)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
11
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
■Manufacturing Guidelines
●Soldering Method
Refl ow Soldering :
Refl ow soldering should follow the temperature profi le shown below.
Soldering should not exceed the curve of temperature profi le and time.
Please don't solder more than twice.
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in fl ow solder bath is allowed under the be-
low listed guidelines.
Flow soldering should be completed below 270C and within 10s.
Preheating is within the bounds of 100 to 150C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400C.
Please don't solder more than twice
Other notice
Please test the soldering method in actual condition and make sure the soldering works fi ne, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
(package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
12
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
●Cleaning instructions
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3 minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fi ne in ac-
tual using conditions since some materials may erode the packaging resin.
●Presence of ODC
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specifi c brominated fl ame retardants such as the PBB and PBDE are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated
diphenyl ethers (PBDE).
13
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
■Package specifi cation
●Sleeve package
1. Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
12
6.7
5.8
10.8
520
±2
(Unit : mm)
2. Wide Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless
stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
15
6.35
5.9
10.8
520
±2
(Unit : mm)
14
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
●Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
D J
G
B
H
H
A
C
5˚MAX.
Dimensions List (Unit : mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.10
D
8.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.40±0.05
J
4.2±0.1
K
5.1±0.1
F
4.0±0.1
G
φ1.5+0.1
−0.0
Reel structure and Dimensions
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
φ330
b
17.5±1.5
c
φ100±1
d
φ13.0±0.5
e
φ23±1
f
2.0±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
15
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
2. Wide SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
Dimensions List
A
24.0±0.3
B
11.5±0.1
C
1.75±0.10
D
8.0±0.1
E
2.0±0.1
H
12.4±0.1
I
0.40±0.05
J
4.1±0.1
K
5.1±0.1
F
4.0±0.1
G
φ1.5+0.1
−0.0
(Unit : mm)
J
GI
EC
B
A
H
H
5˚
MAX.
F D
K
Reel structure and Dimensions
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
φ330
b
25.5±1.5
c
φ100±1
d
φ13.0±0.5
e
φ23±1
f
2.0±0.5
g
2.0±0.5
Direction of product insertion
Pull-out direction
[Packing : 2 000pcs/reel]
16
Sheet No.: D2-A09501EN
PC123XNNSZ0F Series
■Important Notices
· The circuit application examples in this publication
are provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems related
to any intellectual property right of a third party resulting
from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifi cations, characteristics, data, materials, structure,
and other contents described herein at any time
without notice in order to improve design or reliability.
Manufacturing locations are also subject to change
without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specifi ed in the relevant specifi cation
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Offi ce automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffi c signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any means,
electronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative
if there are any questions about the contents of this
publication.
[E253]
