707288S25PFG8 - INTEGRATED DEVICE TECHNOLOGY

August, 2016 − Rev. 14

1Publication Order Number:

MC10LVEP11/D

MC10LVEP11, MC100LVEP11

2.5V / 3.3V ECL 1:2

Differential Fanout Buffer

Description

The MC10/100LVEP11 is a differential 1:2 fanout buffer. The

device is pin and functionally equivalent to the EP11 device. With AC

performance the same as the EP11 device, the LVEP11 is ideal for

applications requiring lower voltage. Single-ended CLK input

operation is limited to a VCC w 3.0 V in PECL mode, or VEE v

−3.0 V in NECL mode.

The 100 Series contains temperature compensation.

Features

•240 ps Typical Propagation Delay

•Maximum Frequency > 3.0 GHz Typical

•PECL Mode Operating Range:

♦VCC = 2.375 V to 3.8 V with VEE = 0 V

•NECL Mode Operating Range:

♦VCC = 0 V with VEE = −2.375 V to −3.8 V

•Open Input Default State

•Q Output Will Default LOW with Inputs Open or at VEE

•LVDS Input Compatible

•These Devices are Pb-Free, Halogen Free and are RoHS Compliant

H = MC10 A = Assembly Location

K = MC100 L = Wafer Lot

5X = MC10 Y= Year

4K = MC100 W = Work Week

M= Date Code

G= Pb-Free Package

ALYWG

HU11

ALYWG

KU11

www.onsemi.com

HVP11

ALYW

KVP11

ALYW

5X MG

(Note: Microdot may be in either location)

4K MG

*For additional marking information, refer to

Application Note AND8002/D.

SOIC−8NB

D SUFFIX

CASE

751−07

TSSOP−8

DT SUFFIX

CASE

948R−02

DFN−8

MN SUFFIX

CASE 506AA

MARKING DIAGRAMS*

See detailed ordering and shipping information on page 9 of

this data sheet.

ORDERING INFORMATION

MC10LVEP11, MC100LVEP11

www.onsemi.com

VEE

VCC

DQ1

Figure 1. 8-Lead Pinout (Top View) and Logic

Diagram

Table 1. PIN DESCRIPTION

PIN FUNCTION

D*, D** ECL Data Inputs

Q0, Q0, Q1, Q1 ECL Data Outputs

VCC Positive Supply

VEE Negative Supply

EP (DFN−8 only) Thermal exposed pad

must be connected to a sufficient ther-

mal conduit. Electrically connect to the

most negative supply (GND) or leave

unconnected, floating open.

*Pins will default to 2/3 VCC when left open.

**Pins will default LOW when left open.

Table 2. ATTRIBUTES

Characteristics Value

Internal Input Pulldown Resistor 75 kW

Internal Input Pullup Resistor 37.5 kW

ESD Protection

Human Body Model

Machine Model

Charged Device Model

> 4 kV

> 200 V

> 2 kV

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb-Free Pkg

SOIC−8NB

TSSOP−8

DFN−8

Level 1

Level 3

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

Transistor Count 110 Devices

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

MC10LVEP11, MC100LVEP11

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Table 3. MAXIMUM RATINGS

Symbol Parameter Condition 1 Condition 2 Rating Unit

VCC PECL Mode Power Supply VEE = 0 V 6 V

VEE NECL Mode Power Supply VCC = 0 V −6 V

VIPECL Mode Input Voltage

NECL Mode Input Voltage

VEE = 0 V

VCC = 0 V

VI v VCC

VI w VEE

−6

Iout Output Current Continuous

Surge

100

TAOperating Temperature Range −40 to +85 °C

Tstg Storage Temperature Range −65 to +150 °C

qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm

500 lfpm

SOIC−8NB 190

130

°C/W

qJC Thermal Resistance (Junction-to-Case) Standard Board SOIC−8NB 41 to 44 °C/W

qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm

500 lfpm

TSSOP−8 185

140

°C/W

qJC Thermal Resistance (Junction-to-Case) Standard Board TSSOP−841 to 44 °C/W

qJA Thermal Resistance (Junction-to-Ambient) 0 lfpm

500 lfpm

DFN−8 129

°C/W

Tsol Wave Solder (Pb-Free) <2 to 3 sec @ 260°C 265 °C

qJC Thermal Resistance (Junction-to-Case) (Note 1) DFN−835 to 40 °C/W

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power)

MC10LVEP11, MC100LVEP11

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Table 4. 10LVEP DC CHARACTERISTICS, PECL (VCC = 2.5 V, VEE = 0 V (Note 1))

Symbol Characteristic

−40°C 25°C 85°C

Unit

Min Typ Max Min Typ Max Min Typ Max

IEE Power Supply Current 25 33 40 29 33 40 32 34 42 mA

VOH Output HIGH Voltage (Note 2) 1365 1490 1615 1430 1555 1680 1490 1615 1740 mV

VOL Output LOW Voltage (Note 2) 565 740 865 630 805 930 690 865 990 mV

VIHCMR Input HIGH Voltage Common Mode

Range (Differential Configuration)

(Note 3)

1.2 2.5 1.2 2.5 1.2 2.5 V

IIH Input HIGH Current 150 150 150 mA

IIL Input LOW Current

0.5

−150

0.5

−150

0.5

−150

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.125 V to −1.3 V.

2. All loading with 50 W to VCC − 2.0 V.

3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential

input signal. Single-Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.

Table 5. 10LVEP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1))

Symbol Characteristic

−40°C 25°C 85°C

Unit

Min Typ Max Min Typ Max Min Typ Max

IEE Power Supply Current 25 33 40 29 33 40 32 34 42 mA

VOH Output HIGH Voltage (Note 2) 2165 2290 2415 2230 2355 2480 2290 2415 2540 mV

VOL Output LOW Voltage (Note 2) 1365 1540 1665 1430 1605 1730 1490 1665 1790 mV

VIH Input HIGH Voltage (Single-Ended) (Note 3) 2090 2415 2155 2480 2215 2540 mV

VIL Input LOW Voltage (Single-Ended) (Note 3) 1365 1690 1430 1755 1490 1815 mV

VIHCMR Input HIGH Voltage Common Mode Range

(Differential Configuration) (Note 4)

1.2 3.3 1.2 3.3 1.2 3.3 V

IIH Input HIGH Current 150 150 150 mA

IIL Input LOW Current

0.5

−150

0.5

−150

0.5

−150

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to −0.5 V.

2. All loading with 50 W to VCC − 2.0 V.

3. Single-Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.

4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential

input signal.

MC10LVEP11, MC100LVEP11

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Table 6. 10LVEP DC CHARACTERISTICS, NECL (VCC = 0 V, VEE = −3.8 V to −2.375 V (Note 1))

Symbol Characteristic

−40°C 25°C 85°C

Unit

Min Typ Max Min Typ Max Min Typ Max

IEE Power Supply Current 25 33 40 29 33 40 32 34 42 mA

VOH Output HIGH Voltage (Note 2) −1135 −1010 −885 −1070 −945 −820 −1010 −885 −760 mV

VOL Output LOW Voltage (Note 2) −1935 −1760 −1635 −1870 −1695 −1570 −1810 −1635 −1510 mV

VIH Input HIGH Voltage (Single-Ended)

(Note 3)

−1210 −885 −1145 −820 −1085 −760 mV

VIL Input LOW Voltage (Single-Ended)

(Note 3)

−1935 −1610 −1870 −1545 −1810 −1485 mV

VIHCMR Input HIGH Voltage Common Mode

Range (Differential Configuration)

(Note 4)

VEE+1.2 0.0 VEE+1.2 0.0 VEE+1.2 0.0 V

IIH Input HIGH Current 150 150 150 mA

IIL Input LOW Current

0.5

−150

0.5

−150

0.5

−150

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

1. Input and output parameters vary 1:1 with VCC.

2. All loading with 50 W to VCC − 2.0 V.

3. Single-Ended input CLK pin operation is limited to VEE v −3.0 V in NECL mode.

4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential

input signal.

Table 7. 100LVEP DC CHARACTERISTICS, PECL (VCC = 2.5 V, VEE = 0 V (Note 1))

Symbol Characteristic

−40°C 25°C 85°C

Unit

Min Typ Max Min Typ Max Min Typ Max

IEE Power Supply Current 25 35 42 29 38 46 32 41 50 mA

VOH Output HIGH Voltage (Note 2) 1355 1480 1605 1355 1480 1605 1355 1480 1605 mV

VOL Output LOW Voltage (Note 2) 555 730 900 555 730 900 555 730 900 mV

VIH Input HIGH Voltage (Single-Ended) 1335 1620 1335 1620 1335 1620 mV

VIL Input LOW Voltage (Single-Ended) 555 900 555 900 555 900 mV

VIHCMR Input HIGH Voltage Common Mode

Range (Differential Configuration)

(Note 3)

1.2 2.5 1.2 2.5 1.2 2.5 V

IIH Input HIGH Current 150 150 150 mA

IIL Input LOW Current

0.5

−150

0.5

−150

0.5

−150

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.125 V to −1.3 V.

2. All loading with 50 W to VCC − 2.0 V.

3. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential

input signal. Single-Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.

MC10LVEP11, MC100LVEP11

www.onsemi.com

Table 8. 100LVEP DC CHARACTERISTICS, PECL (VCC = 3.3 V, VEE = 0 V (Note 1))

Symbol Characteristic

−40°C 25°C 85°C

Unit

Min Typ Max Min Typ Max Min Typ Max

IEE Power Supply Current 25 35 42 29 38 46 32 41 50 mA

VOH Output HIGH Voltage (Note 2) 2155 2280 2405 2155 2280 2405 2155 2280 2405 mV

VOL Output LOW Voltage (Note 2) 1355 1530 1700 1355 1530 1700 1355 1530 1700 mV

VIH Input HIGH Voltage (Single-Ended) (Note 3) 2135 2420 2135 2420 2135 2420 mV

VIL Input LOW Voltage (Single-Ended) (Note 3) 1355 1700 1355 1700 1355 1700 mV

VIHCMR Input HIGH Voltage Common Mode Range

(Differential Configuration) (Note 4)

1.2 3.3 1.2 3.3 1.2 3.3 V

IIH Input HIGH Current 150 150 150 mA

IIL Input LOW Current

0.5

−150

0.5

−150

0.5

−150

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.925 V to −0.5 V.

2. All loading with 50 W to VCC − 2.0 V.

3. Single-Ended input CLK pin operation is limited to VCC w 3.0 V in PECL mode.

4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential

input signal.

Table 9. 100LVEP DC CHARACTERISTICS, NECL (VCC = 0 V; VEE = −3.8 V to −2.375 V (Note 1))

Symbol Characteristic

−40°C 25°C 85°C

Unit

Min Typ Max Min Typ Max Min Typ Max

IEE Power Supply Current 25 35 42 29 38 46 32 41 50 mA

VOH Output HIGH Voltage (Note 2) −1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895 mV

VOL Output LOW Voltage (Note 2) −1945 −1770 −1600 −1945 −1770 −1600 −1945 −1770 −1600 mV

VIH Input HIGH Voltage (Single-Ended)

(Note 3)

−1165 −880 −1165 −880 −1165 −880 mV

VIL Input LOW Voltage (Single-Ended)

(Note 3)

−1945 −1425 −1600 −1945 −1425 −1600 −1945 −1425 −1600 mV

VIHCMR Input HIGH Voltage Common Mode

Range (Differential Configuration)

(Note 4)

VEE+1.2 0.0 VEE+1.2 0.0 VEE+1.2 0.0 V

IIH Input HIGH Current 150 150 150 mA

IIL Input LOW Current

0.5

−150

0.5

−150

0.5

−150

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

1. Input and output parameters vary 1:1 with VCC.

2. All loading with 50 W to VCC − 2.0 V.

3. Single-Ended input CLK pin operation is limited to VEE ≤ −3.0 V in NECL mode.

4. VIHCMR min varies 1:1 with VEE, VIHCMR max varies 1:1 with VCC. The VIHCMR range is referenced to the most positive side of the differential

input signal.

MC10LVEP11, MC100LVEP11

www.onsemi.com

Table 10. AC CHARACTERISTICS (VCC = 0 V; VEE = −3.8 V to −2.375 V or VCC = 2.375 V to 3.8 V; VEE = 0 V (Note 1))

Symbol Characteristic

−40°C 25°C 85°C

Unit

Min Typ Max Min Typ Max Min Typ Max

fmax Maximum Frequency (Figure 2) 3 3 3 GHz

tPLH,

tPHL

Propagation Delay

(Differential Configuration)

CLK to Q, Q

170 230 300 180 240 310 210 270 360 ps

tSKEW Within Device Skew Q, Q

Device to Device Skew (Note 2)

5.0 20

130

5.0 20

130

5.0 20

150

tJITTER CLOCK Random Jitter (RMS)

@ v1.0 GHz

@ v1.5 GHz

@ v2.0 GHz

@ v2.5 GHz

@ v3.0 GHz

0.126

0.112

0.111

0.112

0.155

0.3

0.2

0.3

0.2

0.142

0.162

0.122

0.172

0.217

0.4

0.3

0.2

0.3

0.209

0.162

0.170

0.235

0.368

0.3

0.2

0.3

0.6

VPP Input Voltage Swing

(Differential Configuration)

150 800 1200 150 800 1200 150 800 1200 mV

Output Rise/Fall Times Q, Q

(20% − 80%)

70 110 170 80 120 180 100 140 200 ps

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit

board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared

operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit

values are applied individually under normal operating conditions and not valid simultaneously.

1. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to VCC − 2.0 V.

2. Skew is measured between outputs under identical transitions.

100

200

300

400

500

600

700

800

900

1000

0 1000 2000 3000 4000

FREQUENCY (MHz)

Figure 2. Fmax Typical

VOUTpp (mV)

3.3 V

2.5 V

MC10LVEP11, MC100LVEP11

www.onsemi.com

Figure 3. Typical Phase Noise Plot at

fcarrier = 156.25 MHz

Figure 4. Typical Phase Noise Plot at

fcarrier = 311.04 MHz

Figure 5. Typical Phase Noise Plot at

fcarrier = 1.5 GHz

Figure 6. Typical Phase Noise Plot at

fcarrier = 2 GHz

The above phase noise plots captured using Agilent

E5052A show additive phase noise of the MC100LVEP11

device at frequencies 156.25 MHz, 311.04 MHz, 1.5 GHz

and 2 GHz respectively at an operating voltage of 3.3 V in

room temperature. The RMS Phase Jitter contributed by the

device (integrated between 12 kHz and 20 MHz; as shown

in the shaded region of the plot) at each of the frequencies

is 66 fs, 37 fs, 14 fs and 13 fs respectively. The input source

used for the phase noise measurements is Agilent E8663B.

MC10LVEP11, MC100LVEP11

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Figure 7. Typical Termination for Output Driver and Device Evaluation

(See Application Note AND8020/D − Termination of ECL Logic Devices.)

Driver

Device

Receiver

Device

Q D

Zo = 50 W

50 W50 W

VTT

VTT = VCC − 2.0 V

ORDERING INFORMATION

Device Package Shipping†

MC10LVEP11DG SOIC−8NB

(Pb-Free)

98 Units / Rail

MC10LVEP11DR2G SOIC−8NB

(Pb-Free)

2500 / Tape & Reel

MC10LVEP11DTG TSSOP−8

(Pb-Free)

100 Units / Rail

MC10LVEP11DTR2G TSSOP−8

(Pb-Free)

2500 / Tape & Reel

MC100LVEP11DG SOIC−8

(Pb-Free)

98 Units / Rail

MC100LVEP11DR2G SOIC−8

(Pb-Free)

2500 / Tape & Reel

MC100LVEP11DTG TSSOP−8

(Pb-Free)

100 Units / Rail

MC100LVEP11DTR2G TSSOP−8

(Pb-Free)

2500 / Tape & Reel

MC100LVEP11MNR4G DFN−8

(Pb-Free)

1000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MC10LVEP11, MC100LVEP11

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Resource Reference of Application Notes

AN1405/D −ECL Clock Distribution Techniques

AN1406/D −Designing with PECL (ECL at +5.0 V)

AN1503/D −ECLinPSt I/O SPiCE Modeling Kit

AN1504/D −Metastability and the ECLinPS Family

AN1568/D −Interfacing Between LVDS and ECL

AN1672/D −The ECL Translator Guide

AND8001/D −Odd Number Counters Design

AND8002/D −Marking and Date Codes

AND8020/D −Termination of ECL Logic Devices

AND8066/D −Interfacing with ECLinPS

AND8090/D −AC Characteristics of ECL Devices

MC10LVEP11, MC100LVEP11

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PACKAGE DIMENSIONS

SOIC−8NB

CASE 751−07

ISSUE AK

SEATING

PLANE

X 45 _

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

6. 751−01 THRU 751−06 ARE OBSOLETE. NEW

STANDARD IS 751−07.

0.10 (0.004)

DIM

MIN MAX MIN MAX

INCHES

4.80 5.00 0.189 0.197

MILLIMETERS

B3.80 4.00 0.150 0.157

C1.35 1.75 0.053 0.069

D0.33 0.51 0.013 0.020

G1.27 BSC 0.050 BSC

H0.10 0.25 0.004 0.010

J0.19 0.25 0.007 0.010

K0.40 1.27 0.016 0.050

M0 8 0 8

N0.25 0.50 0.010 0.020

S5.80 6.20 0.228 0.244

−X−

−Y−

0.25 (0.010)

−Z−

0.25 (0.010) ZSXS

____

1.52

0.060

7.0

0.275

0.6

0.024

1.270

0.050

4.0

0.155

ǒmm

inchesǓ

SCALE 6:1

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

MC10LVEP11, MC100LVEP11

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PACKAGE DIMENSIONS

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A2.90 3.10 0.114 0.122

B2.90 3.10 0.114 0.122

C0.80 1.10 0.031 0.043

D0.05 0.15 0.002 0.006

F0.40 0.70 0.016 0.028

G0.65 BSC 0.026 BSC

L4.90 BSC 0.193 BSC

M0 6 0 6

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

5. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

6. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE -W-.

____

SEATING

PLANE

PIN 1

DETAIL E

2X L/2

−U−

U0.15 (0.006) T

0.10 (0.004) V S

0.10 (0.004)

−T−

−V−

−W−

0.25 (0.010)

8x REFK

IDENT

K0.25 0.40 0.010 0.016

TSSOP−8

CASE 948R−02

ISSUE A

MC10LVEP11, MC100LVEP11

www.onsemi.com

PACKAGE DIMENSIONS

ÇÇ

DFN−8 2x2, 0.5P

CASE 506AA

ISSUE F

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994 .

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

C0.10

PIN ONE

REFERENCE

TOP VIEW

SIDE VIEW

BOTTOM VIEW

(A3)

C0.10

C0.08

NOTE 4 A1 SEATING

PLANE

e/2

NOTE 3

0.10 C

0.05 C

ABB

DIM MIN MAX

MILLIMETERS

A0.80 1.00

A1 0.00 0.05

A3 0.20 REF

b0.20 0.30

D2.00 BSC

D2 1.10 1.30

E2.00 BSC

E2 0.70 0.90

e0.50 BSC

L0.25 0.35

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

2.30

0.50

DIMENSIONS: MILLIMETERS

0.30 PITCH

PACKAGE

OUTLINE

RECOMMENDED

DETAIL A

OPTIONAL

CONSTRUCTIONS

DETAIL B

DETAIL A

L1 −−− 0.10

0.30 REF

0.90

1.30

ÉÉ

ÇÇ

DETAIL B

MOLD CMPDEXPOSED Cu

ALTERNATE

CONSTRUCTIONS

ÉÉ

ÇÇ

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