1#
Product Family Data Sheet Rev. 1.1 2016.04.15
High Voltage LED Series
Chip on Board
LC013B
Gen.2
High efficacy COB LED package,
well-suited for use in spotlight applications
Featur
es & Benefits
• Chip on Board (COB) solution makes it easy to design in
• Simple assembly reduces manufacturing cost
• Low thermal resistance
• InGaN/GaN MQW LED with long time reliability
• Completed 6,000 hours of LM-80 Testing
• ENEC certified: Integral LED Module
Applications
• Spotlight / Downlight
• LED Retrofit Bulbs
• Outdoor Illumination
2
Table of Contents
1. Characteristics ----------------------- 3
2. Product Code Information ----------------------- 6
3. Typical Characteristics Graphs ----------------------- 13
4. Outline Drawing & Dimension ----------------------- 18
5. Reliability Test Items & Conditions ----------------------- 19
6. Label Structure ----------------------- 20
7. Packing Structure ----------------------- 22
8. Precautions in Handling & Use ----------------------- 25
3
1. Characteristics
a) Absolute Maximum Rating
Item Symbol Rating Unit Condition
Ambient / Operating Temperature Ta -40 ~ +105 ºC -
Storage Temperature Tstg -40 ~ +120 ºC -
LED Junction Temperature Tj 150 ºC -
Case Temperature Tc 105 ºC *Note
Forward Current IF 660 mA -
Power Dissipation PD 24.4 W -
ESD (HBM) - ±2 kV -
ESD (MM) - ±0.5 kV -
b) Electro-optical Characteristics (IF = 360 mA, Tc = 25 ºC)
Item Unit Rank Min. Typ. Max.
Forward Voltage (VF) V YH 32.5 35.5 38.5
Color Rendering Index (Ra) -
3 70 - -
5 80 - -
7 90 - -
8 95
Thermal Resistance (junction to chip point) ºC/W - 1.6 -
Beam Angle º
- 115 -
Nominal Power W 12.8
Eye Protection
Risk 1 - -
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = T a = 25 °C)
2) Samsung maintains measurement toleran ce of: forward voltage = ±5 %, CRI = ±1
3) Max Tc=105 ℃ (at max current) is for ENEC condition. Refer to the derating curve, ‘3. Typical Characteristics Graph’
designed within the range.
4
c) Luminous Flux Characteristics (IF = 360 mA)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux
Bin
Sorting1) @ Tc = 25 °C (lm)
Calculated Flux2) @ Tc = 85 °C (lm)
Min. Max. Min. Max.
70
3000 1F 11 1633 1856 1470 1670
12 1856 2078 1670 1871
4000 1F 11 1715 1948 1543 1754
12 1948 2182 1754 1964
5000 1F 11 1731 1967 1558 1770
12 1967 2203 1770 1983
80
2700
1D 17 1700 1800 1547 1638
18 1800 1900 1638 1729
1E 18 1800 1900 1638 1729
19 1900 2000 1729 1820
3000
1D 17 1750 1850 1593 1684
18 1850 1950 1684 1775
1E 18 1850 1950 1684 1775
19 1950 2050 1775 1866
3500 1D 18 1840 1950 1674 1775
19 1950 2060 1775 1875
1E 19 1950 2060 1775 1875
4000
1D 18 1760 1870 1602 1702
19 1870 1980 1702 1802
1E 19 1870 1980 1702 1802
20 1980 2090 1802 1902
5000
1D 17 1680 1800 1529 1638
18 1800 1920 1638 1747
1E 18 1800 1920 1638 1747
19 1920 2040 1747 1856
5700
1D 17 1680 1800 1529 1638
18 1800 1920 1638 1747
1E 18 1800 1920 1638 1747
19 1920 2040 1747 1856
5
c) Luminous Flux Characteristics (IF = 360 mA)
CRI (Ra)
Min.
Nominal
CCT (K)
Flux
Rank
Flux
Bin Sorting
1)
@ Tc = 25 °C (lm) Calculated Flux
2)
@ Tc = 85 °C (lm)
Min. Max. Min. Max.
90
2700 1G 14 1405 1520 1279 1383
15 1520 1670 1383 1520
3000 1G 14 1440 1560 1310 1420
15 1560 1710 1420 1556
3500 1G 14 1475 1595 1342 1451
15 1595 1745 1451 1588
4000 1G 14 1520 1645 1383 1497
15 16454 1795 1497 1633
95
2700 1E 11 1160 1289 1056 1173
12 1289 1418 1173 1291
3000 1E 11 1196 1329 1089 1209
12 1329 1462 1209 1330
3500 1E 11 1232 1369 1121 1246
12 1369 1506 1246 1370
Notes:
1) The COB is tested in pulsed condition at rated test current (10 ms pulse width) and rated temperature (Tj = Tc = T a = 25 °C)
2) Calculated flux values are for refer en ce only
3) Samsung main tain s mea sure ment tole r an ce of: luminous flux = ±7 %, CRI = ±1
6
2. Product Code Information
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
S P H C W 1 H D N A 2 5 Y H R T 1 F
Digit PKG Information Code Specification
1 2 3 Samsung Package High Power SPH
4 5 Color WW Warm White (T/U/V/W Ranks)
CW Cool White (Q/R Ranks)
6 Product Version 1
7 8 Form Factor HD COB
9 Lens Type N No lens
10 Internal Code A LC013
11 Chip Type 2
12 CRI & Sorting Temperature
3 Min. 70
25 °C
5 Min. 80
7 Min. 90
8 Min 95
13 14 Forward Voltage (V) YH 32.5~38.5
15 CCT (K)
W 2700 K
Bin
Code:
WA,WB
(MacAdam
Ellipse)
V 3000 K VA, VB
(MacAdam
Ellipse)
VW, VX, VY, VZ
(ANSI bin)
U 3500 K UA, UB
(MacAdam
Ellipse)
T 4000 K TA, TB
(MacAdam
Ellipse)
TW, TX, TY,
TZ (ANSI bin)
R 5000 K RA
(MacAdam Ellipse)
RW, RX, RY, RZ
(ANSI bin)
Q 5700 K
Q
W, QX, QY, QZ (ANSI bin)
16 MacAdam / ANSI
2 MacAdam 2-step
3 MacAdam 3-step
T ANSI bin
17 18 Lum i no us Flu x
1D
Bin
Code:
17, 18, 19 (80 CR)I
1E 18, 19, 20 (80 CRI) 11, 12 (95 CRI)
1F 11, 12 (70 CRI)
1G 14, 15 (80 CRI)
7
a) Binning Structure (IF = 360 mA, Tc = 25 ºC)
a
Nominal
CCT (K)
Product Code
V
F
Rank
Color
Rank
Chrom.
Bin
Flux
Rank
Flux
Bin
Flux Range
(Φv, lm)
70
3000 SPHWW1HDNA23YHVT1F YH VT VW, VX
VY, VZ 1F
11
1633 ~ 1856
12
1856 ~ 2078
4000 SPHWW1HDNA23YHTT1F YH TT TW, TX
TY, TZ 1F
11
1715 ~ 1948
12
1948 ~ 2182
5000 SPHCW1HDNA23YHRT1F YH RT RW, RX
RY, RZ 1F
11
1731 ~ 1967
12
1967 ~ 2203
80
2700
SPHWW1HDNA25YHW21D YH W2 WB 1D
17
1700 ~ 1800
18
1800 ~ 1900
SPHWW1HDNA25YHW31D YH W3 WA, WB 1D
17
1700 ~ 1800
18
1800 ~ 1900
SPHWW1HDNA25YHW21E YH W2 WB 1E
18
1800 ~ 1900
19
1900 ~ 2000
SPHWW1HDNA25YHW31E YH W3 WA, WB 1E
18
1800 ~ 1900
19
1900 ~ 2000
3000
SPHWW1HDNA25YHV21D YH V2 VB 1D
17
1750 ~ 1850
18
1850 ~ 1950
SPHWW1HDNA25YHV31D YH V3 VA, VB 1D
17
1750 ~ 1850
18
1850 ~ 1950
SPHWW1HDNA25YHV21E YH V2 VB 1E
18
1850 ~ 1950
19
1950 ~ 2050
SPHWW1HDNA25YHV31E YH V3 VA, VB 1E
18
1850 ~ 1950
19
1950 ~ 2050
3500
SPHWW1HDNA25YHU21D YH U2 UB 1D
18
1840 ~ 1950
19
1950 ~ 2060
SPHWW1HDNA25YHU31D YH U3 UA, UB 1D
18
1840 ~ 1950
19
1950 ~ 2060
SPHWW1HDNA25YHU21E
YH
U2
UB
1E
19
1950 ~ 2060
SPHWW1HDNA25YHU31E
YH
U3
UA, UB
1E
19
1950 ~ 2060
4000
SPHWW1HDNA25YHT21D YH T2 TB 1D
18
1760 ~ 1870
19
1870 ~ 1980
SPHWW1HDNA25YHT31D YH T3 TA, TB 1D
18
1760 ~ 1870
19
1870 ~ 1980
SPHWW1HDNA25YHT21E YH T2 TB 1E
19
1870 ~ 1980
20
1980 ~ 2090
SPHWW1HDNA25YHT31E YH T3 TA, TB 1E
19
1870 ~ 1980
20
1980 ~ 2090
5000
SPHCW1HDNA25YHR31D YH R3 RA 1D
17
1680 ~ 1800
18
1800 ~ 1920
SPHCW1HDNA25YHRT1D YH RT RW, RX,
RY, RZ 1D
17
1680 ~ 1800
18
1800 ~ 1920
SPHCW1HDNA25YHR31E YH R3 RA 1E
18
1800 ~ 1920
19
1920 ~ 2040
SPHCW1HDNA25YHRT1E YH RT RW, RX,
RY, RZ 1E
18
1800 ~ 1920
19
1920 ~ 2040
5700
SPHCW1HDNA25YHQT1D YH QT QW, QX,
QY, QZ 1D
17
1680 ~ 1800
18
1800 ~ 1920
SPHCW1HDNA25YHQT1E YH QT QW, QX,
QY, QZ 1E
18
1800 ~ 1920
19
1920 ~ 2040
8
a) Binning Structure (IF = 360 mA, Tc = 25 ºC)
CRI (Ra)
Min.
Nominal
CCT (K) Product Code VF
Rank
Color
Rank
Chrom.
Bin
Flux
Rank
Flux
Bin
Flux Range
(Φv, lm)
90
2700
SPHWW1HDNA27YHW31G YH W3 WB 1G 14 1405 ~ 1520
15 1520 ~ 1670
SPHWW1HDNA27YHW21G YH W2 WA, WB 1G 14 1405 ~ 1520
15
1520 ~ 1670
3000
SPHWW1HDNA27YHV21G YH V2 VB 1G
14
1440 ~ 1560
15
1560 ~ 1710
SPHWW1HDNA27YHV31G YH V3 VA, VB 1G
14
1440 ~ 1560
15
1560 ~ 1710
3500
SPHWW1HDNA27YHU21G YH U2 UB 1G
14
1475 ~ 1595
15
1595 ~ 1745
SPHWW1HDNA27YHU31G YH U3 UA, UB 1G
14
1475 ~ 1595
15
1595 ~ 1745
4000
SPHWW1HDNA27YHT21G YH T2 TB 1G 14 1520 ~ 1645
15 1645 ~ 1795
SPHWW1HDNA27YHT31G YH T3 TA, TB 1G 14 1520 ~ 1645
15 1645 ~ 1795
95
2700
SPHWW1HDNA28YHW21E YH W2 WB 1E 11 1160 ~ 1289
12 1289 ~ 1418
SPHWW1HDNA28YHW31E YH W3 WA,WB 1E 11 1160 ~ 1289
12 1289 ~ 1418
3000
SPHWW1HDNA28YHV21E YH V2 VB 1E 11 1169 ~ 1329
12 1329 ~ 1462
SPHWW1HDNA28YHV31E YH V3 VA,VB 1E
11
1169 ~ 1329
12
1329 ~ 1462
3500
SPHWW1HDNA28YHU21E YH U2 UB 1E
11
1232 ~ 1369
12
1369 ~ 1506
SPHWW1HDNA28YHU31E YH U3 UA,UB 1E
11
1232 ~ 1369
12
1369 ~ 1506
9
b) Chromaticity Region & Coordinates (IF = 360 mA, Ta = 25 ºC)
Region CIE x CIE y Region CIE x CIE y
Region CIE x CIE y Region CIE x CIE y
V rank (3000 K)
T rank (4000 K)
VW
0.4223 0.399
VY
0.4345 0.4033
TW
0.3736 0.3874
TY
0.3871 0.3959
0.4345 0.4033 0.4468 0.4077
0.3871 0.3959 0.4006 0.4044
0.4431 0.4213 0.4562 0.4260
0.3828 0.3803 0.3952 0.388
0.4299 0.4165 0.4431 0.4213
0.3703 0.3726 0.3828 0.3803
VX
0.4223 0.399
VZ
0.4260 0.3854
TX
0.3703 0.3726
TZ
0.3828 0.3803
0.4147 0.3814 0.4373 0.3893
0.3828 0.3803 0.3952 0.388
0.4260 0.3854 0.4468 0.4077
0.3784 0.3647 0.3898 0.3716
0.4345 0.4033 0.4345 0.4033
0.367 0.3578 0.3784 0.3647
R rank (5000 K)
Q rank (5700 K)
RW
0.3376 0.3616
RY
0.3463 0.3687
QW
0.3207 0.3462
QY
0.3290 0.3538
0.3463 0.3687 0.3551 0.3760
0.3290 0.3538 0.3376 0.3616
0.3451 0.3554 0.3533 0.3620
0.3290 0.3417 0.3371 0.3490
0.3371 0.3490 0.3451 0.3554
0.3215 0.3350 0.3290 0.3417
RX
0.3371 0.3490
RZ
0.3451 0.3554
QX
0.3215 0.3350
QZ
0.3290 0.3417
0.3451 0.3554 0.3533 0.3620
0.3290 0.3417 0.3371 0.3490
0.3440 0.3428 0.3515 0.3487
0.3290 0.3300 0.3366 0.3369
0.3366 0.3369 0.3440 0.3428
0.3222 0.3243 0.3290 0.3300
10
b) Chromaticity Region & Coordinates (IF = 360 mA, Ta = 25 ºC)
MacAdam Ellipse (WA, WB) MacAdam Ellipse (V A, VB)
Step C IE x C IE y θ a b Step C IE x C IE y θ a b
2-step 0.4578 0.4101 53.70 0.0054 0.0028 2-step 0.4338 0.403 53.22 0.0056 0.0027
3-step 0.4578 0.4101 53.70 0.0081 0.0042 3-step 0.4338 0.4030 53.22 0.0083 0.0041
MacAdam Ellipse (UA, UB) MacAdam Ellipse (TA, TB)
Step C IE x C IE y θ a b Step C IE x C IE y θ a b
2-step 0.4073 0.3917 54.00 0.0062 0.0028 2-step 0.3818 0.3797 53.72 0.0063 0.0027
3-step 0.4073 0.3917 54.00 0.0093 0.0041 3-step 0.3818 0.3797 53.72 0.0094 0.0040
MacAdam Ellipse (RA)
Step C IE x C IE y θ a b
3-step 0.3447 0.3553 59.62 0.0082 0.0035
Note:
Samsung maintai ns me asur e ment t ole ran ce of: Cx, Cy = ±0.005
θ
CIE x,y
11
3. Typical Characteristics Graphs
a) Spectrum Distribution (IF = 360 mA, Tc = 25 ºC)
CCT: 2700 K (80 CRI) CCT: 3000 K (80 CRI)
CCT: 3500 K (80 CRI) CCT: 4000 K (80 CRI)
CCT: 5000 K (80 CRI) CCT: 5700 K (80 CRI)
12
CCT: 2700 K (90 CRI) CCT: 3000 K (90 CRI)
CCT: 3500 K (90 CRI) CCT: 4000 K (90 CRI)
b) Forward Current Characteristics (Tc = 25 ºC)
80 CRI
13
90 CRI
c) Temperature Characteristics (IF = 360 mA)
80 CRI
90 CRI
14
d) Color Shift Characteristics Tc = 25 ºC IF = 360 mA
80 CRI
90 CRI
e) Derating Curve
15
f) Beam Angle Characteristics (IF = 360 mA, Tc = 25 ºC)
80 CRI 90 CRI
16
4. Outline Drawing & Dimension
Item Dimension Tolerance Unit
Length 17.0 ±0.15 mm
Width 17.0 ±0.15 mm
Height 1.50 ±0.20 mm
Light Emitting Surface (LES) Diameter 11 ±0.15 mm
Note: Denoted product information above is only an example
( 13W8027 : 13W, CRI80+, 2700K )
T
c
point
1. Unit: mm
2. Tolerance: ± 0.15 mm
1. Unit: mm
2. Tolerance: ± 0.2 mm
Note
17
5. Reliability Test Items & Conditions
a) Test Items
Test Item Test Condition Test Hour / Cycle
Room Temperature
Life Test 25 ºC, IF = max 1000 h
High Temperature
Humidity Life Test 85 ºC, 85 % RH, DC Derating, IF = max 1000 h
High Temperature
Life Test
105 ºC, DC Derating, IF = max 1000 h
Low Temperature
Life Test -40 ºC, DC 660 mA 1000 h
High Temperature
Storage 120 ºC 1000 h
Low Temperature
Storage -40 ºC 1000 h
Thermal Shock -45 ºC / 15 min ↔ 125 ºC / 15 min
temperature change in 5 min 200 cycles
Temperature Cycle
On/Off Test -40 ºC / 85 ºC each 20 min, 100 min transfer
power on/ off each 5 min, DC 360 mA 100 cycles
Temperature Humidity
Storage Test -10 ºC ↔ 25 ºC, 95 % RH ↔ 85 ºC, 95 % RH
(24 h / cycle) 100 cycles
ESD (HBM)
R
1
: 10 MΩ
R2: 1.5 kΩ
C: 100 pF
V: ±2 kV
5 times
ESD (MM)
R
1
: 10 MΩ
R2: 0 kΩ
C: 200 pF
V: ±0.5 kV
5 times
Vibration Test 20 ~ 80 H z (displacement: 0.06 inch, max. 20 g)
80 ~ 2 kHz (max. 20 g)
min. frequency ↔ max. frequency 4 min transfer 4 times
Mechanical Shock Test 1500 g, 0.5 ms
each of the 6 surfaces (3 axis x 2 sides) 5 times
Salt Spray Test 35 ºC, 5 % salt water
8 h spray, 16 h dwell 2 cycles
b) Criteria for Judging the Damage
Item Symbol Test Condition
(Tc = 25 ºC)
Limit
Min. Max.
Forward Voltage VF IF = 360 mA L.S.L. * 0.9 U.S.L. * 1.1
Lumino us Flu x Φv IF = 360 mA L.S.L * 0.7 U.S.L * 1.3
18
6. Label Structure
a) Label Structure
Note: Denoted rank code and product code above is only an example (see description on page 6)
Rank Code:
ⓐⓑ: Forward Voltage rank (refer to page 7-10)
ⓒⓓ: Chromaticity bin (refer to page 11-12)
ⓔⓕ: Luminous Flux bin (refer to page 7-10)
Aluminum Bag & Inner Box Outer Box
19
b) Lot Number
The lot number is composed of the following characters:
●◎◇◆□■△△△ / 1▲▲▲ / xxx PCS
● : Production site (S: Korea, G: Tianjin, C hin a )
◎ : L (LED)
◇
: Product state (A: Normal, B: Bulk, C: First Production, R: Reproduction, S: Sample)
◆ : Year (Y: 2014, Z: 2015, A: 2016, …)
□ : Month (1~9, A, B, C)
■ : Day (1~9, A, B~V)
△△△ : Product serial number (001 ~ 009)
▲▲▲
: Tray number (001 ~ 999)
20
7. Packing Structure
Packing material Max. quantity
in pcs of COB
Dimension (mm)
Length
Width
Height
Tolerance
Tray 60 322.6 135.9 10.8 1.0
Aluminum Bag 480 (8 trays) 450 230 - 10
PE Foam Pad - 280 130 10 2
Inner Box 480 (1 aluminum bag) 338 148 55 2
Outer Box 1,920 (4 i nn er bo xes) 351 308 120 5
Pallet 107,520 (56 outer boxes) 1000 1000 130 10
a) Packing Structure
BODY
TRAY
PE-
FOAM
8ea
0ea
6ea
1ea
4ea
2ea
2ea
3ea
Cover Tray(1pcs)
HUMIDITY INDICATOR
(Do not use Cobalt Dichloride.)
Body Tray(8pcs)
Taping (Taping Strength : feebly)
Material is PET(Antistatic) 10(5) ~ 10(9) ohm/sq
SILICA GEL(5g)
(Do not use Cobalt Dichloride.)
MBB bag
Heat Sealing
8body + 1cover tray / MBB bag
(MBB-BAG : Heat Sealing)
4 inner-box / Out-box
21
b) Tray
①
COVER
②
BODY
22
c) Aluminum Vinyl Packing Bag
d) Silica Gel & Humidity Indicator Card inside Aluminum Vinyl Packing Bag
23
8. Precautions in Handling & Use
1) This device should not be used in any type of fluid such as water, oil, organic solvent, etc. When cleaning is required, IPA
is recommended as the cleaning agent. Some solvent-based cleaning agent may damage the silicone resins used in the
device.
2) LEDs must be stored in a clean environment. If the LEDs are to be stored for three months or more after being shipped
from Samsung, they should be packed with a nitrogen-filled container (shelf life of sealed bags is 12 months at
temperature 0~40 ºC, 0~90 % RH).
3) After storage bag is opened, device subjected to soldering, solder reflow, or other high temperature processes must be:
a. Mounted within 672 hours (28 days) at an assembly line with a condition of no more than 30 ºC / 60 % RH, or
b. Stored at <10 % RH
4) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place.
5) Devices require baking before mounting, if humidity card reading is >60 % at 23 ± 5 ºC.
6) Devices must be baked for 1 hour at 60 ± 5 ºC, if baking is required.
7) The LEDs are sensitive to the static electricity and surge current. It is recommended to use a wrist band or anti-
electrostatic glove when handling the LEDs. If voltage exceeding the absolute maximum rating is applied to LEDs, it may
cause damage or even destruction to LED devices. Damaged LEDs may show some unusual characteristics such as
increase in leakage current, lowered turn-on voltage, or abnormal lighting of LEDs at low current.
8) VOCs (Volatile Organic Compounds) can be generated from adhesives, flux, hardener or organic additives used in
luminaires (fixtures). Transparent LED silicone encapsulant is permeable to those chemicals and they may lead to a
discoloration of encapsulant when they exposed to heat or light. This phenomenon can cause a significant loss of light
emitted (output) from the luminaires. In order to prevent these problems, we recommend users to know the physical
properties of materials used in luminaires and they must be carefully selected.
9) The resin area is very sensitive, please do not handle, press, touch, rub, clean, or pick by with tweezers on it. Instead,
please pick at the handling area as indicated below.
Legal and additional information.
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