TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 D Qualified for Automotive Applications D 33-m (5-V Input) High-Side MOSFET D D D D D D D D D D D Switch Short-Circuit and Thermal Protection Overcurrent Logic Output Operating Range . . . 2.7 V to 5.5 V Logic-Level Enable Input Typical Rise Time . . . 6.1 ms Undervoltage Lockout Maximum Standby Supply Current . . . 10 A D No Drain-Source Back-Gate Diode Available in 8-pin SOIC Package Ambient Temperature Range, -40C to 85C 2-kV Human-Body-Model, 200-V Machine-Model ESD Protection UL Listed - File No. E169910 D PACKAGE (TOP VIEW) GND IN IN EN 1 8 2 7 3 6 4 5 OUT OUT OUT OC description The TPS203x family of power distribution switches is intended for applications where heavy capacitive loads and short circuits are likely to be encountered. These devices are 50-m N-channel MOSFET high-side power switches. The switch is controlled by a logic enable compatible with 5-V logic and 3-V logic. Gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external components and allows operation from supplies as low as 2.7 V. When the output load exceeds the current-limit threshold or a short is present, the TPS203x limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OC) logic output low. When continuous heavy overloads and short circuits increase the power dissipation in the switch, causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures the switch remains off until valid input voltage is present. The TPS203x devices differ only in short-circuit current threshold. The TPS2030 limits at 0.3-A load, the TPS2031 at 0.9-A load, the TPS2032 at 1.5-A load, the TPS2033 at 2.2-A load, and the TPS2034 at 3-A load (see Available Options). The TPS203x is available in an 8-pin small-outline integrated-circuit (SOIC) package and in an 8-pin dual in-line (DIP) package and operates over a junction temperature range of -40C to 125C. GENERAL SWITCH CATALOG 33 m, single TPS201xA 0.2 A - 2 A TPS202x TPS203x 80 m, single TPS2014 TPS2015 TPS2041 TPS2051 TPS2045 TPS2055 80 m, dual TPS2042 TPS2052 TPS2046 TPS2056 0.2 A - 2 A 0.2 A - 2 A 600 mA 1A 500 mA 500 mA 250 mA 250 mA 260 m IN1 OUT IN2 1.3 500 mA 500 mA 250 mA 250 mA TPS2100/1 IN1 500 mA IN2 10 mA TPS2102/3/4/5 IN1 500 mA IN2 100 mA 80 m, triple TPS2043 TPS2053 TPS2047 TPS2057 500 mA 500 mA 250 mA 250 mA 80 m, quad TPS2044 TPS2054 TPS2048 TPS2058 500 mA 500 mA 250 mA 250 mA Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2008 Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. TI.COM 1 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 AVAILABLE OPTIONS{ TA -40C 40 C to 85C 85 C ENABLE PACKAGED DEVICES} RECOMMENDED MAXIMUM CONTINUOUS LOAD CURRENT (A) TYPICAL SHORT-CIRCUIT CURRENT LIMIT AT 25C (A) 0.2 0.3 0.6 0.9 TPS2031IDRQ1 1 1.5 TPS2032IDRQ1 1.5 2.2 TPS2033IDRQ1 2 3 TPS2034IDRQ1 Active high SMALL OUTLINE (D) TPS2030IDRQ1 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com. Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. The D package is available taped and reeled. Add an R suffix to device type (e.g., TPS2030IDRQ1) Product Preview TPS2030 functional block diagram Power Switch CS IN OUT Charge Pump EN Current Limit Driver OC UVLO Thermal Sense GND Current Sense Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION EN 4 I Enable input. Logic high turns on power switch. GND 1 I Ground IN 2, 3 I Input voltage OC 5 O Overcurrent. Logic output active low 6, 7, 8 O Power-switch output OUT 2 TI.COM TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 detailed description power switch The power switch is an N-channel MOSFET with a maximum on-state resistance of 50 m (VI(IN) = 5 V). Configured as a high-side switch, the power switch prevents current flow from OUT to IN and IN to OUT when disabled. charge pump An internal charge pump supplies power to the driver circuit and provides the necessary voltage to pull the gate of the MOSFET above the source. The charge pump operates from input voltages as low as 2.7 V and requires very little supply current. driver The driver controls the gate voltage of the power switch. To limit large current surges and reduce the associated electromagnetic interference (EMI) produced, the driver incorporates circuitry that controls the rise times and fall times of the output voltage. The rise and fall times are typically in the 2-ms to 9-ms range. enable (EN) The logic enable disables the power switch, the bias for the charge pump, driver, and other circuitry to reduce the supply current to less than 10 A when a logic low is present on EN . A logic high input on EN restores bias to the drive and control circuits and turns the power on. The enable input is compatible with both TTL and CMOS logic levels. overcurrent ( OC) The OC open drain output is asserted (active low) when an overcurrent or overtemperature condition is encountered. The output remains asserted until the overcurrent or overtemperature condition is removed. current sense A sense FET monitors the current supplied to the load. The sense FET measures current more efficiently than conventional resistance methods. When an overload or short circuit is encountered, the current-sense circuitry sends a control signal to the driver. The driver, in turn, reduces the gate voltage and drives the power FET into its saturation region, which switches the output into a constant current mode and holds the current constant while varying the voltage on the load. thermal sense An internal thermal-sense circuit shuts off the power switch when the junction temperature rises to approximately 140C. Hysteresis is built into the thermal sense circuit. After the device has cooled approximately 20C, the switch turns back on. The switch continues to cycle off and on until the fault is removed. undervoltage lockout A voltage sense circuit monitors the input voltage. When the input voltage is below approximately 2 V, a control signal turns off the power switch. TI.COM 3 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Input voltage range, VI(IN) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 6 V Output voltage range, VO(OUT) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to VI(IN) + 0.3 V Input voltage range,VI(EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to 6 V Continuous output current, IO(OUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . internally limited Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40C to 125C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . 260C Electrostatic discharge (ESD) protection: Human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV Machine model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200V Charged device model (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . 750 V Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: All voltages are with respect to GND. DISSIPATION RATING TABLE PACKAGE TA 25C POWER RATING DERATING FACTOR ABOVE TA = 25C TA = 70C POWER RATING TA = 85C POWER RATING D 725 mW 5.8 mW/C 464 mW 377 mW recommended operating conditions Input voltage Continuous output current, IO VI(IN) MAX UNIT 2.7 5.5 V VI(EN) 0 5.5 V TPS2030 0 0.2 TPS2031 0 0.6 TPS2032 0 1 TPS2033 0 1.5 TPS2034 Operating virtual junction temperature, TJ 4 MIN TI.COM 0 2 -40 125 A C TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 electrical characteristics over recommended operating junction temperature range, VI(IN)= 5.5 V, IO = rated current, EN = 5 V, TJ = -405C to 1255C (unless otherwise noted) power switch TEST CONDITIONS PARAMETER VI(IN) = 5 V, TYP MAX TJ = 25C, IO = 1.8 A} 33 36 TJ = 85C, IO = 1.8 A} 38 46 IO = 1.8 A} 44 50 TJ = 25C, IO = 1.8 A} 37 41 TJ = 85C, IO = 1.8 A} 43 52 TJ = 125C, IO = 1.8 A} 51 61 TJ = 25C, IO = 0.18 A 30 34 TJ = 85C, IO = 0.18 A 35 50 TJ = 125C, IO = 0.18 A 39 55 TJ = 25C, IO = 0.18 A 33 37 TJ = 85C, IO = 0.18 A 39 55 TJ = 125C, IO = 0.18 A 44 66 TJ = 125C, VI(IN) = 3.3 V, rDS(on) Static drain-source drain source on-state on state resistance VI(IN) = 5 V, VI(IN) = 3.3 V, tr tf Rise time, time output Fall time time, output MIN VI(IN) = 5.5 V, CL = 1 F, TJ = 25C, RL = 10 6.1 VI(IN) = 2.7 V, CL = 1 F, TJ = 25C, RL = 10 8.6 VI(IN) = 5.5 V, CL = 1 F, TJ = 25C, RL = 10 3.4 VI(IN) = 2.7 V, CL = 1 F, TJ = 25C, RL = 10 3 UNIT m ms ms Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. Not production tested enable input ( EN) PARAMETER VIH High-level input voltage VIL Low level input voltage Low-level TEST CONDITIONS 2.7 V VI(IN) 5.5 V MIN TYP MAX 2 UNIT V 4.5 V VI(IN) 5.5 V 0.8 2.7 V VI(IN) 4.5 V 0.5 II Input current EN = 0 V or EN = VI(IN) -0.5 0.5 ton Turnon time CL = 100 F, RL = 10 20 toff Turnoff time CL = 100 F, RL = 10 40 V A ms current limit PARAMETER IOS Short-circuit Short circuit output current TEST CONDITIONS TJ = 25C, VI = 5.5 V, OUT connected to GND, Device enable into short circuit MIN TYP MAX TPS2030 0.22 0.3 0.4 TPS2031 0.66 0.9 1.1 TPS2032 1.1 1.5 1.8 TPS2033 1.65 2.2 2.7 TPS2034 2.2 3 3.8 UNIT A Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately. TI.COM 5 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 electrical characteristics over recommended operating junction temperature range, VI(IN)= 5.5 V, IO = rated current, EN = 5 V, TA = -405C to 1255C (unless otherwise noted) (continued) supply current PARAMETER TEST CONDITIONS MIN TJ = 25C Supply current, current low-level low level output No Load on OUT EN = 0 level output Supply current current, high high-level No Load on OUT EN = VI(IN) Leakage current OUT connected to ground EN = 0 TYP MAX 0.3 -40C TJ 125C 1 10 TJ = 25C 58 75 -40C TJ 125C 75 100 -40C TJ 125C 10 UNIT A A A A A undervoltage lockout PARAMETER TEST CONDITIONS Low-level input voltage MIN TYP 2 Hysteresis TJ = 25C MAX 2.5 100 UNIT V mV overcurrent (OC) PARAMETER TEST CONDITIONS Output low voltage IO = 10 mA, Off-state current VO = 5 V, 6 Specified by design, not production tested. TI.COM MIN TYP MAX UNIT VOL(OC) 0.5 V VO = 3.3 V 1 A TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 PARAMETER MEASUREMENT INFORMATION OUT RL tf tr CL VO(OUT) 90% 10% 90% 10% TEST CIRCUIT 50% VI(EN) 50% toff ton 90% VO(OUT) 10% VOLTAGE WAVEFORMS Figure 1. Test Circuit and Voltage Waveforms Table of Timing Diagrams FIGURE Turnon Delay and Rise TIme 2 Turnoff Delay and Fall Time 3 Turnon Delay and Rise TIme with 1-F Load 4 Turnoff Delay and Rise TIme with 1-F Load 5 Device Enabled Into Short 6 TPS2030, TPS2031, TPS2032, TPS2033, and TPS2034, Ramped Load on Enabled Device 7, 8, 9, 10, 11 TPS2034, Inrush Current 12 7.9- Load Connected to an Enabled TPS2030 Device 13 3.7- Load Connected to an Enabled TPS2030 Device 14 3.7- Load Connected to an Enabled TPS2031 Device 15 2.6- Load Connected to an Enabled TPS2031 Device 16 2.6- Load Connected to an Enabled TPS2032 Device 17 1.2- Load Connected to an Enabled TPS2032 Device 18 1.2- Load Connected to an Enabled TPS2033 Device 19 0.9- Load Connected to an Enabled TPS2033 Device 20 0.9- Load Connected to an Enabled TPS2034 Device 21 0.5- Load Connected to an Enabled TPS2034 Device 22 TI.COM 7 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 PARAMETER MEASUREMENT INFORMATION VI(EN) (5 V/div) VI(EN) (5 V/div) VI(EN) VI(EN) VI(IN) = 5 V RL = 27 TA = 25C VO(OUT) (2 V/div) VO(OUT) (2 V/div) VIN = 5 V RL = 27 TA = 25C VO(OUT) 0 2 4 6 8 10 12 14 16 18 VO(OUT) 20 0 2 4 6 8 12 14 16 18 20 t - Time - ms t - Time - ms Figure 3. Turnoff Delay and Fall Time Figure 2. Turnon Delay and Rise Time VI(EN) (5 V/div) VI(EN) (5 V/div) VI(EN) VI(EN) VO(OUT) (2 V/div) VO(OUT) (2 V/div) VI(IN) = 5 V CL = 1 F RL = 27 TA = 25C VO(OUT) 0 2 4 6 8 10 12 14 16 18 VI(IN) = 5 V CL = 1 F RL = 27 TA = 25C VO(OUT) 20 0 2 4 6 8 10 12 14 16 18 t - Time - ms t - Time - ms Figure 5. Turnoff Delay and Fall Time With 1-F Load Figure 4. Turnon Delay and Rise Time With 1-F Load 8 10 TI.COM 20 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 PARAMETER MEASUREMENT INFORMATION VO(OC) (5 V/div) VI(EN) VI(EN) (5 V/div) VO(OC) VI(IN) = 5 V TA = 25C VI(IN) = 5 V TA = 25C TPS2034 TPS2033 IO(OUT) (500 mA/div) TPS2032 TPS2031 TPS2030 IO(OUT) IO(OUT) IO(OUT) (1 A/div) 0 1 2 3 4 5 6 7 8 9 0 10 20 40 60 80 100 120 140 160 180 200 t - Time - ms t - Time - ms Figure 7. TPS2030, Ramped Load on Enabled Device Figure 6. Device Enabled Into Short VO(OC) (5 V/div) VO(OC) (5 V/div) VO(OC) VO(OC) VI(IN) = 5 V TA = 25C VI(IN) = 5 V TA = 25C IO(OUT) (1 A/div) IO(OUT) (1 A/div) IO(OUT) IO(OUT) 0 20 40 60 80 100 120 140 160 180 200 0 t - Time - ms 20 40 60 80 100 120 140 160 180 200 t - Time - ms Figure 8. TPS2031, Ramped Load on Enabled Device Figure 9. TPS2032, Ramped Load on Enabled Device TI.COM 9 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 PARAMETER MEASUREMENT INFORMATION VO(OC) (5 V/div) VO(OC) (5 V/div) VO(OC) VO(OC) VI(IN) = 5 V TA = 25C VI(IN) = 5 V TA = 25C IO(OUT) (1 A/div) IO(OUT) (1 A/div) IO(OUT) IO(OUT) 0 20 40 60 0 80 100 120 140 160 180 200 20 40 60 80 100 120 140 160 180 200 t - Time - ms t - Time - ms Figure 11. TPS2034, Ramped Load on Enabled Device Figure 10. TPS2033, Ramped Load on Enabled Device VI(EN) VO(OC) (5 V/div) VI(EN) (5 V/div) VO(OC) IO(OUT) (200 mA/div) 470 F 150 F II(IN) (500 mA/div) II(IN) RL = 10 TA = 25C 47 F 0 1 2 3 4 5 6 7 8 9 10 0 200 400 600 800 1000 1200 1400 1600 1800 2000 t - Time - s t - Time - ms Figure 12. TPS2034, Inrush Current 10 VI(IN) = 5 V RL = 7.9 TA = 25C IO(OUT) Figure 13. 7.9- Load Connected to an Enabled TPS2030 Device TI.COM TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 PARAMETER MEASUREMENT INFORMATION VO(OC) (5 V/div) VO(OC) (5 V/div) VO(OC) VO(OC) VI(IN) = 5 V RL = 3.7 TA = 25C VI(IN) = 5 V RL = 3.7 TA = 25C IO(OUT) (500 mA/div) IO(OUT) (1 A/div) IO(OUT) IO(OUT) 0 0 50 100 150 200 250 300 350 400 450 500 t - Time - s 200 400 600 800 1000 1200 1400 1600 1800 2000 t - Time - s Figure 15. 3.7- Load Connected to an Enabled TPS2031 Device Figure 14. 3.7- Load Connected to an Enabled TPS2030 Device VO(OC) VO(OC) (5 V/div) VO(OC) (5 V/div) VO(OC) VI(IN) = 5 V RL = 2.6 TA = 25C VI(IN) = 5 V RL = 2.6 TA = 25C IO(OUT) (1 A/div) IO(OUT) (1 A/div) IO(OUT) IO(OUT) 0 0 50 100 150 200 250 300 350 400 450 500 200 400 600 800 1000 1200 1400 1600 1800 2000 t - Time - s t - Time - s Figure 17. 2.6- Load Connected to an Enabled TPS2032 Device Figure 16. 2.6- Load Connected to an Enabled TPS2031 Device TI.COM 11 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 PARAMETER MEASUREMENT INFORMATION VO(OC) (5 V/div) VO(OC) (5 V/div) VO(OC) VO(OC) VI(IN) = 5 V RL = 1.2 TA = 25C IO(OUT) (1 A/div) IO(OUT) (2 A/div) VI(IN) = 5 V RL = 1.2 TA = 25C IO(OUT) IO(OUT) 0 100 200 300 400 500 600 700 800 900 1000 0 t - Time - s 100 200 300 400 500 600 700 800 900 1000 t - Time - s Figure 18. 1.2- Load Connected to an Enabled TPS2032 Device Figure 19. 1.2- Load Connected to an Enabled TPS2033 Device VO(OC) (5 V/div) VO(OC) (5 V/div) VO(OC) VO(OC) VI(IN) = 5 V RL = 0.9 TA = 25C VI(IN) = 5 V RL = 0.9 TA = 25C IO(OUT) (2 A/div) IO(OUT) (5 A/div) IO(OUT) IO(OUT) 0 100 200 300 400 500 600 700 800 900 1000 t - Time - s 100 200 300 400 500 600 700 800 900 1000 t - Time - s Figure 20. 0.9- Load Connected to an Enabled TPS2033 Device 12 0 TI.COM Figure 21. 0.9- Load Connected to an Enabled TPS2034 Device TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 PARAMETER MEASUREMENT INFORMATION VO(OC) (5 V/div) VO(OC) VI(IN) = 5 V RL = 0.5 TA = 25C IO(OUT) (5 A/div) IO(OUT) 0 50 100 150 200 250 300 350 400 450 500 t - Time - s Figure 22. 0.5- Load Connected to an Enabled TPS2034 Device TYPICAL CHARACTERISTICS Table of Graphs FIGURE td(on) Turnon delay time vs Output voltage 23 td(off) Turnoff delay time vs Input voltage 24 tr Rise time vs Load current 25 tf Fall time vs Load current 26 Supply current (enabled) vs Junction temperature 27 Supply current (disabled) vs Junction temperature 28 Supply current (enabled) vs Input voltage 29 Supply current (disabled) vs Input voltage 30 vs Input voltage 31 vs Junction temperature 32 vs Input voltage 33 vs Junction temperature 34 vs Input voltage 35 vs Junction temperature 36 Undervoltage lockout 37 IOS Short circuit current limit Short-circuit rDS(on) Static drain-source drain source on-state on state resistance VI Input voltage TI.COM 13 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 TYPICAL CHARACTERISTICS TURNON DELAY TIME vs OUTPUT VOLTAGE TURNOFF DELAY TIME vs INPUT VOLTAGE 18 TA = 25C CL = 1 F 7 t d(off) - Turn-off Delay Time - ms t d(on) - Turn-on Delay Time - ms 7.5 6.5 6 5.5 5 4.5 TA = 25C CL = 1 F 17.5 17 16.5 4 3.5 2.5 3 5 3.5 4 4.5 VI - Input Voltage - V 5.5 16 2.5 6 3 5 3.5 4 4.5 VI - Input Voltage - V Figure 23 Figure 24 RISE TIME vs LOAD CURRENT FALL TIME vs LOAD CURRENT 6.5 5.5 6 3.5 TA = 25C CL = 1 F TA = 25C CL = 1 F t f - Fall Time - ms t r - Rise Time - ms 3.25 6 5.5 3 2.75 5 0 0.5 1 1.5 IL - Load Current - A 2 Figure 25 14 2.5 0 0.5 1 1.5 IL - Load Current - A Figure 26 TI.COM 2 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 TYPICAL CHARACTERISTICS SUPPLY CURRENT (ENABLED) vs JUNCTION TEMPERATURE SUPPLY CURRENT (DISABLED) vs JUNCTION TEMPERATURE 75 5 VI(IN) = 5.5 V Supply Current (Disabled) - A Supply Current (Enabled) - A VI(IN) = 5.5 V 65 VI(IN) = 5 V 55 VI(IN) = 4 V 45 VI(IN) = 3.3 V VI(IN) = 5 V 4 3 2 1 VI(IN) = 4 V VI(IN) = 3.3 V 0 VI(IN) = 2.7 V VI(IN) = 2.7 V 35 -50 -25 75 100 125 0 25 50 TJ - Junction Temperature - C -1 150 -50 -25 Figure 27 75 100 125 0 25 50 TJ - Junction Temperature - C 150 Figure 28 SUPPLY CURRENT (ENABLED) vs INPUT VOLTAGE SUPPLY CURRENT (DISABLED) vs INPUT VOLTAGE 75 5 TJ = 85C Supply Current (Disabled) - A Supply Current (Enabled) - A TJ = 125C 65 55 45 TJ = 25C TJ = 125C 4 3 TJ = 85C 2 1 TJ = 25C 0 TJ = 0C TJ = 0C TJ = -40C TJ = -40C 35 2.5 3 5 3.5 4 4.5 VI - Input Voltage - V 5.5 -1 6 2.5 Figure 29 3 5 3.5 4 4.5 VI - Input Voltage - V 5.5 6 Figure 30 TI.COM 15 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 SHORT-CIRCUIT CURRENT LIMIT vs INPUT VOLTAGE SHORT-CIRCUIT CURRENT LIMIT vs JUNCTION TEMPERATURE 3.5 3.5 TPS2034 TPS2034 I OS - Short-Circuit Current Limit - A I OS - Short-Circuit Current Limit - A TA = 25C 3 2.5 TPS2033 2 TPS2032 1.5 1 TPS2031 0.5 TPS2030 3 5 4 VI - Input Voltage - V 2.5 TPS2033 2 6 TPS2032 1.5 TPS2031 1 TPS2030 0.5 0 -50 0 2 3 25 -25 0 50 75 TJ - Junction Temperature - C Figure 32 STATIC DRAIN-SOURCE ON-STATE RESISTANCE vs INPUT VOLTAGE 60 IO = 0.18 A 50 TJ = 125C 40 TJ = 25C 30 TJ = -40C 20 2.5 3 4.5 5 3.5 4 VI - Input Voltage - V 5.5 6 Figure 33 16 r DS(on) - Static Drain-Source On-State Resistance - m r DS(on) - Static Drain-Source On-State Resistance - m Figure 31 100 STATIC DRAIN-SOURCE ON-STATE RESISTANCE vs JUNCTION TEMPERATURE 60 IO = 0.18 A 50 40 VI = 2.7 V VI = 3.3 V 30 20 -50 -25 VI = 5.5 V 50 75 100 125 0 25 TJ - Junction Temperature - C Figure 34 TI.COM 150 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 60 IO = 1.8 A 50 TJ = 125C 40 TJ = 25C TJ = -40C 30 20 3 3.5 4 4.5 5 VI - Input Voltage - V 5.5 6 r DS(on) - Static Drain-Source On-State Resistance - m STATIC DRAIN-SOURCE ON-STATE RESISTANCE vs INPUT VOLTAGE STATIC DRAIN-SOURCE ON-STATE RESISTANCE vs JUNCTION TEMPERATURE 60 IO = 1.8 A 50 VI = 3.3 V VI = 4 V 40 VI = 5.5 V 30 20 -50 -25 Figure 35 50 75 100 125 0 25 TJ - Junction Temperature - C 150 Figure 36 UNDERVOLTAGE LOCKOUT 2.5 2.4 VI - Input Voltage - V r DS(on) - Static Drain-Source On-State Resistance - m TYPICAL CHARACTERISTICS Start Threshold 2.3 2.2 Stop Threshold 2.1 2 -50 0 50 100 TJ - Temperature - C 150 Figure 37 TI.COM 17 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 APPLICATION INFORMATION TPS2034 2,3 Power Supply 2.7 V to 5.5 V 10 k IN 0.1 F OUT 6,7,8 Load 0.1 F 5 4 22 F OC EN GND 1 Figure 38. Typical Application power supply considerations A 0.01-F to 0.1-F ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the output and input pins is recommended when the output load is heavy. This precaution reduces power supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor improves the immunity of the device to short-circuit transients. overcurrent A sense FET checks for overcurrent conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault is present long enough to activate thermal limiting. Three possible overload conditions can occur. In the first condition, the output has been shorted before the device is enabled or before VI(IN) has been applied (see Figure 6). The TPS203x senses the short and immediately switches into a constant-current output. In the second condition, the excessive load occurs while the device is enabled. At the instant the excessive load occurs, high currents may flow for a short time before the current-limit circuit can react (see Figure 13 through Figure 22). After the current-limit circuit has tripped (reached the overcurrent trip threshhold) the device switches into constant-current mode. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is exceeded (see Figure 7 through Figure 11). The TPS203x is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its constant-current mode. OC response The OC open-drain output is asserted (active low) when an overcurrent or overtemperature condition is encountered. The output remains asserted until the overcurrent or overtemperature condition is removed. Connecting a heavy capacitive load to an enabled device can cause momentary false overcurrent reporting from the inrush current flowing through the device, charging the downstream capacitor. An RC filter can be connected to the OC pin to reduce false overcurrent reporting. Using low-ESR electrolytic capacitors on the output lowers the inrush current flow through the device during hot-plug events by providing a low impedance energy source, thereby reducing erroneous overcurrent reporting. 18 TI.COM TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 APPLICATION INFORMATION TPS203x TPS203x GND OUT IN OUT IN OUT EN V+ Rpullup OUT IN OUT IN OUT EN OC V+ GND Rpullup Rfilter OC Cfilter Figure 39. Typical Circuit for OC Pin and RC Filter for Damping Inrush OC Responses power dissipation and junction temperature The low on-resistance on the n-channel MOSFET allows small surface-mount packages, such as SOIC, to pass large currents. The thermal resistances of these packages are high compared to those of power packages; it is good design practice to check power dissipation and junction temperature. The first step is to find rDS(on) at the input voltage and operating temperature. As an initial estimate, use the highest operating ambient temperature of interest and read rDS(on) from Figure 33 through Figure 36. Next, calculate the power dissipation using: P D +r DS(on) I2 Finally, calculate the junction temperature: T +P J D R qJA )T A Where: TA = Ambient Temperature C RJA = Thermal resistance SOIC = 172C/W, PDIP = 106C/W Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees, repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally sufficient to get an acceptable answer. thermal protection Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for extended periods of time. The faults force the TPS203x into constant current mode, which causes the voltage across the high-side switch to increase; under short-circuit conditions, the voltage across the switch is equal to the input voltage. The increased dissipation causes the junction temperature to rise to high levels. The protection circuit senses the junction temperature of the switch and shuts it off. Hysteresis is built into the thermal sense circuit, and after the device has cooled approximately 20 degrees, the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. undervoltage lockout (UVLO) An undervoltage lockout ensures that the power switch is in the off state at powerup. Whenever the input voltage falls below approximately 2 V, the power switch will be quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed. The UVLO also keeps the switch from being turned on until the power supply has reached at least 2 V, even if the switch is enabled. Upon reinsertion, the power switch will be turned on, with a controlled rise time to reduce EMI and voltage overshoots. TI.COM 19 TPS2030-Q1, TPS2031-Q1, TPS2032-Q1, TPS2033-Q1, TPS2034-Q1 POWER-DISTRIBUTION SWITCHES SGLS298B - SEPTEMBER 2005 - REVISED JUNE 2008 APPLICATION INFORMATION generic hot-plug applications (see Figure 40) In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Because of the controlled rise times and fall times of the TPS203x series, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the TPS203x also ensures the switch will be off after the card has been removed, and the switch will be off during the next insertion. The UVLO feature assures a soft start with a controlled rise time for every insertion of the card or module. PC Board TPS2034 Power Supply 2.7 V to 5.5 V 1000 F Optimum 0.1 F GND OUT IN OUT IN OUT EN Block of Circuitry OC Overcurrent Response Figure 40. Typical Hot-Plug Implementation By placing the TPS203x between the VCC input and the rest of the circuitry, the input power reaches this device first after insertion. The typical rise time of the switch is approximately 9 ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge currents and provides a hot-plugging mechanism for any device. 20 TI.COM PACKAGE OPTION ADDENDUM www.ti.com 26-Mar-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPS2030IDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS2030IDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF TPS2030-Q1 : * Catalog: TPS2030 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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