LD261-5/6 - OSRAM GmbH - Product.Network

LD 261

GaAs-IR-Lumineszenzdiode

GaAs Infrared Emitter

Lead (Pb) Free Product - RoHS Compliant

2007-03-30 1

Wesentliche Merkmale

• GaAs-IR-Lumineszenzdiode

• Hohe Zuverlässigkeit

• Gruppiert lieferbar

• Gehäusegleich mit BPX 81

• Miniatur-Gehäuse

Anwendungen

• Miniaturlichtschranken für Gleich- und

Wechsellichtbetrieb

• Barcodeleser

• Industrieelektronik

• „Messen/Steuern/Regeln“

• Sensorik

• Drehzahlsteuerung

Typ

Type Bestellnummer

Ordering Code Gehäuse

Package

LD 261 Q62703Q0395 Leiterbandgehäuse, klares Epoxy-Gießharz, linsenförmig

im 2.54-mm-Raster (1/10’’), Kathodenkennzeichnung:

Nase am Lötspieß

Lead frame, transparent epoxy resin lens, solder tabs

lead spacing 2.54 mm (1/10’’), cathode marking: projection

at solder lead

LD 261-5/6 Q65110A3337

Features

• GaAs infrared emitting diode

• High reliability

• Available in bins

• Same package as BPX 81

• Miniature package

Applications

• Miniature photointerrupters

• Barcode readers

• Industrial electronics

• For control and drive circuits

• Sensor technol ogy

• Speed controller

2007-03-30 2

LD 261

Grenzwerte (TA = 25 °C)

Maximum Ratings

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Betriebs- und Lagertemperatur

Operating and storage temperature range Top; Tstg – 40 … + 80 °C

Sperrschichttemperatur

Junction temperature Tj80 °C

Sperrspannung

Reverse voltage VR5 V

Durchlassstrom

Forward current IF50 mA

Stoßstrom, τ ≤ 10 μs, D = 0

Surge current IFSM 1.6 A

Verlustleistung

Power dissipation Ptot 70 mW

Wärmewiderstand

Thermal resistance RthJA

RthJL

750

650 K/W

K/W

Kennwerte (TA = 25 °C)

Characteristics

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

Wellenlänge der Strahlung

Wavelength at peak emission

IF = 50 mA, tp = 20 ms

λpeak 950 nm

Spektrale Bandbreite bei 50% von Imax

Spectral bandwidth at 50% of Imax

IF = 50 m A, tp = 20 ms

Δλ 55 nm

Abstrahlwinkel

Half angle ϕ± 15 Grad

deg.

Aktive Chipfläche

Active chip area A0.25 mm2

Abmessungen der aktiven Chipfläche

Dimension of the active chip a r ea L × B

L × W0.5 × 0.5 mm²

Abstand Chipoberfläche bis Linsenscheitel

Distance chip surface to lens top H1.3 … 1.9 mm

LD 261

2007-03-30 3

Schaltzeiten, Ie von 10% auf 90% und von 90%

auf 10%, bei IF = 50 mA, RL = 50 Ω

Switching times, Ie from 10% to 90% and from

90% to 10%, IF = 50 mA, RL = 50 Ω

tr, tf1μs

Kapazität, VR = 0 V

Capacitance Co40 pF

Durchlassspannung

Forward voltage

IF = 50 mA, tp = 20 μs

1.25 (≤ 1.4)

Sperrstrom, VR = 5 V

Reverse current IR0.01 (≤ 1) μA

Gesamtstrahlungsfluss

Total radiant flux

IF = 50 mA, tp = 20 ms

Φe9mW

Temperaturkoeffizient von Ie bzw. Φe,

IF = 50 mA

Temperature coefficient of Ie or Φe,

IF = 50 mA

TCI– 0.55 %/K

Temperaturkoeffizient von VF, IF = 50 mA

Temperature coefficient of VF, IF = 50 mA TCV– 1.5 mV/K

Temperaturkoeffizient von λpeak, IF = 50 mA

Temperature coefficient of λpeak, IF = 50 mA TCλ0.3 nm/K

Gruppierung der Strahlstärke Ie in Achsrichtung

gemessen bei einem Raumwinkel Ω = 0.01 sr

Grouping of radiant intensity Ie in axial direction

at a solid angle of Ω = 0.01 sr

Bezeichnung

Parameter Symbol Werte

Values Einheit

Unit

LD 261 LD 261-5 LD 261-6

Strahlstärke

Radiant intensity

IF = 50 mA, tp = 20 ms

2 … 10

3.2 … 6.3

5 … 10

mW/sr

Kennwerte (TA = 25 °C)

Characteristics (cont’d)

Bezeichnung

Parameter Symbol

Symbol Wert

Value Einheit

Unit

LD 261

2007-03-30 4

Relative Spectral Emission

Irel = f (λ)

Forward Current

IF = f (VF), single pulse,

tp = 20 μs

Radiation Characteristics Irel = f (ϕ)

OHRD1938

rel

0880 920 960 1000

1060

100

OHR01042

-1

10 -2

1.5 2 2.5 3 3.5 4 V 4.5

max.

typ.

OHR01878

02040 60 80 100 1200.40.60.81.0

100

10203040

0.2

0.4

0.6

0.8

1.0

Radiant Intensity

Single pulse, tp = 20 μs

Permissible Pulse Handling

Capability IF = f (τ), TC = 25 °C,

duty cycle D = parameter

Ιe

Ιe 100 mA = f (IF)

OHR01039

-1

-2 -1

10 A 10

(100 mA)

OHR02182

-5

10 10

-4 -3

-2

-1

10s

0,5

0,2

0,1

0,05

0,005

0,01

0,02

Max. Permissible Forward Current

IF = f (TA)

OHR01124

0 20 40 60 80 100C

thJL

= 650 K/W

= 750 K/W

thJA

LD 261

2007-03-30 5

Maßzeichnung

Package Outlines

Maße in mm (inch) / Dimensions in mm (inch).

GEOY6021

2.4 (0.094)

2.1 (0.083)

0.7 (0.028)

0.6 (0.024)

Collector (BPX 81)

Cathode (LD 261)

2.54 (0.100) spacing

1.5 (0.059)

2.1 (0.083)

2.7 (0.106)

2.5 (0.098)

3.2 (0.126)

3.6 (0.142)

3.0 (0.118)

3.5 (0.138)

1.9 (0.075)

1.7 (0.067)

position

Chip

0.25 (0.010)

0.15 (0.006)

1.4 (0.055)

1.0 (0.039)

0.4

0.5 (0.020)

0.4 (0.016)

Radiant sensitive area

(0.4 x 0.4)

Approx. weight 0.03 g

Detaching area for tools, flash not true to size.1)

5˚...0

2007-03-30 6

LD 261

Lötbedingungen

Soldering Conditions

Wellenlöten (TTW) (nach CECC 00802)

TTW Soldering (acc. to CECC 00802)

Published by

OSRAM Opto Semiconductors GmbH

Wernerwerkstrasse 2, D-93049 Regensburg

www.osram-os.com

The information describes the type of component and shall not be considered as assu red characteristics.

Terms of delivery and rights to change design reserved. Due to technical requirements components may contain

dangerous substances. For information on the types in que stion please contact our Sales Organization.

Packing

Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.

By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing

material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs

incurred.

Components used in life-support devices or systems must be expressly authorized for such purpose! Critical

components 1 , may only be used in life-support dev ices or systems 2 with the express written approval of OSRAM OS.

1 A critical componen t is a component usedin a life-support device or syste m whose failure can reasonably be expected

to cause the failure of that life-support devic e or system, or to a ffect its safety or e ffectiveness of that device or system.

2 Life support devices or syste ms are intended (a) to be implanted in the human body, o r (b) to support and/or maintain

and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.

OHLY0598

050 100 150 200 250

100

150

200

250

300

235 C

10 s

C... 260

1. Welle

1. wave

2. Welle

2. wave

5 K/s 2 K/s

ca 200 K/s

CC... 130100

2 K/s Zwangskühlung

forced cooling

Normalkurve

standard curve

Grenzkurven

limit curves