AON2240
Symbol Min Typ Max Units
BV
DSS
40 V
V
DS
=40V, V
GS
=0V 1
T
J
=55°C 5
I
GSS
±100 nA
V
GS(th)
Gate Threshold Voltage 1.4 1.9 2.4 V
I
D(ON)
32 A
16.8 21
T
J
=125°C 24.5 31
22.6 29 mΩ
g
FS
33 S
V
SD
0.75 1 V
I
S
3.5 A
C
iss
415 pF
C
oss
112 pF
C
rss
11 pF
R
g
1 2.2 3.5 Ω
Q
g
(10V)
6.5 12 nC
Q
g
(4.5V)
3 6 nC
Q
gs
1.2 nC
Q
gd
1.1 nC
t
D(on)
4 ns
mΩ
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
On state drain current
I
D
=250µA, V
GS
=0V
Drain-Source Breakdown Voltage
R
DS(ON)
Static Drain-Source On-Resistance
I
DSS
V
DS
=0V, V
GS
=±20V
V
GS
=0V, V
DS
=20V, f=1MHz
µA
V
DS
=V
GS,
I
D
=250µA
V
GS
=10V, I
D
=8A
Zero Gate Voltage Drain Current
Gate-Body leakage current
V
GS
=4.5V, I
D
=4A
Gate Drain Charge
Gate resistance
Total Gate Charge
Reverse Transfer Capacitance
Total Gate Charge
SWITCHING PARAMETERS
V
DS
=5V, I
D
=8A
Forward Transconductance
V
GS
=10V, V
DS
=5V
I
S
=1A,V
GS
=0V
Turn-On DelayTime
Diode Forward Voltage
V
GS
=0V, V
DS
=0V, f=1MHz
Gate Source Charge
Input Capacitance
Output Capacitance
Maximum Body-Diode Continuous Current
DYNAMIC PARAMETERS
V
GS
=10V, V
DS
=20V, I
D
=8A
r
t
D(off)
15 ns
t
f
2 ns
t
rr
12.5 ns
Q
rr
3.5 nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Turn-Off DelayTime
GS
DS
L
R
GEN
=3Ω
Body Diode Reverse Recovery Charge I
F
=8A, dI/dt=100A/µs
Body Diode Reverse Recovery Time I
F
=8A, dI/dt=100A/µs
Turn-Off Fall Time
A. The value of RθJA is measured with the device mounted on 1in2FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The
Power dissipation PDSM is based on R θJA t ≤10s value and the maximum allowed junction temperature of 150°C. The value in any given
application depends on the user's specific board design.
B. The power dissipation PDis based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper
dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C. Ratings are based on low frequency and duty cycles to keep
initial TJ =25°C.
D. The RθJA is the sum of the thermal impedance from junction to case RθJC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal impedance which is measured with the device mounted to a large heatsink, assuming
a maximum junction temperature of TJ(MAX)=150°C. The SOA curve provides a single pulse rating.
G. The maximum current rating is package limited.
H. These tests are performed with the device mounted on 1 in2FR-4 board with 2oz. Copper, in a still air environment with TA=25°C.
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