REV. 0
a
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700 www.analog.com
Fax: 781/326-8703 © Analog Devices, Inc., 2002
AD9879
Mixed-Signal Front End
Set-Top Box, Cable Modem
FEATURES
Low Cost 3.3 V MxFE™ for
DOCSIS EURO DOCSIS DVB DAVIC Compliant
Set-Top Box and Cable Modem Applications
232 MHz Quadrature Digital Upconverter
12-Bit Direct IF DAC (TxDAC+™)
Up to 65 MHz Carrier Frequency DDS
Programmable Sampling Clock Rates
16 Upsampling Interpolation LPF
Single-Tone Frequency Synthesis
Analog Tx Output Level Adjust
Direct Cable Amp Interface
12-Bit, 33 MSPS Direct IF ADC
with Optional Video Clamping Input
10-Bit, 33 MSPS Direct IF ADC
Dual 7-Bit, 16.5 MSPS Sampling I/Q ADC
12-Bit Sigma-Delta Auxiliary DAC
APPLICATIONS
Cable Modem and Satellite Systems
Set-Top Boxes
Power Line Modem
PC Multimedia
Digital Communications
Data and Video Modems
QAM, OFDM, FSK Modulation
FUNCTIONAL BLOCK DIAGRAM
TX DATA
I
Q
12
DAC
CAPORT
MCLK
RXI
RX10
RX12
VIDEO
SPORT
RXIQ[3:0]
RXIF[11:0]
Tx 16 SINC–1
DDS
PLL
XM/N
MUX
MUX
CONTROL REGISTERS
ADC
ADC
ADC
MUX
MUX
CLAMP
TX
--_OUT
AD9879
4
8
10
12
RXQ
2
2
GENERAL DESCRIPTION
The AD9879 is a single-supply cable modem/set-top box mixed
signal front end. The device contains a transmit path interpolation
filter, a complete quadrature digital upconverter, and a transmit
DAC. The receive path contains a 12-bit ADC, a 10-bit ADC,
and dual 7-Bit ADCs. All internally required clocks and an output
system clock are generated by the PLL from a single crystal or
clock input.
The transmit path interpolation filter provides an upsampling
factor of 16× with an output signal bandwidth as high as 8.3 MHz.
Carrier frequencies up to 65 MHz with 26 bits of frequency tuning
resolution can be generated by the direct digital synthesizer
(DDS). The transmit DAC resolution is 12 bits and can run at
sampling rates as high as 232 MSPS. Analog output scaling from
0 dB to 7.5 dB in 0.5 dB steps is available to preserve SNR when
reduced output levels are required.
MxFE and TxDAC are trademarks of Analog Devices, Inc.
The 12-bit and 10-bit IF ADCs can convert direct IF inputs up
to 70 MHz and run at sample rates up to 33 MSPS. A video
input with an adjustable signal clamping level, along with the
10-bit ADC, allow the AD9879 to process an NTSC and a
QAM channel simultaneously.
The programmable sigma-delta DAC can be used to control
external components, such as variable gain amplifiers (VGAs) or
voltage controlled tuners. The CA PORT provides an interface to
the AD8321/AD8323 or AD8322/AD8327 programmable gain
amplifier (PGA) cable drivers enabling host processor control via
the MxFE SPORT. The AD9879 is available in a 100-lead
MQFP package. It offers enhanced receive path undersampling
performance and lower cost when compared with the pin compat-
ible AD9873. The AD9879 is specified over the commercial
(–40°C to +85°C) temperature range.
REV. 0–2–
AD9879–SPECIFICATIONS
Test
Parameter Temp Level Min Typ Max Unit
OSCIN AND XTAL CHARACTERISTICS
Frequency Range Full II 3 29 MHz
Duty Cycle Full II 35 50 65 %
Input Impedance 25ºC III 100
||
3MΩ
||
pF
MCLK Cycle to Cycle Jitter 25ºC III 6 ps rms
Tx DAC CHARACTERISTICS
Resolution N/A N/A 12 Bits
Maximum Sample Rate Full II 232 MHz
Full-Scale Output Current Full II 4 10 20 mA
Gain Error (Using Internal Reference) Full II –2.0 –1.0 +2.0 %FS
Offset Error 25ºC III ±1.0 %FS
Reference Voltage (REFIO Level) 25ºC III 1.23 V
Differential Nonlinearity (DNL) 25ºC III ±2.5 LSB
Integral Nonlinearity (INL) 25ºC III ±8LSB
Output Capacitance 25ºC III 5 pF
Phase Noise @ 1 kHz Offset, 42 MHz
Crystal and OSCIN Multiplier Enabled at 16 25ºC III –110 dBc/Hz
Output Voltage Compliance Range Full II –0.5 +1.5 V
Wideband SFDR
5 MHz Analog Out, I
OUT
= 10 mA Full I 60.8 66.9 dBc
65 MHz Analog Out, I
OUT
= 10 mA Full I 44.0 46.2 dBc
Narrow-band SFDR (±1 MHz Window):
5 MHz Analog Out, I
OUT
= 10 mA Full I 65.4 72.3 dBc
Tx MODULATOR CHARACTERISTICS
I/Q Offset Full II 50 55 dB
Pass-Band Amplitude Ripple (f < f
IQCLK
/8) Full II ±0.1 dB
Pass-Band Amplitude Ripple (f < f
IQCLK
/4) Full II ±0.5 dB
Stop-Band Response (f > f
IQCLK
3/4) Full II –63 dB
Tx GAIN CONTROL
Gain Step Size 25ºC III 0.5 dB
Gain Step Error 25ºC III <0.05 dB
Settling Time to 1% (Full-Scale Step) 25ºC III 1.8 s
IQ ADC CHARACTERISTICS
Resolution*N/A N/A 6 Bits
Maximum Conversion Rate Full III 14.5 MHz
Pipeline Delay N/A N/A 3.5 ADC Cycles
Offset Matching between I and Q ADCs ±4.0 LSBs
Gain Matching between I and Q ADCs ±2.0 LSBs
Analog Input
Input Voltage Range*Full III 1 Vppd
Input Capacitance 25ºC III 2.0 pF
Differential Input Resistance 25ºC III 4 kΩ
AC Performance (A
IN
= 0.5 dBFS, f
IN
= 5 MHz)
Effective Number of Bits (ENOB) Full I 5.25 5.8 Bits
Signal-to-Noise Ratio (SNR) Full I 36.5 dB
Total Harmonic Distortion (THD) Full I –50 dB
Spurious-Free Dynamic Range (SFDR) Full I 51 dB
(VAS = 3.3 V 5%, VDS = 3.3 V 10%, fOSCIN = 27 MHz, fSYSCLK = 216 MHz,
fMCLK = 54 MHz (M = 8), ADC Clock from OSCIN, RSET = 4.02 k, 75 DAC Load)
*IQ ADC in Default Mode. ADC Clock Select Register 8, Bit 3 set to “0.”
REV. 0
AD9879
–3–
Test
Parameter Temp Level Min Typ Max Unit
10-BIT ADC CHARACTERISTICS
Resolution N/A N/A 10 Bits
Maximum Conversion Rate Full II 29 MHz
Pipeline Delay N/A N/A 4.5 ADC Cycles
Analog Input
Input Voltage Range Full III 2.0 Vppd
Input Capacitance 25ºC III 2 pF
Differential Input Resistance 25ºC II 4 kΩ
Reference Voltage Error
(REFT10–REFB10) –1 V Full I ±4±200 mV
AC Performance (A
IN
= –0.5 dBFS, f
IN
= 5 MHz)
ADC Sample Clock Source = OSCIN
Signal-to-Noise and Distortion (SINAD) Full I 58.3 59.9 dB
Effective Number of Bits (ENOB) Full I 9.4 9.65 Bits
Signal-to-Noise Ratio (SNR) Full I 58.6 60 dB
Total Harmonic Distortion (THD) Full I –73 –62 dB
Spurious-Free Dynamic Range (SFDR) Full I 65.7 76 dB
AC Performance (A
IN
= –0.5 dBFS, f
IN
= 50 MHz)
ADC Sample Clock Source = OSCIN
Signal-to-Noise and Distortion (SINAD) Full II 57.7 59.0 dB
Effective Number of Bits (ENOB) Full II 9.29 9.51 Bits
Signal-to-Noise Ratio (SNR) Full II 57.8 59.1 dB
Total Harmonic Distortion (THD) Full II +57 –75 dB
Spurious-Free Dynamic Range (SFDR) Full II 64 78 dB
12-BIT ADC CHARACTERISTICS
Resolution N/A N/A 12 Bits
Maximum Conversion Rate Full II 29 MHz
Pipeline Delay N/A N/A 5.5 ADC Cycles
Analog Input
Input Voltage Range Full III 2 Vppd
Input Capacitance 25ºC III 2 pF
Differential Input Resistance 25ºC III 4 kΩ
Reference Voltage Error
(REFT12–REFB12) –1 V Full I ±16 ±200 mV
AC Performance (A
IN
= –0.5 dBFS, f
IN
= 5 MHz)
ADC Sample Clock Source = OSCIN
Signal-to-Noise and Distortion (SINAD) Full I 60.0 65.2 dB
Effective Number of Bits (ENOB) Full I 9.67 10.53 Bits
Signal-to-Noise Ratio (SNR) Full I 60.3 65.6 dB
Total Harmonic Distortion (THD) Full I –76.6 –58.7 dB
Spurious-Free Dynamic Range (SFDR) Full I 64.7 79 dB
AC Performance (A
IN
= –0.5 dBFS, f
IN
= 50 MHz)
ADC Sample Clock Source = OSCIN
Signal-to-Noise and Distortion (SINAD) Full II 59.5 62.7 dB
Effective Number of Bits (ENOB) Full II 9.59 10.1 Bits
Signal-to-Noise Ratio (SNR) Full II 59.7 63.0 dB
Total Harmonic Distortion (THD) Full II –75.5 –60.5 dB
Spurious-Free Dynamic Range (SFDR) Full II 63.8 79 dB
REV. 0–4–
AD9879
Test
Parameter Temp Level Min Typ Max Unit
CHANNEL-TO-CHANNEL ISOLATION
Tx DAC-to-ADC Isolation (A
OUT
= 5 MHz)
Isolation between Tx and IQ ADCs 25ºC III >60 dB
Isolation between Tx and 10-Bit ADC 25ºC III >80 dB
Isolation between Tx and 12-Bit ADC 25ºC III >80 dB
ADC-to-ADC (A
IN
= –0.5 dBFS, f = 5 MHz)
Isolation between IF10 and IF12 ADCs 25ºC III >85 dB
Isolation between Q and I Inputs 25ºC III >50 dB
TIMING CHARACTERISTICS (10 pF Load)
Minimum RESET Pulsewidth Low (t
RL
)N/A N/A 5 t
MCLK
Cycles
Digital Output Rise/Fall Time Full II 2.8 4 ns
Tx/Rx Interface
MCLK Frequency (f
MCLK
)Full II 66 MHz
TxSYNC/TxIQ Setup Time (t
SU
)Full II 3 ns
TxSYNC/TxIQ Hold Time (t
HD
)Full II 3 ns
MCLK Rising Edge to
RxSYNC/RxIQ/IF Valid Delay (t
MD
)Full II 0 1.0 ns
OSCOUT Rising or Falling Edge to
RxSYNC/RxIQ/IF Valid Delay (t
OD
)Full II T
OSC
/4 – 2.0 T
OSC
/4 + 3.0 ns
OSCOUT Edge to MCLK Falling Edge (t
EE
)Full II –1.0 +1.0 ns
Serial Control Bus
Maximum SCLK Frequency (f
SCLK
)Full II 15 MHz
Minimum Clock Pulsewidth High (t
PWH
)Full II 30 ns
Minimum Clock Pulsewidth Low (t
PWL
)Full II 30 ns
Maximum Clock Rise/Fall Time Full II 1 ms
Minimum Data/Chip-Select Setup Time (t
DS
)Full II 25 ns
Minimum Data Hold Time (t
DH
)Full II 0 ns
Maximum Data Valid Time (t
DV
)Full II 30 ns
CMOS LOGIC INPUTS
Logic “1” Voltage 25ºC II V
DRVDD
– 0.7 V
Logic “0” Voltage 25ºC II 0.4 V
Logic “1” Current 25ºC II 12 A
Logic “0” Current 25ºC II 12 A
Input Capacitance 25ºC II 3 pF
CMOS LOGIC OUTPUTS (1 mA Load)
Logic “1” Voltage 25ºC II V
DRVDD
– 0.6 V
Logic “0” Voltage 25ºC II 0.4 V
POWER SUPPLY
Supply Current, I
S
(Full Operation) 25CII 163 178 mA
Analog Supply Current, I
AS
25ºC III 95 mA
Digital Supply Current, I
DS
25ºC III 68 mA
Supply Current, I
S
Standby (PWRDN Pin Active) 25ºC II 119 123 mA
Full Power-Down (Register 2 = 0xF9) 25ºC III 16 mA
Power-Down Tx Path (Register 2 = 0x60) 25ºC III 113 mA
Power-Down Rx Paths (Register 2 = 0x19) 25ºC III 110 mA
REV. 0
AD9879
–5–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD9879 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS*
Power Supply (V
AVDD
,V
DVDD
,V
DRVDD
) . . . . . . . . . . . . . . 3.9 V
Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . 5 mA
Digital Inputs . . . . . . . . . . . . . . . . . –0.3 V to V
DRVDD
+ 0.3 V
Analog Inputs . . . . . . . . . . . . . . . . . . –0.3 V to V
AVDD
+ 0.3 V
Operating Temperature . . . . . . . . . . . . . . . . . –40ºC to +85ºC
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 150ºC
Storage Temperature . . . . . . . . . . . . . . . . . . –65ºC to +150ºC
Lead Temperature (Soldering 10 sec) . . . . . . . . . . . . . . 300ºC
*Absolute Maximum Ratings are limiting values, to be applied individually, and
beyond which the serviceability of the circuit may be impaired. Functional
operability under any of these conditions is not necessarily implied. Exposure to
absolute maximum rating conditions for extended periods may affect device
reliability.
ORDERING GUIDE
Temperature Package
Model Range Description
AD9879BS –40ºC to +85ºC 100-Lead MQFP
EXPLANATION OF TEST LEVELS
I. Devices are 100% production tested at +25ºC and guaranteed
by design and characterization testing for commercial
operating temperature range (–40ºC to +85ºC).
II. Parameter is guaranteed by design and/or characterization
testing.
III. Parameter is a typical value only.
N/A Test level definition is not applicable.
THERMAL CHARACTERISTICS
Thermal Resistance
100-Lead MQFP
JA
= 40.5ºC/W
REV. 0–6–
AD9879
PIN CONFIGURATION
5
4
3
2
7
6
9
8
1
11
10
16
15
14
13
18
17
20
19
22
21
12
24
23
26
25
28
27
30
29
32
33
34
35
36
38
39
40
41
42
43
44
45
46
47
48
49
50
31
37
76
77
78
79
74
75
72
73
70
71
80
65
66
67
68
63
64
61
62
59
60
69
57
58
55
56
53
54
51
52
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
TOP VIEW
100-LEAD MQFP
VIDEO IN
AGND
IF12+
IF12–
AGND
AVDD
REFT12
REFB12
AVDD
AGND
IF10+
IF10–
AGND
AVDD
REFT10
REFB10
AVDD
AGND
Q+
Q–
TXIQ(1)
TXIQ(0)
DVDD
DGND
DNC
PROFILE
RESET
DVDD
DGND
DGND
SCLK
CS
SDIO
SDO
DGNDTX
DVDDTX
PWRDN
REFIO
FSADJ
AGNDTX
DNC
I+
I–
DNC
DNC
DNC
AGNDIQ
AVDDIQ
DRVDD
REFCLK
DRGND
DGND -
-_OUT
FLAG1
DVDD -
CA_EN
CA_DATA
CA_CLK
DVDDOSC
OSCIN
XTAL
DGNDOSC
AGNDPLL
PLLFILT
AVDDPLL
DVDDPLL
DGNDPLL
AVDDTX
TX+
TX–
DNC
DRGND
DRVDD
IF(11)
IF(10)
IF(9)
IF(8)
IF(7)
IF(6)
IF(5)
IF(4)
IF(3)
IF(2)
IF(1)
IF(0)
RXIQ(3)
RXIQ(2)
RXIQ(1)
RXIQ(0)
RXSYNC
DRGND
DRVDD
MCLK
DVDD
DGND
TXSYNC
TXIQ(5)
TXIQ(4)
TXIQ(3)
TXIQ(2)
AD9879
REV. 0
AD9879
–7–
PIN FUNCTION ASSIGNMENTS
Pin No. Mnemonic Pin Function
56 AVDDPLL PLL Analog 3.3 V Supply
57 PLLFILT PLL Loop Filter Connection
58 AGNDPLL PLL Analog Ground
59 DGNDOSC Oscillator Digital Ground
60 XTAL Crystal Oscillator Inv. Output
61 OSCIN Oscillator Clock Input
62 DVDDOSC Oscillator Digital 3.3 V Supply
63 CA_CLK Serial Clock to Cable Driver
64 CA_DATA Serial Data to Cable Driver
65 CA_EN Serial Enable to Cable Drive
66 DVDD ⌺-⌬Sigma Delta Digital 3.3 V Supply
67 FLAG1 Digital Output Flag 1
68 ⌺-⌬ _OUT Sigma-Delta DAC Output
69 DGND ⌺-⌬Sigma-Delta Digital Ground
71 REFCLK Oscillator Clock Output
73 AVDDIQ 7-Bit ADCs Analog 3.3 V Supply
74 AGNDIQ 7-Bit ADCs Analog Ground
78, 79 I–, I+ Differential Input to I ADC
81, 82 Q–, Q+ Differential Input to Q ADC
83, 88, AGND 12-Bit ADC Analog Ground
91, 96, 99
84, 87, AVDD 12-Bit ADC Analog 3.3 V Supply
92, 95
85 REFB10 10-Bit ADC Decoupling Node
86 REFT10 10-Bit ADC Decoupling Node
89, 90 IF10–, IF10+ Differential Input to 10-Bit ADC
93 REFB12 12-Bit ADC Decoupling Node
94 REFT12 12-Bit ADC Decoupling Node
97, 98 IF12–, IF12+ Differential Input to IF ADC
100 VIDEO IN Video Clamp Input, 12-Bit ADC
Pin No. Mnemonic Pin Function
1, 35, DNC Do Not Connect. Pins are not
75–77, 80 bonded to die.
2, 21, 70 DRGND Pin Driver Digital Ground
3, 22, 72 DRVDD Pin Driver Digital 3.3 V Supply
4–15 IF[11:0] 12-Bit ADC Digital Output
16–19 RXIQ[3:0] Muxed I and Q ADCs Output
20 RXSYNC Sync Output, IF, I and Q ADCs
23 MCLK Master Clock Output
24, 33, 38 DVDD Digital 3.3 V Supply
25, 34, DGND Digital Ground
39, 40
26 TXSYNC Sync Input for Transmit Port
27–32 TXIQ[5:0] Digital Input for Transmit Port
36 PROFILE Profile Selection Inputs
37 RESET Chip Reset Input (Active Low)
41 SCLK SPORT Clock
42 CS SPORT Chip Select
43 SDIO SPORT Data I/O
44 SDO SPORT Data Output
45 DGNDTX Tx Path Digital Ground
46 DVDDTX Tx Path Digital 3.3 V Supply
47 PWRDN Power-Down Transmit Path
48 REFIO TxDAC Decoupling (to AGND)
49 FSADJ DAC Output Adjust (External Res.)
50 AGNDTX Tx Path Analog Ground
51, 52 TX–, TX+ Tx Path Complementary Outputs
53 AVDDTX Tx Path Analog 3.3 V Supply
54 DGNDPLL PLL Digital Ground
55 DVDDPLL PLL Digital 3.3 V Supply
REV. 0–8–
AD9879
DEFINITIONS OF SPECIFICATIONS
Differential Nonlinearity Error (DNL, NO MISSING CODES)
An ideal converter exhibits code transitions that are exactly 1 LSB
apart. DNL is the deviation from this ideal value. Guaranteed
no missing codes to 10-bit resolution indicates that all 1024 codes,
respectively, must be present over all operating ranges.
Integral Nonlinearity Error (INL)
Linearity error refers to the deviation of each individual code
from a line drawn from negative full scale through positive full
scale. The point used as negative full scale occurs 1/2 LSB
before the first code transition. Positive full scale is defined as a
level 1 1/2 LSB beyond the last code transition. The deviation is
measured from the middle of each particular code to the true
straight line.
Phase Noise
Single-sideband phase noise power is specified relative to the car-
rier (dBc/Hz) at a given frequency offset (1 kHz) from the carrier.
Phase noise can be measured directly in single-tone transmit mode
with a spectrum analyzer that supports noise marker measure-
ments. It detects the relative power between the carrier and the
offset (1 kHz) sideband noise and takes the resolution bandwidth
(rbw) into account by subtracting 10log(rbw). It also adds a
correction factor that compensates for the implementation of the
resolution bandwidth, log display, and detector characteristic.
Output Compliance Range
The range of allowable voltage at the output of a current output
DAC. Operation beyond the maximum compliance limits may
cause either output stage saturation or breakdown, resulting in
nonlinear performance.
Spurious-Free Dynamic Range (SFDR)
The difference, in dB, between the rms amplitude of the DAC
output signal (or the ADC input signal) and the peak spurious
signal over the specified bandwidth (Nyquist bandwidth unless
otherwise noted).
Pipeline Delay (Latency)
The number of clock cycles between conversion initiation and
the associated output data being made available.
Offset Error
First transition should occur for an analog value 1/2 LSB above
–FS. Offset error is defined as the deviation of the actual transi-
tion from that point.
Gain Error
The first code transition should occur at an analog value 1/2 LSB
above full scale. The last transition should occur at an analog
value 1 1/2 LSB below the nominal full scale. Gain error is the
deviation of the actual difference between the first and last code
transitions and the ideal difference between the first and last
code transitions.
Aperture Delay
The aperture delay is a measure of the sample-and-hold ampli-
fier (SHA) performance and specifies the time delay between
the rising edge of the sampling clock input to when the input
signal is held for conversion.
Aperture Uncertainty (Jitter)
Aperture jitter is the variation in aperture delay for successive
samples and is manifested as noise on the input to the ADC.
Input Reference Noise
The rms output noise is measured using histogram techniques.
The ADC output codes’ standard deviation is calculated in LSB
and converted to an equivalent voltage. This results in a noise
figure that can directly be referred to the input of the MxFE.
Signal-To-Noise and Distortion (S/N+D, SINAD) Ratio
SINAD is the ratio of the rms value of the measured input sig-
nal to the rms sum of all other spectral components below the
Nyquist frequency, including harmonics but excluding dc. The
value for SINAD is expressed in decibels.
Effective Number of Bits (ENOB)
For a sine wave, SINAD can be expressed in terms of the num-
ber of bits. Using the following formula:
N = (SINAD – 1.76)dB/6.02
it is possible to get a performance measurement expressed as N,
the effective number of bits. Thus, effective number of bits for a
device for sine wave inputs at a given input frequency can be
calculated directly from its measured SINAD.
Signal-To-Noise Ratio (SNR)
SNR is the ratio of the rms value of the measured input signal to
the rms sum of all other spectral components below the Nyquist
frequency, excluding harmonics and dc. The value for SNR is
expressed in decibels.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first six harmonic com-
ponents to the rms value of the measured input signal and is
expressed as a percentage or in decibels.
Power Supply Rejection
Power supply rejection specifies the converter’s maximum full-
scale change when the supplies are varied from nominal to
minimum and maximum specified voltages.
Channel-To-Channel Isolation (Crosstalk)
In an ideal multichannel system, the signal in one channel will
not influence the signal level of another channel. The channel-
to-channel isolation specification is a measure of the change that
occurs to a grounded channel as a full-scale signal is applied to
another channel.
REV. 0
AD9879
–9–
Table I. Register Map
Address Default
(hex) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 (hex) Type
00h SDIO SPI Bytes Reset OSCIN 0x08 Read/Write
Bidirectional LSB First Multiplier
M[4:0]
01h PLL MCLK/REFCLK Ratio 0x00 Read/Write
Lock R[5:0]
Detect
02h Power-Down Power-Down Power-Down Power-Down Power-Down Power-Down Power-Down Power-Down 0x00 Read/Write
PLL DAC Tx Digital Tx IF12 ADC Reference IF10 ADC Reference IQ ADC
IF12 ADC IQ and IF10 ADC
03h Sigma-Delta Output Control Word [3:0] Flag 1 Flag 0 0x00 Read/Write
Enable
04h Flag 0 Sigma-Delta Output Control Word [11:4] 0x00 Read/Write
05h 0 0 0 0 0 0 0 0 0x00 Read/Write
06h 0 0 0 0 0 0 0 0 0x00 Read-Only
07h Video Input Clamp Level for Video Input [6:0] 0x00 Read/Write
Enable
08h ADCs Clocked 0 Rx Port Power-Down Enable 7-Bits 0 Send 12-Bit Send 10-Bit 0x80 Read/Write
Direct from Fast Edge Rate RxSYNC and IQ ADC ADC Data Only ADC Data Only
OSCIN IQ ADC Clocks
09h 0 0 0 0 0 0 0 0 0x00 Read/Write
0Ah 0 0 0 0 0 0 0 0 0x00 Read/Write
0Bh 0 0 0 0 0 0 0 0 0x00 Read/Write
0Ch 0 0 0 0 Version [3:0] 0x05 Read/Write
0Dh0 000 Tx Frequency Tuning Word Tx Frequency Tuning Word 0x00 Read/Write
Profile 1 LSBs [1:0] Profile 0 LSBs [1:0]
0Eh 0 0 0 0 DAC Fine Gain Control [3:0] 0x00 Read/Write
0Fh 0 0 Tx Path 0 Tx Path Tx Path Tx Path Tx Path 0x00 Read/Write
Select Profile 1 AD8322/ Bypass Spectral Transmit
AD8327 Gain Sinc
-1
Inversion Single Tone
Control Mode Filter
10h Tx Path Frequency Tuning Word Profile 0 [9:2] 0x00 Read/Write
11h Tx Path Frequency Tuning Word Profile 0 [17:10] 0x00 Read/Write
12h Tx Path Frequency Tuning Word Profile 0 [25:18] 0x00 Read/Write
13h Cable Driver Amplifier Coarse Gain Control Profile 0 [7:4] Fine Gain Control Profile 0 [3:0] 0x00 Read/Write
14h Tx Path Frequency Tuning Word Profile 1 [9:2] 0x00 Read/Write
15h Tx Path Frequency Tuning Word Profile 1 [17:10] 0x00 Read/Write
16h Tx Path Frequency Tuning Word Profile 1 [25:18] 0x00 Read/Write
17h Cable Driver Amplifier Coarse Gain Control Profile 1 [7:4] Fine Gain Control Profile 1 [3:0] 0x00 Read/Write
Register bits denoted with “0” MUST be programmed with a “0” every time that register is written.
REV. 0–10–
AD9879
REGISTER BIT DEFINITIONS
Register 00 — Initialization
Bits 0 to 4: OSCIN Multiplier
This register field is used to program the on-chip multiplier
(PLL) that generates the chip’s high frequency system clock
f
SYSCLK
. The value of M will depend on the ADC clocking mode
selected as shown in the table below.
Table II.
ADC Clock Select M
1, f
OSCIN
8
0, f
MCLK
(PLL Derived) 16
When using the AD9879 in systems where the Tx path and Rx
path do not operate simultaneously, the value of M can be pro-
grammed from 1 to 31. The maximum f
SYSCLK
rate of 236 MHz
must be observed, whatever value is chosen for M. When M is
set to 1, the internal PLL is disabled and all internal clocks are
derived directly from OSCIN.
Bit 5: Reset
Writing a 1 to this bit resets the registers to their default values
and restarts the chip. The Reset bit always reads back 0. The
bits in Register 0 are not affected by this software reset. How-
ever, a low level at the RESET pin would force all registers,
including all bits in Register 0, to their default state.
Bit 6: SPI Bytes LSB First
Active high indicates SPI serial port access of instruction byte
and data registers is least significant bit (LSB) first. Default low
indicates most significant bit (MSB) first format.
Bit 7: SDIO Bidirectional
Active high configures the serial port as a three signal port with
the SDIO pin used as a bidirectional input/output pin. Default
low indicates the serial port uses four signals with SDIO config-
ured as an input and SDO configured as an output.
Register 01 — Clock Configuration
Bits 0 to 5: MCLK/REFCLK Ratio
This bit field defines, R, the ratio between the auxiliary clock
output, REFCLK and MCLK. R can be any integer number
between 2 and 63. At default zero (R = 0), REFCLK provides a
buffered version of the OSCIN clock signal.
Bit 7: PLL Lock Detect
When this bit is set low, the REFCLK pin functions in its default
mode, and provides an output clock with frequency f
MCLK
/R as
described above.
If this bit is set to 1, the REFCLK pin is configured to indicate
whether the PLL is locked to f
OSCIN
. In this mode, the REFCLK
pin should be low-pass filtered with an RC filter of 1.0 kW and
0.1 mF. A high output on REFCLK indicates that the PLL has
achieved lock with f
OSCIN
.
Register 02 — POWER-DOWN
Sections of the chip that are not used can be powered down
when the corresponding bits are set high. This register has a
default value of 0x00; all sections active.
Bit 0: Power-Down IQ ADC
Active high powers down the IQ ADC.
Bit 1: Power-Down IQ and IF10 ADC Reference
Active high powers down the IQ and IF10 ADC reference.
Bit 2: Power-Down IF10 ADC
Active high powers down the IF10 ADC.
Bit 3: Power-Down IF12 ADC Reference
Active high powers down the 12-bit ADC reference.
Bit 4: Power-Down IF12 ADC
Active high powers down the IF12 ADC.
Bit 5: Power-Down Digital TX
Active high powers down the digital transmit section of the chip,
similar to the function of the PWRDN Pin.
Bit 6: Power-Down DAC TX
Active high powers down the DAC.
Bit 7: Power-Down PLL
Active high powers down the OSCIN multiplier.
Registers 03 and 04 — Sigma-Delta and Flag Control
The sigma-delta control word is 12 bits wide and split in MSB bits
[11:4] and LSB bits [3:0]. Changes to the sigma-delta control
words take effect immediately for every MSB or LSB register
write. Sigma-delta output control words have a default value of
“0.” The control words are in straight binary format with 0x000
corresponding to the bottom of the scale and 0xFFF correspond-
ing to the top of the scale. See Figure 6 for details.
If the Flag 0 Enable (Register 3, Bit 0) is set high, the ⌺-⌬_OUT
pin will maintain a fixed logic level determined directly by the
MSB of the sigma-delta control word.
The FLAG1 pin assumes the logic level programmed into the
FLAG1 bit (Register 3, Bit 1).
Register 07 —VIDEO INPUT CONFIGURATION
Bits 0-6: Clamp Level Control Value
The 7-bit clamp level control value is used to set an offset to the
automatic clamp level control loop. The actual ADC output will
have a clamp level offset equal to 16 times the clamp level control
value as shown:
Clamp Level Offset Clamp Level Control Value=¥
()
16
The default value for the clamp level control value is 0x20. This
results in an ADC output clamp level offset of 512 LSBs. The
valid programming range for the clamp level control value is
from 0x16 to 0x127.
Register 08 — ADC CLOCK CONFIGURATION
Bit 0: Send 10-Bit ADC Data Only
When this bit is set high, the device enters a Nonmultiplexed
mode and only the data from the 10-bit ADC will be sent to the
IF [11:0] digital output port.
Bit 1: Send 12-Bit ADC Data Only
When this bit is set high, the device enters a Nonmultiplexed
mode and only data from the 12-bit ADC will be sent to the IF
[11:0] digital output port.
Bit 3: Enable 7-Bits, IQ ADC
When this bit is active the IQ ADC is put into 7-bit mode. In
this mode, the full-scale input range is 2 Vppd. When this bit is
set inactive, the IQ ADC is put into 6-bit mode and the full-
scale input voltage range is 1 Vppd.
Bit 4: Power-Down RXSYNC and IQ ADC Clocks
Setting this bit to 1 powers down the IQ ADC’s sampling clock
and stops the RXSYNC output pin. It can be used for additional
power saving on top of the power-down selections in Register 2.
REV. 0
AD9879
–11–
Bit 5: Rx Port Fast Edge Rate
Setting this bit to 1 increases the output drive strength of all
digital output pins, except MCLK, REFCLK, ⌺-⌬_OUT, and
FLAG1. These pins always have high output drive capability.
Bit 7: ADC Clocked Direct from OSCIN
When set high, the input clock at OSCIN is used directly as the
ADC sampling clock. When set low, the internally generated
master clock, MCLK, is divided by two and used as the ADC
sampling clock. Best ADC performance is achieved when the
ADCs are sampled directly from f
OSCIN
using an external crystal
or low jitter crystal oscillator.
Register C—DIE REVISION
Bits 0 to 3: Version
The die version of the chip can be read from this register.
Register D—Tx Frequency Tuning Words LSBs
This register accommodates two least significant bits for both of
the frequency tuning words. See description of Carrier Frequency
Tuning.
Register E—DAC Gain Control
Bits 0 to 3: DAC Fine Gain Control
This bit field sets the DAC gain if the Tx Path AD8321/AD8323
Gain Control Select bit (Register F, Bit 3) is set to 0. The DAC
gain can be set from 0.0 dB to 7.5 dB in increments of 0.5 dB.
Table III details the programming.
Table III.
Bits [3:0] DAC Gain
0000 0.0 dB (Default)
0001 0.5 dB
0010 1.0 dB
0011 1.5 dB
.... ....
1110 7.0 dB
1111 7.5 dB
Register F — Tx PATH CONFIGURATION
Bit 0: Tx Path Transmit Single Tone
Active high configures the AD9879 for single-tone applications
(e.g., FSK). The AD9879 will supply a single frequency output
as determined by the frequency tuning word selected by the
active profile. In this mode, the TXIQ input data pins are ignored
but should be tied to a valid logic voltage level. Default value is
0 (inactive).
Bit 1: Tx Path Spectral Inversion
When set to 1, inverted modulation is performed:
MODULAR_OUT I cos t Q sin t=
()
+
()
[]
ww
Default is logic zero, noninverted modulation:
MODULAR_OUT I cos t Q sin t=
()
+
()
[]
ww
Bit 2: Tx Path Bypass Sinc
–1
Filter
Setting this bit high bypasses the digital inverse sinc filter of the
Tx path.
Bit 3: Tx Path AD8322/AD8327 Gain Control Mode
This bit changes the manner in which transmit gain control is
performed. Typically either AD8321/AD8323 (default 0) or
AD8222/AD8327 (default 1) variable gain cable drivers are
programmed over the chip’s 3-wire CA interface. The Tx gain
control select changes the interpretation of the bits in Registers
13 and 17. See Cable Driver Gain Control.
Bit 5: Tx Path Select Profile 1
The AD9879 quadrature digital upconverter is capable of stor-
ing two preconfigured modulation modes called profiles.
Each profile defines a transmit frequency tuning word and cable
driver amplifier gain (/DAC gain) setting. The Profile Select bit
or PROFILE pin programs the current register profile to be used.
The Profile Select bit should always be “0” if the PROFILE pin
is to be used to switch between profiles. Using the Profile Select
bit as a means of switching between different profiles requires
the PROFILE pin to be tied low.
Registers 10–17: Carrier Frequency Tuning
Tx Path Frequency Tuning Words
The frequency tuning word (FTW) determines the DDS-generated
carrier frequency (f
C
) and is formed via a concatenation of
register addresses.
The 26-bit FTW is spread over four register addresses. Bit 25 is
the MSB and Bit 0 is the LSB.
The carrier frequency equation is given as:
fFTW f
CSYSCLK
=¥
[]
/2
26
where fMfand FTW
SYSCLK OSCIN
=¥ <¥0 2000000
Changes to FTW bytes take effect immediately.
Cable Driver Gain Control
The AD9879 has a 3-pin interface to the AD832x family of
programmable gain cable driver amplifiers. This allows direct
control of the cable driver’s gain through the AD9879.
In its Default mode, the complete 8-bit register value is transmitted
over the 3-wire cable amplifier (CA) interface.
If Bit 3 of Register F is set high, Bits [7:4] determine the 8-bit
word sent over the CA interface according to Table IV.
Table IV.
Bits [7:4] CA Interface Transmit Word
0000 0000 0000 (Default)
0001 0000 0001
... ...
0111 0100 0000
1000 1000 0000
In this mode, the lower bits determine the fine gain setting
of the DAC output.
Table V.
Bits [3:0] DAC Fine Gain
0000 0.0 dB (Default)
0001 0.5 dB
... ...
1110 7.0 dB
1111 7.5 dB
New data is automatically sent over the 3-wire CA interface
(and DAC gain adjust) whenever the value of the active gain
control register changes or a new profile is selected. The default
value is 0x00 (lowest gain).
REV. 0–12–
AD9879
The formula for the combined output level calculation of the
AD9879 fine gain and AD8327 or AD8322 coarse gain is:
VV fine coarse
8327 9877 0
26 19=+
()
+
()
-
()
VV fine coarse
8322 9877 0
26 14=+
()
+
()
-
()
with:
fine = decimal value of Bits [3:0]
coarse = decimal value of Bits [7:8]
V
9877
(0): Level at AD9879 output in dBmV for fine = 0.
V
8327
: Level at output of AD8327 in dBmV.
V
8322
: Level at output of AD8322 in dBmV.
DEVICE OVERVIEW
To gain a general understanding of the AD9879, it is helpful to
refer to Figure 1, which displays a block diagram of the device
architecture. The device consists of a transmit path, receive path,
and auxiliary functions, such as a DPLL, a sigma-delta DAC,
aserial control port, and a cable amplifier interface.
Transmit Path
The transmit path contains an interpolation filter, a complete
quadrature digital upconverter, an inverse sinc filter, and a
TXIQ
TXSYNC
MCLK
REFCLK
CA_PORT
PROFILE
SPORT
RXIQ[3:0]
RXSYNC
IF[11:0]
FSADJ
XTAL
OSCIN
⌺-⌬_OUT
FLAG1
I INPUT
Q INPUT
IF10 INPUT
IF12 INPUT
VIDEO INPUT
6
3
12
12
10
7
12
AD9879
DATA
ASSEMBLER
QUADRATURE
MODULATOR
FIR LPF CIC LPF
COS
SIN
(f
IQCLK
)
(f
SYSCLK
)
(f
OSCIN
)
(f
MCLK
)
DAC GAIN CONTROL
PLL
OSCIN ⴛ M
DDS
MUX
MUX
CA
INTERFACE
PROFILE
SELECT
SERIAL
INTERFACE
12
4
ⴜ4
SINC–1 MUX DAC
IQ
IF
CLAMP LEVEL
ADC
ADC
ADC
ADC MUX
DAC
ⴜ2
ⴜ8
ⴜ4
ⴜ2
12
12
(f
OSCIN
)
(f
OSCIN
)
7
ⴜR
4
4
12
I
Q
RXPORT
TX
⌺-⌬ INPUT REG
–+
—
ⴜ2
4
44
12
—
SINC–1
BYPASS
⌺-⌬
Figure 1. Block Diagram
12-bit current output DAC. The maximum output current of the
DAC is set by an external resistor. The Tx output PGA provides
additional transmit signal level control.
The transmit path interpolation filter provides an upsampling
factor of 16 with an output signal bandwidth as high as 5.8 MHz.
Carrier frequencies up to 65 MHz with 26 bits of frequency
tuning resolution can be generated by the direct digital synthesizer
(DDS). The transmit DAC resolution is 12 bits and can run at
sampling rates as high as 232 MSPS.
Analog output scaling from 0 dB to 7.5 dB in 0.5 dB steps is
available to preserve SNR when reduced output levels are required.
Data Assembler
The AD9879 data path operates on two 12-bit words, the I and Q
components, that form a complex symbol. The data assembler
builds the 24-bit complex symbols from four consecutive 6-bit
nibbles read over the TxIQ[5:0] bus. The nibbles are strobed
synchronous to the master clock, MCLK, into the data assembler.
A high level on TxSYNC signals the start of a transmit symbol.
The first two nibbles of the symbol form the I component, the
second two nibbles form the Q component. Symbol components
are assumed to be in twos complement format. The timing of
the interface is fully described in the Transmit Timing section
of this data sheet.
REV. 0
AD9879
–13–
INTERPOLATION FILTER
Once through the Data Assembler, the IQ data streams are fed
through a 4⫻ FIR low-pass filter and a 4⫻ Cascaded Integrator-
Comb (CIC) low-pass filter. The combination of these two filters
results in the sample rate increasing by a factor of 16. In addi-
tion to the sample rate increase, the half-band filters provide the
low-pass filtering characteristic necessary to suppress the spectral
images between the original sampling frequency and the new
(16⫻ higher) sampling frequency.
DIGITAL UPCONVERTER
The digital quadrature modulator stage following the CIC filters
is used to frequency shift (upconvert) the baseband spectrum of
the incoming data stream up to the desired carrier frequency. The
carrier frequency is controlled numerically by a Direct Digital
Synthesizer (DDS). The DDS uses the internal system clock
(f
SYSCLK
) to generate the desired carrier frequency with a high
degree of precision. The carrier is applied to the I and Q multi-
pliers in quadrature fashion (90∞ phase offset) and summed to
yield a data stream that is the modulated carrier. The modulated
carrier becomes the 12-bit sample sent to the DAC.
The receive path contains a 12-bit ADC, a 10-bit ADC, and a dual
7-bit ADC. All internally required clocks and an output system
clock are generated by the PLL from a single crystal or clock input.
The 12-bit and 10-bit IF ADCs can convert direct IF inputs up
to 70 MHz and run at sample rates up to 33 MSPS. A video
input with an adjustable signal clamping level along with the
10-bit ADC allow the AD9879 to process an NTSC and a
QAM channel simultaneously.
The programmable sigma-delta DAC can be used to control
external components, such as variable gain amplifiers (VGAs) or
voltage controlled tuners. The CAPORT provides an interface
to the AD8321/AD8323 or AD8322/AD8327 programmable
gain amplifier (PGA) cable drivers enabling host processor
control via the MxFE SPORT.
OSCIN Clock Multiplier
The AD9879 can accept either an input clock into the OSCIN
Pin or a fundamental mode XTAL across the OSCIN Pin and
XTAL Pins as the devices main clock source. The internal PLL
then generates the f
SYSCLK
signal from which all other internal
signals are derived.
The DAC uses f
SYSCLK
as its sampling clock. For DDS applications,
the carrier is typically limited to about 30% of f
SYSCLK
. For a
65 MHz carrier, the system clock required is above 216 MHz.
The OSCIN multiplier function maintains clock integrity as
evidenced by the AD9879’s systems excellent phase noise char-
acteristics and low clock-related spur in the output spectrum.
External loop filter components consisting of a series resistor
(1.3 kW) and capacitor (0.01 mF) provide the compensation zero
for the OSCIN multiplier PLL loop. The overall loop perfor-
mance has been optimized for these component values.
DPLL-A CLOCK DISTRIBUTION
Figure 1 shows the clock signals used in the transmit path. The
DAC sampling clock, f
DAC
, is generated by DPLL-A. F
DAC
has
a frequency equal to the L ¥ f
OSCIN
, where f
OSCIN
is the internal
signal generated either by the crystal oscillator when a crystal is
connected between the OSCIN and XTAL pins, or by the clock
that is fed into the OSCIN pin, and L is the multiplier programmed
through the serial port. L can have the values of 1, 2, 3, or 8.
The transmit path expects a new half word of data at the rate of
f
CLK-A
. When the Tx multiplexer is enabled, the frequency of Tx
Port is:
ffKLfK
CLK A DAC OSCIN-
=¥ =¥ ¥22
where K is the interpolation factor.
The interpolation factor can be programmed to be 1, 2, or 4. When
the Tx multiplexer is disabled, the frequency of the Tx Port is:
ffKLfK
CLK A DAC OSCIN-
==¥
Receive Section
The AD9879 includes two high speed, high performance ADCs.
The 10-bit and 12-bit direct IF ADC’s deliver excellent
undersampling performance with input frequencies as high as
70 MHz. The sampling rate can be as high as 33 MSPS.
The ADC sampling frequency can be derived directly from the
OSCIN signal or from the on-chip OSCIN multiplier. For highest
dynamic performance, it is recommended to choose an OSCIN
frequency that can directly be used as the ADC sampling clock.
Digital IQ ADC outputs are multiplexed to one 4-bit bus, clocked
by a frequency (f
MCLK
) of four times the sampling rate. The IF
ADCs use a multiplexed 12-bit interface with an output word
rate of f
MCLK
.
CLOCK AND OSCILLATOR CIRCUITRY
The AD9879’s internal oscillator generates all sampling clocks
from a simple, low cost, parallel resonance, fundamental fre-
quency quartz crystal. Figure 2 shows how the quartz crystal is
connected between OSCIN (Pin 61) and XTAL (Pin 60) with
parallel resonant load capacitors as specified by the crystal
manufacturer. The internal oscillator circuitry can also be
overdriven by a TTL-level clock applied to OSCIN with XTAL
left unconnected.
ffM
OSCIN MCLK
=¥
An internal phase-locked loop (PLL) generates the DAC sampling
frequency, f
SYSCLK
, by multiplying OSCIN frequency M times.
The MCLK signal (Pin 23), f
MCLK
, is derived by dividing
f
SYSCLK
by 4.
ffM
SYSCLK OSCIN
=¥
ffM
MCLK OSCIN
=¥4
An external PLL loop filter (Pin 57) consisting of a series resistor
and ceramic capacitor (Figure 15, R1 = 1.3 kW, C12 = 0.01 F) is
required for stability of the PLL. Also, a shield surrounding these
components is recommended to minimize external noise coupling
into the PLL’s voltage controlled oscillator input (guard trace
connected to AVDDPLL).
Figure 1 shows that ADCs are either sampled directly by a low
jitter clock at OSCIN or by a clock that is derived from the PLL
output. Operating modes can be selected in Register 8. Sampling
the ADCs directly with the OSCIN clock requires MCLK to be
programmed to be twice the OSCIN frequency.
REV. 0–14–
AD9879
5
4
3
2
7
6
9
8
1
11
10
16
15
14
13
18
17
20
19
22
21
12
24
23
26
25
28
27
30
29
32
33
34
35
36
38
39
40
41
42
43
44
45
46
47
48
49
50
31
37
76
77
78
79
74
75
72
73
70
71
80
65
66
67
68
63
64
61
62
59
60
69
57
58
55
56
53
54
51
52
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
TOP VIEW
(Pins Down)
VIDEO IN
AGND
IF12+
IF12–
AGND
AVDD
REFT12
REFB12
AVDD
AGND
IF10+
IF10–
AGND
AVDD
REFT10
REFB10
AVDD
AGND
Q+
Q–
TXIQ(1)
TXIQ(0)
DVDD
DGND
DNC
PROFILE
RESET
DVDD
DGND
DGND
SCLK
CS
SDIO
SDO
DGNDTX
DVDDTX
PWRDN
REFIO
FSADJ
AGNDTX
DNC
I+
I–
DNC
DNC
DNC
AGND
AVDD
DRVDD
REFCLK
DRGND
DGND -
-_OUT
FLAG1
DVDD
CA_EN
CA_DATA
CA_CLK
DVDDOSC
OSCIN
XTAL
DGNDOSC
AGNDPLL
PLLFILTER
AVDDPLL
DVDDPLL
DGNDPLL
AVDDTX
TX+
TX–
DNC
DRGND
DRVDD
(MSB) IF(11)
IF(10)
IF(9)
IF(8)
IF(7)
IF(6)
IF(5)
IF(4)
IF(3)
IF(2)
IF(1)
IF(0)
(MSB) RXIQ(3)
RXIQ(2)
RXIQ(1)
RXIQ(0)
RXSYNC
DRGND
DRVDD
MCLK
DVDD
DGND
TXSYNC
(MSB) TXIQ(5)
TXIQ(4)
TXIQ(3)
TXIQ(2)
AD9879
C5
0.1F
CP2
10F
C4
0.1F
C6
0.1F
C2
0.1F
CP1
10F
C1
0.1F
C3
0.1F
RSET
4.02k
C13
0.1F
C10
20pF
C11
20pF GUARD
TRACE
R1
1.3k
C12
0.01F
Figure 2. Basic Connection Diagram
PROGRAMMABLE CLOCK OUTPUT REFCLK
The AD9879 provides an auxiliary output clock on Pin 71,
REFCLK. The value of the MCLK divider bit field, R, determines
its output frequency as shown in the equations:
fREFCLK = fMCLK /R, For R = 2–63
fREFCLK = fOSCIN, For R = 0
In its default setting (0x00 in Register 1), the REFCLK pin
provides a buffered output of f
OSCIN
.
REV. 0
AD9879
–15–
RESET AND TRANSMIT POWER-DOWN
Power-Up Sequence
On initial power-up, the RESET pin should be held low until
the power supply is stable.
Once RESET is deasserted, the AD9879 can be programmed
over the serial port. The on-chip PLL requires a maximum of
1millisecond after the rising edge of RESET or a change of the
multiplier factor (M) to completely settle. It is recommended
that the PWRDN pin be held low during the reset and PLL
settling time. Changes to ADC Clock Select (Register 08h) or
SYS Clock Divider N (Register 01) should be programmed
before the rising edge of PWRDN.
Once the PLL is frequency locked and after the PWRDN pin is
brought high, transmit data can be sent reliably.
If the PWRDN pin cannot be held low throughout the reset and
PLL settling time period, then the Power-Down Digital Tx bit
or the PWRDN pin should be pulsed after the PLL has settled.
This will ensure correct transmit filter initialization.
RESET
To initiate hardware reset, the RESET pin should be held low
for at least 100 nanoseconds. All internally generated clocks but
OSCOUT stop during reset. The rising edge of RESET resets
the PLL clock multiplier and reinitializes the programmable
registers to their default values. The same sequence as described
above in the Power-Up Sequence section should be followed
after a reset or change in M.
PWRDN
TxIQ
TxSYNC
20 NULL SYMBOLS DATA SYMBOLS 20 NULL SYMBOLS
00 00 00 00
5MCLKMIN
Figure 4. Timing Sequence to Flush Tx Data Path
A software reset (writing a 1 into Bit 5 of Register 00h) is func-
tionally equivalent to the hardware reset but does not force
Register 00h to its default value.
VS
RESET
P
WRDN
1msmin
5MCLKMIN
Figure 3. Power-Up Sequence for Tx Data Path
Transmit Power-Down
A low level on the PWRDN pin stops all clocks linked to the
digital transmit data path and resets the CIC filter. Deasserting
PWRDN reactivates all clocks. The CIC filter is held in a reset
state for 80 MCLK cycles after the rising edge of PWRDN to
allow for flushing of the half-band filters with new input data.
Transmit data bursts should be padded with at least 20 symbols
of null data directly before the PWRDN pin is deasserted.
Immediately after PWRDN pin is deasserted, the transmit burst
should start with a minimum of 20 null data symbols. This
avoids unintended DAC output samples caused by the transmit
path latency and filter settling time.
Software Power-Down Digital Tx (Bit 5 in Register 02h) is
functionally equivalent to the hardware PWRDN pin and takes
effect immediately after the last register bit has been written
over the serial port.
REV. 0–16–
AD9879
SIGMA-DELTA OUTPUTS
The AD9879 contains an on-chip sigma-delta output that pro-
vides a digital logic bit stream with an average duty cycle that
varies between 0% and (4095/4096)%, depending on the pro-
grammed code, as shown in Figure 5.
000h
001h
002h
800h
FFFh
8
t
MCLK
4096 8
t
MCLK
4096 8
t
MCLK
8
t
MCLK
Figure 5. Sigma-Delta Output Signals
This bit stream can be low-pass filtered to generate a program-
mable dc voltage of:
V
DC
= (Sigma-Delta Code/4096)(V
H
) + V
L
where:
V
H
= V
DRVDD
– 0.6 V
V
L
= 0.4 V
In cable modem set-top box applications, the output can be
used to control external variable gain amplifiers or RF tuners. A
simple single-pole RC low-pass filter provides sufficient filtering
(see Figure 6).
AD9879
MCLK
DAC
12
CONTROL
WORD
8
-R
C
DC(V
L
TO V
H
)
TYPICAL: R = 50k
C = 0.1F
f–3dB
= 1/(2RC) = 318Hz
Figure 6. Sigma-Delta RC Filter
In more demanding applications where additional gain, level
shift, or drive capability is required, a first or second order active
filter might be considered for each sigma-delta output (see Figure 7).
AD9879
SIGMA-DELTA
R
C
V
SD
RVOUT
R
R1
VOFFSET
VOUT = (VSD + VOFFSET) (1 + R/R1)/2
TYPICAL: R = 50k
C = 0.1F
f
–3dB = 1/(2RC) = 318Hz
C
OP250
-
Figure 7. Sigma-Delta Active Filter with Gain and Offset
SERIAL INTERFACE FOR REGISTER CONTROL
The AD9879 serial port is a flexible, synchronous serial commu-
nications port that allows easy interface to many industry-standard
microcontrollers and microprocessors. The interface allows
read/write access to all registers that configure the AD9879.
Single or multiple byte transfers are supported. Also, the interface
can be programmed to read words either MSB first or LSB first.
The AD9879’s serial interface port I/O can be configured to
have one bidirectional I/O (SDIO) pin or two unidirectional I/O
(SDIO/SDO) pins.
General Operation of the Serial Interface
There are two phases to a communication cycle with the AD9879.
Phase 1 is the instruction cycle, which is the writing of an
instruction byte into the AD9879, coincident with the first eight
SCLK rising edges. The instruction byte provides the AD9879
serial port controller with information regarding the data trans-
fer cycle, which is Phase 2 of the communication cycle. The
Phase 1 instruction byte defines whether the upcoming data
transfer is read or write, the number of bytes in the data transfer,
and the starting register address for the first byte of the data
transfer. The first eight SCLK rising edges of each communication
cycle are used to write the instruction byte into the AD9879.
The eight remaining SCLK edges are for Phase 2 of the communi-
cation cycle. Phase 2 is the actual data transfer between the
AD9879 and the system controller. Phase 2 of the communication
cycle is a transfer of 1 to 4 data bytes as determined by the
instruction byte. Normally, using one multibyte transfer is the
preferred method. However, single byte data transfers are useful
to reduce CPU overhead when register access requires one byte
only. Registers change immediately upon writing to the last bit
of each transfer byte.
Instruction Byte
The instruction byte contains the following information as
shown below:
MSB LSB
17 16 15 14 13 12 11 10
R/W N1 N0 A4 A3 A2 A1 A0
The R/W bit of the instruction byte determines whether a read
or a write data transfer will occur after the instruction byte
write. Logic high indicates a read operation. Logic zero indi-
cates a write operation. The N1:N0 bits determine the number
of bytes to be transferred during the data transfer cycle. The bit
decodes are shown in Table VI.
Table VI.
N1 N0 Description
00Transfer 1 Byte
01Transfer 2 Bytes
10Transfer 3 Bytes
11Transfer 4 Bytes
The Bits A4:A0 determine which register is accessed during the
data transfer portion of the communications cycle. For multibyte
transfers, this address is the starting byte address. The remaining
register addresses are generated by the AD9879.
REV. 0
AD9879
–17–
Serial Interface Port Pin Description
SCLK—Serial Clock. The serial clock pin is used to synchronize
data transfers from the AD9879 and to run the serial port state
machine. The maximum SCLK frequency is 15 MHz. Input
data to the AD9879 is sampled on the rising edge of SCLK.
Output data changes on the falling edge of SCLK.
CS—Chip Select. Active low input starts and gates a communi-
cation cycle. It allows multiple devices to share a common serial
port bus. The SDO and SDIO pins go to a high impedance
state when CS is high. Chip select should stay low during the
entire communication cycle.
SDIO—Serial Data I/O. Data is always written into the AD9879
on this pin. However, this pin can be used as a bidirectional
data line. The configuration of this pin is controlled by Bit 7 of
Register 0. The default is Logic 0, which configures the SDIO
pin as unidirectional.
SDO—Serial Data Out. Data is read from this pin for protocols
that use separate lines for transmitting and receiving data. In the
case where the AD9879 operates in a single bidirectional I/O
mode, this pin does not output data and is set to a high imped-
ance state.
MSB/LSB Transfers
The AD9879 serial port can support both most significant bit
(MSB) first or least significant bit (LSB) first data formats. This
functionality is controlled by the LSB First Bit in Register 0.
The default is MSB first.
When this bit is set active high, the AD9879 serial port is in
LSB first format. In LSB first mode, the instruction byte and
data bytes must be written from the least significant bit to the
most significant bit. In LSB first mode, the serial port internal
byte address generator increments for each byte of the multibyte
communication cycle.
When this bit is set default low, the AD9879 serial port is in
MSB first format. In MSB first mode, the instruction byte and
data bytes must be written from the most significant bit to the
least significant bit. In MSB first mode, the serial port internal byte
address generator decrements for each byte of the multibyte
communication cycle.
When incrementing from 0x1F, the address generator changes
to 0x00. When decrementing from 0x00, the address generator
changes to 0x1F.
Notes on Serial Port Operation
The AD9879 serial port configuration bits reside in Bits 6 and 7
of Register Address 00h. It is important to note that the con-
figuration changes immediately upon writing to the last bit of
the register. For multibyte transfers, writing to this register may
occur during the middle of the communication cycle. Care must
be taken to compensate for this new configuration for the
remaining bytes of the current communication cycle.
The same considerations apply to setting the reset bit in Register
Address 00h. All other registers are set to their default values, but
the software reset does not affect the bits in Register Address 00h.
It is recommended to use only single byte transfers when chang-
ing serial port configurations or initiating a software reset.
A write to Bits 1, 2, and 3 of Address 00h with the same logic
levels as Bits 7, 6, and 5 (bit pattern: XY1001YX binary) allows
the user to reprogram a lost serial port configuration and to
reset the registers to their default values. A second write to
Address 00h with the RESET bit low and the serial port
configuration as specified above (XY) reprograms the OSCIN
multiplier setting. A changed f
SYSCLK
frequency is stable after a
maximum of tbd f
MCLK
cycles (wake-up time).
CS
SCLK
SDIO
SDO
INSTRUCTION CYCLE DATA TRANSFER CYCLE
R/W N1 N0 A4 A3 A2 A1 A0 D7nD6nD20D10D00
D7nD6nD20D10D00
Figure 8a. Serial Register Interface Timing MSB First
CS
SCLK
SDIO
SDO
INSTRUCTION CYCLE DATA TRANSFER CYCLE
A0 A1 A2 A3 A4 N0 N1 R/W D6nD7n
D00D10D20
D6nD7n
D00D10D20
Figure 8b. Serial Register Interface Timing LSB First
CS
SCLK
SDIO INSTRUCTION BIT 7 INSTRUCTION BIT 6
t
SCLK
t
DS
t
PWL
t
PWH
t
DS
t
DH
Figure 9. Timing Diagram for Register Write to AD9879
CS
SCLK
SDIO DATA BIT N
tDV
DATA BIT N
SDO
Figure 10. Timing Diagram for Register Read
TRANSMIT PATH (Tx)
Transmit Timing
The AD9879 provides a master clock MCLK and expects 6-bit
multiplexed TxIQ data on each rising edge. Transmit symbols
are framed with the TxSYNC input. TxSYNC high indicates
the start of a transmit symbol. Four consecutive 6-bit data pack-
ages form a symbol (I MSB, I LSB, Q MSB, and Q LSB).
Data Assembler
The input data stream is representative complex data. Two 6-bit
words form a 12-bit symbol component (in twos complement
format). Four input samples are required to produce one I/Q
data pair. The I/Q sample rate f
IQCLK
at the input to the first
half-band filter is a quarter of the input data rate f
MCLK
. The I/Q
sample rate f
IQCLK
puts a bandwidth limit on the maximum
transmit spectrum. This is the familiar Nyquist limit and is
equal to one-half f
IQCLK
that hereafter will be referred to as f
NYQ
.
REV. 0–18–
AD9879
Half-Band Filters (HBFs)
HBF 1 and HBF 2 are both interpolating filters, each of which
doubles the sampling rate. Together, HBF 1 and HBF 2 have
26 taps and provide a factor-of-four increase in the sampling
rate (4 f
IQCLK
or 8 f
NYQ
).
In relation to phase response, both HBFs are linear phase filters.
As such, virtually no phase distortion is introduced within the
pass band of the filters. This is an important feature as phase
distortion is generally intolerable in a data transmission system.
Cascaded Integrator-COMB (CIC) Filter
The CIC filter is configured as a programmable interpolator and
provides a sample rate increase by a factor of 4. The frequency
response of the CIC filter is given by:
Hf e
e
f
f
jf
jf
() sin( )
sin( )
(())
=
−
−
=
−
1
4
1
1
1
4
4
24
2
33
π
π
π
π
The frequency response in this form is such that f is scaled to the
output sample rate of the CIC filter. That is, f = 1 corresponds
to the frequency of the output sample rate of the CIC filter.
H(f/R) will yield the frequency response with respect to the input
sample of the CIC filter.
Combined Filter Response
The combined frequency response of HBF 1, HBF 2, and CIC
puts a limit on the input signal bandwidth that can be propagated
through the AD9879.
The usable bandwidth of the filter chain puts a limit on the
maximum data rate that can be propagated through the AD9879.
A look at the pass-band detail of the combined filter response
(Figure 12 and Figure 13) indicates that in order to maintain an
amplitude error of no more than 1 dB, we are restricted to
t
HD
t
SU
MCLK
TxSYNC
TxIQ
TxI[11:6] TxI[11:6]TxI[5:0] TxQ[11:6] TxQ[5:0] TxI[5:0] TxQ[11:6] TxQ[5:0] TxI[11:6] TxI[5:0]
Figure 11. Timing Diagram for Register Read
FREQUENCY RELATIVE TO I/Q NYQUIST BW
0 1.00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
0
MAGNITUDE – dB
–1
–2
–3
–4
–5
–6
Figure 12. Cascaded Filter Pass-Band Detail (N = 4)
FREQUENCY RELATIVE TO I/Q NYQUIST BW
0 1.00.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
1
0
MAGNITUDE – dB
–1
–2
–3
–4
–5
–6
Figure 13. Cascaded Filter Pass-Band Detail (N = 3)
signals having a bandwidth of no more than about 60% of f
NYQ
.
Thus, in order to keep the bandwidth of the data in the flat portion
of the filter pass band, the user must oversample the baseband
data by at least a factor of two prior to representing it to the
AD9879. Note that without oversampling, the Nyquist bandwidth
of the baseband data corresponds to the f
NYQ
. As such, the upper
end of the data bandwidth will suffer 6 dB or more of attenuation
due to the frequency response of the digital filters. Furthermore,
if the baseband data applied to the AD9879 has been pulse
shaped, there is an additional concern. Typically, pulse shaping
is applied to the baseband data via a filter having a raised cosine
response. In such cases, an value is used to modify the band-
width of the data where the value of is such that 0 < < 1.
Avalue of 0 causes the data bandwidth to correspond to the
Nyquist bandwidth. A value of 1 causes the data bandwidth to
be extended to twice the Nyquist bandwith. Thus, with 2 over-
sampling of the baseband data and =1, the Nyquist bandwidth
of the data will correspond with the I/Q Nyquist bandwidth. As
stated earlier, this results in problems near the upper edge of the
data bandwidth due to the frequency response of the filters. The
maximum value of that can be implemented is 0.45. This is
because the data bandwidth becomes:
12 1 0725+
()
=
α
ff
NYQ NYQ
.
which puts the data bandwidth at the extreme edge of the flat
portion of the filter response.
If a particular application requires an value between 0.45 and 1,
then the user must oversample the baseband data by at least a
factor of four.
The combined HB1, HB2, and CIC filter introduces, over the
frequency range of the data to be transmitted, a worst-case droop
of less than 0.2 dB.
REV. 0
AD9879
–19–
Tx Signal Level Considerations
The quadrature modulator itself introduces a maximum gain of
3 dB in signal level. To visualize this, assume that both the I data
and Q data are fixed at the maximum possible digital value, x.
Then the output of the modulator, z is:
zxcos t x sin t=
() ()
[]
ωω–
I
O
XZ
X
Figure 14. 16-Quadrature Modulation
It can be shown that |z| assumes a maximum value of |z| =
(x
2
+ x
2
) = √
2
(a gain of +3 dB). However, if the same number
of bits were used to represent the |z|values, as is used to repre-
sent the x values, an overflow would occur. To prevent this
possibility, an effective –3 dB attenuation is internally imple-
mented on the I and Q data path:
|| / /zx=+
()
=
12 12
3
LOW-PASS
FILTER
Tx
AD832x
DAC
AD9879
CA
75
VARIABLE GAIN
CABLE DRIVER
AMPLIFIER
CA_DATA
CA_CLK
CA_EN
Figure 15. 16-Quadrature Modulation
The following example assumes an PK/rms level of 10 dB:
Maximum Symbol Component Input Value
LSBs dB LSBs
=
±−
()
=±2047 0 2 2000.
Maximum Complex Input RMS Value
LSBs dB Pk rms dB LSBs rms
=
±−
()
=2000 6 1265
The maximum complex input rms value calculation uses both
Iand Q symbol components that add a factor of 2 (= 6 dB) to the
formula. Table VII shows typical I-Q input test signals with ampli-
tude levels related to 12-bit full scale (FS).
Tx Throughput and Latency
Data inputs effect the output fairly quickly but remain effective
due to AD9879’s filter characteristics. Data transmit latency
through the AD9879 is easiest to describe in terms of f
SYSCLK
clock cycles (4 f
MCLK
). The numbers quoted are when an effect
is first seen after an input value change.
Latency of I/Q data entering the data assembler (AD9879 input)
to the DAC output is 119 f
SYSCLK
clock cycles (29.75 f
MCLK
cycles). DC values applied to the data assembler input will take
up to 176 f
SYSCLK
clock cycles (44 f
MCLK
cycles) to propagate
and settle at the DAC output.
Frequency hopping is accomplished via changing the PROFILE
input pin. The time required to switch from one frequency to
another is less than 232 f
SYSCLK
cycles (58.5 f
MCLK
cycles).
D/A Converter
A 12-bit digital-to-analog converter (DAC) is used to convert
the digitally processed waveform into an analog signal. The
worst-case spurious signals due to the DAC are the harmonics
of the fundamental signal and their aliases (please see the
Analog Devices DDS Tutorial at: www.analog.com/dds). The
conversion process will produce aliased components of the fun-
damental signal at n f
SYSCLK
± f
CARRIER
(n = 1, 2, 3). These
are typically filtered with an external RLC filter at the DAC
output. It is important for this analog filter to have a sufficiently
flat gain and linear phase response across the bandwidth of
interest so as to avoid modulation impairments. A relatively
inexpensive seventh order elliptical low-pass filter is sufficient to
suppress the aliased components for HFC network applications.
The AD9879 provides true and complement current outputs.
The full-scale output current is set by the R
SET
resistor at Pin 49
and the DAC Gain register. Assuming maximum DAC gain, the
value of R
SET
for a particular full-scale I
OUT
is determined using
the following equation:
RV I I
SET DACRSET OUT OUT
==32 39 4.
For example, if a full-scale output current of 20 mA is desired,
then R
SET
= (39.4/0.02) Ω, or approximately 2 kΩ.
The following equation calculates the full-scale output current
including the programmable DAC gain control.
IR NGAIN
OUT SET
=×+
∧
[./ ] ((– . . ) / )39 4 10 7 5 0 5 20
where N
GAIN
is the value of DAC Fine Gain Control[3:0].
Table VII. I–Q Input Test Signals
Analog Output Digital Input Input Level Modulator Output Level
Single Tone (f
C
– f) I = cos(f) FS – 0.2 dB FS – 3.0 dB
Q = cos(f + 90) = –sin(f) FS – 0.2 dB
Single Tone (f
C
+ f) I = cos(f) FS – 0.2 dB FS – 3.0 dB
Q = cos(f + 270) = +sin(f) FS – 0.2 dB
Dual Tone (f
C
f) I = cos(f) FS – 0.2 dB FS
Q = cos(f + 180) = –cos(f) or Q = +cos(f) FS – 0.2 dB
REV. 0–20–
AD9879
The full-scale output current range of the AD9879 is
4 mA–20 mA. Full-scale output currents outside of this range
will degrade SFDR performance. SFDR is also slightly affected
by output matching, that is, the two outputs should be termi-
nated equally for best SFDR performance. The output load
should be located as close as possible to the AD9879 package to
minimize stray capacitance and inductance. The load may be a
simple resistor to ground, an op amp current-to-voltage con-
verter, or a transformer-coupled circuit. It is best not to attempt
to directly drive highly reactive loads (such as an LC filter).
Driving an LC filter without a transformer requires that the
filter be doubly terminated for best performance, that is, the
filter input and output should both be resistively terminated
with the appropriate values. The parallel combination of the two
terminations will determine the load that the AD9879 will see
for signals within the filter pass band. For example, a 50 Ω
terminated input/output low-pass filter will look like a 25 Ω load
to the AD9879. The output compliance voltage of the AD9879
is –0.5 V to +1.5 V. Any signal developed at the DAC output
should not exceed +1.5 V, otherwise signal distortion will result.
Furthermore, the signal may extend below ground as much as
0.5 V without damage or signal distortion. The AD9879 true
and complement outputs can be differentially combined for
common-mode rejection using a broadband 1:1 transformer.
Using a grounded center tap results in signals at the AD9879
DAC output pins that are symmetrical about ground. As previ-
ously mentioned, by differentially combining the two signals, the
user can provide some degree of common-mode signal rejection.
A differential combiner might consist of a transformer or an
operational amplifier. The object is to combine or amplify only
the difference between two signals and to reject any common,
usually undesirable, characteristic, such as 60 Hz hum or clock
feedthrough that is equally present on both individual signals.
DAC LOW-PASS
FILTER
75
VARIABLE GAIN
CABLE DRIVER
AMPLIFIER
CA_EN
CA_DATA
CA_CLK
3
CA
Tx
AD832x
AD9879
Figure 16. Cable Amplifier Connection
CA_EN
CA_CLK
CA_DATA
8 tMCLK 8 tMCLK 4 tMCLK
4 tMCLK
8 tMCLK
LSB
MSB
Figure 17. Cable Amplifier Interface Timing
Connecting the AD9879 true and complement outputs to the
differential inputs of the gain programmable cable drivers
AD8321/AD8323 or AD8322/AD8327 provides an optimized
solution for the standard compliant cable modem upstream
channel. The cable driver’s gain can be programmed through a
direct 3-wire interface using the AD9879’s profile registers.
PROGRAMMING THE AD8321/AD8323 OR AD8323/AD8327
CABLE DRIVER AMPLIFIER GAIN CONTROL
Programming the gain of the AD832x family of cable driver
amplifiers can be accomplished via the AD9879 cable amplifier
control interface. Four 8-bit registers within the AD9879 (one per
profile) store the gain value to be written to the serial 3-wire port.
Typically, either the AD8321/AD8323 or AD8222/AD8227
variable gain cable amplifiers are connected to the chip’s 3-wire
cable amplifier interface. The Tx Gain Control Select bit in
Register 0Fh changes the interpretation of the bits in Register
13h, 17h, 1Bh, and 1Fh. See Cable Driver Gain Control
Register description.
Data transfers to the gain programmable cable driver amplifier
are initiated by four conditions including:
1. Power-up and Hardware Reset—Upon initial power up and
every hardware reset, the AD9879 clears the contents of the
gain control registers to 0, which defines the lowest gain
setting of the AD832x. Thus, the AD9879 writes all 0s out
of the 3-wire cable amplifier control interface.
2. Software Reset—Writing a 1 to Bit 5 of Address 00h initiates
a software reset. On a software reset, the AD9879 clears the
contents of the gain control registers to 0 for the lowest gain
and sets the profile select to 0. The AD9879 writes all 0s out
of the 3-wire cable amplifier control interface if the gain was
on a different setting (different from 0) before.
3. Change in Profile Selection—The AD9879 sample the PRO-
FILE input pin together with the two Profile Select Bits and
writes to the AD832x gain control registers when a change in
profile and gain is determined. The data written to the cable
driver amplifier comes from the AD9879 gain control regis-
ter associated with the current profile.
4. Write to AD9879 Cable Driver Amplifier Control Regis-
ters—The AD9879 will write gain control data associated
with the current profile to the AD832x whenever the selected
AD9879 cable driver amplifier gain setting is changed.
Once a new stable gain value has been detected (48 MCLK to
64 MCLK cycles after initiation) data write starts with CA_EN
going low. The AD9879 will always finish a write sequence to
the cable driver amplifier once it is started. The logic controlling
data transfers to the cable driver amplifier uses up to 200 MCLK
cycles and has been designed to prevent erroneous write cycles
from ever occurring.
REV. 0
AD9879
–21–
RECEIVE PATH (Rx)
IF10 and IF12 ADC Operation
The IF10 and IF12 ADCs have a common architecture and
share many of the same characteristics from an applications
standpoint. Most of the information in the section below will be
applicable to both IF ADCs. Differences, where they exist, will
be highlighted.
Input Signal Range and Digital Output Codes
The IF ADCs have differential analog inputs labelled IF+ and
IF–. The signal input, V
AIN
, is the voltage difference between
the two input pins, V
AIN
= V
IF+
– V
IF–
. The full-scale input
voltage range is determined by the internal reference voltages,
REFT and REFB, which define the top and bottom of the scale.
The peak input voltage to the ADC is the difference between
REFT and REFB which is 1 V
PD
. This results in the ADC full-
scale input voltage range of 2 V
PPD
. The digital output code is
straight binary and is illustrated in Table VIII.
Table VIII.
IF[11:0] Input Signal Voltage
111...111 V
AIN
>= +1.0 V
111...111 V
AIN
= +1.0 – (1 LSB) V
111...110 V
AIN
= +1.0 – (2 LSB) V
...
100...001 V
AIN
= +1 LSB V
100...000 V
AIN
= 0.0 V
011...111 V
AIN
= –1 LSB V
...
000...001 V
AIN
= –1.0 + (2 LSB) V
000...000 V
AIN
= –1.0 V
000...000 V
AIN
< –1.0 V
The IF10 ADC digital output code occupies the 10 most signifi-
cant bits of the Rx digital output port (IF[11:2]). The output
codes clamp to the top or the bottom of the scale when the inputs
are overdriven.
Driving the Input
The IF ADCs have differential switched capacitor sample-and-
hold amplifier (SHA) inputs. The nominal differential input
impedance is 4.0 kΩ||3 pF. This impedance can be used as the
effective termination impedance when calculating filter transfer
characteristics and voltage signal attenuation from non-zero
source impedances. It should be noted however that for best
performance additional requirements must be met by the signal
source. The SHA has input capacitors that must be recharged
each time the input is sampled. This results in a dynamic input
current at the device input. This demands that the source has
low (<50 V) output impedance at frequencies up to the ADC
sampling frequency. Also, the source must have settling to better
than 0.1% in <1/2 ADC CLK period.
Another consideration for getting the best performance from the
ADC inputs is the dc biasing of the input signal. Ideally, the
signal should be biased to a dc level equal to the midpoint of the
ADC reference voltages, REFT12 and REFB12. Nominally, this
level will be 1.2 V. When ac-coupled, the ADC inputs will self-
bias to this voltage and requires no additional input circuitry.
Figure 20 illustrates a recommended circuit that eases the burden
on the signal source by isolating its output from the ADC input.
The 33 Ω series termination resistors isolate the amplifier outputs
from any capacitive load, which typically improves settling time.
The series capacitors provide ac signal coupling which ensures
that the ADC inputs operate at the optimal dc bias voltage. The
shunt capacitor sources the dynamic currents required to charge
the SHA input capacitors, removing this requirement from the
ADC buffer. The values of CC and CS should be calculated to
get the correct HPF and LPF corner frequencies.
tEE
tMD
tOD
MCLK
RxSYNC
RxIQ
DATA I[7:4] I[3:0] I[7:4] I[3:0]Q[7:4] Q[3:0]
IF10 IF12 IF10 IF12 IF10 IF12
REFCLK
IF DATA
M = 8
Figure 18. Rx Port Timing
(Default Mode: Multiplexed IF ADC Data)
t
EE
t
MD
t
OD
MCLK
RxSYNC
RxIQ
DATA I[7:4] I[3:0] I[7:4] I[3:0]Q[7:4] Q[3:0]
IF10 OR IF12
REFCLK
IF DATA IF10 OR IF12 IF10 OR IF12
M = 8
Figure 19. Rx Port Timing (Nonmultiplexed Data)
AINP
AINN
33
CS
V
S
C
C
C
C
33
Figure 20. Simple ADC Drive Configuration
REV. 0–22–
AD9879
PCB DESIGN CONSIDERATIONS
Although the AD9879 is a mixed-signal device, the part should
be treated as an analog component. The digital circuitry on-chip
has been specially designed to minimize the impact that the
digital switching noise will have on the operation of the analog
circuits. Following the power, grounding, and layout recommen-
dations in this section will help the user get the best performance
from the MxFE.
Component Placement
If the three following guidelines of component placement are
followed, chances for getting the best performance from the
MxFE are greatly increased. First, manage the path of return
currents flowing in the ground plane so that high frequency
switching currents from the digital circuits do not flow on the
ground plane under the MxFE or analog circuits. Second, keep
noisy digital signal paths and sensitive receive signal paths as
short as possible. Third, keep digital (noise generating) and analog
(noise susceptible) circuits as far away from each other as possible.
In order to best manage the return currents, pure digital circuits
that generate high switching currents should be closest to the
power supply entry. This will keep the highest frequency return
current paths short, and prevent them from traveling over the
sensitive MxFE and analog portions of the ground plane. Also,
these circuits should be generously bypassed at each device
which will further reduce the high frequency ground currents.
The MxFE should be placed adjacent to the digital circuits,
such that the ground return currents from the digital sections
will not flow in the ground plane under the MxFE. The analog
circuits should be placed furthest from the power supply.
The AD9879 has several pins which are used to decouple sensi-
tive internal nodes. These pins are REFIO, REFB10, REFT10,
REFB12, and REFT12. The decoupling capacitors connected
to these points should have low ESR and ESL. These capacitors
should be placed as close to the MxFE as possible and be con-
nected directly to the analog ground plane.
The resistor connected to the FSADJ pin and the RC network
connected to the PLLFILT pin should also be placed close to
the device and connected directly to the analog ground plane.
Power Planes and Decoupling
The AD9879 evaluation board demonstrates a good power
supply distribution and decoupling strategy. The board has four
layers; two signal layers, one ground plane and one power plane.
The power plane is split into a 3 VDD section which is used for
the 3 V digital logic circuits, a DVDD section that is used to
supply the digital supply pins of the AD9879, an AVDD section
that is used to supply the analog supply pins of the AD9879,
and a VANLG section that supplies the higher voltage analog
components on the board. The 3 VDD section will typically have
the highest frequency currents on the power plane and should be
kept the furthest from the MxFE and analog sections of the board.
The DVDD portion of the plane brings the current used to power
the digital portion of the MxFE to the device. This should be
treated similar to the 3VDD power plane and be kept from
going underneath the MxFE or analog components. The MxFE
should largely sit above the AVDD portion of the power plane.
The AVDD and DVDD power planes may be fed from the same
low noise voltage source; however, they should be decoupled
from each other to prevent the noise generated in the DVDD
portion of the MxFE from corrupting the AVDD supply. This
can be done by using ferrite beads between the voltage source
and DVDD and between the source and AVDD. Both DVDD
and AVDD should have a low ESR, bulk decoupling capacitor on
the MxFE side of the ferrite as well as a low ESR, ESL decoupling
capacitors on each supply pin (i.e., the AD9879 requires 17
power supply decoupling caps). The decoupling caps should be
placed as close to the MxFE supply pins as possible. An example
of the proper decoupling is shown in the AD9875 evaluation
board schematic.
Ground Planes
In general, if the component placing guidelines discussed earlier
can be implemented, it is best to have at least one continuous
ground plane for the entire board. All ground connections should
be made as short as possible. This will result in the lowest imped-
ance return paths and the quietest ground connections.
If the components cannot be placed in a manner that would keep
the high frequency ground currents from traversing under the
MxFE and analog components, it may be necessary to put current
steering channels into the ground plane to route the high fre-
quency currents around these sensitive areas. These current
steering channels should be made only when and where necessary.
Signal Routing
The digital Rx and Tx signal paths should be kept as short as
possible. Also, the impedance of these traces should have a
controlled impedance of about 50 Ω. This will prevent poor
signal integrity and the high currents that can occur during
undershoot or overshoot caused by ringing. If the signal traces
cannot be kept shorter than about 1.5 inches, then series termi-
nation resistors (33 Ω to 47 Ω) should be placed close to all
signal sources. It is a good idea to series terminate all clock
signals at their source regardless of trace length.
The receive (I in, Q in, and RF in) signals are the most sensitive
signals on the entire board. Careful routing of these signals is
essential for good receive path performance. The Rx+/– signals
form a differential pair and should be routed together as a pair.
By keeping the traces adjacent to each other, noise coupled onto
the signals will appear as common mode and will be largely
rejected by the MxFE receive input. Keeping the driving point
impedance of the receive signal low and placing any low-pass
filtering of the signals close to the MxFE will further reduce the
possibility of noise corrupting these signals.
REV. 0
AD9879
–23–
OUTLINE DIMENSIONS
100-Lead Plastic Quad Flatpack (MQFP)
(S-100C)
Dimensions shown in millimeters
81
100
1
50
31
30
51
TOP VIEW
(PINS DOWN)
PIN 1
80
12.35
REF
23.20 BSC
3.40
MAX
SEATING
PLANE 0.13
COPLANARITY
1.03
0.88
0.73
2.90
2.70
2.50
20.00 BSC
18.85 REF
14.00
BSC
17.20
BSC
0.40
0.22
0.65 BSC
0.50
0.25
COMPLIANT TO JEDEC STANDARDS MS-022-GC-1
C02773–0–8/02(0)
PRINTED IN U.S.A.
–24–
