CYDD09S72V18-167BBXC - Cypress Semiconductor Corp.

PRELIMINARY

FullFlex™ Synchronous

DDR Dual-Port SRAM

Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600

Document #: 38-06072 Rev. *E Revised October 11, 2005

Features

• True dual-ported memory allows simultaneous access

to the shared array from each port

• Synchronous pipelined operation with selectable

Double Data Rate (DDR) or Single Data Rate (SDR)

operation on each port

— DDR SRAM interface (data transferred at 400 Mbps)

@ 200 MHz

— SDR interface at 250 MHz

— Up to 36-Gb/s bandwidth (250 MHz * 72 bit * 2 ports)

• Selectable pipeline or flow-through mode

• Selectable 1.5V or 1.8V core power supply

• Commercial and Industrial temperature ranges

• IEEE 1149.1 JTAG boundary scan

• Available in 484-ball PBGA Packages and 256-ball

FBGA Packages

• FullFlex72 family

— 36 Mbit: 512K x 72 (CYDD36S72V18)

— 18 Mbit: 256K x 72 (CYDD18S72V18)

— 9 Mbit: 128K x 72 (CYDD09S72V18)

— 4 Mbit: 64K x 72 (CYDD04S72V18)

• FullFlex36 family

— 36 Mbit: 512K x 72 (CYDD36S36V18)

— 18 Mbit: 256K x 72 (CYDD18S36V18)

— 9 Mbit: 128K x 72 (CYDD09S36V18)

— 4 Mbit: 64K x 72 (CYDD04S36V18)

• FullFlex18 family

— 36 Mbit: 1M x 36 (CYDD36S18V18)

— 18 Mbit: 512K x 36 (CYDD18S18V18)

— 9 Mbit: 256K x 36 (CYDD09S18V18)

— 4 Mbit: 128K x 36 (CYDD04S18V18)

• Built-in deterministic access control to manage

address collisions

— Deterministic flag output upon collision detection

— Collision detection on back-to-back clock cycles

— First Busy Address readback

• Advanced features for improved high-speed data

transfer and flexibility

— Variable impedance Matching (VIM)

— Echo clocks

— Selectable LVTTL (3.3V), Extended HSTL

(1.4V–1.9V), 1.8V LVCMOS, or 2.5V LVCMOS I/O on

each port

— Burst counters for sequential memory access

— Mailbox with interrupt flags for message passing

— Dual Chip Enables for easy depth expansion

Functional Description

The FullFlex Dual-Port SRAM families consist of 4-Mbit,

9-Mbit, 18-Mbit, and 36-Mbit synchronous, true dual-port static

RAMs that are high-speed, low-power 1.8V/1.5V CMOS. Two

ports are provided, allowing the array to be accessed simulta-

neously. Simultaneous access to a location triggers determin-

istic access control. For FullFlex72, these ports can operate

independently in DDR mode with 36-bit bus widths or in SDR

mode with 72-bit bus widths. For FullFlex36 and FullFlex18,

the ports operate in DDR mode only. Each port can be

independently configured for two pipeline stages for SDR

mode or 2.5 stages in DDR mode. Each port can also be

configured to operate in pipeline or flow-through mode in SDR

mode.

Advanced features include built-in deterministic access

control to manage address collisions during simultaneous

access to the same memory location, variable impedance

Matching (VIM) to improve data transmission by matching the

output driver impedance to the line impedance, and echo

clocks to improve data transfer.

To reduce the static power consumption, chip enables can be

used to power down the internal circuitry. The number of

cycles of latency before a change in CE0 or CE1 will enable

or disable the databus matches the number of cycles of read

latency selected for the device. In order for a valid write or read

to occur, both chip enable inputs on a port must be active.

Each port contains an optional burst counter on the input

address register. After externally loading the counter with the

initial address, the counter will increment the address inter-

nally.

Additional features of this device include a mask register and

a mirror register to control counter increments and

wrap-around, counter-interrupt (CNTINT) flags to notify that

the counter will reach the maximum value on the next clock

cycle, readback of the burst-counter internal address, mask

retransmit functionality, mailbox interrupt flags for message

passing, JTAG for boundary scan, and asynchronous Master

Reset (MRST). The logic block diagram in Figure 1 displays

these features.

The FullFlex72 DDR family of devices is offered in a 484-ball

plastic BGA package. The FullFlex36 and FullFlex18 DDR

only families of devices are offered in a 256-ball fine pitch BGA

package.

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 2 of 48

Notes:

1. The CYDD36S18V18 device has 20 address bits. The CYDD36S36V18, CYDD36S72V18, and the CYDD18S18V18 devices have 19 address bits. The

CYDD18S72V18, CYDD18S36V18, and the CYDD09S18V18 devices have 18 address bits. The CYDD09S72V18, CYDD04S18V18, and the CYDD09S36V18

devices have 17 address bits. The CYDD04S36V18 and the CYDD04S72V18 devices have 16 address bits.

2. The FullFlex72 family of devices has 72 data lines. The FullFlex36 family of devices has 36 data lines. The FullFlex18 family of devices has 18 data lines.

3. The FullFlex72 family of devices has eight byte enables. The FullFlex36 family of devices has four byte enables. The FullFlex18 family of devices has two byte

enables.

FTSELL

PORTSTD[1:0]L

DQ[71:0]L

BE [7:0]

CE0L

CE1L

OEL

R/W

CQ0L

FTSELR

PORTSTD[1:0]R

DQ [71:0]R

BE [7:0]

CE0R

CE1R

OER

R/W

CQ0R

A [19:0]L

CNT/MSK

ADSL

CNTENL

CNTRSTL

RETL

CNTINT

A [19:0]R

CNT/MSK

ADSR

CNTENR

CNTRSTR

RETR

CNTINT

WRPR

CONFIG Block CONFIG Block

Control

Address &

Counter Logic Address &

Counter Logic

INTL

TRST

TMS

TDI

TDO

TCK

JTAG

MRST

READY

LowSPDR

READYL

LowSPDLRESET

LOGIC

INTR

BUSYLBUSYR

CQ1L

CQ1R

Mailboxes

Collision Detection

Logic

CQ0LCQ0R

Dual Ported Array

Figure 1. Block Diagram[1,2,3]

VC_SEL

WRPL

ZQ0R

ZQ1R

ZQ0L

ZQ1L

CQENLCQENR

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 3 of 48

FullFlex72 SDR/DDR 484-ball BGA Pinout (Top View)

12345678910111213141516171819

20 21 22

ANC DQ34L DQ32L DQ30L DQ27L DQ60L DQ57L DQ54L DQ24L DQ21L DQ18L DQ18R DQ21R DQ24R DQ54R DQ57R[DQ60R DQ27R DQ30R DQ32R DQ34R NC

BDQ63L DQ35L DQ33L DQ31L DQ28L DQ61L[DQ58L DQ55L DQ25L DQ22L DQ19L DQ19R DQ22R DQ25R DQ55R DQ58R DQ61R DQ28R DQ31R DQ33R DQ35R DQ63R

CDQ65L DQ64L VSS VSS DQ29L DQ62L DQ59L DQ56L DQ26L DQ23L DQ20L DQ20R DQ23R DQ26R DQ56R DQ59R DQ62R DQ29R VSS VSS DQ64R DQ65R

DDQ67L DQ66L VSS VSS VSS CQ1L CQ1L DDRON

LOWSP

PORTS

TD0L

ZQ0L[4][ BUSYL CNTINT

PORTS

TD1L

NC CQ1R CQ1R VSS VSS VSS DQ66R DQ67R

EDQ69L DQ68L VDDIOL VSS VSS VDDIOL VDDIOL VDDIOL VDDIOL VDDIOL VTTL VTTL VTTL VDDIO

VDDIO

NC VSS VDDIO

DQ68R DQ69R

FDQ71L DQ70L[CE1L CE0L VDDIOL VDDIOL VDDIOL VDDIOL VDDIOL VCORE VCORE VCORE VCORE VDDIO

VDDIO

CE0R CE1R DQ70R[DQ71R

GA0L A1L RETL BE2L VDDIOL VDDIOL VREFL VSS VSS VSS VSS VSS VSS VSS VSS VREFR VDDIO

VDDIO

BE2R RETR A1R A0R

HA2L A3L WRPL BE6L VDDIOL VDDIOL VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDIO

VDDIO

BE6R WRPR A3R A2R

JA4L A5L READY

BE3L VDDIOL VDDIOL VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDIO

VDDIO

BE3R READY

A5R A4R

KA6L A7L ZQ1L[4] BE7L VTTL VCORE VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCORE VDDIO

BE7R ZQ1R[4] A7R A6R

LA8L A9L CL OEL VTTL VCORE VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCORE VTTL OER CR A9R A8R

MA10L A11L CL BE5L VTTL VCORE VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCORE VTTL BE5R CR A11R A10R

NA12L A13L ADSL BE1L VDDIOL VCORE VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCORE VTTL BE1R ADSR A13R A12R

PA14L A15L CNTMS

BE4L VDDIOL VDDIOL VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDIO

VDDIO

BE4R CNTMS

A15R A14R

RA16L[7] A17L[6] CNTEN

BE0L VDDIOL VDDIOL VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDIO

VDDIO

BE0R CNTEN

A17R[6] A16R[7]

TA18L[5] NC CNTRS

INTL VDDIOL VDDIOL VREFL VSS VSS VSS VSS VSS VSS VSS VSS VREFR VDDIO

VDDIO

INTR CNTRS

NC A18R[5]

UDQ53L DQ52L[R/WL CQENL VDDIOL VDDIOL VDDIOL VDDIOL VDDIOL VCORE VCORE VCORE VCORE VDDIO

VDDIO

CQENR R/WRDQ52RDQ53R

VDQ51L DQ50L FTSELL VDDIOL NC VDDIOL VDDIOL VDDIOL VDDIOL VTTL VTTL VTTL VDDIO

VDDIO

TRST VDDIO

FTSEL

DQ50R DQ51R

WDQ49L DQ48L VSS MRST VSS CQ0L CQ0L VC_SE

PORTS

TD1R

CNTINT

BUSYR ZQ0R[4] PORTS

TD0R

LOWSP

DDRON

CQ0R CQ0R VSS TDI TDO DQ48R DQ49R

YDQ47L DQ46L VSS VSS DQ11L DQ44L DQ41L DQ38L DQ8L DQ5L DQ2L DQ2R DQ5R DQ8R DQ38R DQ41R DQ44R DQ11R TMS TCK DQ46R DQ47R

AA DQ45L DQ17L DQ15L DQ13L DQ10L DQ43L DQ40L DQ37L DQ7L DQ4L DQ1L DQ1R DQ4R DQ7R DQ37R DQ40R DQ43R DQ10R DQ13R DQ15R DQ17R DQ45R

AB NC DQ16L DQ14L DQ12L DQ9L DQ42L DQ39L DQ36L DQ6L DQ3L DQ0L DQ0R DQ3R DQ6R DQ36R DQ39R DQ42R DQ9R DQ12R DQ14R DQ16R NC

Note:

4. Leaving this pin NC disables VIM

5. Leave this ball unconnected for CYDD18S72V18, CYDD09S72V18 and CYDD04S72V18.

6. Leave this ball unconnected for CYDD09S72V18 and CYDD04S72V18

7. Leave this ball unconnected for CYDD04S72V18

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 4 of 48

FullFlex36 DDR 484-ball BGA Pinout (Top View)[8]

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

ANC DQ34

DQ32

DQ30

DQ27

NC NC NC DQ24

DQ21

DQ18

DQ21

DQ24

NC NC NC DQ27

DQ30

DQ32

DQ34

BNC DQ35

DQ33

LNC

DQ31

DQ28

NC NC NC DQ25

DQ22

DQ19

DQ22

DQ25

NC NC NC DQ28

DQ31

DQ33

DQ35

CNC NC VSS VSS DQ29

NC NC NC DQ26

DQ23

DQ20

DQ23

DQ26

NC NC NC DQ29

VSS VSS NC NC

NC NC VSS VSS VSS CQ1L CQ1L DDR

ONL

LOW

SPDL

PORT

STD0

ZQ0L[

4] BUSY

CNTI

NTL

PORT

STD1

NC CQ1R CQ1R VSS VSS VSS NC NC

ENC NC VDDI

VSS VSS VDDI

VDDI

VTTL VTTL VTTL VDDI

VDDI

NC VSS VDDI

NC NC

FNC NC CE1L CE0L VDDI

VDDI

VCO

VDDI

CE0R CE1R NC NC

GA0L A1L RETL BE2L VDDI

VDDI

VREF

VSS VSS VSS VSS VSS VSS VSS VSS VREF

VDDI

BE2R RETR A1R A0R

HA2L A3L WRP

NC VDDI

VDDI

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDI

VDDI

NC WRP

A3R A2R

JA4L A5L READ

BE3L VDDI

VDDI

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDI

VDDI

BE3R READ

A5R A4R

KA6L A7L ZQ1L[

4] NC VTTL VCO

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCO

VDDI

NC ZQ1R

[4] A7R A6R

LA8L A9L CL OEL VTTL VCO

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCO

VTTL OER CR A9R A8R

MA10L A11L CL NC VTTL VCO

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCO

VTTL NC CR A11R A10R

NA12L A13L ADSL BE1L VDDI

VCO

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCO

VTTL BE1R ADSR A13R A12R

A14L A15L CNT

MSKL

NC VDDI

VDDI

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDI

VDDI

NC CNT

MSK

A15R A14R

RA16L A17L CNTE

BE0L VDDI

VDDI

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDI

VDDI

BE0R CNTE

A17R A16R

TA18L NC CNTR

STL

INTL VDDI

VDDI

VREF

VSS VSS VSS VSS VSS VSS VSS VSS VREF

VDDI

INTR CNTR

STR

NC A18R

UNC NC R/WL CQE

VDDI

VCO

VDDI

CQE

R/WR NC NC

VNC NC FTSE

VDDI

NC VDDI

VDDI

VTTL VTTL VTTL VDDI

VDDI

TRST VDDI

FTSE

NC NC

NC NC VSS MRST VSS CQ0L CQ0L VC_S

PORT

STD1

CNTI

NTR

BUSY

ZQ0R

[4] PORT

STD0

LOW

SPDR

DDR

ONR CQ0R CQ0R VSS TDI TDO NC NC

YNC NC VSS VSS DQ11

NC NC NC DQ8L DQ5L DQ2L DQ2R DQ5R DQ8R NC NC NC DQ11

TMS TCK NC NC

AA NC DQ17

DQ15

DQ13

DQ10

NC NC NC DQ7L DQ4L DQ1L DQ1R DQ4R DQ7R NC NC NC DQ10

DQ13

DQ15

DQ17

AB NC DQ16

DQ14

DQ12

DQ9L NC NC NC DQ6L DQ3L DQ0L DQ0R DQ3R DQ6R NC NC NC DQ9R DQ12

DQ14

DQ16

Note:

8. Use this pinout only for device CYDD36S36V18 of the FullFlex36 famiy.

PRELIMINARY

FullFlex™ Synchronous

DDR Dual-Port SRAM

Cypress Semiconductor Corporation • 198 Champion Court • San Jose,CA 95134-1709 • 408-943-2600

Document #: 38-06072 Rev. *E Revised October 11, 2005

FullFlex18 DDR 484-ball BGA Pinout (Top View)

12345678910111213141516171819

20 21 22

ANC NC NC NC NC NC NC NC DQ15

DQ12

DQ9L DQ9R DQ12

DQ15

NC NC NC NC NC NC NC NC

BNC NC NC NC NC NC NC NC DQ16

DQ13

DQ10

DQ13

DQ16

NC NC NC NC NC NC NC NC

CNC NC VSS VSS NC NC NC NC DQ17

DQ14

DQ11

DQ14

DQ17

NC NC NC NC VSS VSS NC NC

NC NC VSS VSS VSS CQ1L CQ1L DDR

ONL

LOW

SPDL

PORT

STD0

ZQ0L[

4] BUSY

CNTI

NTL

PORT

STD1

NC CQ1R CQ1R VSS VSS VSS NC NC

ENC NC VDDI

VSS VSS VDDI

VDDI

VTTL VTTL VTTL VDDI

VDDI

NC VSS VDDI

NC NC

FNC NC CE1L CE0L VDDI

VDDI

VCO

VDDI

CE0R CE1R NC NC

GA0L A1L RETL BE1L VDDI

VDDI

VREF

VSS VSS VSS VSS VSS VSS VSS VSS VREF

VDDI

BE1R RETR A1R A0R

HA2L A3L WRP

NC VDDI

VDDI

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDI

VDDI

NC WRP

A3R A2R

JA4L A5L READ

NC VDDI

VDDI

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDI

VDDI

NC READ

A5R A4R

KA6L A7L ZQ1L[

4] NC VTTL VCO

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCO

VDDI

NC ZQ1R

[4] A7R A6R

LA8L A9L CL OEL VTTL VCO

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCO

VTTL OER CR A9R A8R

MA10L A11L CL NC VTTL VCO

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCO

VTTL NC CR A11R A10R

NA12L A13L ADSL NC VDDI

VCO

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VCO

VTTL NC ADSR A13R A12R

A14L A15L CNT

MSKL

NC VDDI

VDDI

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDI

VDDI

NC CNT

MSK

A15R A14R

RA16L A17L CNTE

BE0L VDDI

VDDI

VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS VDDI

VDDI

BE0R CNTE

A17R A16R

TA18L A19L CNTR

STL

INTL VDDI

VDDI

VREF

VSS VSS VSS VSS VSS VSS VSS VSS VREF

VDDI

INTR CNTR

STR

A19R A18R

UA20L NC R/WL CQE

VDDI

VCO

VDDI

CQE

R/WR NC A20R

VNC NC FTSE

VDDI

NC VDDI

VDDI

VTTL VTTL VTTL VDDI

VDDI

TRST VDDI

FTSE

NC NC

NC NC VSS MRST VSS CQ0L CQ0L VC_S

PORT

STD1

CNTI

NTR

BUSY

ZQ0R

[4] PORT

STD0

LOW

SPDR

DDR

ONR CQ0R CQ0R VSS TDI TDO NC NC

YNC NC VSS VSS NC NC NC NC DQ8L DQ5L DQ2L DQ2R DQ5R DQ8R NC NC NC NC TMS TCK NC NC

AA NC NC NC NC NC NC NC NC DQ7L DQ4L DQ1L DQ1R DQ4R DQ7R NC NC NC NC NC NC NC NC

AB NC NC NC NC NC NC NC NC DQ6L DQ3L DQ0L DQ0R DQ3R DQ6R NC NC NC NC NC NC NC NC

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 6 of 48

FullFlex36 DDR 256 Ball BGA (Top View)

12345678910111213141516

ADQ32L DQ30L DQ28L DQ26L DQ24L DQ22L DQ20L DQ18L DQ18R DQ20R DQ22R DQ24R DQ26R DQ28R DQ30R DQ32R

BDQ33L DQ31L DQ29L DQ27L DQ25L DQ23L DQ21L DQ19L DQ19R DQ21R DQ23R DQ25R DQ27R DQ29R DQ31R DQ33R

CDQ34L DQ35L RETL INTL CQ1L CQ1L VC_SEL TRST MRST ZQ0R[4] CQ1R CQ1R INTR RETR DQ35R DQ34R

DA0L A1L WRPL VREF VDDIOL LOWSP

VSS VTTL VTTL VSS LOWSP

VDDIO

VREF WRPR A1R A0R

EA2L A3L CE0L CE1L VDDIOL VDDIOL VDDIOL VCORE VCORE VDDIO

VDDIO

CE1R CE0R A3R A2R

FA4L A5L CNINTL BE3L VDDIOL VDDIOL VSS VSS VSS VSS VSS VDDIO

BE3R CNINTR A5R A4R

GA6L A7L BUSYL BE2L ZQ0L[4] VSS VSS VSS VSS VSS VSS VDDIO

BE2R BUSYR A7R A6R

HA8L A9L CL VTTL VCORE VSS VSS VSS VSS VSS VSS VCORE VTTL CR A9R A8R

JA10L A11L CL PORTS

TD1L

VCORE VSS VSS VSS VSS VSS VSS VCORE PORTS

TD1R

CR A11R A10R

KA12L A13L OEL BE1L VDDIOL VSS VSS VSS VSS VSS VSS VDDIO

BE1R OER A13R A12R

LA14L A15L ADSL BE0L VDDIOL VSS VSS VSS VSS VSS VDDIO

VDDIO

BE0R ADSR A15R A14R

MA16L[10] A17L[9] RWL CQENL VDDIOL VDDIOL VDDIOL VCORE VCORE VDDIO

VDDIO

CQENR RWR A17R[9] A16R[10]

NNC NC CNTMS

VREF PORTS

TD0L

READY

ZQ1L[4] VTTL VTTL ZQ1R[4] READY

PORTS

TD0R

VREF CNTMS

NC NC

PDQ16L DQ17L CNTEN

CNTRS

CQ0L CQ0L TCK TMS TDO TDI CQ0R CQ0R CNTRS

CNTEN

DQ17R DQ16R

RDQ15L DQ13L DQ11L DQ9L DQ7L DQ5L DQ3L DQ1L DQ1R DQ3R DQ5R DQ7R DQ9R DQ11R DQ13R DQ15R

TDQ14L DQ12L DQ10L DQ8L DQ6L DQ4L DQ2L DQ0L DQ0R DQ2R DQ4R DQ6R DQ8R DQ10R DQ12R DQ14R

Notes:

9. Leave this ball unconnected for CYDD09S36V18 and CYDD04S36V18.

10. Leave this ball unconnected for CYDD04S36V18.

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 7 of 48

FullFlex18 DDR 256 Ball BGA (Top View)

12345678910111213141516

ANC NC NC DQ17L DQ16L DQ13L DQ12L DQ9L DQ9R DQ12R DQ13R DQ16R DQ17R NC NC NC

BNC NC NC NC DQ15L DQ14L DQ11L DQ10L DQ10R DQ11R DQ14R DQ15R NC NC NC NC

CNC NC RETL INTL CQ1L CQ1L VC_SEL TRST MRST ZQ0R[4] CQ1R CQ1R INTR RETR NC NC

DA0L A1L WRPL VREF VDDIOL LOWSP

VSS VTTL VTTL VSS LOWSP

VDDIOR VREF WRPR A1R A0R

EA2L A3L CE0L CE1L VDDIOL VDDIOL VDDIOL VCORE VCORE VDDIOR VDDIOR VDDIOR CE1R CE0R A3R A2R

FA4L A5L CNINTL NC VDDIOL VDDIOL VSS VSS VSS VSS VSS VDDIOR NC CNINTR A5R A4R

GA6L A7L BUSYL NC ZQ0L[4] VSS VSS VSS VSS VSS VSS VDDIOR NC BUSYR A7R A6R

HA8L A9L CL VTTL VCORE VSS VSS VSS VSS VSS VSS VCORE VTTL CR A9R A8R

JA10L A11L CL PORTST

D1L

VCORE VSS VSS VSS VSS VSS VSS VCORE PORTST

D1R

CR A11R A10R

KA12L A13L OEL BE1L VDDIOL VSS VSS VSS VSS VSS VSS VDDIOR BE1R OER A13R A12R

LA14L A15L ADSL BE0L VDDIOL VSS VSS VSS VSS VSS VDDIOR VDDIOR BE0R ADSR A15R A14R

MA16L A17L[12] RWL CQENL VDDIOL VDDIOL VDDIOL VCORE VCORE VDDIOR VDDIOR VDDIOR CQENR RWR A17R[12] A16R

NA18L[11] NC CNTMS

VREF PORTST

D0L

READYL ZQ1L[4] VTTL VTTL ZQ1R[4] READY

PORTST

D0R

VREF CNTMS

NC A18R[11]

PNC NC CNTENL CNTRST

CQ0L CQ0L TCK TMS TDO TDI CQ0R CQ0R CNTRST

CNTEN

NC NC

RNC NC NC NC DQ6L DQ5L DQ2L DQ1L DQ1R DQ2R DQ5R DQ6R NC NC NC NC

TNC NC NC DQ8L DQ7L DQ4L DQ3L DQ0L DQ0R DQ3R DQ4R DQ7R DQ8R NC NC NC

Note:

11. Leave this ball unconnected for CYDD09S18V18 and CYDD04S18V18.

12. Leave this ball unconnected for CYDD04S18V18.

Table 1. Selection Guide

-250[13,15,17] -200[13,14,16,17

]-167[13,14] Unit

fMAX 250 200 167 MHz

SDR Max. Access Time (Clock to Data) 2.64 3.3 4.0 ns

DDR Max. Access Time (Clock to Data) 0.50 0.50 0.50 ns

Typical Operating Current ICC TBD TBD TBD mA

Typical Standby Current for ISB3 (Both Ports CMOS Level) TBD TBD TBD mA

Notes:

13. SDR mode with two pipeline stages.

14. DDR mode with 2.5 pipeline stages.

15. In SDR mode, these parameters apply for the 1.8V LVCMOS and HSTL.

16. In DDR mode, these parameters apply for the 1.8V LVCMOS and HSTL.

17. There is a speed bin drop for a 1.5V Core voltage.

18. These parameters apply for the 1.5V Core voltage only.

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 8 of 48

Pin Definitions

Left Port Right Port Description

A[20:0]LA[20:0]RAddress Inputs.[1]

DQ0L–DQ71L DQ0R–DQ71R Data Bus Input/Output.[2]

BE0L–BE7L BE0R–BE7R Byte Select Inputs.[3] Asserting these signals enables Read and Write operations to the

corresponding bytes of the memory array.

BUSYLBUSYRPort Busy Output. When there is an address match and both chip enables are active for

both ports, an external BUSY signal is asserted on the fifth clock cycle from when the collision

occurs.

C/CLC/CRClock Signal.[19] Maximum clock input rate is fMAX. Tie C to VSS when operating in SDR

mode.

CE0LCE0RActive LOW Chip Enable Input.

CE1LCE1RActive HIGH Chip Enable Input.

CQENLCQENREcho Clock Enable Input. Assert HIGH to enable echo clocking on respective port.

CQ0L, CQ0LCQ0R, CQ0REcho Clock Signal Output for DQ[35:0] for FullFlex72 devices. Echo Clock Signal Output

for DQ[17:0] for FullFlex36 devices. Echo Clock Signal Output for DQ[8:0] for FullFlex18

devices.

CQ1L, CQ1LCQ1R, CQ1REcho Clock Signal Output for DQ[71:36] for FullFlex72 devices. Echo Clock Signal

Output for DQ[35:18] for FullFlex36 devices. Echo Clock Signal Output for DQ[17:9] for

FullFlex18 devices.

DDRONLDDRONRDDR Enable Input. Assert HIGH to enable DDR clocking on respective port.

ZQ<1:0>LZQ<1:0>RVIM Output Impedance Matching Input. To use, connect a calibrating resistor between ZQ

and ground. The resistor must be five times larger than the intended line impedance driven

by the dual-port. Assert HIGH to disable Variable Impedance Matching.

OELOEROutput Enable Input. This asynchronous signal must be asserted LOW to enable the DQ

data pins during Read operations.

INTLINTRMailbox Interrupt Flag Output. The mailbox permits communications between ports. The

upper two memory locations can be used for message passing. INTL is asserted LOW when

the right port writes to the mailbox location of the left port, and vice versa. An interrupt to a

port is deasserted HIGH when it reads the contents of its mailbox.

LowSPDLLowSPDRPort Low Speed Select Input. Assert this pin LOW to disable the DLL. For operation at less

than 100 MHz, assert this pin LOW.

PORTSTD[1:0]L

[20] PORTSTD[1:0]R

[20] Port Clock/Address/Control/Data/Echo Clock/ I/O Standard Select Input. Assert these

pins LOW/LOW for LVTTL, LOW/HIGH for HSTL, HIGH/LOW for 2.5V LVCMOS, and

HIGH/HIGH for 1.8V LVCMOS, respectively. Connect these pins to a VTTL supply.

R/WLR/WRRead/Write Enable Input. Assert this pin LOW to Write to, or HIGH to Read from the

dual-port memory array.

READYLREADYRPort DLL Ready Output. This signal will be asserted LOW when the DLL and Variable

Impedance Matching circuits have completed calibration. This is a wired OR capable output.

CNT/MSKLCNT/MSKRPort Counter/Mask Select Input. Counter control input.

ADSLADSRPort Counter Address Load Strobe Input. Counter control input.

CNTENLCNTENRPort Counter Enable Input. Counter control input.

CNTRSTLCNTRSTRPort Counter Reset Input. Counter control input.

CNTINTLCNTINTRPort Counter Interrupt Output. This pin is asserted LOW one cycle before the unmasked

portion of the counter is incremented to all “1s”.

WRPLWRPRPort Counter Wrap Input. When the burst counter reaches the maximum count, on the next

counter increment WRP can be set LOW to load the unmasked counter bits to 0 or set HIGH

to load the counter with the value stored in the mirror register.

RETLRETRPort Counter Retransmit Input. Assert this pin LOW to reload the initial address for

repeated access to the same segment of memory.

Notes:

19. C and C are complimentary for DDR operation.

20. Pins D14 and W9 of the FullFlex72 have an internal pull-down resistor.

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 9 of 48

Selectable I/O Standard

The FullFlex families of devices also offer the option of

choosing one of four port standards for the device. Each port

can independently select standards from single-ended HSTL

class I, single-ended LVTTL, 2.5V LVCMOS, or 1.8V

LVCMOS. The selection of the standard is determined by the

PORTSTD pins for each port. These pins must be connected

to a VTTL power supply. This will determine the input clock,

address, control, data, and Echo clock standard for each port

as shown in Table 2.

Operating mode with different IO standards combined with

different core power supply will result in different maximum

speed as shown in Table 3.

Clocking

Separate clocks synchronize the operations on each port.

Each port has two clock inputs C and C. In SDR mode only the

C input clock is used and C should be tied to VSS. In this

mode, all the transactions on the address, control, and data

will be on the C rising edge. In DDR mode, both C and C will

be used and these signals are complementary. In this mode,

all transactions on the address and control, except for the byte

enables, will occur on the C rising edge. Transactions on the

data input, output, and byte enables will be on the C and C

rising edges.

Double Data Rate (DDR)

In DDR mode with a x36 bus width, the input data is sampled

on both edges of the input clock. During a write, on the rising

edge of C, the first 36 bits (DQ[71:36]) will be latched into a

will be latched into a register. During a read, the first 36 bits

are driven out first on the rising edge of C. The next 36 bits will

be driven out on the rising edge of C. The internal bus width of

the FullFlex72 family is still x72. All counter operation is based

upon the x72 word width. The DDR option is set on a per port

basis by the configuration of the DDRON pin. Table 4 shows

the data assignment for SDR and DDR configuration. The

column on the right (Data Pin Name) shows the pins on which

data is presented on the data lines.

VREFLVREFRPort External HSTL I/O Reference Input.

VDDIOLVDDIORPort Data I/O Power Supply.

FTSELLFTSELRPort Flow-Through Mode Select Input. Assert this pin LOW to select Flow-Through mode.

Assert this pin HIGH to select Pipeline mode. Selection for SDR only.

MRST Master Reset Input. MRST is an asynchronous input signal and affects both ports. Asserting

MRST LOW performs all of the reset functions as described in the text. A MRST operation

is required at power-up. This pin must be driven by VDDIO referenced levels.

VC_SEL Core Power Supply Select. Assert this pin LOW to select 1.8V Core operation. Assert this

pin HIGH to select 1.5V Core operation. This pin must be driven by VTTL referenced levels.

TMS JTAG Test Mode Select Input. It controls the advance of JTAG TAP state machine. State

machine transitions occur on the rising edge of TCK. Operation for LVTTL or 2.5V LVCMOS.

TDI JTAG Test Data Input. Data on the TDI input will be shifted serially into selected registers.

Operation for LVTTL or 2.5V LVCMOS.

TRST JTAG Reset Input. Operation for LVTTL or 2.5V LVCMOS.

TCK JTAG Test Clock Input. Operation for LVTTL or 2.5V LVCMOS.

TDO JTAG Test Data Output. TDO transitions occur on the falling edge of TCK. TDO is normally

three-stated except when captured data is shifted out of the JTAG TAP. Operation for LVTTL

or 2.5V LVCMOS.

VSS Ground Inputs.

VCORE Device Core Power Supply.

VTTL LVTTL Power Supply.

Pin Definitions (continued)

Left Port Right Port Description

Table 2. Port Standard Selection

PORTSTD1 PORTSTD0 I/O Standard

VSS VSS LVTTL

VSS VTTL HSTL

VTTL VSS 2.5V LVCMOS

VTTL VTTL 1.8V LVCMOS

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 10 of 48

Table 3. Operating Mode vs. Speed, I/O Standard and Pipeline Stages

Operating Mode Maximum Speed (MHz) Core Voltage (V) I/O Standard Latency Cycles

SDR 250 1.8 HSTL/1.8V LVCMOS 2

SDR 200 1.8 LVTTL/2.5V LVCMOS 2

SDR 200 1.5 HSTL/LVTTL/2.5V LVCMOS/1.8V

LVCMOS

DDR 200 1.8 HSTL/1.8V LVCMOS 2.5

DDR 167 1.5 HSTL/LVTTL/2.5V LVCMOS/1.8V

LVCMOS

2.5

Table 4. Data Pin Assignment for SDR and DDR Configuration

BE Pin Name for

DDR

BE Pin Name for

SDR

x72 SDR Mode x36 DDR Mode

Data Pin Name

Related Rising Edge

Clock for Write

Related Rising Edge

Clock for Read

Data Pin

Name

BE[3] BE[7] DQ[71] C C DQ[35]

BE[3] BE[3] DQ[35] C C

BE[3] BE[7] DQ[70] C C DQ[34]

BE[3] BE[3] DQ[34] C C

BE[3] BE[7] DQ[69] C C DQ[33]

BE[3] BE[3] DQ[33] C C

BE[3] BE[7] DQ[68] C C DQ[32]

BE[3] BE[3] DQ[32] C C

BE[3] BE[7] DQ[67] C C DQ[31]

BE[3] BE[3] DQ[31] C C

BE[3] BE[7] DQ[66] C C DQ[30]

BE[3] BE[3] DQ[30] C C

BE[3] BE[7] DQ[65] C C DQ[29]

BE[3] BE[3] DQ[29] C C

BE[3] BE[7] DQ[64] C C DQ[28]

BE[3] BE[3] DQ[28] C C

BE[3] BE[7] DQ[63] C C DQ[27]

BE[3] BE[3] DQ[27] C C

BE[2] BE[6] DQ[62] C C DQ[26]

BE[2] BE[2] DQ[26] C C

BE[2] BE[6] DQ[61] C C DQ[25]

BE[2] BE[2] DQ[25] C C

BE[2] BE[6] DQ[60] C C DQ[24]

BE[2] BE[2] DQ[24] C C

BE[2] BE[6] DQ[59] C C DQ[23]

BE[2] BE[2] DQ[23] C C

BE[2] BE[6] DQ[58] C C DQ[22]

BE[2] BE[2] DQ[22] C C

BE[2] BE[6] DQ[57] C C DQ[21]

BE[2] BE[2] DQ[21] C C

BE[2] BE[6] DQ[56] C C DQ[20]

BE[2] BE[2] DQ[20] C C

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 11 of 48

BE[2] BE[6] DQ[55] C C DQ[19]

BE[2] BE[2] DQ[19] C C

BE[2] BE[6] DQ[54] C C DQ[18]

BE[2] BE[2] DQ[18] C C

BE[1] BE[5] DQ[53] C C DQ[17]

BE[1] BE[1] DQ[17] C C

BE[1] BE[5] DQ[52] C C DQ[16]

BE[1] BE[1] DQ[16] C C

BE[1] BE[5] DQ[51] C C DQ[15]

BE[1] BE[1] DQ[15] C C

BE[1] BE[5] DQ[50] C C DQ[14]

BE[1] BE[1] DQ[14] C C

BE[1] BE[5] DQ[49] C C DQ[13]

BE[1] BE[1] DQ[13] C C

BE[1] BE[5] DQ[48] C C DQ[12]

BE[1] BE[1] DQ[12] C C

BE[1] BE[5] DQ[47] C C DQ[11]

BE[1] BE[1] DQ[11] C C

BE[1] BE[5] DQ[46] C C DQ[10]

BE[1] BE[1] DQ[10] C C

BE[1] BE[5] DQ[45] C C DQ[9]

BE[1] BE[1] DQ[9] C C

BE[0] BE[4] DQ[44] C C DQ[8]

BE[0] BE[0] DQ[8] C C

BE[0] BE[4] DQ[43] C C DQ[7]

BE[0] BE[0] DQ[7] C C

BE[0] BE[4] DQ[42] C C DQ[6]

BE[0] BE[0] DQ[6] C C

BE[0] BE[4] DQ[41] C C DQ[5]

BE[0] BE[0] DQ[5] C C

BE[0] BE[4] DQ[40] C C DQ[4]

BE[0] BE[0] DQ[4] C C

BE[0] BE[4] DQ[39] C C DQ[3]

BE[0] BE[0] DQ[3] C C

BE[0] BE[4] DQ[38] C C DQ[2]

BE[0] BE[0] DQ[2] C C

BE[0] BE[4] DQ[37] C C DQ[1]

BE[0] BE[0] DQ[1] C C

BE[0] BE[4] DQ[36] C C DQ[0]

BE[0] BE[0] DQ[0] C C

Table 4. Data Pin Assignment for SDR and DDR Configuration (continued)

BE Pin Name for

DDR

BE Pin Name for

SDR

x72 SDR Mode x36 DDR Mode

Data Pin Name

Related Rising Edge

Clock for Write

Related Rising Edge

Clock for Read

Data Pin

Name

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 12 of 48

Selectable Pipeline/Flow-Through Mode

To meet data rate and throughput requirements, the FullFlex

families offer selectable pipeline or flow-through mode.

Flow-through mode is only supported in the FullFlex72

devices when the port is configured in SDR mode. Echo clocks

are not supported in flow-through mode and the DLL must be

disabled.

Flow-Through mode is selected by the FTSEL pin. Strapping

this pin HIGH selects pipeline mode. Strapping this pin LOW

selects flow-through mode.

DLL

The FullFlex families of devices have an on-chip DLL.

Enabling the DLL reduces the clock to data valid time allowing

more setup time for the receiving device. For operation at or

below 100 MHz, the DLL must be disabled. This is selectable

by strapping LowSPD LOW. For information on DLL lock and

reset time, please see the Master Reset section below.

Echo Clocking

As the speed of data increases, on-board delays caused by

parasitics make providing accurate clock trees extremely

difficult. To counter this problem, the FullFlex families incor-

porate Echo Clocks. Echo Clocks are enabled on a per port

basis. The dual-port receives input clocks (C and C for DDR

mode, C for SDR mode) that are used to clock in the address

and control signals for a read operation. The dual-port

retransmits the input clocks relative to the data output. The

buffered clocks are provided on the CQ1, CQ1, CQ0, and CQ0

outputs. Each port has two pairs of Echo clocks. Each clock is

associated with half the data bits. The output clock will match

the corresponding ports I/O configuration.

To enable Echo clock outputs, tie CQEN HIGH. To disable

Echo clock outputs, tie CQEN LOW.

Deterministic Access Control

Deterministic Access Control is provided for ease of design.

The circuitry detects when both ports are accessing the same

location and provides an external BUSY flag to the port on

which data may be corrupted. The collision detection logic

saves the address in conflict (Busy Address) to a readable

address will be written to the Busy Address register.

If both ports are accessing the same location at the same time

and only one port is doing a write, if tCCS is met, then the data

being written to and read from the address is valid data. For

example, if the right port is reading and the left port is writing

and the left ports clock meets tCCS, then the data being read

from the address by the right port will be the old data. In the

same case, if the right ports clock meets tCCS, then the data

being read out of the address from the right port will be the new

data. In the above case, if tCCS is violated by the either ports

clock with respect to the other port and the right port gets the

external BUSY flag, the data from the right port is corrupted.

Table 5 shows the tCCS timing that must be met to guarantee

the data.

Table 6 shows that in the case of the left port writing and the

right port reading, when an external BUSY flag is asserted on

the right port, the data read out of the device will not be

guaranteed.

The value in the busy address register can be read back to the

address lines. The required input control signals for this

function are shown in Table 9. The value in the busy address

amount of latency as a data read operation in SDR mode. In

DDR mode, the address latency is only 2 cycles instead of 2.5

which is the data latency. After an initial address match, the

address under contention is saved in the busy address

to be generated, however, none of the addresses are saved

into the busy address register. Once a busy readback is

performed, the address of the first match which happens at

least two clock cycles after the busy readback, is saved into

the busy address register.

Figure 2. SDR Echo Clock Delay

Figure 3. DDR Echo Clock Delay

Input Clock

Echo Clock

Data Out

Echo Clock

Input Clock

Data Out

Input Clock

Echo Clock

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 13 of 48

Variable Impedance Matching (VIM)

Each port contains a Variable Impedance Matching circuit to

set the impedance of the I/O driver to match the impedance of

the on board traces. The impedance is set for all outputs

except JTAG and is done on a per port basis. To take

advantage of the VIM feature, connect a calibrating resistor

(RQ) that is five times the value of the intended line impedance

from the ZQ pin to VSS. The output impedance is then

adjusted to account for drifts in supply voltage and temper-

ature every 1024 clock cycles. If a port’s clock is suspended,

the VIM circuit will retain its last setting until the clock is

restarted where it will then resume periodic adjustment. In the

case of a significant change in device temperature or supply

voltage, the recalibration period is multiples of 1024 clock

cycles. A Master Reset will initialize the VIM circuitry. Ta ble 7

shows the VIM parameters and Table 8 describes the VIM

operation modes.

In order to disable VIM, the ZQ pin must be connected to

VDDIO of the relative supply for the I/Os before a Master

Reset.

Address Counter and Mask Register Operations[1]

Each port of the FullFlex families contains a programmable

burst address counter. The burst counter contains four

registers: a counter register, a mask register, a mirror register,

and a busy address register.

The counter register contains the address used to access the

RAM array. It is changed only by the master reset (MRST),

Counter Reset, Counter Load, Retransmit, and Counter

Increment operations.

Table 5. tCCS Timing for All Operating Modes

Port A – Early Arriving Port Port B – Late Arriving Port tCCS C/C Rise to Opposite C/C Rise Set-up Time

for Non-corrupt Data UnitMode Active Edge Mode Active Edge

SDR C SDR C tCYC(min) – 1 ns

SDR C DDR C tCYC(min) – 1 ns

DDR C SDR C 0.55 * tCYC + tCYC(min) – 1 ns

DDR C DDR C 0.55 * tCYC + tCYC(min) – 1 ns

Table 6. Deterministic Access Control Winning Port

Left Port Right Port

Clock Timing

BUSYLBUSYRDescriptionLeft Clock Right Clock

Read Read X X H H No Collision

Write Read >tCCS 0 H H Read OLD Data

0>t

CCS H H Read NEW Data

<tCCS 0 H H Read OLD Data

H L Data Not Guaranteed

0<t

CCS H H Read NEW Data

H L Data Not Guaranteed

Read Write >tCCS 0 H H Read NEW Data

0>t

CCS H H Read OLD Data

<tCCS 0 H H Read NEW Data

L H Data Not Guaranteed

0<t

CCS H H Read OLD Data

L H Data Not Guaranteed

Write Write 0 >–tCCS & <tCCS L L Array Data Corrupted

0>t

CCS L H Array Stores Right Port Data

>tCCS 0 H L Array Stores Left Port Data

Table 7. Variable Impedance Matching Parameters

Parameter Min. Max. Unit Tolerance

RQ Value 100 275 Ω±2%

Output Impedance 20 55 Ω±15%

Reset Time N/A 1024 Cycles N/A

Update Time N/A 1024 Cycles N/A

Table 8. Variable Impedance Matching Operation

RQ Connection Output Configuration

100Ω–275Ω to

VSS

Output Driver Impedance = RQ/5 ± 15% at

Vout = VDDIO/2

ZQ to VDDIO VIM Disabled. Rout < 20Ω at Vout =

VDDIO/2

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 14 of 48

The mask register value affects the Counter Increment and

Counter Reset operations by preventing the corresponding

bits of the counter register from changing. It also affects the

counter interrupt output (CNTINT). The mask register is only

changed by Mask Reset, Mask Load, and MRST. The Mask

Load operation loads the value of the address bus into the

mask register. The mask register defines the counting range

of the counter register. It divides the counter register into two

or three consecutive regions. Zero or more “0s” define the

masked region and one or more “1s” define the unmasked

portion of the counter register. The counter register may only

be divided into up to three regions. The region containing the

least significant bits must be no more than two bits. Bits one

and zero may be “10” respectively, masking the least signif-

icant counter bit and causing the counter to increment by two

instead of one. If bits one and zero are “00”, the two least

significant bits are masked and the counter will increment by

four instead of one. For example, in the case of a 256Kx72

configuration, a mask register value of 003FC divides the

mask register into three regions. With bit 0 being the least

significant bit and bit 17 being the most significant bit, the two

least significant bits are masked, the next eight bits are

unmasked, and the remaining bits are masked.

The mirror register is used to reload the counter register on

retransmit operations (see “retransmit” below) and wrap

functions (see “counter increment” below). The last value

loaded into the counter register is stored in the mirror register.

The mirror register is only changed by master reset (MRST),

Counter Reset, and Counter Load.

Table 9 summarizes the operations of these registers and the

required input control signals. All signals except MRST are

synchronized to the ports clock.

Counter Load Operation[1]

The address counter and mirror registers are both loaded with

the address value presented on the address lines. This value

ranges from 0 to FFFFF.

Mask Load Operation[1]

The mask register is loaded with the address value presented

on the address bus. This value ranges from 0 to FFFFF though

not all values permit correct increment operations. Permitted

values are in the form of 2n–1, 2n–2, or 2n–4. The counter

the most significant bit to the least significant bit, permitted

values have zero or more “0s”, one or more “1s”, and the least

significant two bits can be “11”, “10”, or “00”. Thus FFFFE,

7FFFF, and 03FFC are permitted values but 2FFFF, 03FFA,

and 7FFE4 are not.

Counter Readback Operation

The internal value of the counter register can be read out on

the address lines. The address will be valid tCA after the

selected number of latency cycles configured by FTSEL. This

is the same as data in SDR mode and one half cycle earlier

than data latency for DDR mode. The data bus (DQ) is

tri-stated on the cycle that the address is presented on the

address lines. Figure 4 shows a block diagram of the

operation.

Mask Readback Operation

The internal value of the mask register can be read out on the

address lines. The address will be valid tCA after the selected

number of latency cycles configured by FTSEL. For pipelined

SDR and DDR mode this is two cycles. The data bus (DQ) is

tri-stated on the cycle that the address is presented on the

address lines. Figure 4 shows a block diagram of the

operation.

Table 9. Burst Counter and Mask Register Control Operation (Any Port) [21,22]

CMRSTCNTRST CNT/MSK CNTEN ADS RET Operation Description

X L X X X X X Master Reset Reset address counter to all 0s, mask register

to all 1s, and BUSY address to all 0’s.

H L H X X X Counter Reset Reset counter and mirror unmasked portion to

all 0s.

H L L X X X Mask Reset Reset mask register to all 1s.

H H H L L X Counter Load Load burst counter and mirror with external

address value presented on address lines.

H H L L L X Mask Load Load mask register with value presented on the

address lines.

H H H L H L Retransmit Load counter with value in the mirror register

H H H L H H Counter

Increment

Internally increment address counter value.

H H H H H H Counter Hold Constantly hold the address value for multiple

clock cycles.

H H H H L H Counter

Readback

Read out counter internal value on address

lines.

H H L H L H Mask Readback Read out mask register value on address lines.

Notes:

21. X” = “Don’t Care,” “H” = HIGH, “L” = LOW.

22. Counter operation and mask register operation is independent of chip enables.

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 15 of 48

Counter Reset Operation

All unmasked bits of the counter are reset to “0”. All masked

bits remain unchanged. The new burst counter value is loaded

into the mirror registers. A mask reset followed by a counter

reset will reset the counter and mirror registers to 00000.

Mask Reset Operation

The mask register is reset to all “1s”, which unmasks every bit

of the burst counter.

Increment Operation[1]

Once the address counter is initially loaded with an external

address, the counter can internally increment the address

value and address the entire memory array. Only the

unmasked bits of the counter register are incremented. In

order for a counter bit to change, the corresponding bit in the

mask register must be “1”. If the two least significant bits of the

mask register are “11”, the burst counter will increment by one.

If the two least significant bits are “10”, the burst counter will

increment by two, and if they are “00”, the burst counter will

increment by four. If all unmasked counter bits are incre-

mented to “1” and WRP is deasserted, the next increment will

wrap the counter back to the initially loaded value. The cycle

before an increment will result in the unmasked counter bits

being “1s”, a counter interrupt flag (CNTINT) is asserted if the

counter is continuously incrementing. The next increment will

cause the counter to reach its maximum value and the second

increment will return the counter register to its initial value

which was stored in the mirror register when WRP is

deasserted. When WRP is asserted, the second increment

after CNTINT is asserted will load the unmasked counter bits

with “0”. The example shown in Figure 5 shows an example of

the CYDD36S18V18 device with the mask register loaded with

a mask value of 0007F unmasking the seven least significant

bits. Setting the mask register to this value allows the counter

to access the entire memory space. The address counter is

then loaded with an initial value of 00005 assuming WRP is

deasserted. The base address bits (in this case, the seventh

address through the twentieth address) do not increment once

the counter is configured for increment operation. The counter

address will start at address 00005 and will increment its

internal address value until it reaches the mask register value

of 0007F. The counter wraps around the memory block to

location 00005 at the next count. CNTINT is issued when the

counter reaches the maximum –1 count.

Hold Operation

The value of all three registers can be constantly maintained

unchanged for an unlimited number of clock cycles. Such

operation is useful in applications where wait states are

needed, or when address is available a few cycles ahead of

data in a shared bus interface.

Retransmit

Retransmit allows repeated access to the same block of

memory without the need to reload the initial address. An

internal mirror register stores the address counter value last

loaded. When the burst counter reaches its maximum value

set by the mask register, it wraps back to the initial value stored

in the mirror register as long as WRP is deasserted. The

unmasked counter bits will be loaded with “0” if WRP is

asserted. If the counter is configured to continuously be in

increment mode, it increments once again to the maximum

value and wraps back to the value initially stored in the mirror

low, the counter will continue to wrap back to the value in the

mirror register independent of the state of WRP

Counter Interrupt

The counter interrupt (CNTINT) is asserted LOW one clock

cycle before an increment operation that results in the

unmasked portion of the counter register being all “1s”. It is

deasserted by counter reset, counter load, mask reset, mask

load, counter increment, re-transmit, and MRST.

Counting by Two

When the two least significant bits of the mask register are

“10,” the counter increments by two.

Counting by Four

When the two least significant bits of the mask register are

“00,” the counter increments by four.

Mailbox Interrupts

The upper two memory locations can be used for message

passing and permit communications between ports. Tabl e 10

shows the interrupt operation for both ports. The highest

memory location is the mailbox for the right port and the

maximum address–1 is the mailbox for the left port.

When one port Writes to the other ports mailbox, the INT flag

of the port that the mailbox belongs to is asserted LOW. The

INT flag remains asserted until the mailbox location is read by

the other port. When a port reads it’s mailbox, the INT flag is

H H L H H L Busy Address

Readback

Read out first busy address after last busy

address readback

HH L LHXReserved

HH L HLLReserved

HH L HHHReserved

HH H HLLReserved

HH H HHLReserved

Table 9. Burst Counter and Mask Register Control Operation (Any Port) (continued)[21,22]

CMRSTCNTRST CNT/MSK CNTEN ADS RET Operation Description

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 16 of 48

deasserted HIGH after one cycle of latency with respect to the

input clock of the port to which the mailbox belongs and is

independent of OE.

Table 10 shows that in order to set the INTR flag, a Write

operation by the left port to address FFFFF will assert INTR

LOW. A valid Read of the FFFFF location by the right port will

reset INTR HIGH after one cycle of latency with respect to the

right port’s clock. At least one byte enable has to be activated

to set or reset the mailbox interrupt.

From

Mask

Mirror Counter

Address

Decode

RAM

Array

Wrap

Increment

Logic

Wrap

Detect

From

Mask

From

Counter

Bit 0

and 1

Wrap

Figure 4. Counter, Mask, and Mirror Logic Block Diagram[1]

21 21

Load/Increment

CNT/MSK

CNTEN

CNTRST

Decode

Logic

Bidirectional

Address

Lines

Mask

Counter/

Address

From

Address

Lines To Readback

and Address

Decode

MRST

RET

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 17 of 48

Master Reset

The FullFlex family of dual-ports undergo a complete reset by

asserting MRST. MRST must be connected to VDDIO. The

MRST can be asserted asynchronously to the clocks and must

remain asserted for at least tRS. Once asserted MRST

deasserts READY, initializes the internal burst counters,

internal mirror registers, and internal Busy Addresses to zero,

and initializes the internal mask register to all “1s”. All mailbox

interrupts (INT), Busy Address Outputs (BUSY), and burst

counter interrupts (CNTINT) are deasserted upon master

reset. Releasing MRST also signifies that the power supplies

and all port clocks are stable. This begins calibration of the

DLL and VIM circuits. READY will be asserted within 1024

clock cycles. READY is a wired OR capable output with a

strong pull-up and weak pull-down. Up to four outputs may be

connected together. For faster pull-down of the signal, connect

a 250-Ohm resistor to VSS. If the DLL and VIM circuits are

disabled for a port, the port will be operational within five clock

cycles. However, the READY will be asserted within 160 clock

cycles.

IEEE 1149.1 Serial Boundary Scan (JTAG)

The FullFlex families incorporate an IEEE 1149.1 serial

boundary scan test access port (TAP). The TAP operates

using JEDEC-standard 3.3V or 2.5V I/O logic levels depending

on the VTTL power supply. It is composed of four input

connections and one output connection required by the test

logic defined by the standard.

Notes:

23. CE is internal signal. CE = LOW if CE0 = LOW and CE1 = HIGH. For a single Read operation, CE only needs to be asserted once at the rising edge of the C and

can be deasserted after that. Data will be out after the following C edge and will be tri-stated after the next C edge.

24. OE is “Don’t Care” for mailbox operation.

25. At least one of BE0, BE1, BE2, BE3, BE4, BE5, BE6, or BE7 must be LOW.

26. The “X” in this diagram represents the counter upper bits.

219 218 2621

2522

242320

219 218 2621

2522

242320

219 218 2621

2522

242320

219 218 2621

2522

242320

0s 1

0111

Xs 0

X001

Xs 1

X111

Xs 0

X001

Masked Address Unmasked Address

Mask

LSB

Address

Counter

LSB

CNTINT

Example:

Load

Counter-Mask

Load

Address

Counter = 000005

Max

Address

Value

Max + 1

Address

Value

Figure 5. Programmable Counter-Mask Register Operation[1,26]

Table 10.Interrupt Operation Example [1, 22, 23, 24, 25]

Function

Left Port Right Port

R/WLCELA0L–19L INTLR/WRCERA0R–19R INTR

Set Right INTR Flag L L Max. Address X X X X L

Reset Right INTR Flag X X X X H L Max. Address H

Set Left INTL Flag X X X L L L Max. Address–1 X

Reset Left INTL Flag H L Max. Address–1 H X X X X

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 18 of 48

Table 11.Identification Register Definitions

Part Number Configuration Value

CYDD36S72V18 512Kx72 0C040069h

CYDD36S36V18 512Kx72 0C041069h

CYDD36S18V18 1024Kx36 0C042069h

CYDD18S72V18 256Kx72 0C043069h

CYDD18S36V18 256Kx72 0C044069h

CYDD18S18V18 512Kx36 0C045069h

CYDD09S72V18 128Kx72 0C046069h

CYDD09S36V18 128Kx72 0C047069h

CYDD09S18V18 256Kx36 0C048069h

CYDD04S72V18 64Kx72 0C049069h

CYDD04S36V18 64Kx72 0C04A069h

CYDD04S18V18 128Kx36 0C04B069h

Table 12.Scan Registers Sizes

Instruction 4

Bypass 1

Identification 32

Boundary Scan n[27]

Table 13.Instruction Identification Codes

Instruction Code Description

EXTEST 0000 Captures the Input/Output ring contents. Places the BSR between the TDI and TDO.

BYPASS 1111 Places the BYR between TDI and TDO.

IDCODE 1011 Loads the IDR with the vendor ID code and places the register between TDI and TDO.

HIGHZ 0111 Places BYR between TDI and TDO. Forces all FullFlex72 and FullFlex36 output drivers

to a High-Z state.

CLAMP 0100 Controls boundary to 1/0. Places BYR between TDI and TDO.

SAMPLE/PRELOAD 1000 Captures the input/output ring contents. Places BSR between TDI and TDO.

RESERVED All other codes Other combinations are reserved. Do not use other than the above.

Note:

27. Details of the boundary scan length can be found in the BSDL file for the device.

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 19 of 48

Maximum Ratings

(Above which the useful life may be impaired. For user guide-

lines, not tested.)

Storage Temperature ................................ –65°C to + 150°C

Ambient Temperature with

Power Applied............................................–55°C to + 125°C

Supply Voltage to Ground Potential .............. –0.5V to + 4.1V

DC Voltage Applied to

Outputs in High-Z State......................–0.5V to VCORE + 0.5V

DC Input Voltage............................... –0.5V to VCORE + 0.5V

Output Current into Outputs (LOW) ............................ 20 mA

Static Discharge Voltage ...........................................> 2200V

(JEDEC JESD8-6, JESD8-B)

Latch-up Current .....................................................> 200 mA

Operating Range

Range Ambient Temperature VCORE

Commercial 0°C to +70°C 1.8V ± 100 mV

1.5V ± 80 mV

Industrial –40°C to +85°C 1.8V ± 100 mV

1.5V ± 80 mV

Power Supply Requirements

Min. Typ. Max.

LVTTL VDDIO 3.0V3.3V3.6V

2.5V LVCMOS VDDIO 2.3V 2.5V 2.7V

HSTL VDDIO 1.4V1.5V1.9V

1.8V LVCMOS VDDIO 1.7V 1.8V 1.9V

3.3V VTTL 3.0V 3.3V 3.6V

2.5V VTTL 2.3V 2.5V 2.7V

HSTL VREF 0.68V 0.75V 0.95V

Electrical Characteristics Over the Operating Range

Parameter Description Configuration

-250[15,17] -200[16,17]

UnitMin. Typ. Max. Min. Typ. Max.

VOH Output HIGH Voltage

(VCORE = Min., IOH = –8 mA)

LVTTL 2.4[28] 2.4[28] V

(VCORE = Min., IOH = –4 mA) HSTL (DC)[29] VDDIO – 0.4[28] VDDIO – 0.4[28] V

(VCORE = Min., IOH = –4 mA) HSTL (AC)[29] VDDIO – 0.5[28] VDDIO – 0.5[28] V

(VCORE = Min., IOH = –6 mA) 2.5V LVCMOS 1.7[28] 1.7[28] V

(VCORE = Min., IOH = –4 mA) 1.8V LVCMOS 1.6[28] 1.6[28] V

VOL Output HIGH Voltage

(VCORE = Min., IOL = 8 mA)

LVTTL 0.4[28] 0.4[28] V

(VCORE = Min., IOL = 4 mA) HSTL (DC) 0.4[28] 0.4[28] V

(VCORE = Min., IOL = 4 mA) HSTL (AC) 0.5[28] 0.5[28] V

(VCORE = Min., IOL = 6 mA) 2.5V LVCMOS 0.7[28] 0.7[28] V

(VCORE = Min., IOL = 4 mA) 1.8V LVCMOS 0.2[28] 0.2[28] V

VIH Input HIGH Voltage LVTTL 2 VDDIO

+ 0.3

2VDDIO

+ 0.3

HSTL (DC) VREF + 0.1 VDDIO

+ 0.3

VREF + 0.1 VDDIO

+ 0.3

HSTL (AC) VREF + 0.2 VREF + 0.2 V

2.5V LVCMOS 1.7 1.7 V

1.8V LVCMOS 1.26 1.26 V

VIL Input LOW Voltage LVTTL –0.3 0.8 –0.3 0.8 V

HSTL (DC) –0.3 VREF –

0.1

–0.3 VREF

– 0.1

HSTL (AC) VREF –

0.2

VREF

– 0.2

2.5V LVCMOS 0.7 0.7 V

1.8V LVCMOS 0.36 0.36 V

Notes:

28. These parameters are met with VIM disabled.

29. The (DC) specifications are measured under steady state conditions. The (AC) specifications are measured while switching at speed.

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 20 of 48

READY

VOH

Output HIGH Voltage

(VCORE = Min., IOH = –24 mA)

LVTTL 2.7[28] 2.7[28] V

(VCORE = Min., IOH = –12 mA) HSTL (DC)[29] VDDIO – 0.4[28] VDDIO – 0.4[28] V

(VCORE = Min., IOH = –12 mA) HSTL (AC)[29] VDDIO – 0.5[28] VDDIO – 0.5[28] V

(VCORE = Min., IOH = –15 mA) 2.5V LVCMOS 2.0[28] 2.0[28] V

(VCORE = Min., IOH = –12 mA) 1.8V LVCMOS VDDIO – 0.45[28] VDDIO –

0.45[28] V

READY

VOL

Output HIGH Voltage

(VCORE = Min., IOL = 0.12 mA)

LVTTL 0.4[28] 0.4[28] V

(VCORE = Min., IOL = 0.12 mA) HSTL (DC) 0.4[28] 0.4[28] V

(VCORE = Min., IOL = 0.12 mA) HSTL (AC) 0.5[28] 0.5[28] V

(VCORE = Min., IOL = 0.15 mA) 2.5V LVCMOS 0.7[28] 0.7[28] V

(VCORE = Min., IOL = 0.08 mA) 1.8V LVCMOS 0.2[28] 0.2[28] V

IOZ Output Leakage Current –10 10 –10 10 µA

IIX1 Input Leakage Current –10 10 –10 10 µA

IIX2 Input Leakage Current TDI,

TMS, MRST, TRST, TCK

–300 10 –300 10 µA

IIX3 Input Leakage Current

PORTSTD, DDRON,

VC_SEL

–10 300 –10 300 µA

ICC Operating Current

(VCORE = Max.,IOUT = 0 mA)

Outputs Disabled

512Kx72 TBD TBD TBD TBD TBD TBD mA

1024Kx36 TBD TBD TBD TBD TBD TBD mA

256Kx72 TBD TBD TBD TBD TBD TBD mA

512Kx36 TBD TBD TBD TBD TBD TBD mA

128Kx72 TBD TBD TBD TBD TBD TBD mA

256Kx36 TBD TBD TBD TBD TBD TBD mA

64Kx72 TBD TBD TBD TBD TBD TBD mA

128Kx36 TBD TBD TBD TBD TBD TBD mA

ISB1 Standby Current

(Both Ports TTL Level)

CEL and CER ≥ VIH,

f = fMAX

512Kx72 TBD TBD TBD TBD TBD TBD mA

1024Kx36 TBD TBD TBD TBD TBD TBD mA

256Kx72 TBD TBD TBD TBD TBD TBD mA

512Kx36 TBD TBD TBD TBD TBD TBD mA

128Kx72 TBD TBD TBD TBD TBD TBD mA

256Kx36 TBD TBD TBD TBD TBD TBD mA

64Kx72 TBD TBD TBD TBD TBD TBD mA

128Kx36 TBD TBD TBD TBD TBD TBD mA

Electrical Characteristics Over the Operating Range (continued)

Parameter Description Configuration

-250[15,17] -200[16,17]

UnitMin. Typ. Max. Min. Typ. Max.

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 21 of 48

ISB2 Standby Current

(One Port TTL Level)

CEL | CER ≥ VIH,

f = fMAX

512Kx72 TBD TBD TBD TBD TBD TBD mA

1024Kx36 TBD TBD TBD TBD TBD TBD mA

256Kx72 TBD TBD TBD TBD TBD TBD mA

512Kx36 TBD TBD TBD TBD TBD TBD mA

128Kx72 TBD TBD TBD TBD TBD TBD mA

256Kx36 TBD TBD TBD TBD TBD TBD mA

64Kx72 TBD TBD TBD TBD TBD TBD mA

128Kx36 TBD TBD TBD TBD TBD TBD mA

ISB3 Standby Current

(Both Ports CMOS Level)

CEL and CER ≥ VCORE –

0.2V, f = 0

512Kx72 TBD TBD TBD TBD TBD TBD mA

1024Kx36 TBD TBD TBD TBD TBD TBD mA

256Kx72 TBD TBD TBD TBD TBD TBD mA

512Kx36 TBD TBD TBD TBD TBD TBD mA

128Kx72 TBD TBD TBD TBD TBD TBD mA

256Kx36 TBD TBD TBD TBD TBD TBD mA

64Kx72 TBD TBD TBD TBD TBD TBD mA

128Kx36 TBD TBD TBD TBD TBD TBD mA

ISB4 Standby Current

(One Port CMOS Level)

CEL | CER ≥ VIH,

f = fMAX

512Kx72 TBD TBD TBD TBD TBD TBD mA

1024Kx36 TBD TBD TBD TBD TBD TBD mA

256Kx72 TBD TBD TBD TBD TBD TBD mA

512Kx36 TBD TBD TBD TBD TBD TBD mA

128Kx72 TBD TBD TBD TBD TBD TBD mA

256Kx36 TBD TBD TBD TBD TBD TBD mA

64Kx72 TBD TBD TBD TBD TBD TBD mA

128Kx36 TBD TBD TBD TBD TBD TBD mA

Electrical Characteristics Over the Operating Range (continued)

Parameter Description Configuration

-250[15,17] -200[16,17]

UnitMin. Typ. Max. Min. Typ. Max.

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 22 of 48

Electrical Characteristics Over the Operating Range (continued)

Parameter Description Configuration

-167

UnitMin. Typ. Max.

VOH Output HIGH Voltage

(VCORE = Min., IOH = –8 mA)

LVTTL 2.4[28] V

(VCORE = Min., IOH = –4 mA) HSTL (DC) VDDIO – 0.4[28] V

(VCORE = Min., IOH = –4 mA) HSTL (AC) VDDIO – 0.5[28] V

(VCORE = Min., IOH = –6 mA) 2.5V LVCMOS 1.7[28] V

(VCORE = Min., IOH = –4 mA) 1.8V LVCMOS 1.6[28] V

VOL Output HIGH Voltage

(VCORE = Min., IOL = 8 mA)

LVTTL 0.4[28] V

(VCORE = Min., IOL = 4 mA) HSTL (DC) 0.4[28] V

(VCORE = Min., IOL = 4 mA) HSTL (AC) 0.5[28] V

(VCORE = Min., IOL = 6 mA) 2.5V LVCMOS 0.7[28] V

(VCORE = Min., IOL = 4 mA) 1.8V LVCMOS 0.2[28] V

VIH Input HIGH Voltage LVTTL 2 VDDIO + 0.3 V

HSTL (DC) VREF + 0.1 VDDIO + 0.3 V

HSTL (AC) VREF + 0.2 V

2.5V LVCMOS 1.7 V

1.8V LVCMOS 1.26 V

VIL Input LOW Voltage LVTTL –0.3 0.8 V

HSTL (DC) –0.3 VREF – 0.1 V

HSTL (AC) VREF – 0.2 V

2.5V LVCMOS 0.7 V

1.8V LVCMOS 0.36 V

READY VOH Output HIGH Voltage

(VCORE = Min., IOH = –24 mA)

LVTTL 2.7[28] V

(VCORE = Min., IOH = –12 mA) HSTL (DC)[29] VDDIO – 0.4[28] V

(VCORE = Min., IOH = –12 mA) HSTL (AC)[29] VDDIO – 0.5[28] V

(VCORE = Min., IOH = –15 mA) 2.5V LVCMOS 2.0[28] V

(VCORE = Min., IOH = –12 mA) 1.8V LVCMOS VDDIO – 0.45[28] V

READY VOL Output HIGH Voltage

(VCORE = Min., IOL = 0.12 mA)

LVTTL 0.4[28] V

(VCORE = Min., IOL = 0.12 mA) HSTL (DC) 0.4[28] V

(VCORE = Min.,IOL = 0.12 mA) HSTL (AC) 0.5[28] V

(VCORE = Min., IOL = 0.15 mA) 2.5V LVCMOS 0.7[28] V

(VCORE = Min., IOL = 0.08 mA) 1.8V LVCMOS 0.2[28] V

IOZ Output Leakage Current –10 10 µA

IIX1 Input Leakage Current –10 10 µA

IIX2 Input Leakage Current TDI,

TMS, MRST, TRST, TCK

–300 10 µA

IIX3 Input Leakage Current

PORTSTD, DDRON,

VC_SEL

–10 300 µA

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 23 of 48

ICC Operating Current

(VCORE = Max.,IOUT = 0 mA)

Outputs Disabled

512Kx72 TBD TBD TBD mA

1024Kx36 TBD TBD TBD mA

256Kx72 TBD TBD TBD mA

512Kx36 TBD TBD TBD mA

128Kx72 TBD TBD TBD mA

256Kx36 TBD TBD TBD mA

64Kx72 TBD TBD TBD mA

128Kx36 TBD TBD TBD mA

ISB1 Standby Current

(Both Ports TTL Level)

CEL and CER ≥ VIH, f = fMAX

512Kx72 TBD TBD TBD mA

1024Kx36 TBD TBD TBD mA

256Kx72 TBD TBD TBD mA

512Kx36 TBD TBD TBD mA

128Kx72 TBD TBD TBD mA

256Kx36 TBD TBD TBD mA

64Kx72 TBD TBD TBD mA

128Kx36 TBD TBD TBD mA

ISB2 Standby Current

(One Port TTL Level)

CEL | CER ≥ VIH, f = fMAX

512Kx72 TBD TBD TBD mA

1024Kx36 TBD TBD TBD mA

256Kx72 TBD TBD TBD mA

512Kx36 TBD TBD TBD mA

128Kx72 TBD TBD TBD mA

256Kx36 TBD TBD TBD mA

64Kx72 TBD TBD TBD mA

128Kx36 TBD TBD TBD mA

ISB3 Standby Current

(Both Ports CMOS Level)

CEL and CER ≥ VCORE – 0.2V,

f = 0

512Kx72 TBD TBD TBD mA

1024Kx36 TBD TBD TBD mA

256Kx72 TBD TBD TBD mA

512Kx36 TBD TBD TBD mA

128Kx72 TBD TBD TBD mA

256Kx36 TBD TBD TBD mA

64Kx72 TBD TBD TBD mA

128Kx36 TBD TBD TBD mA

ISB4 Standby Current

(One Port CMOS Level)

CEL | CER ≥ VIH, f = fMAX

512Kx72 TBD TBD TBD mA

1024Kx36 TBD TBD TBD mA

256Kx72 TBD TBD TBD mA

512Kx36 TBD TBD TBD mA

128Kx72 TBD TBD TBD mA

256Kx36 TBD TBD TBD mA

64Kx72 TBD TBD TBD mA

128Kx36 TBD TBD TBD mA

Electrical Characteristics Over the Operating Range (continued) (continued)

Parameter Description Configuration

-167

UnitMin. Typ. Max.

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 24 of 48

AC Test Load and Waveforms

Notes:

30. Capacitance for the 36M x18 device is 20 pF, capacitance for all other 36M or x18 devices is 12 pF.

31. Cout also references to CI/O.

32. Input and Output switch from 0V to 3V or from 3V to 0V.

Table 14.Capacitance

Parameter Description Test Conditions Max. Unit

CIN[30] Input Capacitance TA = 25°C, f = 1MHz,

VDD = 3V[32] 10 pF

COUT[30, 31] Output Capacitance 12 pF

Figure 6. Output Test Load for LVTTL/CMOS

Figure 7. Output Test Load for HSTL

Output

50 Ohm 50 Ohm

VTH = 1.5V for LVTTL

VTH = 50% VDDIO for 2.5V CMOS

VTH = 50% VDDIO for 1.8V CMOS

RQ=250 Ohm

Device under

test

VREF

VREF = 0V

Test Point

C = 10pF

R=250 Ohm

READY VTH

Output

50 O hm 50 O hm

VTH = 50% VDDIO

R Q =250 O hm

D evice under

te s t

VREF

VREF = 0.75V

Test Point

C= 0pF for DDR

C = 10pF for SD R

R =250 O hm

READY

VTH

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 25 of 48

Switching Characteristics Over the Operating Range

Table 15.DDR Mode with 2.5 Pipeline Stages and DLL Enabled (LOWSPD-HIGH)[36]

Parameter Description

-200[16,17,34] -167[17]

UnitMin. Max. Min. Max.

fMAX Maximum Operating Frequency 159 200 127 167 MHz

tCYC C/C Clock Cycle Time 5.00 6.3 6.00 7.88 ns

tCH C/C Clock HIGH Time 2.00 2.40 ns

tCL C/C Clock LOW Time 2.00 2.40 ns

tCHCH C/C Clock Rise to C/C Clock Rise 2.20 2.70 ns

tSD Data Input Set-up Time to C/C Rise 0.40[35] 0.50[35] ns

tHD Data Input Hold Time after C/C Rise 0.40[35] 0.50[35] ns

tSBE Byte enable Set-up Time to C/C Rise 0.40[35] 0.50[35] ns

tHBE Byte enable Hold Time after C/C Rise 0.40[35] 0.50[35] ns

tSAC Address & Control Input except BE Set-up Time to C Rise 1.50 1.70 ns

tHAC Address & Control Input except BE Hold Time after C Rise 0.50 0.60 ns

tOE Output Enable to Data Valid 4.40[35] 5.00[35] ns

tOLZ[33] OE to Low Z 1.00 1.00 ns

tOHZ[33] OE to High Z 1.00[35] 4.40[35] 1.00[35] 5.00[35] ns

tCD C/C Rise to DQ Valid 0.50[35] 0.60[35] ns

tDC DQ Output Hold after C/C Rise –0.50 –0.60 ns

tCCQ C/C Rise to CQ/CQ Rise –0.50 0.50 –0.60 0.60 ns

tCQHQV Echo Clock (CQ/CQ) High to Output Valid, SC = LOW 0.35[35] 0.40[35] ns

tCQHQX Echo Clock (CQ/CQ) High to Output Hold, SC = LOW –0.35 –0.40 ns

tCKHZ[33] C Rise to DQ Output High Z 0.50[35] 0.60[35] ns

tCKLZ[33] C Rise to DQ Output Low Z –0.50 –0.60 ns

tCA C Rise to Address Readback Valid 5.00 6.00 ns

tAC Address Output Hold after C Rise 1.00 1.00 ns

tCKHZA[33] C Rise to Address Output High Z 1.00 5.00 1.00 6.00 ns

tCKLZA[33] C Rise to Address Output Low Z 1.00 1.00 ns

tSCINT C Rise to CNTINT Low 1.00 3.30 1.00 4.00 ns

tRCINT C Rise to CNTINT High 1.00 3.30 1.00 4.00 ns

tSINT C Rise to INT Low 0.50 7.00 0.50 8.00 ns

tRINT C Rise to INT High 0.50 7.00 0.50 8.00 ns

tBSY C Rise to BUSY Valid 1.00 3.30 1.00 4.00 ns

Notes:

33. Parameters specified with the load capacitance in Figure 6 and Figure 7.

34. These parameters apply for the HSTL and 1.8V LVCMOS standards.

35. For the x18 devices, add 200 ps to this parameter in the table above.

36. Test conditions assume a signal transition time of 2 V/ns

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 26 of 48

Table 16.SDR Mode with DLL Enabled (LOWSPD-HIGH) [36]

Parameter Description

-250[15,17] -200[15,17] -167[17]

UnitMin. Max. Min. Max. Min. Max.

fMAX (PIPELINED) Maximum Operating Frequency for

Pipelined Mode

100 250 100 200 100 167 MHz

fMAX

(FLOW-THROUGH)

Maximum Operating Frequency for

Flow-through Mode

100 77 66.7 MHz

tCYC (PIPELINED) C Clock Cycle Time for Pipelined mode 4.00 10.00 5.00 10.00 6.00 10.00 ns

tCYC

(FLOW-THROUGH)

C Clock Cycle Time for Flow-through

mode

10.00 13.00 15.00 ns

tCKD C Clock Duty Time 45 55 45 55 45 55 %

tCHCH C/C Clock Rise to C/C Clock Rise N/A N/A N/A ns

tSD Data Input Set-up Time to C Rise 1.20[35] 1.50[35] 1.70[35] ns

tHD Data Input Hold Time after C Rise 0.50[35] 0.50[35] 0.50[35] ns

tSAC Address & Control Input Set-up Time to C

Rise

1.20 1.50 1.70 ns

tHAC Address & Control Input Hold Time after

C Rise

0.50 0.50 0.60 ns

tOE Output Enable to Data Valid 3.40[35] 4.40[35] 5.00[35] ns

tOLZ[33] OE to Low Z 1.00 1.00 1.00 ns

tOHZ[33] OE to High Z 1.00[35] 3.40 [35] 1.00[35] 4.40[35] 1.00[35] 5.00[35] ns

tCD1 C Rise to DQ Valid for Flow-through Mode

(LowSPD = 1)

7.20 9.00 11.00 ns

tCD2 C Rise to DQ Valid for Pipelined Mode

(LowSPD = 1)

2.6 [35] 3.30[35] 4.00[35] ns

tCA1 C Rise to Address Readback Valid for

Flow-through Mode

7.20 9.00 11.00 ns

tCA2 C Rise to Address Readback Valid for

Pipelined Mode

4.00 5.00 6.00 ns

tDC DQ Output Hold after C Rise 1.00 1.00 1.00 ns

tCCQ C Rise to CQ Rise 1.00 2.64 1.00 3.30 1.00 4.00 ns

tCQHQV Echo Clock (CQ) High to Output Valid 0.70[35] 0.76[35] 0.80[35] ns

tCQHQX Echo Clock (CQ) High to Output Hold –0.66 –0.72 –0.76 ns

tCKHZ1[33] C Rise to DQ Output High Z in

Flow-through Mode

1.00 7.20 1.00 9.00 1.00 11.00 ns

tCKLZ1[33] C Rise to DQ Output Low Z in

Flow-Through Mode

1.00 1.00 1.00 ns

tCKHZ2[33] C Rise to DQ Output High Z in

Flow-through Mode

1.00[35] 2.64 [35] 1.00[35] 3.30[35] 1.00[35] 4.00[35]

tCKLZ2[33] C Rise to DQ Output Low Z in

Flow-Through Mode

1.00 1.00 1.00

tAC Address Output Hold after C Rise 1.00 1.00 1.00 ns

tCKHZA1[33] C Rise to Address Output High Z for

flow-through mode

1.00 7.20 1.00 9.00 1.00 11.00 ns

tCKHZA2[33] C Rise to Address Output High Z for

pipelined mode

1.00 4.00 1.00 5.00 1.00 6.00 ns

tCKLZA[33] C Rise to Address Output Low Z 1.00 1.00 1.00 ns

tSCINT C Rise to CNTINT Low 1.00 2.64 1.00 3.30 1.00 4.00 ns

tRCINT C Rise to CNTINT High 1.00 2.64 1.00 3.30 1.00 4.00 ns

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 27 of 48

tSINT C Rise to INT Low 0.50 6.00 0.50 7.00 0.50 8.00 ns

tRINT C Rise to INT High 0.50 6.00 0.50 7.00 0.50 8.00 ns

tBSY C Rise to BUSY Valid 1.00 2.64 1.00 3.30 1.00 4.00 ns

Table 17.SDR Mode with DLL Disabled (LOWSPD-LOW)[36]

Parameter Description

-100

UnitMin. Max.

fMAX (PIPELINED) Maximum Operating Frequency for Pipelined mode 100 MHz

fMAX (FLOW-THROUGH) Maximum Operating Frequency for Flow-through mode 55.6 MHz

tCYC (PIPELINED) C Clock Cycle Time for Pipelined mode 7.00 10.00 ns

tCYC (FLOW-THROUGH) C Clock Cycle Time for Flow-through mode 18.00 ns

tCKD C Clock Duty Time 45 55 %

tCHCH C/C Clock Rise to C/C Clock Rise N/A ns

tSD Data Input Set-up Time to C Rise 1.80[35] ns

tHD Data Input Hold Time after C Rise 0.50[35] ns

tSAC Address & Control Input Set-up Time to C Rise 1.80 ns

tHAC Address & Control Input Hold Time after C Rise 0.70 ns

tOE Output Enable to Data Valid 5.50[35] ns

tOLZ[33] OE to Low Z 1.00 ns

tOHZ[33] OE to High Z 1.00[35] 5.50[35] ns

tCD1 C Rise to DQ Valid for Flow-through Mode (LowSPD = 0) 13.00 ns

tCD2 C Rise to DQ Valid for Pipelined Mode (LowSPD = 0) 6.00[35] ns

tCA1 C Rise to Address Readback Valid for Flow-through Mode 13.00 ns

tCA2 C Rise to Address Readback Valid for Pipelined Mode 7.50 ns

tDC DQ Output Hold after C Rise 1.00 ns

tCCQ C Rise to CQ Rise 1.00 6.00 ns

tCQHQV Echo Clock (CQ) High to Output Valid 0.90[35] ns

tCQHQX Echo Clock (CQ) High to Output Hold –0.90 ns

tCKHZ1[33] C Rise to DQ Output High Z in Flow-through Mode 1.00 13.00 ns

tCKLZ1[33] C Rise to DQ Output Low Z in Flow-Through Mode 1.00 ns

tCKHZ2[33] C Rise to DQ Output High Z in Flow-through Mode 1.00[35] 6.00[35]

tCKLZ2[33] C Rise to DQ Output Low Z in Flow-Through Mode 1.00

tAC Address Output Hold after C Rise 1.00 ns

tCKHZA1[33] C Rise to Address Output High Z for flow-through mode 1.00 13.00 ns

tCKHZA2[33] C Rise to Address Output High Z for pipelined mode 1.00 7.50 ns

tCKLZA[33] C Rise to Address Output Low Z 1.00 ns

tSCINT C Rise to CNTINT Low 1.00 4.50 ns

tRCINT C Rise to CNTINT High 1.00 4.50 ns

tSINT C Rise to INT Low 0.50 8.50 ns

tRINT C Rise to INT High 0.50 8.50 ns

tBSY C Rise to BUSY Valid 1.00 4.50 ns

Table 16.SDR Mode with DLL Enabled (LOWSPD-HIGH) (continued)[36]

Parameter Description

-250[15,17] -200[15,17] -167[17]

UnitMin. Max. Min. Max. Min. Max.

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 28 of 48

Table 18.Master Reset Timing

Parameter Description

-250[15,17] -200[16,17] -167

UnitMin. Max. Min. Max. Min. Max.

tPUP Power-up Time 1 1 1 ms

tRS Master Reset Pulse Width 5 5 5 cycles

tRSR Master Reset Recovery Time 5 5 5 cycles

tRSF Master Reset to Outputs Inactive/Hi-Z 10 10 10 ns

tRDY[37] Master Reset Release to Port Ready 1024 1024 1024 cycles

tCORDY[38] C Rise to Port Ready 8 9.5 11 ns

Table 19.JTAG Timing

Parameter Description

-250[15,17] -200[16,17] -167[17]

UnitMin. Max. Min. Max. Min. Max.

fJTAG JTAG TAP Controller Frequency 20 20 20 MHz

tTCYC TCK Cycle Time 50 50 50 ns

tTH TCK High Time 20 20 20 ns

tTL TCK Low Time 20 20 20 ns

tTMSS TMS Set-up to TCK Rise 10 10 10 ns

tTMSH TMS Hold to TCK Rise 10 10 10 ns

tTDIS TDI Set-up to TCK Rise 10 10 10 ns

tTDIH TDI Hold to TCK Rise 10 10 10 ns

tTDOV TCK Low to TDO Valid 10 10 10 ns

tTDOX TCK Low to TDO Invalid 0 0 0 ns

tJXZ TCK Low to TDO hi-Z 15 15 15 ns

tJZX TCK Low to TDO Active 15 15 15 ns

Notes:

37. READY is a wired OR capable output with a weak pull-down. For a decreased falling delay, connect a 250 Ohm resistor to VSS.

38. Add this propagation delay after tRDY for all Master Reset Operations

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 30 of 48

READ Cycle for Pipelined Mode, DDRON = LOW

WRITE Cycle for Pipelined and Flow-Through Modes, DDRON = LOW

Switching Waveforms (continued)

tCYC

R/W

2 pipeline stages

AnAn+1 An+2 An+3 An+4 An+5 An+6

DQx-1 DQxDQnDQn+1 DQn+2 DQn+3 DQn+4

tDC tCD

tSAC tHAC

tCYC

R/W

AAnAn+1 An+2 An+3 An+4 An+5 An+6

DQnDQn+1 DQn+2 DQn+3 DQn+4 DQn+5 DQn+6

2 pipeline stages

tSD tHD

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 31 of 48

READ with Address Counter Advance for Pipelined Mode, DDRON = LOW

READ with Address Counter Advance for Flow-Through Mode, DDRON = LOW

Switching Waveforms (continued)

tCYC

DQx-1 DQxDQnDQn+1 DQn+2

Internal

ADS

Address

CNTEN

An+1 An+2 An+3

DQn+3

tCYC

tSAC tHAC

tHAC

tDC

tCD1

tSAC

READ EXTERNAL ADDRESS READ W ITH COUNTERCOUNTER HOLDREAD WITH COUNTER

DQx DQn + 1 DQn + 2 DQn + 3 DQn + 4DQn

CNTEN

ADS

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 32 of 48

Mailbox Interrupt Output, DDRON = LOW

Switching Waveforms (continued)

tCYC

R/WL

DQL

INTR

R/WR

DQR

AMAX

DQMAX

AMAX

tSINT tRINT

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 33 of 48

Port-to-Port WRITE–READ for Pipelined Mode, DDRON = LOW

Chip Enable READ for Pipelined Mode, DDRON = LOW

Switching Waveforms (continued)

DQn

Left Port

R/WL

Right Port

R/WR

DQRDQn

tCD2 tDC

tSAC tHAC

tCYC

tCCS

DQL

R/W

AAnAn+1 An+2 An+3 An+4 An+5 An+6

tSAC tHAC

tCYC

CE0

CE1

DQ DQnDQn+3

tCD2 tCKHZ2 tCKLZ2

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 34 of 48

OE Controlled WRITE for Pipelined Mode, DDRON = LOW

OE Controlled WRITE for Flow-Through Mode, DDRON = LOW

Switching Waveforms (continued)

R/W

AAx+1 Ax+2 Ax+3 AnAn+1 An+2 An+3

tCYC

DQx-1 DQx

DQx+1

DQnDQn+1 DQn+2 DQn+3

OHZ

R/W

AAx+1 Ax+2 Ax+3 AnAn+1 An+2 An+3

tCYC

DQxDQx+1

DQx+2

DQnDQn+1 DQn+2 DQn+3

tOHZ

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 35 of 48

Byte-Enable READ for Pipelined Mode, DDRON = LOW

Switching Waveforms (continued)

R/W

AAnAn+1 An+2 An+3

tCYC

BE7

BE6

BE5

BE4

BE3

BE2

BE1

BE0

DQ63:71

DQ54:62

DQ45:53

DQ36:44

DQ27:35

DQ18:26

DQ9:17

DQ0:8

DQn+1(63:71)

DQn+1(54:62)

DQn+1(27:35)

DQn+2(45:53)

DQn+2(36:44)

DQn+2(18:26)

DQn+3(9:17)

DQn+3(0:8)

tCKLZ2 tCKHZ2

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 36 of 48

Port-to-Port WRITE-to-READ for Flow-Through Mode, DDRON = LOW

Busy Address Readback for Pipelined and Flow-Through Modes, DDRON = LOW[39]

Note:

39. Amatch is the matching address which will be reported on the address bus of the losing port. The counter operation selected for reporting the address is “Busy

Address Readback.”

Switching Waveforms (continued)

tHD

tSD

tCD1

tDC

tSAC tHAC

tCD1

tCCS

tHAC

tSAC

MATCH

VALID

NO MATCH

MATCH

VALID VALID

R/WL

DQL

R/WR

DQR

Internal

Amatch+2 Amatch+3 Amatch+4

tCYC

BUSY

CNTEN

ADS

External

Amatch

tCA tAC

ddress

Address

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 37 of 48

Read Cycle for Flow-Through Mode, DDRON = LOW

READ-to-WRITE for Pipelined Mode, DDRON = LOW (OE = VIL)[40, 41, 42]

Notes:

40. When OE = VIL, the last read operation is allowed to complete before the DQ bus is tri-stated and the user is allowed to drive write data.

41. Two dummy writes should be issued to accomplish bus turnaround. The third instruction is the first valid write.

42. Chip enable or all byte enables should be held inactive during the two dummy writes to avoid data corruption.

Switching Waveforms (continued)

tCYC

tSAC tHAC

tCKHZ1

tDC

tOE

tOLZ

tOHZ

tDCtCD1

tCKLZ1

tHACtSAC

CE1

CE0

An + 1 An + 3An + 2

DQn DQn + 1 DQn + 2

R/W

BEn

AAxAnAn+1 An+2

tCYC

DQx-2 DQx-1 DQxDQnDQn+1 DQn+2

tCH

tCL

tSAC tHAC tSAC tHAC

tDC

tCD2 tCKHZ2 tSD tHD

R/W

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 38 of 48

READ-to-WRITE for Pipelined Mode, DDRON = LOW (OE Controlled)[43, 44]

READ-to-WRITE-to-READ for DDR, DDRON = HIGH[40,41,45,46]

Notes:

43. OE should be deasserted and tOHZ allowed to elapse before the first write operation is issued.

44. Any write scheduled to complete after OE is deasserted will be preempted.

45. The address should be held constant during the two dummy writes and first valid write to avoid data corruption.

46. D[1] / Q [1] contains data [71:36]; D[0] / Q[0] contains data [35:0].

Switching Waveforms (continued)

R/W

AAxAx+1 Ax+2 AnAn+1 An+2 An+3

tCYC

DQx-2 DQx-1

DQx

DQnDQn+1 DQn+2 DQn+3

tSAC tHAC

tOHZ tSD tHD

tCYC

AAxAnAn+1 An+2

tSAC tHAC

R/W

tCD tDC

tCKHZ

tSD tHD

DQx-2[0]

DQx-1[1] DQx-1[0] DQx[1] DQx[0]

DQn[1] DQn[0]

DQn+1[1]

DQn+1[0]

tCH tCL

tCHCH tCHCH

DQn+2[1]

DQn+2[0]

DQn+2[1]

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 39 of 48

Read-to-Write-to-Read for Flow-Through Mode, DDRON = LOW (OE = LOW)

Switching Waveforms (continued)

tHDtSD

tSAC

tCKHZ1

tDC

tCD1

tSAC

tCYC

tHAC

tDC

tCD1tCD1

tCKLZ1

READ READWRITENOP

An An + 1 An + 2 An + 2 An + 3 An + 4

DQn + 2

DQn DQn + 1 DQn + 3

R/W

BEn

CE1

DQOUT

DQIN

tHAC

CE0

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 40 of 48

Read-to-Write-to-Read for Flow-Through Mode, DDRON = LOW (OE Controlled)

Switching Waveforms (continued)

tCD1

tCKLZ1

tHDtSD

tOHZ

tDCtCD1

tHAC

tSAC

tCYC

tDC

tCD1

tOE

READ READWRITE

An An + 1 An + 2 An + 3 An + 4 An + 5

DQn + 2 DQn + 3

DQn DQn + 4

R/W

BEn

CE1

DQOUT

DQIN

tHAC

tSAC

CE0

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 41 of 48

BUSY Timing, WRITE-WRITE Collision for Pipelined and Flow-Through Modes, Clock Timing Violates tCCS. (Flag Both

Ports)

Switching Waveforms (continued)

Port A

R/W

tBSY tBSY

BUSY

Port B

< tCCS

R/W

tBSY tBSY

BUSY

Losing Port

R/W

tBSY tBSY

BUSY

Winning Port

R/W

tccs

Match

BUSY Timing, WRITE-WRITE Collision for Pipelined and Flow-Through Modes, Clock Timing Meets tCCS. (Flag Losing

Port)

BUSY

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 42 of 48

Read with Echo Clock for Pipelined and Flow-Through Modes (CQEN = HIGH)

Switching Waveforms (continued)

R/W

AAnAn+1 An+2 An+3 An+4 An+5 An+6

DQx-1 DQxDQnDQn+1 DQn+2 DQn+3 DQn+4

tSAC tHAC

CQ1

CQ0

tCCQ

tCQHQV tCQHQX

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 43 of 48

Ordering Information

512K

72 (36 Mbit) 1.8V Synchronous CYDD36S72V18 Dual-Port SRAM (SDR and DDR I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

200 CYDD36S72V18-200BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

CYDD36S72V18-200BBI BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Industrial

167 CYDD36S72V18-167BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

CYDD36S72V18-167BBi BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Industrial

256K

72 (18 Mbit) 1.8V Synchronous CYDD18S72V18 Dual-Port SRAM (SDR and DDR I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

250 CYDD18S72V18-250BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

200 CYDD18S72V18-200BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

CYDD18S72V18-200BBI BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Industrial

167 CYDD18S72V18-167BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

CYDD18S72V18-167BBI BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Industrial

128K

72 (9 Mbit) 1.8V Synchronous CYDD09S72V18 Dual-Port SRAM (SDR and DDR I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

200 CYDD09S72V18-200BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

CYDD09S72V18-200BBI BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Industrial

167 CYDD09S72V18-167BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

CYDD09S72V18-167BBI BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Industrial

64K

72 (4 Mbit) 1.8V Synchronous CYDD04S72V18 Dual-Port SRAM (SDR and DDR I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

250 CYDD04S72V18-250BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

200 CYDD04S72V18-200BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

CYDD04S72V18-200BBI BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Industrial

167 CYDD04S72V18-167BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

CYDD04S72V18-167BBI BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Industrial

1024K

36 (36 Mbit) 1.8V Synchronous CYDD36S36V18 Dual-Port SRAM (DDR only I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

200 CYDD36S36V18-200BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

167 CYDD36S36V18-167BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

CYDD36S36V18-167BBI BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Industrial

512K

36 (18 Mbit) 1.8V Synchronous CYDD18S36V18 Dual-Port SRAM (DDR only I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

200 CYDD18S36V18-200BBC BW256C

256-ball Grid Array 19 mm x 19 mm with 1.0 mm pitch (FBGA)

Commercial

167 CYDD18S36V18-167BBC BW256C

256-ball Grid Array 19 mm x 19 mm with 1.0 mm pitch (FBGA)

Commercial

CYDD18S36V18-167BBI BW256C

256-ball Grid Array 19 mm x 19 mm with 1.0 mm pitch (FBGA)

Industrial

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 44 of 48

256K

36 (9 Mbit) 1.8V Synchronous CYDD09S36V18 Dual-Port SRAM (DDR only I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

200 CYDD09S36V18-200BBC BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Commercial

167 CYDD09S36V18-167BBC BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Commercial

CYDD09S36V18-167BBI BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Industrial

128K

36 (4 Mbit) 1.8V Synchronous CYDD04S36V18 Dual-Port SRAM (DDR only I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

200 CYDD04S36V18-200BBC BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Commercial

167 CYDD04S36V18-167BBC BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Commercial

CYDD04S36V18-167BBI BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Industrial

2048K

18 (36 Mbit) 1.8V Synchronous CYDD36S18V18 Dual-Port SRAM (DDR only I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

200 CYDD36S18V18-200BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

167 CYDD36S18V18-167BBC BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Commercial

CYDD36S18V18-167BBI BY484

484-ball Grid Array 23 mm x 23 mm with 1.0 mm pitch (PBGA)

Industrial

1024K

18 (18 Mbit) 1.8V Synchronous CYDD18S18V18 Dual-Port SRAM (DDR only I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

200 CYDD18S18V18-200BBC BW256C

256-ball Grid Array 19 mm x 19 mm with 1.0 mm pitch (FBGA)

Commercial

167 CYDD18S18V18-167BBC BW256C

256-ball Grid Array 19 mm x 19 mm with 1.0 mm pitch (FBGA)

Commercial

CYDD18S18V18-167BBI BW256C

256-ball Grid Array 19 mm x 19 mm with 1.0 mm pitch (FBGA)

Industrial

512K

18 (9 Mbit) 1.8V Synchronous CYDD09S18V18 Dual-Port SRAM (DDR only I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

200 CYDD09S18V18-200BBC BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Commercial

167 CYDD09S18V18-167BBC BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Commercial

CYDD09S18V18-167BBI BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Industrial

256K

18 (4 Mbit) 1.8V Synchronous CYDD04S18V18 Dual-Port SRAM (DDR only I/O)

Speed

(MHz) Ordering Code

Package

Name Package Type

Operating

Range

200 CYDD04S18V18-200BBC BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Commercial

167 CYDD04S18V18-167BBC BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Commercial

CYDD04S18V18-167BBI BB256

256-ball Grid Array 17 mm x 17 mm with 1.0 mm pitch (FBGA)

Industrial

Ordering Information (continued)

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 45 of 48

Package Diagrams

BOTTOM VIEW

TOP VIEW

10987654321

PIN 1 CORNER

0.20(4X)

Ø0.25MCAB

Ø0.05 M C

Ø0.45±0.05(256X)-CPLD DEVICES (37K & 39K)

0.25 C

0.70±0.05

SEATING PLANE

0.15 C

16 15 14 13 12 11

161513 141210 11928765431

Ø0.50 (256X)-ALL OTHER DEVICES

+0.10

-0.05

A1 0.36 0.56

A 1.40 MAX. 1.70 MAX.

REFERENCE JEDEC MO-192

15.00

1.00

0.35

17.00±0.10

7.50

15.00

17.00±0.10

1.00

-0.05

+0.10

256-Ball FBGA (17 x 17 mm) BB256

51-85108-*F

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 46 of 48

Package Diagrams (continued)

Package Weight - 1.1 grams

0.70 (REF)

0.56 (REF)

SEATING PLANE

-C-

PIN A1 CORNER

56810

TOP VIEW

0.15 C

1.70 MAX.

0.35 +0.10/-0.05 0.25 C

0.15(4X)

-A-

-B-

19.00 +/- 0.10

15.00 (REF)

1.00 (REF)

19.00 +/- 0.10

15.00 (REF)

1.00 (REF)

1412 16

11 13 15 16 14 12

15 13

A1 CORNER

Ø0.05 M C

10 6

Ø0.50 (256 X)

Ø0.25 M C A B

BOTTOM VIEW

Jedec Outline - Design Guide 4.14

256 FBGA (19 x 19 x 1.7 mm) BW256C

001-00915-*A

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 47 of 48

of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be

used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its

products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress

products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.

FullFlex is a trademark of Cypress Semiconductor Corporation. All product and company names mentioned in this document are

trademarks of their respective holders.

Package Diagrams (continued)

Ø0.50~Ø0.70(484X)

0.97 REF.

0.20 C

0.56 REF.

SEATING PLANE

-C-

30° TYP.

0.40~0.60

0.132.03 ±

PIN #1 CORNER

1.00

20.00 REF.

3.20*45°(4x)

20.00 REF.

-A-

0.20(4X)

-B-

23.00±0.20

21.00

23.00±0.20

21.00

Ø1.00(3X) REF.

359

10 12

1614

13 15

17 21

20 22 22

21 17

18 16 1214

11 9

1.00

8642

Package Weight - 2.0 grams

Jedec Outline - Design Guide 4.14

0.25 C

0.35 C

484-ball PBGA (23 mm x 23 mm x 2.03 mm) BY484

51-85218-**

PRELIMINARY FullFlex

Document #: 38-06072 Rev. *E Page 48 of 48

Document History Page

Document Title: FullFlex™ Synchronous DDR Dual-Port SRAM

Document Number: 38-06072

REV. ECN NO.

Issue

Date

Orig. of

Change Description of Change

** 274729 See ECN SPN New data sheet

*A 294239 See ECN SPN Updated VIM section

Added notes 7

Added timing for 100 MHz with DLL Disabled

Removed tPS

*B 301331 See ECN SPN Added note 19

Updates Selectable I/O Standard Section

*C 318834 See ECN SPN Updated Block Diagram

Updated 484 pinouts, changed pins D11, W12, K3, K20

Added note 4 - Leaving pin NC disables VIM

Updated 256 pinout, changed pins C10, G5, N7, N10

Added note 18, 19, 20, 21

Updated parameters in table 16

Updated note 1

*D 386692 See ECN SPN Updated ordering information

Added statement about no echo clocks for flow-through mode

Updated electrical characteristics

Added note 27 (timing for x18 devices)

Updated address readback latency to 2 cycles for DDR mode

Updated DDR timing numbers for tCD, tDC, tCCQ, tCQHQV, tCQHQX, tCKHZ, tCKLZ

Updated input edge rate

Removed -133 speed bin electrical characteristics and timing columns

Updated Table 5 on collision detection to be the same as the one found in the EROS

Added description of busy readback in collision detection section

Changed dummy write descriptions

Updated PORTSTD[1:0] connection details

Updated ZQ pins connection details

Updated address count notes

Updated note 17, BO to BEO

Added power supply requirements to MRST and VC_SEL

Updated 484 ball package

Changed name from FLEX72-E, FLEX36-E, AND FLEX18-E to FullFlex72,

FullFlex36, and FullFlex18

*E 401662 See ECN KGH Updated READY description to include Wired OR note

Updated master reset to include wired OR note for READY

Updated electrical characteristics to include IOH and IOL values

Updated electrical characteristics to include READY

Added IIX3

Updated maximum input capacitance

Added note 29

Updated Pin Definitions for CQ0, CQ0, CQ1, and CQ1

Changed voltage name from VDDQ to VDDIO

Changed voltage name from VDD to VCORE

Updated the Package Type for the CYDXXS36V18 parts

Updated the Package Type for the CYDXXS18V18 parts

Included the Package Diagram for the 256-Ball FBGA (19 x 19 mm) BW256

Included an OE Controlled Write for Flow-Through Mode Switching Waveform

Included a Read with Echo Clock Switching Waveform

Included a Unit column for Table 5

Removed Switching Characteristic tCA from chart

Included tOHZ in Switching Waveform OE Controlled Write for Pipelined Mode

Included tCKLZ2 in Waveform Read-to-Write-to-Read for Flow-Through Mode

Updated AC Test Load and Waveforms

Included FullFlex36 DDR 484-ball BGA Pinout (Top View)

Included FullFlex18 DDR 484-ball BGA Pinout (Top View)Included Timing

Parameter tCORDY