PC817XJ0000F
Series
1. Recognized by UL1577 (Double protection isolation),
file No. E64380 (as model No. PC817)
2. Package resin : UL flammability grade
(94V-0)
■ Features
■ Agency approvals/Compliance
1. I/O isolation for MCUs (Micro Controller Units)
2. Noise suppression in switching circuits
3. Signal transmission between circuits of different po-
tentials and impedances
■ Applications
DIP 4pin General Purpose
Photocoupler
1. 4pin DIP package
2. Double transfer mold package (Ideal for Flow Solder-
ing)
3. High collector-emitter voltage (VCEO:80V)
4. Current transfer ratio (CTR : MIN. 50% at IF=5 mA,
VCE=5V)
5. Several CTR ranks available
6. High isolation voltage between input and output
(Viso(rms) : 5.0 kV)
7. Lead-free and RoHS directive compliant
∗4-channel package type is also available.
(model No. PC847XJ0000F Series)
■ Description
PC817XJ0000F Series contains an IRED optically
coupled to a phototransistor.
It is packaged in a 4pin DIP, available in wide-lead
spacing option and SMT gullwing lead-form option.
Input-output isolation voltage(rms) is 5.0kV.
Collector-emitter voltage is 80V and CTR is 50% to
600% at input current of 5mA.
1Sheet No.: D2-A03102EN
Date Jun. 30. 2005
© SHARP Corporation
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PC817XJ0000F Series
■ Internal Connection Diagram
Anode
Cathode
Emitter
Collector
1
1
2
3
4
2
4
3
2
Sheet No.: D2-A03102EN
■ Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PC817XJ0000F] 2. SMT Gullwing Lead-Form [ex. PC817XIJ000F]
3.
Wide Through-Hole Lead-Form
[ex. PC817XFJ000F]
Product mass : approx. 0.22gProduct mass : approx. 0.23g
Product mass : approx. 0.22gProduct mass : approx. 0.23g
4.
Wide SMT Gullwing Lead-Form
[ex. PC817XFPJ00F]
6.5±0.5
7.62±0.3 4.58±0.5
θθ
θ : 0 to 13˚
Epoxy resin
3.5±0.5
3.0±0.5
0.5TYP.
0.6±0.2
1.2±0.3
1
2
4.58±0.5
2.54±0.25
4
3
Anode mark Rank mark
Factory identification mark
Date code
PC817
2.7±0.5
0.5±0.1
0.26±0.1
0.6±0.2
1.2±0.3
6.5±0.5
7.62±0.3
0.26±0.1
4.58±0.5
2.54±0.25
Epoxy resin
3.5±0.5
4.58±0.5
2.54±0.25
4
3
Anode mark Rank mark
Factory identification mark
Date code
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.35±0.25
1
2PC817
PC817
4.58±0.5
0.6±0.2
1.2±0.3
1.0±0.1
2.54±0.25
6.5±0.5
Anode mark
Factory identification mark
Date code
4
3
7.62±0.3
10.16±0.5
0.26±0.1
4.58±0.5
0.5±0.1
Epoxy resin
3.5±0.5
2.7MIN.
Rank mark
1
2PC817
0.6±0.2
1.2±0.3
1.0±0.1
6.5±0.5
10.16±0.5 0.75±0.25
0.75±0.25
4.58±0.5
2.54±0.25
Anode mark
Rank mark
Factory identification mark
Date code
4
3
7.62±0.3
12.0MAX
4.58±0.5
Epoxy resin
3.5±0.5
0.26±0.1
0.5±0.1
0.25±0.25
1
2
PC817XJ0000F Series
Date code (2 digit)
Rank mark
Refer to the Model Line-up table
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
Factory identification mark and Plating material
Factory identification Mark
no mark
Country of origin
Japan
Indonesia
China
Plating material
SnCu (Cu : TYP. 2%)
SnBi (Bi : TYP. 2%)
SnCu (Cu : TYP. 2%)*
* Up to Date code "T4" (April 2005), SnBi (Bi : TYP. 2%).
** This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
3
repeats in a 20 year cycle
Sheet No.: D2-A03102EN
PC817XJ0000F Series
Sheet No.: D2-A03102EN
■ Electro-optical Characteristics
Parameter Conditions
Forward voltage
Peak forward voltage
Reverse current
Collector dark current
Transfer characteristics
Collector current
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
Cut-off frequency
MIN.
−
−
−
−
2.5
−
5×1010
−
−
−
−
TYP.
1.2
−
−
−
−
0.1
1×1011
0.6
80
4
3
MAX.
1.4
3.0
10
100
30.0
0.2
−
1.0
−
18
18
Unit
V
V
µA
nA
mA
V
Ω
pF
kHz
µs
µs
Symbol
VF
VFM
IR
ICEO
IC
VCE (sat)
RISO
fc
tr
tf
Cf
Response time Rise time
Fall time
IF=20mA
IFM=0.5A
VR=4V
Terminal capacitance −30 250 pFCtV=0, f=1kHz
VCE=50V, IF=0
IF=5mA, VCE=5V
IF=20mA, IC=1mA
V=0, f=1MHz
VCE=2V, IC=2mA, RL=100Ω
VCE=5V, IC=2mA, RL=100Ω, −3dB
DC500V, 40 to 60%RH
(Ta=25˚C)
Collector-emitter breakdown voltage
80 −−VBVCEO IC=0.1mA, IF=0
Emitter-collector breakdown voltage
6−−VBVECO IE=10µA, IF=0
InputOutput
■ Absolute Maximum Ratings (Ta=25˚C)
Parameter Symbol Unit
Input
Forward current mA
*1 Peak forward current A
Power dissipation mW
Output
Collector-emitter voltage
V
Emitter-collector voltage
V
Collector current mA
Collector power dissipation
mW
Total power dissipation mW
*2 Isolation voltage
Operating temperature ˚C
Storage temperature ˚C
*3 Soldering temperature
IF
IFM
P
VCEO
VECO
IC
PC
Ptot
Viso (rms)
Topr
Tstg
Tsol ˚C
*1 Pulse width≤100µs, Duty ratio : 0.001
*2 40 to 60%RH, AC for 1minute, f=60Hz
*3 For 10s
Rating
50
1
Reverse voltage VVR6
70
80
6
50
150
200
−30 to +100
−55 to +125
260
5.0 kV
4
PC817XJ0000F Series
Sheet No.: D2-A03102EN
■ Model Line-up
I
C
[mA]
(I
F
=5mA, V
CE
=5V, T
a
=25˚C)
Lead Form
Package Rank mark
with or without
A
B
C
D
A or B
B or C
C or D
A, B or C
B, C or D
A, B, C or D
2.5 to 30.0
4.0 to 8.0
6.5 to 13.0
10.0 to 20.0
15.0 to 30.0
4.0 to 13.0
6.5 to 20.0
10.0 to 30.0
4.0 to 20.0
6.5 to 30.0
4.0 to 30.0
Through-Hole
PC817XJ0000F
PC817X1J000F
PC817X2J000F
PC817X3J000F
PC817X4J000F
PC817X5J000F
PC817X6J000F
PC817X7J000F
PC817X8J000F
PC817X9J000F
PC817X0J000F
Wide Through-Hole
PC817XFJ000F
PC817XF1J00F
PC817XF2J00F
PC817XF3J00F
PC817XF4J00F
PC817XF5J00F
PC817XF6J00F
PC817XF7J00F
PC817XF8J00F
PC817XF9J00F
PC817XF0J00F
Sleeve
100pcs/sleeve
Model No.
I
C
[mA]
(I
F
=5mA, V
CE
=5V, T
a
=25˚C)
Lead Form
Package Rank mark
with or without
A
B
C
D
A or B
B or C
C or D
A, B or C
B, C or D
A, B, C or D
2.5 to 30.0
4.0 to 8.0
6.5 to 13.0
10.0 to 20.0
15.0 to 30.0
4.0 to 13.0
6.5 to 20.0
10.0 to 30.0
4.0 to 20.0
6.5 to 30.0
4.0 to 30.0
PC817XIJ000F
PC817XI1J00F
PC817XI2J00F
PC817XI3J00F
PC817XI4J00F
PC817XI5J00F
PC817XI6J00F
PC817XI7J00F
PC817XI8J00F
PC817XI9J00F
PC817XI0J00F
Taping
PC817XPJ000F
PC817XP1J00F
PC817XP2J00F
PC817XP3J00F
PC817XP4J00F
PC817XP5J00F
PC817XP6J00F
PC817XP7J00F
PC817XP8J00F
PC817XP9J00F
PC817XP0J00F
Wide SMT Gullwing
PC817XFPJ00F
−
−
−
−
−
−
−
−
−
−
2 000pcs/reel
Sleeve
100pcs/sleeve
SMT Gullwing
Model No.
5
Please contact a local SHARP sales representative to inquire about production status.
PC817XJ0000F Series
Sheet No.: D2-A03102EN
100101
0.1
Current transfer ratio CTR (%)
200
400
0
100
300
500
Forward current IF (mA)
VCE=5V
Ta=25˚C
Fig.6 Current Transfer Ratio vs. Forward
Current
Duty ratio
Pulse width≤100µs
Ta=25˚C
10
100
10−310−210−1
Peak forward current IFM (mA)
1
10 000
1 000
Fig.5 Peak Forward Current vs. Duty Ratio
6
PC817XJ0000F Series
Forward current IF (mA)
Ambient temperature Ta (˚C)
0
50
40
30
20
10
−30 0 25 50 55 75 100 125
Fig.1 Forward Current vs. Ambient
Temperature
Diode power dissipation P (mW)
Ambient temperature Ta (˚C)
0
100
80
70
60
40
20
−30 0 25 50 55 75 100 125
Fig.2 Diode Power Dissipation vs.
Ambient Temperature
Collector power dissipation PC (mW)
Ambient temperature Ta (˚C)
0
250
200
150
100
50
−30 0 25 50 75 100 125
Fig.3 Collector Power Dissipation vs.
Ambient Temperature
Fig.4 Total Power Dissipation vs. Ambient
Temperature
Total Power dissipation Ptot (mW)
Ambient temperature Ta (˚C)
0
250
200
150
100
50
−30 0 25 50 75 100 125
Sheet No.: D2-A03102EN
Collector-emitter saturation voltage VCE (sat) (V)
Forward current IF (mA)
0
0
1
2
3
4
5
510
6
15
7mA
1mA
3mA
5mA
IC=0.5mA
Ta=25˚C
Fig.12 Collector-emitter Saturation Voltage
vs. Forward Current
806040200−30 100
10−5
10−6
10−7
10−8
10−9
10−10
10−11
Collector dark current ICEO (A)
Ambient temperature Ta (˚C)
VCE=50V
Fig.11 Collector Dark Current vs. Ambient
Temperature
Relative current transfer ratio (%)
0
150
100
50
−40 0−20 20 40 60 80 100
Ambient temperature Ta (˚C)
IF=1mA,VCE=5V
IF=5mA,VCE=5V
Fig.9 Relative Current Transfer Ratio vs.
Ambient Temperature
0
0.02
0.04
0.06
0.08
0.1
0.12
0.14
Collector-emitter saturation voltage V
CE (sat)
(V)
IF=20mA
IC=1mA
Ambient temperature Ta (˚C)
−40 0−20 20 40 60 80 100
Fig.10 Collector - emitter Saturation Voltage
vs. Ambient Temperature
7
PC817XJ0000F Series
50˚C 25˚C
0˚C
0
2
0.5 1 1.5 2 2.5 3 3.5
5
10
20
50
100
1
−25˚C
Ta=75˚C
Forward current I
F
(mA)
Forward voltage VF (V)
Fig.7 Forward Current vs. Forward Voltage
0
0
5
1
10
15
20
25
30
23456789
20mA
10mA
5mA
Collector current IC (mA)
Collector-emitter voltage VCE (V)
IF=30mA
PC (MAX.)
Ta=25˚C
Fig.8 Collector Current vs. Collector-emitter
Voltage
Sheet No.: D2-A03102EN
Frequency f (kHz)
−20
0
1
−10
10010
1kΩ
100Ω
Voltage gain Av (dB)
RL=10kΩ
VCE=5V
IC=2mA
Ta=25˚C
Fig.15 Frequency Response
VCC
RLOutput
Please refer to the conditions in Fig.15.
RD
VCE
Fig.16 Test Circuit for Frequency Response
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.
8
PC817XJ0000F Series
VCC
tf
tr
ts
90%
10%
td
Output
Input
RL
Input OutputRD
Please refer to the conditions in Fig.13.
VCE
Fig.14 Test Circuit for Response TimeFig.13 Response Time vs. Load Resistance
0.01 0.1 1 10
10
0.1
1
100
Response time (µs)
VCE=2V
IC=2mA
Ta=25˚C
ts
td
tf
tr
Load resistance RL (kΩ)
Sheet No.: D2-A03102EN
■ Design Considerations
While operating at IF<1.0mA, CTR variation may increase.
Please make design considering this fact.
This product is not designed against irradiation and incorporates non-coherent IRED.
● Degradation
In general, the emission of the IRED used in photocouplers will degrade over time.
In the case of long term operation, please take the general IRED degradation (50% degradation over 5
years) into the design consideration.
● Recommended Foot Print (reference)
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
9
SMT Gullwing Lead-form Wide SMT Gullwing Lead-form
10.2
2.54
1.7
2.2
8.2
2.54
1.7
2.2
(Unit : mm)
● Design guide
PC817XJ0000F Series
Sheet No.: D2-A03102EN
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PC817XJ0000F Series
Sheet No.: D2-A03102EN
Solvent cleaning:
Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less
Ultrasonic cleaning:
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials:
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-
tual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this product.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
This product shall not contain the following materials banned in the RoHS Directive (2002/95/EC).
•Lead, Mercury, Cadmium, Hexavalent chromium, Polybrominated biphenyls (PBB), Polybrominated di-
phenyl ethers (PBDE).
● Presence of ODC
11
PC817XJ0000F Series
Sheet No.: D2-A03102EN
■ Package specification
12
12.0
6.7
5.8
10.8
15.0
6.35
5.9
10.8
520
±2
520
±2
● Sleeve package
1. Through-Hole or SMT Gullwing Lead-Form
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
(Unit : mm)
(Unit : mm)
2. Wide Through-Hole Lead-Form or Wide SMT Gullwing Lead-Form
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 100pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
PC817XJ0000F Series
Sheet No.: D2-A03102EN
13
● Tape and Reel package
1. SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
D J
G
B
H
H
A
C
5˚
MAX.
Dimensions List (Unit : mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
8.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
5.1±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 2 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC817XJ0000F Series
Sheet No.: D2-A03102EN
2. Wide SMT Gullwing
Package materials
Carrier tape : PS
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
14
Dimensions List
A
24.0±0.3
B
11.5±0.1
C
1.75±0.1
D
8.0±0.1
E
2.0±0.1
H
12.4±0.1
I
0.4±0.05
J
4.1±0.1
K
5.1±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
(Unit : mm)
J
GI
EC
B
A
H
H
5˚MAX.
F D
K
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
25.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 2 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PC817XJ0000F Series
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems
related to any intellectual property right of a third party
resulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the
specifications, characteristics, data, materials,
structure, and other contents described herein at any
time without notice in order to improve design or
reliability. Manufacturing locations are also subject to
change without notice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in
connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall
within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Law of Japan, it
is necessary to obtain approval to export such SHARP
devices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be
reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in
whole or in part, without the express written permission
of SHARP. Express written permission is also required
before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this
publication.
15
Sheet No.: D2-A03102EN
■ Important Notices
PC817XJ0000F Series
[E178]
