BIPOLAR ANALOG INTEGRATED CIRCUIT PC8182TB 3 V, 2.9 GHz SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS D DESCRIPTION The PC8182TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC operates at 3 V. The medium output power is suitable for RF-TX of mobile communications system. UE This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES * Supply voltage: VCC = 2.7 to 3.3 V * Circuit current: ICC = 30 mA TYP. @ VCC = 3.0 V O NT IN * Medium output power: PO (1dB) = +9.5 dBm TYP. @ f = 0.9 GHz PO (1dB) = +9.0 dBm TYP. @ f = 1.9 GHz PO (1dB) = +8.0 dBm TYP. @ f = 2.4 GHz * Power gain: GP = 21.5 dB TYP. @ f = 0.9 GHz GP = 20.5 dB TYP. @ f = 1.9 GHz GP = 20.5 dB TYP. @ f = 2.4 GHz * Upper limit operating frequency: fu = 2.9 GHz TYP. @ 3 dB bandwidth * High-density surface mounting: 6-pin super minimold package (2.0 1.25 0.9 mm) APPLICAION * Buffer amplifiers on 1.9 to 2.4 GHz mobile communications system ORDERING INFORMATION (Solder Contains Lead) Part Number 6-pin super minimold Marking C3F Supplying Form * Embossed tape 8 mm wide * Pin 1, 2, 3 face the perforation side of the tape SC PC8182TB-E3 Package * Qty 3 kpcs/reel Remark To order evaluation samples, contact you're nearby sales office. Part number for sample order: PC8182TB-AZ DI ORDERING INFORMATION (Pb-Free) Part Number PC8182TB-E3-AZ* Package 6-pin super minimold Marking C3F Supplying Form * Embossed tape 8 mm wide * Pin 1, 2, 3 face the perforation side of the tape * Qty 3 kpcs/reel *NOTE: Please refer to the last page of this data sheet, "Compliance with EU Directives" for Pb-Free RoHS Compliance Information. Document No. PU10206EJ01V0DS (1st edition) (Previous No. P14543EJ2V0DS00) Date Published December 2002 CP (K) PC8182TB PIN CONNECTIONS Pin Name 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC UE D Pin No. PRODUCT LINE-UP (T A = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 ) PC8182TB PC2762T PC2762TB PC2763T PC2763TB PC2771T PC2771TB PC8181TB fu PO (1 dB) GP (GHz) (dBm) (dB) 2.9 +9.5 @ f = 0.9 GHz 21.5 @ f = 0.9 GHz +9.0 @ f = 1.9 GHz 20.5 @ f = 1.9 GHz +8.0 @ f = 2.4 GHz 20.5 @ f = 2.4 GHz +8.0 @ f = 0.9 GHz 13.0 @ f = 0.9 GHz +7.0 @ f = 1.9 GHz 15.5 @ f = 1.9 GHz +9.5 @ f = 0.9 GHz 20.0 @ f = 0.9 GHz +6.5 @ f = 1.9 GHz 21.0 @ f = 1.9 GHz +11.5 @ f = 0.9 GHz 21.0 @ f = 0.9 GHz +9.5 @ f = 1.5 GHz 21.0 @ f = 1.5 GHz +8.0 @ f = 0.9 GHz 19.0 @ f = 0.9 GHz +7.0 @ f = 1.9 GHz 21.0 @ f = 1.9 GHz +7.0 @ f = 2.4 GHz 22.0 @ f = 2.4 GHz ICC Package (mA) 30.0 6-pin super minimold O NT IN Part No. 2.9 2.7 2.2 4.0 26.5 6-pin minimold 27.0 6-pin minimold SC DI C1Z C2A 6-pin super minimold 36.0 6-pin minimold C2H 6-pin super minimold 23.0 6-pin super minimold Caution The package size distinguishes between minimold and super minimold. Data Sheet PU10206EJ01V0DS C3F 6-pin super minimold Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2 Marking C3E PC8182TB SYSTEM APPLICATION EXAMPLE O NT IN UE D Digital cellular telephone DI SC Caution The insertion point is different due to the specifications of conjunct devices. Data Sheet PU10206EJ01V0DS 3 PC8182TB PIN EXPLANATION Applied Pin Voltage Voltage (V) 1 INPUT - (V) Function and Applications Internal Equivalent Circuit Note 0.99 Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multi-feedback circuit is designed resistance. UE to cancel the deviations of hFE and D Pin No. Pin Name This pin must be coupled to signal source with capacitor for DC cut. 4 OUTPUT Voltage - Signal output pin. The inductor as same as must be attached between VCC and VCC through output pins to supply current to the external internal output transistors. 6 VCC O NT IN inductor 2.7 to 3.3 - Power supply pin, which biases the internal input transistor. This pin should be externally equipped with bypass capacitor to minimize its impedance. 2 3 5 GND 0 - Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. DI SC Note Pin voltage is measured at VCC = 3.0 V. 4 Data Sheet PU10206EJ01V0DS PC8182TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Test Conditions Ratings Unit VCC TA = +25C, pin 4 and pin 6 3.6 V Total Circuit Current ICC TA = +25C 60 mA Power Dissipation PD TA = +85C 270 mW Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin +10 dBm TA = +25C UE Note D Supply Voltage Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter MIN. TYP. VCC 2.7 3.0 MAX. Unit 3.3 V Remarks Same voltage should be applied O NT IN Supply Voltage Symbol to pin 4 and pin 6. TA 40 +25 +85 C DI SC Operating Ambient Temperature Data Sheet PU10206EJ01V0DS 5 PC8182TB ELECTRICAL CHARACTERISTICS (T A = +25C, VCC = Vout = 3.0 V, ZS = ZL = 50 , unless otherwise specified) Symbol Test Conditions MIN. TYP. MAX. Unit 30.0 38.0 mA 21.5 25.0 dB ICC No signal Power Gain GP f = 0.9 GHz 19.0 f = 1.9 GHz 18.0 f = 2.4 GHz 18.0 f = 0.9 GHz Noise Figure NF Isolation ISL Gain 1 dB Compression Output Power PO(1dB) PO(sat) 3 dB down below from gain at f = 0.1 GHz 2.6 2.9 GHz f = 0.9 GHz 28 33 dB 27 32 26 31 f = 0.9 GHz 5 8 f = 1.9 GHz 7 10 f = 2.4 GHz 9 12 f = 0.9 GHz 7 10 f = 1.9 GHz 8 11 f = 2.4 GHz 11 14 f = 0.9 GHz +7.0 +9.5 f = 1.9 GHz +6.5 +9.0 f = 2.4 GHz +5.5 +8.0 f = 0.9 GHz, Pin = 5 dBm +11.0 f = 1.9 GHz, Pin = 5 dBm +10.5 f = 2.4 GHz, Pin = 5 dBm +10.0 DI 6 dB 6.5 SC Saturated Output Power RLout 6.0 5.0 O NT IN Output Return Loss 4.5 f = 2.4 GHz RLin 24.0 6.0 f = 1.9 GHz Input Return Loss 20.5 4.5 f = 2.4 GHz fu 24.0 f = 1.9 GHz Upper Limit Operating Frequency 20.5 UE Circuit Current D Parameter Data Sheet PU10206EJ01V0DS dB dB dBm dBm PC8182TB COMPONENTS OF TEST CIRCUIT UE D TEST CIRCUITS EXAMPLE OF ACTUAL APPLICATION COMPONENTS O NT IN FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value C1 , C 2 Bias Tee 1 000 pF C3 Capacitor 1 000 pF L Bias Tee 1 000 nH Type Value Operating Frequency C1 to C3 Chip capacitor 1 000 pF 100 MHz or higher L Chip inductor 100 nH 100 MHz or higher 10 nH 2.0 GHz or higher INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output transistor, connect an inductor between the Vcc pin (pin 6) and output pin (pin 4). Select large value inductance, as listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor makes output-port-impedance higher to get enough gain. In this case, large inductance and Q is suitable. For above reason, select an inductance of 100 or over impedance in the operating frequency. The gain is a SC peak in the operating frequency band, and suppressed at lower frequencies. The recommendable inductance can be chosen from example of actual application components list as shown above. CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the Vcc pin and the coupling capacitors for the input and output pins. DI The bypass capacitor connected to the Vcc pin is used to minimize ground impedance of Vcc pin. So, stable bias can be supplied against Vcc fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2Rfc). Data Sheet PU10206EJ01V0DS 7 PC8182TB COMPONENT LIST O NT IN UE D ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Value 1 000 pF L Example: 10 nH DI SC C 8 Data Sheet PU10206EJ01V0DS PC8182TB DI SC O NT IN UE D TYPICAL CHARACTERISTICS (T A = +25C, unless otherwise specified) Data Sheet PU10206EJ01V0DS 9 DI SC O NT IN UE D PC8182TB 10 Data Sheet PU10206EJ01V0DS O NT IN UE D PC8182TB DI SC Remark The graphs indicate nominal characteristics. Data Sheet PU10206EJ01V0DS 11 PC8182TB SMITH CHART (VCC = Vout = 3.0 V) DI SC S22-FREQUENCY O NT IN UE D S11-FREQUENCY 12 Data Sheet PU10206EJ01V0DS PC8182TB DI SC O NT IN UE D S-PARAMETERS Data Sheet PU10206EJ01V0DS 13 PC8182TB PACKAGE DIMENSIONS DI SC O NT IN UE D 6-PIN SUPER MINIMOLD (UNIT: mm) 14 Data Sheet PU10206EJ01V0DS PC8182TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. D (3) The bypass capacitor should be attached to the VCC pin. (4) The inductor must be attached between VCC and output pins. The inductance value should be determined in accordance with desired frequency. RECOMMENDED SOLDERING CONDITIONS UE (5) The DC cut capacitor must be attached to input and output pin. This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method VPS Wave Soldering Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (package surface temperature) : 215C or below Time at temperature of 200C or higher : 25 to 40 seconds Preheating time at 120 to 150C : 30 to 60 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (pin temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 VP215 WS260 HS350 SC Partial Heating Condition Symbol O NT IN Infrared Reflow Soldering Conditions DI Caution Do not use different soldering methods together (except for partial heating). Data Sheet PU10206EJ01V0DS 15 Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: CEL: UPC8128TB-EV09 UPC8128TB-EV19