SML-S1x Series Data Sheet Features * Surface mount Lens LEDs * Narrow directivity and high brightness * Availability of reverse mounting Outline Size Color Type 32161206 size 3.2x1.6mm t=1.85mm V U D Y M P E B Dimensions Recommended Solder Pattern 1.6 2.3 (1.6) 2.1 (1.8) 5.1 (4.6) <Surface Mount <Surface Mount> <Reverse ReverseMount> Mount Tolerance : 0.1 (unit : mm) (unit : mm) Specifications Absolute Maximum Ratings (Ta=25C) Part No. Emitting Power Forward Peak Forward Chip Structure Color Dissipation Current Red SML-S13UT SML-S13DT SML-S13YT AlGaInP SML-S13MT SMLS14EET SMLS14BET Tstg(C) 75 Yellow 78 Green InGaN Topr(C) Reverse Current IR Typ. IF Max. VR (V) (mA) (A) (V) 1.9 Orange Yellowish green SML-S13PT Operating Temp. Storage Temp. Current PD(mW) IF(mA) IFP(mA) VR(V) SML-S13VT Electrical and Optical Characteristics (Ta=25C) Forward Voltage VF Blue 117 30 100*1 5 -40+85 -40+100 2 20 10 5 Dominant Wavelength D Luminous Intensity IV Min.*2 Typ. Max.*2 IF Min. Typ. (nm) (nm) (nm) 625 630 635 160 450 615 620 625 400 700 602 605 608 587 590 593 569 572 575 IF (mA) (mcd) (mcd) (mA) 630 1400 20 160 400 63 160 557 560 563 3.3 520 527 538 1800 3000 3.2 464 470 476 560.0 800 20 *1 : Duty 1/10, 1kHz, *2 : Measurement tolerance:1nm www.rohm.com 1/10 (c)2019 ROHM Co., Ltd. All rights reserved 2019.3 - Rev.011 [SML-S1x series] [Data Sheet] Electrical Characteristics Curves Reference Fig.1 Forward Current - Forward Voltages FORWARD CURRENT : IF [mA] 100 Ta=25C SML-S13VT SML-S13UT SML-S13DT SML-S13YT SML-S13MT SML-S13PT 10 1 1.6 1.8 2.0 2.2 RELATIVE LUMINOUS INTENSITY [a.u.] Fig.2 Luminous Intensity Atmosphere Temperature FORWARD VOLTAGE : VF [V] MAXIMUM FORWARD CURRENT : [mA] RELATIVE LUMINOUS INTENSITY Ta=25C 1.0 0.5 SML-S13VT SML-S13UT SML-S13DT SML-S13YT SML-S13MT SML-S13PT 5 10 15 20 25 FORWARD CURRENT : IF [mA] 1.2 1.0 0.8 SML-S13VT SML-S13UT SML-S13DT SML-S13YT SML-S13MT SML-S13PT 0.6 0.4 0.2 -40 -20 0 20 40 60 80 100 Fig.4 Derating 1.5 0 IF=20mA 1.4 ATMOSPHERE TEMPERATURE : Ta [C] Fig.3 Luminous Intensity - Forward Current 0 1.6 SML-S13VT SML-S13UT SML-S13DT SML-S13YT SML-S13MT SML-S13PT 30 AMBIENT TEMPERATURE : Ta [C] www.rohm.com 2/10 (c)2019 ROHM Co., Ltd. All rights reserved 2019.3 - Rev.011 [SML-S1x series] [Data Sheet] Electrical Characteristics Curves Reference Fig.2 Luminous Intensity Atmosphere Temperature RELATIVE LUMINOUS INTENSITY [a.u.] FORWARD CURRENT : IF [mA] Fig.1 Forward Current - Forward Voltages Ta=25C SMLS14EET SMLS14BET FORWARD VOLTAGE : VF [V] MAXIMUM FORWARD CURRENT : [mA] RELATIVE LUMINOUS INTENSITY Ta=25C 1.0 0.5 0 5 10 15 20 25 FORWARD CURRENT : IF [mA] 1.2 1.0 0.8 0.6 -40 -20 0 20 40 60 80 100 Fig.4 Derating 1.5 0 IF=20mA SMLS14EET SMLS14BET ATMOSPHERE TEMPERATURE : Ta [C] Fig.3 Luminous Intensity - Forward Current SMLS14EET SMLS14BET 1.4 SMLS14EET SMLS14BET 30 AMBIENT TEMPERATURE : Ta [C] www.rohm.com 3/10 (c)2019 ROHM Co., Ltd. All rights reserved 2019.3 - Rev.011 [SML-S1x series] [Data Sheet] Viewing Angle Reference SCANNING ANGLE (deg) X - Y (Scanning Direction) 0 10 20 10 20 30 40 60 70 80 80 (Scanning Direction) X - Y 90 100 50 RELATIVE INTENSITY (%) SCANNING ANGLE (deg) 20 10 0 30 10 50 Y 60 70 70 80 80 90 100 X' SCANNING ANGLE (deg) 20 SMLS14EET SMLS14BET 20 30 40 50 60 70 80 80 50 10 40 60 0 0 50 50 70 10 30 40 60 90 100 Y' 50 RELATIVE INTENSITY (%) (Scanning Direction) 30 40 50 0 50 X' - Y' 20 50 90 100 X 40 60 70 0 30 50 60 90 100 Y RELATIVE INTENSITY (%) SML-S13VT SML-S13UT SML-S13DT SML-S13YT SML-S13MT SML-S13PT 20 40 50 50 10 30 40 90 100 0 10 20 (Scanning Direction) 30 50 X SCANNING ANGLE (deg) X' - Y' 60 70 70 80 90 100 80 50 0 50 X' 90 100 Y' RELATIVE INTENSITY (%) www.rohm.com 4/10 (c)2019 ROHM Co., Ltd. All rights reserved 2019.3 - Rev.011 [SML-S1x series] [Data Sheet] Rank Reference of Brightness* *Measurement tolerance:10% Red(V,U) (Ta=25C, IF20mA) Rank G H J K L M N P Q R Iv (mcd) 1.01.6 1.62.5 2.54.0 4.06.3 6.310 1016 1625 2540 4063 63100 SML-S13VT SML-S13UT S T U V W 100160 160250 250400 400630 6301000 X Orange(D) S T U V W 100160 160250 250400 400630 6301000 X Y Z 10001600 16002500 25004000 Yellow(Y) (Ta=25C, IF20mA) Rank G H J K L M N P Q R Iv (mcd) 1.01.6 1.62.5 2.54.0 4.06.3 6.310 1016 1625 2540 4063 63100 SML-S13YT S T U V W 100160 160250 250400 400630 6301000 X Y Z 10001600 16002500 25004000 Yellowish Green(M), Green(P) (Ta=25C, IF20mA) Rank G H J K L M N P Q R Iv (mcd) 1.01.6 1.62.5 2.54.0 4.06.3 6.310 1016 1625 2540 4063 63100 SML-S13MT SML-S13PT S T U V W 100160 160250 250400 400630 6301000 X Y Z 10001600 16002500 25004000 Green(E ) (Ta=25C, IF20mA) S2 T1 T2 U1 U2 V1 V2 W1 W2 X1 110140 140180 180220 220280 280360 360450 450560 560710 710900 9001100 X2 Y1 Y2 Z1 Z2 Z3 11001400 14001800 18002200 22002800 28003600 36004500 Blue(B) Rank R1 R2 S1 Iv (mcd) 5671 7190 90110 SMLS14BET Z (Ta=25C, IF20mA) Rank G H J K L M N P Q R Iv (mcd) 1.01.6 1.62.5 2.54.0 4.06.3 6.310 1016 1625 2540 4063 63100 SML-S13DT Rank R1 R2 S1 Iv (mcd) 5671 7190 90110 SMLS14EET Y 10001600 16002500 25004000 (Ta=25C, IF20mA) S2 T1 T2 U1 U2 V1 V2 W1 W2 X1 110140 140180 180220 220280 280360 360450 450560 560710 710900 9001100 X2 Y1 Y2 Z1 Z2 11001400 14001800 18002200 22002800 28003600 www.rohm.com 5/10 (c)2019 ROHM Co., Ltd. All rights reserved 2019.3 - Rev.011 [SML-S1x series] [Data Sheet] 4.0 0.250.05 2.0 1.75 TapingT86) 4.0 ' 1.8 0.01 (5 (5) 0.1 1.95 3.45 ' (2.75) 8.0 3.5 (5 ) 1.5 +0.1 0 Feeding holes 1.70.05 0.5 0.1 (2.2) -' cross sectional view ) -' cross sectional view 11.4 1 13 60 +1 0 0 180 -3 Unit: Note)Tolerance is within 0.2mm unless otherwise specified. Packing quantity 2,000pcs/reel Pull direction Part No. Construction *"-"will be taken out for emitting color Special Code will be applied for Chromaticity rank Rank sign WB/B/E series. Emitting color WB/B/E series. (for white LED (Brightness Rank)* S M L Series name SML Chip LED S 1 3 Package Type Chip type V T Emitting Color Resin Color 6 U Taping Specification 0 Standard Type V Red T Transparent Colorless T86 Cathode at sprocket hole side(the back) E1 1.6x0.8 t=0.36mm 1 Low Current Type U Red W Milkey White T68 Cathode at sprocket hole side(the top) D1 1.6x0.8 t=0.55mm 2 High Brightness type U2 Red B H1 3 D Orange 4 Y3 Yellow 01 3.0x2.0 t=1.3mm 5 Y2 Yellow 3.5x2.8 t=1.9mm 6 Y Yellow A1 1.6x1.15 t=0.55mm 7 W Yellow 3.4x1.25 t=1.1mm 8 M2 Yellowish green Z1/ZN 81/82 2.0x1.25 t=0.8mm Ultra High Brightness type K1 4.5x2.0 t=0.6mm M Yellowish green S1 3.2x1.6 t=1.85mm F Green P2 1.0x1.0 t=0.2mm P Green 52 1.3x1.5 t=0.6mm E Green P34 1.0x1.0 t=0.2mm B Blue P36 1.5x1.0 t=0.2mm WB White VN 3.5x2.8 t=0.6mm T Phototransistors RGB Chip LED 8 P1 1.0x0.6 t=0.2mm M1 SCM T 01 3.0x1.5 t=2.2mm Red/Green/Blue Black *Concerning the Brightness rank. *Please refer to the rank chart above for luminous intensity classification. *Part name is individual for each rank. *When shipped as sample,the part name will be a representative part name. General products are free of ranks. Please contact sales if rank appointment is needed. Packing Specification ROHM LED products are being shipped with desiccant (silica gel) included in moisture-proof bags. Pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card inside the bag is available upon request. Please contact the nearest sales office or distributer if necessary. www.rohm.com 6/10 (c)2019 ROHM Co., Ltd. All rights reserved 2019.3 - Rev.011 [SML-S1x series] [Data Sheet] Precaution (Surface Mount Device) Storage If the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. Therefore, the package is waterproof. Please use the product following the conditions: Using Conditions Humidity Expiration Date Remark Classification Temperature Within 1 year Before using 530 3070%RH Storage with waterproof package from Receiving After opening Please storing in the airtight container 530 Below 70%RH Within 168h package with our desiccant (silica gel) Baking Bake the product in case of below: The expiration date is passed. The color of indicator (silica gel) turned from blue to colorless or from green to pink. (Even if the product is within the expiration date.) Baking Conditions Time Humidity Temperature 603 1224h Below 20%RH Bake products in reel. Reel and embossed tape are easy to be deformed when baking, Remark so please try not to apply stress on it. Recommend bake once. Application Methods Precaution for Drive System and Off Mode Design the circuit without the electric load exceeding the ABSOLUTE MAXIMUM RATING that applies on the products. If drive by constant voltage, it may cause current deviation of the LED and result in deviation of luminous intensity, so we recommend to drive by constant current. (Deviation of VF Value will cause deviation of current in LED.) Furthermore, for off mode, please do not apply voltage neither forward nor reverse. Especially, for the products with the Ag-paste used in the die bonding, theres high possibility to cause electro migration and result in function failure. About Derating It is considered that derating characteristics will not result in LED chip's electrical destruction. Even within the derating, the reliability and luminous life can be affected depending on operating conditions and ambient environment. So we would be appreciate it if you can confirm with your application again. About product life Depending on operating conditions and environment(applied current, ambient temperature and humidity, corrosive gas), decreasing of luminosity and change of chromaticity may occur even within the specification conditions. Please contact our sales office if you use it for the following applications. It requires long luminosity life It is always lit Applied Stress on Product No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, please pay attention to the overstress on it which may influence its reliability. Usage The Product is LED. We are not responsible for the usage as the diode such as Protection Chip, Rectifier, Switching and so on. www.rohm.com 7/10 (c)2019 ROHM Co., Ltd. All rights reserved 2019.3 - Rev.011 [SML-S1x series] [Data Sheet] Others Surrounding Gas Notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical characteristics changes (light intensity, chrominance) and change in quality of cause die bonding (Ag-paste) materials. All of the above will function failure of the products. Therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the surrounding parts of the products and the atmospheric environment). Electrostatic Damage The product is part of semiconductor and electrostatic sensitive, theres high possibility to be damaged by the electrostatic discharge. Please take appropriate measures to avoid the static electricity from human body and earthing of production equipment. Especially, InGaN type LEDs have lower resistance value of electrostatic discharge and it is recommended to introduce the ESD protection circuit. The resistance values of electrostatic discharge (actual values) vary with products, therefore, please call our Sales staffs for inquiries. Electromagnetic Wave Applications with strong electromagnetic wave such as, IH cooker, will influence the reliability of LED, therefore please evaluate before using it. www.rohm.com 8/10 (c)2019 ROHM Co., Ltd. All rights reserved 2019.3 - Rev.011 [SML-S1x series] [Data Sheet] Mounting . Soldering No resin hardening agent such as filler is used in the sealing resin of the product. Therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the products reliability. The product is not guaranteed for flow soldering. Do not expose the product in the environment of high temperature (over 100) or rapid temperature shift (within 3/sec. of temperature gradient) during the flow soldering of surrounding parts. In case of carrying out flow soldering of surrounding parts without recommended conditions, please contact us for inquiries. Please set appropriate reflow temperature based on our product usage conditions and specification. The max for reflowing is 2 times, please finish the second reflow soldering and flow soldering with other parts within the usage limitation after open the moistureproof package. Compare with N2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the discoloration of the resin. For our product that has no solder resist, because of its solder amount and soldering conditions, one of its specific characteristics is that solder will penetrate into LED. Thus, there's high possibility that will influence its reliability.Therefore, please be informed, concerning it before using it. . Automatic Mounting --. Silicon Resin Sealing Product The sealing resin of LED is very soft, so please select adsorption nozzle that would not apply stress directly on the sealing section. --. Mini Package (Smaller than 1608 size) Vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. Therefore, the magnet should be set on parts feeder cassette of the mounter to control the product stabilization. In addition, it is recommended to set ionizer to prevent electrostatic charge. . Mounting Location The stress like bending stress of circuit board dividing after mounting, may cause LED package crack or damage of LED internal junction, therefore, please concern the mounting direction and position to avoid bending or screwing with great stress of the circuit board. Stress strength according to he mounting position: ABCD 2.1 1.6 2.3 (1.6) . Mechanical Stress after Mounting The mechanical stress may damage the LED after Circuit Mounting, so please pay attention to the touch on product. Soldering Pattern for Recommendation We recommend the soldering pattern that shows on the right. It will be different according to mounting situation of circuit board, therefore, please concern before designing. (1.8) (4.6) 5.1 The product has adopted the electrode structure that it should solder with back electrode of the product. Thus, please be informed that the shape of electrode pin of <Reverse <Surface Mount ReverseMount> Mount <Surface Mount> solder fillet formation is not guaranteed. Land pattern diagramUnitmm The through hole on electrode surface is for conduction of front and rear electrodes but not for formation of solder fillet. www.rohm.com (c)2019 ROHM Co., Ltd. All rights reserved 9/10 2019.3 - Rev.011 [SML-S1x series] [Data Sheet] Reflow Profile For reflow profile, please refer to the conditions below:() Meaning of marks, Conditions Mark Tsmax Tsmin ts TL tL TP tP TR/t TD/t Meanings Maximum of pre-heating temperature Minimum of pre-heating temperature Time from Tsmin to Tsmax Reference temperature Retention time for TL Peak temperature Time for peak temperature Temperature rising rate Temperature decreasing rate Conditions 180 140 Over 60sec. 230260 Within 40sec. 260(Max) Within 10sec. Under 3/sec. Over -3/sec. Above conditions are for reference. Therefore, evaluate by customers own circuit boards and reflow furnaces before using, because stress from circuit boards and temperature variations of reflow furnaces vary by customers own conditions. Attention Points in Soldering Operation This product was developed as a surface mount LED especially suitable for reflow soldering. So reflow soldering is recommended. In case of implementing manual soldering, please take care of following points. SOLDER USED Sn-CuSn-Ag-CuSn-Ag-Bi-Cu HAND SOLDERING CONDITION LED products do not contain reinforcement material such as a glass fillers. So thermal stress by soldering greatly influence its reliability. Please keep following points for manual soldering. RECOMMENDED CONDITION Condition ) Temp. of iron top less than 350 within 3 sec. Heating method Heating on PCB pattern, not direct to the LED. (Fig-1) Handling after Please handle after the part temp. soldering goes down to room temp. ITEM a) b) Fig.-1 SOLDERING SOLDERING Cleaning after Soldering Please follow the conditions below if the cleaning is necessary after soldering. Solvent We recommend to use alcohols solvent such as, isopropyl alcohols Temperature Under 30 within 3 minutes Ultrasonic Cleaning 15WBelow 1 liter (capacity of tank) Drying Under 100 within 3 minutes www.rohm.com 10/10 (c)2019 ROHM Co., Ltd. All rights reserved 2019.3 - Rev.011 Notice Notes 1) The information contained herein is subject to change without notice. 2) Before you use our Products, please contact our sales representative and verify the latest specifications : 3) Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no responsibility for any damages arising out of the use of our Poducts beyond the rating specified by ROHM. 4) Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. 5) The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM or any other parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of such technical information. 6) The Products are intended for use in general electronic equipment (i.e. AV/OA devices, communication, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document. 7) The Products specified in this document are not designed to be radiation tolerant. 8) For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a ROHM representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. 9) Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. 10) ROHM shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. 11) ROHM has used reasonable care to ensur the accuracy of the information contained in this document. However, ROHM does not warrants that such information is error-free, and ROHM shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. 12) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. 13) When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act. 14) This document, in part or in whole, may not be reprinted or reproduced without prior consent of ROHM. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http://www.rohm.com/contact/ www.rohm.com (c) 201 ROHM Co., Ltd. All rights reserved. R1102A Datasheet sml-s13yt - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS sml-s13yt SML-S1 2000 2000 Taping inquiry Yes