January 2011 Doc ID 7480 Rev 4 1/11
11
X02
1.25 A sensitive gate SCR
Features
■on-state rms current: 1.25 A
■repetitive peak off-state voltage: 600 V and
800 V
■gate triggering current: 50 and 200 µA
Applications
■ground fault circuit interrupters
■overvoltage crowbar protection in power
supplies
■capacitive ignition circuits
Description
The X02 SCR can be used as the on/off function
in applications where topology does not offer high
current for gate triggering.
This device is optimized in forward voltage drop
and inrush current capabilities for reduced power
losses and high reliability in harsh environments.
A
K
G
A
A
K
GA
KG
A
K
G
SOT-223
X02xxN
TO-92
X02xxA
SMBflat-3L
X0202NUF
Table 1. Device summary
Order code
Voltage
Sensitivity µA Package
600 V 800 V
X0202MA Y 200 TO-92
X0202MN Y 200 SOT-223
X0202NA Y 200 TO-92
X0202NN Y 200 SOT-223
X0205MA Y 50 TO-92
X0205NA Y 50 TO-92
X0202NUF Y 200 SMBflat-3L
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Characteristics X02
2/11 Doc ID 7480 Rev 4
1 Characteristics
Table 2. Absolute ratings (limiting values, TJ = 25 °C unless otherwise specified)
Symbol Parameter Value Unit
IT(RMS) On-state rms current (180 °Conduction angle)
TO-92 TL = 63 °C
1.25 ASOT-223 Ttab = 99 °C
SMBflat-3L Ttab = 111 °C
IT(AV) Average on-state current (180 °Conduction angle)
TO-92 TL = 63 °C
0.8 ASOT-223 Ttab = 99 °C
SMBflat-3L Ttab = 111 °C
ITSM Non repetitive surge peak on-state current tp = 8.3 ms Tj = 25 °C 25 A
tp = 10 ms 22.5
I²tI
²t Value for fusing tp = 10 ms Tj = 25 °C 2.5 A2s
di/dt Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns F = 60 Hz Tj = 125 °C 50 A/µs
IGM Peak gate current tp = 20 µs Tj = 125 °C 1.2 A
PG(AV) Average gate power dissipation Tj = 125 °C 0.2 W
Tstg
Tj
Storage junction temperature range
Operating junction temperature range
- 40 to + 150
- 40 to + 125 °C
Table 3. Electrical characteristics (TJ = 25 °C unless otherwise specified)
Symbol Test conditions X0202 X0205 Unit
IGT VD = 12 V, RL = 140 Ω
Min. 20 µA
Max. 200 50
VGT Max. 0.8 V
VGD VD = VDRM, RL = 3.3 kΩ , RGK = 1 kΩTj = 125 °C Min. 0.1 V
VRG IRG = 10 µA Min. 8 V
IHIT = 50 mA, RGK = 1 kΩMax. 5 mA
ILIG = 1 mA, RGK = 1 kΩ Max. 6 mA
dV/dt VD = 67% VDRM, RGK = 1 kΩTj = 110 °C Min. 10 15 V/µs
Table 4. Static electrical characteristics
Symbol Test conditions X0202 X0205 Unit
VTM ITM = 2.5 A, tp = 380 µs Tj = 25 °C
Max.
1.45 V
VTO Threshold voltage Tj = 125 °C 0.9 V
RdDynamic resistance 200 mΩ
IDRM IRRM VDRM = VRRM, RGK = 1 kΩ
Tj = 25 °C 5 µA
Tj = 125 °C 500 µA
X02 Characteristics
Doc ID 7480 Rev 4 3/11
Table 5. Thermal resistances
Symbol Parameter Value Unit
Rth(j-l) Junction to leads (DC) TO-92
Max.
60
°C/W
Rth(j-t) Junction to tab (DC) SOT-223 25
Rth(j-t) Junction to tab (DC) SMBflat-3L 14
Rth(j-a) Junction to ambient (DC)
TO-92 150
S = 5 cm2SOT-223 60
SMBflat-3L 75
Figure 1. Maximum average power
dissipation versus average
on-state current (full cycle)
Figure 2. Average and DC on-state current
versus tab (SOT-223, SMBflat-3L) or
lead (TO-92) temperature
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
P(W)
α= 180°
I (A)
T(AV)
360°
α
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 25 50 75 100 125
D.C. (SMBflat-3L)
D.C. (TO-92) D.C. (SOT-223)
α= 180° (SMBflat-3L)
α= 180° (SOT-223)
α= 180° (TO-92)
T or T (°C)
lead tab
I (A)
T(AV)
Figure 3. Average and DC on-state current
versus ambient temperature
Figure 4. Relative variation of thermal
impedance junction to ambient
versus pulse duration
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
0 25 50 75 100 125
I (A)
T(AV)
D.C. (SMBflat-3L)
D.C. (TO-92)
D.C. (SOT-223)
α= 180° (SMBflat-3L)
α= 180° (SOT-223)
α= 180° (TO-92)
T (°C)
amb
K=[Z /R
th(j-a) th(j-a)
]
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
TO-92
SOT-223
t (s)
p
SMBflat-3L
Characteristics X02
4/11 Doc ID 7480 Rev 4
Figure 5. Relative variation of triggering,
holding and latching current versus
junction temperature
Figure 6. Relative variation of holding
current versus gate-cathode
resistance (typical values)
I,I,I[T] /
GT H L j I ,I ,I [T =25°C]
GT H L j
0.00
0.25
0.50
0.75
1.00
1.25
1.50
-40 -20 0 20 40 60 80 100 120 140
IGT
T (°C)
j
IH& I
R = 1k
L
GK Ω
Typical values I [R ] / I [ =1k ]
HGK H ΩRGK
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
1.E-02 1.E-01 1.E+00 1.E+01
Tj=25
R(k)
GK Ω
Figure 7. Relative variation of dV/dt immunity
versus gate-cathode resistance
(typical values)
Figure 8. Relative variation of dV/dt immunity
versus gate-cathode capacitance
(typical values)
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
0.1
1.0
10.0
dV/dt[R ] / dV/dt[ =1k ]
GK Ω
RGK
Tj= 125°C
V = 0.67 x V
D DRM
R(k)
GK Ω
20
18
16
14
12
10
8
6
4
2
0
0246810
12 14 16 18 20 22
C (nF)
GK
dV/dt[C ] / dV/dt[ =1k ]
GK Ω
RGK
T
V = 0.67 x V
= 125°C
R = 1k
D DRM
GK
j
Ω
Figure 9. Surge peak on-state current
versus number of cycles
Figure 10. Non repetitive surge peak on state
current for a sinusoidal pulse and
corresponding value of I2T
1 10 100 1000
0
5
10
15
20
25
I (A)
TSM
Number of cycles
Non repetitive
T initial=25°C
j
Repetitive
T =25°C
amb
t =10ms
p
One cycle
1.00 10.000.100.01
300
100
10
1
I (A), I t (A s)
TSM 22
T initial = 25°C
j
I t
2
ITSM
t (ms)
p
dI/dt limitation
X02 Ordering information scheme
Doc ID 7480 Rev 4 5/11
2 Ordering information scheme
Figure 13. Ordering information scheme
Figure 11. On-state characteristics (maximum
values)
Figure 12. Thermal resistance junction to
ambient versus copper surface
under tab (SOT-223, SMBflat-3L)
I (A)
TM
3E+1
1E+1
1E+0
1E-1
2.0 2.5 3.0 3.5 4.0 4.51.51.00.5
Tj=max
T =25°C
j
V (V)
TM
V =0.9V
R =200m
T max.:
j
t0
dΩ
R (°C/W)
th(j-a)
50
60
70
80
90
100
110
120
130
140
150
160
170
012345
SMBF3L (typical)
SOT-223
(maximum)
S(cm²)
Epoxy printed circuit board FR4,
copper thickness 35 µm
X 02 02 M ZBlank 1BA2
Sensitive SCR series
Sensitivity
Voltage
Package
Packing mode
Current
02 = 1.25 A
2BL2 = Ammopack
5BA4 = Tape and reel 7” (SOT-223)
Blank = Tape and reel 13” (SMBflat-3L)
02 = 200 µA
05 = 50 µA
M = 600 V
N = 800 V
A = TO-92 (A"Blank")
N = SOT-223 (N"No Blank”)
UF = SMBF3L
1BA2 = Bulk
Package information X02
6/11 Doc ID 7480 Rev 4
3 Package information
●Epoxy meets UL94, V0
●Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 6. TO-92 dimensions
Ref
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A1.35 0.053
B 4.70 0.185
C2.54 0.100
D 4.40 0.173
E 12.70 0.500
F 3.70 0.146
a 0.50 0.019
A
F
C
B
a
DE
X02 Package information
Doc ID 7480 Rev 4 7/11
Figure 14. SOT-223 footprint
Table 7. SOT-223 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A1.800.071
A1 0.02 0.10 0.001 0.004
B 0.60 0.70 0.85 0.024 0.027 0.033
B1 2.90 3.00 3.15 0.114 0.118 0.124
c 0.24 0.26 0.35 0.009 0.010 0.014
D(1)
1. Do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm (0.006inches)
6.30 6.50 6.70 0.248 0.256 0.264
e 2.3 0.090
e1 4.6 0.181
E(1) 3.30 3.50 3.70 0.130 0.138 0.146
H 6.70 7.00 7.30 0.264 0.276 0.287
V 10° max
A
A1
e1
D
B1
HE
e
12
4
3
B
Vc
3.25
1.32
7.80
5.16
1.32
2.30 0.95
Package information X02
8/11 Doc ID 7480 Rev 4
Figure 15. SMBflat-3L footprint dimensions
Table 8. SMBflat-3L dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.90 1.10 0.035 0.043
b 0.35 0.65 0.014 0.026
b4 1.95 2.20 0.07 0.087
c 0.15 0.40 0.006 0.016
D 3.30 3.95 0.130 0.156
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.156 0.181
L 0.75 1.50 0.030 0.059
L1 0.40 0.016
L2 0.60 0.024
e 1.60 0.063
D
A
L 2x
LL2
L1
L1
L2 2x
EE1
b4
c
e
b 2x
millimeters
(inches)
1.20
(0.047)
2.07
(0.082)
0.51
(0.020)
0.51
(0.020)
1.20
(0.047)
3.44
(0.136)
5.84
(0.230)
2.07
(0.082)
X02 Package information
Doc ID 7480 Rev 4 9/11
Figure 16. Footprint and connectors for SOT-223 or SMBflat-3L (dimensions in mm)
SOT-223
SOT-223
SOT-223
SOT-223
SMBF3L
SMBF3L
SMBF3L
3.42
1.50
3.25
1.32
2.92
1.19
1.32
0.95
7.80
2.30
1.10
0.85
2.07
1.20
0.51
1.20
1.95
2.22
1.08
1.35
1.08
1.30
0.46
0.61
1.19
1.47
5.84
2.07
Solder resist
Solder lands
Solder paste
Connector line
Ordering information X02
10/11 Doc ID 7480 Rev 4
4 Ordering information
5 Revision history
Table 9. Ordering information
Order code Marking Package Weight Base qty Delivery mode
X0202MA 1BA2 X0202 MA TO-92 0.2 g 2500 Bulk
X0202MA 2BL2 X0202 MA TO-92 0.2 g 2000 Ammopack
X0202MN5BA4 X2M SOT-223 0.12 g 1000 Tape and reel
X0202NA 1BA2 X0202 NA TO-92 0.2 g 2500 Bulk
X0202NA 2BL2 X0202 NA TO-92 0.2 g 2000 Ammopack
X0202NN5BA4 X2N SOT-223 0.12 g 1000 Tape and reel
X0205MA 1BA2 X0205 MA TO-92 0.2 g 2500 Bulk
X0205MA 2BL2 X0205 MA TO-92 0.2 g 2000 Ammopack
X0205NA 1BA2 X0205 NA TO-92 0.2 g 2500 Bulk
X0202NUF X2N SMBflat-3L 46.914 mg 5000 Tape and reel
Table 10. Document revision history
Date Revision Changes
Sep-2000 3 Previous issue
14-Jan-2011 4 Added SMBflat-3L package and ECOPACK statement.
X02
Doc ID 7480 Rev 4 11/11
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