intel. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings Storage Temperature .......... 65C to + 150C Case Temperature Under Bias... - 65C to + 100C Supply Voltage with Respect to Vsgg ........... 0.5V to + 6.5V Voltage on Other Pins with Respect to Vss ...... 0.5V to Voc + 0.5V Recommended Connections Power and ground connections must be made to multiple Voc and Vssg pins. Every 80C186EC-based circuit board should include separate power (Vcc) and ground (Vsg) planes. Every Vcc pin must be connected to the power plane, and every Vss pin must be connected to the ground plane. Liberal de- coupling capacitance should be placed near the processor. The processor can cause transient pow- er surges when its output buffers transition, particu- larly when connected to large capacitive loads. PRELIMINARY 80C186EC/188EC, 80L186EC/188EC NOTICE: This data sheet contains preliminary infor- mation on new products in production. The specifica- tions are subject to change without notice. Verify with your locai Intel Sales office that you have the latest data sheet before finalizing a design. * WARNING: Stressing the device beyond the Absolute Maximum Ratings may cause permanent damage. These are stress ratings only. Operation beyond the Operating Conditions is not recommended and ex- tended exposure beyond the Operating Conditions may affect device reliability. Low inductance capacitors and interconnects are recommended for best high frequency electrical per- formance. Inductance is reduced by placing the de- coupling capacitors as close as possible to the proc- essor Vcc and Vgs package pins. Always connect any unused input to an appropriate signal level. In particular, unused interrupt inputs (NMI, INTO:7) should be connected to Vss through a pull-down resistor. Leave any unused output pin un- connected. 1-215