DESCRIPTION
The ADS7817 is a 12-bit, 200kHz sampling Analog-to-
Digital (A/D) converter that features a high impedance fully
differential analog input. The reference voltage can be var-
ied from 100mV to 2.5V, with a corresponding input-
referred resolution between 49µV and 1.22mV.
The differential input, low power, automatic power down,
and small size make the ADS7817 ideal for direct connec-
tion to transducers in battery operated systems, remote data
acquisition, or multi-channel applications. The ADS7817 is
available in a plastic mini-DIP-8, an SO-8, or an MSOP-8
package.
12-Bit Differential Input Micro Power Sampling
ANALOG-TO-DIGITAL CONVERTER
FEATURES
BIPOLAR INPUT RANGE
TRUE DIFFERENTIAL INPUT
200kHz SAMPLING RATE
MICRO POWER: 2.3mW at 200kHz
POWER DOWN: 3µA Max
AVAILABLE IN MSOP-8 PACKAGE
SERIAL INTERFACE
AC COMMON-MODE REJECTION
SAR Control
Serial
Interface
D
OUT
Comparator
S/H Amp CS/SHDN
DCLOCK
+In
V
REF
–In CDAC
OPA658
ADS7817
ADS7817
APPLICATIONS
TRANSDUCER INTERFACE
BATTERY OPERATED SYSTEMS
REMOTE DATA ACQUISITION
ISOLATED DATA ACQUISITION
AC MOTOR CONTROL
ADS7817
SBAS066A MAY 2001
www.ti.com
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 1997, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ADS7817
2SBAS066A
ABSOLUTE MAXIMUM RATINGS(1)
+VCC ..................................................................................................... +6V
Analog Input........................................................... 0.3V to (+VCC + 0.3V)
Logic Input .............................................................0.3V to (+VCC + 0.3V)
Case Temperature ......................................................................... +100°C
Junction Temperature .................................................................... +150°C
Storage Temperature..................................................................... +125°C
External Reference Voltage .............................................................. +5.5V
NOTE: (1) Stresses above these ratings may permanently damage the device.
PIN CONFIGURATION
PIN DESCRIPTIONS
PIN NAME DESCRIPTION
1V
REF Reference Input.
2 +In Non Inverting Input.
3In Inverting Input.
4 GND Ground.
5 CS/SHDN Chip Select when LOW, Shutdown Mode when HIGH.
6D
OUT The serial output data word is comprised of 12 bits of data. In operation the data is valid on the falling edge of DCLOCK. The
second clock pulse after the falling edge of CS enables the serial output. After one null bit the data is valid for the next 12 edges.
7 DCLOCK Data Clock synchronizes the serial data transfer and determines conversion speed.
8+V
CC Power Supply.
1
2
3
4
8
7
6
5
+VCC
DCLOCK
DOUT
CS/SHDN
VREF
+In
In
GND
ADS7817
PDIP-8,
SOIC-8,
MSOP-8
PACKAGE/ORDERING INFORMATION
MAXIMUM MAXIMUM
INTEGRAL DIFFERENTIAL
LINEARITY LINEARITY PACKAGE SPECIFICATION
ERROR ERROR DRAWING TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT (LSB) (LSB) PACKAGE NUMBER(1) RANGE MARKING(2) NUMBER(3) MEDIA
ADS7817P ±2±2 DIP-8 006 40°C to +85°C ADS7817P ADS7817P Rails
ADS7817U ±2±2 SO-8 182 40°C to +85°C ADS7817U ADS7817U "
ADS7817U """"""ADS7817U/2K5 Tape and Reel
ADS7817E ±2±2 MSOP-8 337 40°C to +85°C A17 ADS7817E Rails
ADS7817E """"""ADS7817E/250 Tape and Reel
ADS7817E """"""ADS7817E/2K5 "
ADS7817PB ±2±1 Plastic DIP-8 006 40°C to +85°C ADS7817PB ADS7817PB Rails
ADS7817UB ±2±1 SO-8 182 40°C to +85°C ADS7817UB ADS7817UB "
ADS7817UB """"""ADS7817UB/2K5 Tape and Reel
ADS7817EB ±2±1 MSOP 337 40°C to +85°C A17 ADS7817EB Rails
ADS7817EB """"""ADS7817EB/250 Tape and Reel
ADS7817EB """"""ADS7817EB/2K5 "
ADS7817PC ±1±0.75 DIP-8 006 40°C to +85°C ADS7817PC ADS7817PC Rails
ADS7817UC ±1±0.75 SO-8 182 40°C to +85°C ADS7817UC ADS7817UC "
ADS7817UC """"""ADS7817UC/2K5 Tape and Reel
ADS7817EC ±1±0.75 MSOP-8 337 40°C to +85°C A17 ADS7817EC Rails
ADS7817EC """"""ADS7817EC/250 Tape and Reel
ADS7817EC """"""ADS7817EC/2K5 "
NOTE: (1) For detail drawing and dimension table, please see end of data sheet or Package Drawing File on Web. (2) Performance Grade information is marked
on the reel. (3) Models with a slash(/) are available only in Tape and reel in quantities indicated (e.g. /250 indicates 250 units per reel, /2K5 indicates 2500 devices
per reel). Ordering 2500 pieces of ADS7817E/2K5 will get a single 2500-piece Tape and Reel.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
ADS7817 3
SBAS066A
ELECTRICAL CHARACTERISTICS
At 40°C to +85°C, +VCC = +5V, VREF = +2.5V, fSAMPLE = 200kHz, fCLK = 16 fSAMPLE, In = +2.5V, unless otherwise specified.
ADS7817 ADS7817B ADS7817C
PARAMETER CONDITIONS MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS
ANALOG INPUT
Full-Scale Input Span +In (In) VREF +VREF ✻✻✻✻V
Absolute Input Voltage +In 0.3 VCC +0.3 ✻✻✻✻V
In 0.3 4 ✻✻✻✻V
Capacitance 15 ✻✻pF
Leakage Current ±1✻✻µA
SYSTEM PERFORMANCE
Resolution 12 ✻✻Bits
No Missing Codes 11 12 Bits
Integral Linearity Error ±1±2±0.8 ±2±0.5 ±1 LSB(1)
Differential Linearity Error ±1±2±0.7 ±1±0.4 ±1 LSB
Offset Error ±1±6✻✻ ✻✻LSB
Gain Error ±0.5 ±4✻✻ ✻✻LSB
Noise 63 ✻✻µVrms
Common-Mode Rejection 80 ✻✻dB
Power Supply Rejection 82 ✻✻dB
SAMPLING DYNAMICS
Conversion Time 12 ✻✻
Clk Cycles
Acquisition Time 1.5 ✻✻
Clk Cycles
Throughput Rate 200 ✻✻kHz
DYNAMIC CHARACTERISTICS
Total Harmonic Distortion VIN = 5.0Vp-p at 1kHz 83 ✻✻dB
VIN = 5.0Vp-p at 5kHz 81 ✻✻dB
SINAD VIN = 5.0Vp-p at 1kHz 71 ✻✻dB
Spurious Free Dynamic Range VIN = 5.0Vp-p at 1kHz 86 ✻✻dB
REFERENCE INPUT
Voltage Range 0.1 2.5 ✻✻✻✻V
Resistance CS = VCC 5✻✻G
CS = GND, fSAMPLE = 0Hz
5✻✻G
Current Drain At Code FF8h 20 100 ✻✻ ✻✻µA
f
SAMPLE
= 12.5kHz
1.3 20 ✻✻ ✻✻µA
CS = VCC 0.001 3 ✻✻ ✻✻µA
DIGITAL INPUT/OUTPUT
Logic Family CMOS ✻✻
Logic Levels:
VIH IIH = +5µA3
+VCC +0.
3✻✻✻✻V
VIL IIL = +5µA0.3 0.8 ✻✻✻✻V
VOH IOH = 250µA 3.5 ✻✻V
VOL IOL = 250µA 0.4 ✻✻V
Data Format Binary Twos Complement ✻✻
POWER SUPPLY REQUIREMENTS
VCC Specified Performance 4.75 5.25 ✻✻✻✻V
Quiescent Current 460 800 ✻✻ ✻✻µA
fSAMPLE = 12.5kHz(2, 3) 40 ✻✻µA
fSAMPLE = 12.5kHz(3) 330 ✻✻µA
Power Down CS =VCC, fSAMPLE = 0Hz 3 ✻✻µA
TEMPERATURE RANGE
Specified Performance 40 +85 ✻✻✻✻°C
Specifications same as ADS7817.
NOTE: (1) LSB means Least Significant Bit, with VREF equal to +2.5V, one LSB is 1.22mV. (2) fCLK = 3.2MHz, CS = VCC for 241 clock cycles out of every 256.
(3) See the Power Dissipation section for more information regarding lower sample rates.
ADS7817
4SBAS066A
TIMING CHARACTERISTICS
At TA = +25°C, VCC = +5V, VREF = +2.5V, fSAMPLE = 200kHz, and fCLK = 16 fSAMPLE, In = +2.5V, unless otherwise specified.
CHANGE IN OFFSET vs REFERENCE VOLTAGE
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
Change in Offset (LSB)
1.0 1.25 1.5 1.75 2.252.0 2.5
Reference Voltage (V)
CHANGE IN GAIN vs REFERENCE VOLTAGE
4
3.5
3
2.5
2
1.5
1
0.5
0
Change in Gain (LSB)
Reference Voltage (V)
1.0 1.25 1.5 1.75 2.252.0 2.5
CHANGE IN OFFSET vs TEMPERATURE
1.2
0.8
0.4
0.0
0.4
0.8
1.2
Delta from 25°C (LSB)
50 25 0 25 50 75 100
Temperature (°C)
CHANGE IN GAIN vs TEMPERATURE
0.15
0.1
0.05
0
0.05
0.1
0.15
Delta from 25°C (LSB)
50 25 0 25 50 75 100
Temperature (°C)
12.0
11.5
11.0
10.5
10.0
9.5
9.0
EFFECTIVE NUMBER OF BITS
vs REFERENCE VOLTAGE
Reference Voltage
0.1 1 10
Effective Number of Bits
18
15
12
9
6
3
0
PEAK-TO-PEAK NOISE vs REFERENCE VOLTAGE
Reference Voltage
0.1 1 10
Peak-to-Peak Noise (LSB)
ADS7817 5
SBAS066A
TIMING CHARACTERISTICS (Cont.)
At TA = +25°C, VCC = +5V, VREF = +2.5V, fSAMPLE = 200kHz, and fCLK = 16 fSAMPLE, In = +2.5V, unless otherwise specified.
73
72
71
70
69
68
67
SIGNAL-TO-NOISE RATIO AND
SIGNAL-TO-(NOISE+DISTORTION)
vs INPUT FREQUENCY
Input Frequency (kHz)
1 10 100
SNR and SINAD (dB)
SNR
SINAD
80
70
60
50
40
30
20
10
SIGNAL-TO-(NOISE+DISTORTION)
vs INPUT LEVEL
Input Level (dB)
60 50 40 30 1020 0
SINAD (dB)
POWER SUPPLY REJECTION vs RIPPLE FREQUENCY
0
10
20
30
40
50
60
70
80
90
Power Supply Rejection (dB)
1 10 100 1000 10000
Ripple Frequency (kHz)
FREQUENCY SPECTRUM
(4096 Point FFT; fIN = 9.9kHz, 0.5dB)
0
20
40
60
80
100
120
Amplitude (dB)
0 255075100
Frequency (kHz)
95
90
85
80
75
70
65
SPURIOUS FREE DYNAMIC RANGE AND
TOTAL HARMONIC DISTORTION
vs INPUT FREQUENCY
Input Frequency (kHz)
110100
SFDR (dB)
95
90
85
80
75
70
65
THD (dB)
SFDR
THD
CHANGE IN INTEGRAL LINEARITY and DIFFERENTIAL
LINEARITY vs SAMPLE RATE
1.5
1.0
0.5
0
0.5
Delta from f
SAMPLE
= 200kHz (LSB)
0 80 160 240 320 400
Sample Rate (kHz)
Change in Integral
Linearity (LSB)
Change in Differential
Linearity (LSB)
ADS7817
6SBAS066A
TIMING CHARACTERISTICS (Cont.)
At TA = +25°C, VCC = +5V, VREF = +2.5V, fSAMPLE = 200kHz, and fCLK = 16 fSAMPLE, In = +2.5V, unless otherwise specified.
1.00
0.75
0.50
0.25
0.00
0.25
0.50
0.75
1.00
INTEGRAL LINEARITY ERROR vs CODE
Hex BTC Code
800 000 7FF
ILE (LSB)
1.00
0.75
0.50
0.25
0.00
0.25
0.50
0.75
1.00
DIFFERENTIAL LINEARITY ERROR vs CODE
Hex BTC Code
800 000 7FF
DLE (LSB)
CHANGE IN INTEGRAL LINEARITY AND DIFFERENTIAL
LINEARITY vs REFERENCE VOLTAGE
0.10
0.05
0.00
0.05
0.10
0.15
0.20
Delta from +2.5V Reference (LSB)
1 1.25 1.751.5 2.0 2.25 2.5
Reference Voltage (V)
Change in Differential
Linearity (LSB)
Change in Integral
Linearity (LSB)
INPUT LEAKAGE CURRENT vs TEMPERATURE
10
1
0.1
0.01
Leakage Current (nA)
50 25 0 25 50 75 100
Temperature (°C)
SUPPLY CURRENT vs TEMPERATURE
600
550
500
450
400
350
300
Supply Current (µA)
50 25 0 25 50 75 100
Temperature (°C)
POWER DOWN SUPPLY CURRENT
vs TEMPERATURE
3
2.5
2
1.5
1
0.5
0
Supply Current (µA)
50 25 0 25 50 75 100
Temperature (°C)
ADS7817 7
SBAS066A
TIMING CHARACTERISTICS (Cont.)
At TA = +25°C, VCC = +5V, VREF = +2.5V, fSAMPLE = 200kHz, and fCLK = 16 fSAMPLE, In = +2.5V, unless otherwise specified.
REFERENCE CURRENT vs SAMPLE RATE
(Code = FF8h)
20
15
10
5
0
Reference Current (µA)
0 40 80 120 160 200
Sample Rate (kHz)
REFERENCE CURRENT vs TEMPERATURE
(Code = FF8h)
30
25
20
15
10
5
0
Reference Current (µA)
50 25 0 25 50 75 100
Temperature (°C)
ADS7817
8SBAS066A
THEORY OF OPERATION
The ADS7817 is a classic successive approximation register
(SAR) analog-to-digital (A/D) converter. The architecture is
based on capacitive redistribution which inherently includes
a sample/hold function. The converter is fabricated on a 0.6µ
CMOS process. The architecture and process allow the
ADS7817 to acquire and convert an analog signal at up to
200,000 conversions per second while consuming very little
power.
The ADS7817 requires an external reference, an external
clock, and a single +5V power source. The external refer-
ence can be any voltage between 100mV and 2.5V. The
value of the reference voltage directly sets the range of the
analog input. The reference input current depends on the
conversion rate of the ADS7817.
The external clock can vary between 10kHz (625Hz through-
put) and 3.2MHz (200kHz throughput). The duty cycle of
the clock is essentially unimportant as long as the minimum
high and low times are at least 150ns. The minimum clock
frequency is set by the leakage on the capacitors internal to
the ADS7817.
The analog input is provided to two input pins: +In and –In.
When a conversion is initiated, the differential input on these
pins is sampled on the internal capacitor array. While a
conversion is in progress, both inputs are disconnected from
any internal function.
The digital result of the conversion is clocked out by the
DCLOCK input and is provided serially, most significant bit
first, on the DOUT pin. The digital data that is provided on the
DOUT pin is for the conversion currently in progress—there
is no pipeline delay. It is possible to continue to clock the
ADS7817 after the conversion is complete and to obtain the
serial data least significant bit first. See the Digital Interface
section for more information.
ANALOG INPUT
The analog input is bipolar and fully differential. There are
two general methods of driving the analog input of the
ADS7817: single-ended or differential (see Figure 1). When
the input is single-ended, the –In input is held at a fixed
voltage. The +In input swings around the same voltage and
the peak-to-peak amplitude is 2 • VREF. The value of VREF
determines the range over which the common voltage may
vary (see Figure 2).
When the input is differential, the amplitude of the input is the
difference between the +In and –In input, or: +In – (–In). A
voltage or signal is common to both of these inputs. The peak-
to-peak amplitude of each input is VREF about this common
voltage. However, since the inputs are 180° out of phase, the
peak-to-peak amplitude of the difference voltage is 2 • VREF.
The value of VREF also determines the range of the voltage
that may be common to both inputs (see Figure 3).
FIGURE 1. Methods of Driving the ADS7817: Single-
Ended or Differential.
FIGURE 2. Single-Ended Input: Common Voltage Range vs
VREF.
FIGURE 3. Differential Input: Common Voltage Range vs
VREF.
ADS7817
ADS7817
Single-Ended Input
Common
Voltage
2 V
REF
peak-to-peak
Differential Input
Common
Voltage
V
REF
peak-to-peak
V
REF
peak-to-peak
0.0 0.5 1.0 1.5 2.0 2.5
VREF (V)
Common Voltage Range (V)
1
0
1
2
3
4
5
2.8
2.2
0.3
4.0 VCC = 5V
Single-Ended Input
0.0 0.5 1.0 1.5 2.0 2.5
V
REF
(V)
2.75
V
CC
= 5V
1.95
4.0
0.3
Common Voltage Range (V)
1
0
1
2
3
4
5
Differential Input
ADS7817 9
SBAS066A
In each case, care should be taken to ensure that the output
impedance of the sources driving the +In and –In inputs are
matched. If this is not observed, the two inputs could have
different settling times. This may result in offset error, gain
error, and linearity error which change with both temperature
and input voltage. If the impedance cannot be matched, the
errors can be lessened by giving the ADS7817 more acquisi-
tion time.
The input current on the analog inputs depends on a number
of factors: sample rate, input voltage, and source impedance.
Essentially, the current into the ADS7817 charges the inter-
nal capacitor array during the sample period. After this
capacitance has been fully charged, there is no further input
current. The source of the analog input voltage must be able
to charge the input capacitance (15pF) to a 12-bit settling
level within 1.5 clock cycles. When the converter goes into
the hold mode or while it is in the power down mode, the
input impedance is greater than 1G.
Care must be taken regarding the absolute analog input
voltage. The +In input should always remain within the
range of GND –300mV to VCC +300mV. The –In input
should always remain within the range of GND –300mV to
4V. Outside of these ranges, the converter’s linearity may
not meet specifications.
REFERENCE INPUT
The external reference sets the analog input range. The
ADS7817 will operate with a reference in the range of 100mV
to 2.5V. There are several important implications of this.
As the reference voltage is reduced, the analog voltage
weight of each digital output code is reduced. This is often
referred to as the LSB (least significant bit) size and is equal
to two times the reference voltage divided by 4096. This
means that any offset or gain error inherent in the A/D
converter will appear to increase, in terms of LSB size, as
the reference voltage is reduced. The typical performance
curves of “Change in Offset vs Reference Voltage” and
“Change in Gain vs Reference Voltage” provide more infor-
mation.
The noise inherent in the converter will also appear to
increase with lower LSB size. With a 2.5V reference, the
internal noise of the converter typically contributes only
0.52 LSB peak-to-peak of potential error to the output code.
When the external reference is 100mV, the potential error
contribution from the internal noise will be 25 times larger—
13 LSBs. The errors due to the internal noise are gaussian in
nature and can be reduced by averaging consecutive conver-
sion results.
For more information regarding noise, consult the typical
performance curves “Effective Number of Bits vs Reference
Voltage” and “Peak-to-Peak Noise vs Reference Voltage.”
Note that the effective number of bits (ENOB) figure is
calculated based on the converter’s signal-to-(noise + distor-
tion) with a 1kHz, 0dB input signal. SINAD is related to
ENOB as follows: SINAD = 6.02 • ENOB + 1.76.
With lower reference voltages, extra care should be taken to
provide a clean layout including adequate bypassing, a clean
power supply, a low-noise reference, and a low-noise input
signal. Because the LSB size is lower, the converter will also
be more sensitive to external sources of error such as nearby
digital signals and electromagnetic interference.
The current that must be provided by the external reference
will depend on the conversion result. The current is lowest
at negative full-scale (800h) and is typically 15µA at a
200kHz conversion rate (25°C). For the same conditions, the
current will increase as the analog input approaches positive
full scale, reaching 25µA at an output result of 7FFh. The
current does not increase linearly, but depends, to some
degree, on the bit pattern of the digital output.
The reference current diminishes directly with both conver-
sion rate and reference voltage. As the current from the
reference is drawn on each bit decision, clocking the con-
verter more quickly during a given conversion period will
not reduce the overall current drain from the reference. The
reference current changes only slightly with temperature.
See the curves, “Reference Current vs Sample Rate” and
“Reference Current vs Temperature” in the Typical Perfor-
mance Curves section for more information.
DIGITAL INTERFACE
SERIAL INTERFACE
The ADS7817 communicates with microprocessors and other
digital systems via a synchronous 3-wire serial interface as
shown in Figure 4 and Table I. The DCLOCK signal
synchronizes the data transfer with each bit being transmit-
ted on the falling edge of DCLOCK. Most receiving systems
will capture the bitstream on the rising edge of DCLOCK.
However, if the minimum hold time for DOUT is acceptable,
the system can use the falling edge of DCLOCK to capture
each bit.
TABLE I. Timing Specifications –40°C to +85°C.
SYMBOL
DESCRIPTION MIN TYP MAX UNITS
tSMPL Analog Input Sample TIme 1.5 2.0
Clk Cycles
tCONV Conversion Time 12
Clk Cycles
tCYC Throughput Rate 200 kHz
tCSD CS Falling to 0 ns
DCLOCK LOW
tSUCS CS Falling to 30 ns
DCLOCK Rising
thDO DCLOCK Falling to 15 ns
Current DOUT Not Valid
tdDO DCLOCK Falling to Next 85 150 ns
DOUT Valid
tdis CS Rising to DOUT Tri-State 25 50 ns
ten DCLOCK Falling to DOUT 50 100 ns
Enabled
tfDOUT Fall Time 70 100 ns
trDOUT Rise Time 60 100 ns
ADS7817
10 SBAS066A
CS/SHDN
D
OUT
DCLOCK
t
DATA
t
SUCS
t
CYC
t
CONV
POWER
DOWN
t
SMPL
Note: (1) After completing the data transfer, if further clocks are applied with CS
LOW, the A/D will output LSB-First data then followed with zeroes indefinitely.
B11
(MSB)B10 B9 B8 B7 B6 B5 B4 B3 B2 B1 B0
(1)
NULL
BIT
HI-ZHI-Z B11 B10 B9 B8
NULL
BIT
CS/SHDN
D
OUT
DCLOCK
t
CONV
t
DATA
t
SUCS
t
CSD
t
CSD
t
CYC
POWER DOWN
t
SMPL
Note: (2) After completing the data transfer, if further clocks are applied with CS
LOW, the A/D will output zeroes indefinitely.
t
DATA
: During this time, the bias current and the comparator power down and the reference input
becomes a high impedance node, leaving the CLK running to clock out LSB-First data or zeroes.
B11
(MSB)B10 B9 B8 B7 B6 B5 B4 B4B3 B3B2 B2B1 B1B0
NULL
BIT
HI-Z HI-Z
B5 B6 B7 B8 B9 B10 B11
(2)
A falling CS signal initiates the conversion and data transfer.
The first 1.5 to 2.0 clock periods of the conversion cycle are
used to sample the input signal. After the second falling
DCLOCK edge, DOUT is enabled and will output a LOW
value for one clock period. For the next 12 DCLOCK
periods, DOUT will output the conversion result, most sig-
nificant bit first. After the least significant bit (B0) has been
output, subsequent clocks will repeat the output data but in
a least significant bit first format.
After the most significant bit (B11) has been repeated, DOUT
will tri-state. Subsequent clocks will have no effect on the
converter. A new conversion is initiated only when CS has
been taken HIGH and returned LOW.
DATA FORMAT
The output data from the ADS7817 is in Binary Two’s
Complement format as shown in Table II. This table repre-
sents the ideal output code for the given input voltage and
does not include the effects of offset, gain error, or noise.
POWER DISSIPATION
The architecture of the converter, the semiconductor fabrica-
tion process, and a careful design allow the ADS7817 to
convert at up to a 200kHz rate while requiring very little
power. Still, for the absolute lowest power dissipation, there
are several things to keep in mind.
The power dissipation of the ADS7817 scales directly with
conversion rate. The first step to achieving the lowest power
dissipation is to find the lowest conversion rate that will
satisfy the requirements of the system.
In addition, the ADS7817 is in power down mode under two
conditions: when the conversion is complete and whenever
CS is HIGH (see Figure 1). Ideally, each conversion should
occur as quickly as possible, preferably, at a 3.2MHz clock
rate. This way, the converter spends the longest possible
time in the power down mode. This is very important as the
converter not only uses power on each DCLOCK transition
(as is typical for digital CMOS components) but also uses
some current for the analog circuitry, such as the compara-
tor. The analog section dissipates power continuously, until
the power down mode is entered.
Figure 6 shows the current consumption of the ADS7817
versus sample rate. For this graph, the converter is clocked
at 3.2MHz regardless of the sample rate—CS is HIGH for
the remaining sample period. Figure 7 also shows current
consumption versus sample rate. However, in this case, the
DCLOCK period is 1/16th of the sample period—CS is
HIGH for one DCLOCK cycle out of every 16.
FIGURE 4. ADS7817 Basic Timing Diagrams.
DESCRIPTION
ANALOG VALUE
Full Scale Input Span
2 VREF
Least Significant 2 VREF/4096
Bit (LSB)
+Full Scale VREF 1 LSB 0111 1111 1111 7FF
Midscale 0V 0000 0000 0000 000
Midscale 1 LSB 0V 1 LSB 1111 1111 1111 FFF
Full Scale VREF 1000 0000 0000 800
TABLE II. Ideal Input Voltages and Output Codes.
DIGITAL OUTPUT:
BINARY TWOS COMPLEMENT
BINARY CODE HEX CODE
ADS7817 11
SBAS066A
DOUT
1.4V
Test Point
3k
100pF
CLOAD
tr
DOUT VOH
VOL
tf
tdDO
thDO
DOUT
DCLOCK
VOH
VOL
VIL
DOUT
Test Point
tdis Waveform 2, ten
tdis Waveform 1
100pF
CLOAD
3k
tdis
CS/SHDN
DOUT
Waveform 1(1)
DOUT
Waveform 2(2)
90%
10%
VIH
1
B11
2
ten
CS/SHDN
DCLOCK
VOL
DOUT
VCC
Load Circuit for tdDO, tr, and tfVoltage Waveforms for DOUT Rise and Fall Times tr, and tf
Voltage Waveforms for DOUT Delay Times, tdDO Load Circuit for tdis and tden
Voltage Waveforms for ten
FIGURE 5. Timing Diagrams and Test Circuits for the Parameters in Table I.
Voltage Waveforms for tdis
NOTES: (1) Waveform 1 is for an output with internal conditions such that
the output is HIGH unless disabled by the output control. (2) Waveform 2
is for an output with internal conditions such that the output is LOW unless
disabled by the output control.
1000
100
10
1
Supply Current (µA)
1 10 100 1000
Sample Rate (kHz)
T
A
= 25°C
V
CC
= +5V
V
REF
= +2.5V
f
CLK
= 3.2MHz
FIGURE 6. Maintaining fCLK at the Highest Possible Rate
Allows Supply Current to Drop Directly with
Sample Rate.
FIGURE 7. Scaling fCLK Reduces Supply Current Only
Slightly with Sample Rate.
1000
100
10
1
Supply Current (µA)
1 10 100 1000
Sample Rate (kHz)
T
A
= 25°C
V
CC
= +5V
V
REF
= +2.5V
f
CLK
= 16 f
SAMPLE
ADS7817
12 SBAS066A
There is an important distinction between the power down
mode that is entered after a conversion is complete and the
full power down mode which is enabled when CS is HIGH.
While both power down the analog section, the digital section
is powered down only when CS is HIGH. Thus, if CS is left
LOW at the end of a conversion and the converter is continu-
ally clocked, the power consumption will not be as low as
when CS is HIGH. See Figure 8 for more information.
By lowering the reference voltage, the ADS7817 requires
less current to completely charge its internal capacitors on
both the analog input and the reference input. This reduction
in power dissipation should be weighed carefully against the
resulting increase in noise, offset, and gain error as outlined
in the Reference section.
FIGURE 8. Shutdown Current is Considerably Lower with
CS HIGH than when CS is LOW.
60
50
40
30
20
10
0
Supply Current (µA)
1 10 100 1000
Sample Rate (kHz)
T
A
= 25°C
V
CC
= +5V
V
REF
= +2.5V
f
CLK
= 16 f
SAMPLE
CS LOW
(GND)
CS = HIGH (V
CC
)
SHORT CYCLING
Another way of saving power is to utilize the CS signal to
short cycle the conversion. Because the ADS7817 places the
latest data bit on the DOUT line as it is generated, the
converter can easily be short cycled. This term means that
the conversion can be terminated at any time. For example,
if only 8-bits of the conversion result are needed, then the
conversion can be terminated (by pulling CS HIGH) after
the 8th bit has been clocked out.
This technique can be used to lower the power dissipation in
those applications where an analog signal is being monitored
until some condition becomes true. For example, if the
signal is outside a predetermined range, the full 12-bit
conversion result may not be needed. If so, the conversion
can be terminated after the first n-bits, where n might be as
low as 3 or 4. This results in lower power dissipation in both
the converter and the rest of the system, as they spend more
time in the power down mode.
LAYOUT
For optimum performance, care should be taken with the
physical layout of the ADS7817 circuitry. This is particularly
true if the reference voltage is low and/or the conversion rate
is high. At 200kHz conversion rate, the ADS7817 makes a bit
decision every 312ns. That is, for each subsequent bit deci-
sion, the digital output must be updated with the results of the
last bit decision, the capacitor array appropriately switched
and charged, and the input to the comparator settled to a
12-bit level all within one clock cycle.
The basic SAR architecture is sensitive to spikes on the
power supply, reference, and ground connections that occur
just prior to latching the comparator output. Thus, during
any single conversion for an n-bit SAR converter, there are
n “windows” in which large external transient voltages can
easily affect the conversion result. Such spikes might origi-
nate from switching power supplies, digital logic, and high
power devices, to name a few. This particular source of error
can be very difficult to track down if the glitch is almost
synchronous to the converter’s DCLOCK signal—as the
phase difference between the two changes with time and
temperature, causing sporadic misoperation.
With this in mind, power to the ADS7817 should be clean
and well bypassed. A 0.1µF ceramic bypass capacitor should
be placed as close to the ADS7817 package as possible. In
addition, a 1 to 10µF capacitor and a 10 series resistor may
be used to lowpass filter a noisy supply.
The reference should be similarly bypassed with a 0.1µF
capacitor. Again, a series resistor and large capacitor can be
used to lowpass filter the reference voltage. If the reference
voltage originates from an op amp, be careful that the op-
amp can drive the bypass capacitor without oscillation (the
series resistor can help in this case). Keep in mind that while
the ADS7817 draws very little current from the reference on
average, there are higher instantaneous current demands
placed on the external reference circuitry.
Also, keep in mind that the ADS7817 offers no inherent
rejection of noise or voltage variation in regards to the
reference input. This is of particular concern when the
reference voltage is derived from the power supply. Any
noise and ripple from the supply that is not rejected by the
external reference circuitry will appear directly in the digital
results. While high frequency noise can be filtered out as
described in the previous paragraph, voltage variation due to
line frequency (50Hz or 60Hz) can be difficult to remove.
The GND pin on the ADS7817 should be placed on a clean
ground point. In many cases, this will be the “analog”
ground. Avoid connecting the GND pin too close to the
grounding point for a microprocessor, microcontroller, or
digital signal processor. If needed, run a ground trace di-
rectly from the converter to the power supply connection
point. The ideal layout will include an analog ground plane
for the converter and associated analog circuitry.
ADS7817 13
SBAS066A
APPLICATION CIRCUITS
Figures 9, 10 and 11 show some typical applications circuits
for the ADS7817. Figure 9 shows a low cost, low power
circuit for basic data acquisition. Total power dissipation in
the ADS7817 and reference circuitry is under 5mW over
temperature, power supply variations, and at a 200kHz sample
rate.
Figure 10 is a motor control application using three ISO130s
to isolate the motor from the sensing system (three ADS7817s
and a DSP56004). The ISO130 provides 10kV/µs (minimum)
isolation-mode rejection, 85kHz large signal bandwidth, and
a fixed gain of 8. The ADS7817’s reference voltage is 1.2V
and is derived from a REF1004-1.2. This gives the converter
a full-scale input range of ±1.2V. Because of the gain of 8 in
the ISO130, the current sense resistor should give a worst-
case output voltage of less than ±150mV.
Figure 11 is a similar application that isolates the digital
outputs of the three ADS7817s instead of the analog signal
from the motor. Here, the reference voltage for the ADS7817
is 150mV, and the analog input of each ADS7817 is con-
nected directly to the current sense resistor. By removing the
ISO130 from the signal path, a greater signal-to-noise ratio is
achieved in the sensing system. However, nine optical isola-
tors are needed to isolate the A/D converters.
FIGURE 9. Low Cost, Low Power Data Acquisition System.
ADS7817
V
CC
CS
D
OUT
DCLOCK
V
REF
+In
In
GND
+
+
5 to 10
22
24.9k
REF1004-2.5 1µF to
10µF
1µF to
10µF
0.1µF
4.7µF
+
Microcontroller
+5V
ADS7817
14 SBAS066A
FIGURE 10. Motor Control Using the ISO130, ADS7817, and DSPS6004.
78L05
R
SENSE
from
PWM
from
PWM
First Motor
Leg Driver
AC Motor
HV
(Several
Hundred
Volts)
C
8
0.1µF
C
7
0.1µF
+V
ISO1
+5V
GND1
GND1
System
GND System
GND
CLK
CS/SHDN
D
OUT
SCKT
SDO 0
SDI 1
SDI 0
MOSI/HA 0
ISO130
+
+5V
System
GND
R
8
200
R
9
200SD02
SS/HA2
HV+
(Several
Hundred
Volts)
0.01µF
R
10
ADS7817
C
9
0.01µF
78L05
C
5
0.1µF
C
4
0.1µF
+V
ISO2
GND2
GND2
System
GND System
GND
D
OUT
CLK
CS/SHDN
ISO130
to 2nd Motor
Leg Driver
+5V
R
5
200
R
6
200
ADS7817
C
6
0.01µF
78L05
C
2
0.1µF
C
1
0.1µF
+V
ISO3
GND3
GND3
System
GND System
GND
D
OUT
CLK
CS/SHDN
ISO130
to 3rd Motor
Leg Driver
+5V
R
2
200
R
3
200
ADS7817
C
3
0.01µF
REF1004-1.2
C
15
0.1µF
C
14
5µF
+
R
7
1k
+5V
REF1004-1.2
C
13
0.1µF
C
12
5µF
+
R
4
1k
+5V
REF1004-1.2
C
11
0.1µF
C
10
5µF
+
R
1
1k
WST
Motorola
DSPS6004
WSR
SCKR
SCK/SCL
ADS7817 15
SBAS066A
FIGURE 11. Motor Control Using an Isolated ADS7817.
R
SENSE
from
PWM
from
PWM
AC Motor
1st Motor Leg
To 3rd Motor
Leg
To 2nd Motor
Leg
CS
D
OUT
CLK
R
5
200
R
6
200
ADS7817
+V
ISO1
+V
CC
V
REF
V
REF
+V
CC
Opto-Couplers
(1)
NOTE: (1) Suggested Opto-couplers are HCPL-2611 or
HCPL-7611. Inverters or buffers will be needed to drive
these devices. See the appropriate Hewlett-Packard data
sheet for more information.
REF1004-1.2
R
1
+5V
R
2
768
R
3
301+150mV
R
4
43.2
C
2
4.7µF
+
C
4
0.01µF
C
1
4.7µF
+
C
3
0.1µF
WST
Motorola
DSP56004
SDO0
SDO1
SDO2
SCKT
SCKR
SDI0
SDI1
WSR
SCK/SCL
MISO/SDA
MOSI/HA0
HREQ
SS/HA2
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
ADS7817E/250 ACTIVE MSOP DGK 8 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817E/250G4 ACTIVE MSOP DGK 8 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817E/2K5 ACTIVE MSOP DGK 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817E/2K5G4 ACTIVE MSOP DGK 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817EB/250 ACTIVE MSOP DGK 8 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817EB/250G4 ACTIVE MSOP DGK 8 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817EB/2K5 ACTIVE MSOP DGK 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817EB/2K5G4 ACTIVE MSOP DGK 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817EC/250 ACTIVE MSOP DGK 8 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817EC/250G4 ACTIVE MSOP DGK 8 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817EC/2K5 ACTIVE MSOP DGK 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817EC/2K5G4 ACTIVE MSOP DGK 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
ADS7817P OBSOLETE PDIP P 8 TBD Call TI Call TI
ADS7817PB OBSOLETE PDIP P 8 TBD Call TI Call TI
ADS7817PC OBSOLETE PDIP P 8 TBD Call TI Call TI
ADS7817U ACTIVE SOIC D 8 100 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS7817U/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS7817U/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS7817UB ACTIVE SOIC D 8 100 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS7817UB/2K5G4 ACTIVE SOIC D 8 TBD Call TI Call TI
ADS7817UBG4 ACTIVE SOIC D 8 100 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS7817UC ACTIVE SOIC D 8 100 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS7817UC/2K5 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS7817UC/2K5G4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS7817UCG4 ACTIVE SOIC D 8 100 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
ADS7817UG4 ACTIVE SOIC D 8 100 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
PACKAGE OPTION ADDENDUM
www.ti.com 19-Jun-2007
Addendum-Page 1
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 19-Jun-2007
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
ADS7817E/250 MSOP DGK 8 250 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
ADS7817E/2K5 MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
ADS7817EB/250 MSOP DGK 8 250 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
ADS7817EB/2K5 MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
ADS7817EC/250 MSOP DGK 8 250 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
ADS7817EC/2K5 MSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
ADS7817U/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
ADS7817UC/2K5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
ADS7817E/250 MSOP DGK 8 250 346.0 346.0 29.0
ADS7817E/2K5 MSOP DGK 8 2500 346.0 346.0 29.0
ADS7817EB/250 MSOP DGK 8 250 346.0 346.0 29.0
ADS7817EB/2K5 MSOP DGK 8 2500 346.0 346.0 29.0
ADS7817EC/250 MSOP DGK 8 250 346.0 346.0 29.0
ADS7817EC/2K5 MSOP DGK 8 2500 346.0 346.0 29.0
ADS7817U/2K5 SOIC D 8 2500 346.0 346.0 29.0
ADS7817UC/2K5 SOIC D 8 2500 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers shouldobtain the latest relevant information before placing orders and should verify that such information is current and complete. All products aresold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standardwarranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except wheremandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license from TI to use such products or services or awarranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectualproperty of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompaniedby all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptivebusiness practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additionalrestrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids allexpress and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is notresponsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonablybe expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governingsuch use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, andacknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their productsand any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may beprovided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products insuch safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely atthe Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products aredesignated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designatedproducts in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers amplifier.ti.com Audio www.ti.com/audioData Converters dataconverter.ti.com Automotive www.ti.com/automotiveDSP dsp.ti.com Broadband www.ti.com/broadbandClocks and Timers www.ti.com/clocks Digital Control www.ti.com/digitalcontrolInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Military www.ti.com/militaryPower Mgmt power.ti.com Optical Networking www.ti.com/opticalnetworkMicrocontrollers microcontroller.ti.com Security www.ti.com/securityRFID www.ti-rfid.com Telephony www.ti.com/telephonyRF/IF and ZigBee® Solutions www.ti.com/lprf Video & Imaging www.ti.com/videoWireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2008, Texas Instruments Incorporated