TORX147(F,T)
2006-12-28
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FIBER OPTIC RECEIVING MODULE
TORX147(F,T)
FIBER OPTIC RECEIVING MODULE
FOR DIGITAL AUDIO INTERFACE
z For JEITA Standard CP−1212
(Digital Audio Optical Interface
for Consumer Equipment).
z A self−tapping hole for easy attachment to
Audio Equipments panels.
z RoHS Compatible
1. Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Storage Temperature Tstg −40 to 70 °C
Operating Temperature Topr −20 to 70 °C
Supply Voltage VCC −0.5 to 4.5 V
High Level Output Current IOH −2 mA
Low Level Output Current IOL 2 mA
Soldering Temperature Tsol 260 (Note 1) °C
Note 1: Soldering time ≤ 10 seconds (At a distance of 1 mm from the package).
2. Operating Ranges
Characteristics Symbol Min Typ. Max Unit
Supply Voltage VCC 2.7 3.0 3.6 V
Unit: mm
Pin Connection
1. Output
2. GND
3. Vcc
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3. Electrical and Optical Characteristics (Ta = 25°C, VCC = 3 V)
Characteristics Symbol Test Condition Min Typ. Max Unit
Data Rate NRZ code (Note 2) 0.1 --- 15 Mb / s
Transmission Distance Using APF (Note 3), Using TOTX147(F,T) 0.2 --- 5 m
Pulse Width Distortion (Note 4) ⊿t w
Pulse Width = 67 ns
Pulse Cycle = 134 ns
CL = 10 pF
Using TOTX147(F,T)
−15 --- 15 ns
Maximum Receivable
Power (Note 5) PMAX 15 Mb / s, Using APF −14.5 --- --- dBm
Minimum Receivable
Power (Note 5) PMIN 15 Mb / s, Using APF --- --- −24 dBm
Current Consumption ICC --- 10 15 mA
High Level Output Voltage VOH 2.1 2.5 --- V
Low Level Output Voltage VOL --- 0.2 0.4 V
Note 2: 7.5Mb/s (max.) Biphase marked signal.
When modulated optical high level signal is received, output signal is high.
When modulated optical low level signal is received, output signal is low.
When non−modulated signal (optical all high or all low level signal) is inputted, output signal is not stable.
Note 3: All Plastic Fiber (980 / 1000 μm).
Note 4: Between input of TOTX147(F,T) and output of TORX147(F,T).
Note 5: BER ≤ 10−9, peak value.
4. Mechanical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Insertion Force (Note 6) Initial value --- --- 39.2 N
Withdrawal Force (Note 6) Initial value 5.9 --- 39.2 N
Torque for Self−Tap
Using self−tapping screw
(M3 × 8) 58.8 --- 98 N·cm
Note 6: Square type connector : EIAJ RC-5720B
5. Application Circuit
6. Required Optical Fiber with Fiber Optic Connectors
All Plastic Fiber with Square Type Connector ( EIAJ RC-5720B )
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7. Board layout hole pattern (Recommendation)
Unit: mm
Tolerance: ±0.05 mm
Recommended PCB thickness: 1.6 mm
8. Precautions on Use
(1) Absolute maximum rating
The absolute maximum ratings are the limit values which must not be exceeded during operation of
device. None of these rating value must not be exceeded. If the absolute maximum rating value is
exceeded, the characteristics of devices may never be restored properly. In extreme cases, the device
may be permanently damages.
(2) Soldering
Optical modules are comprised of internal semiconductor devices. However, in principle, optical
modules are optical components. During soldering, ensure that flux does not contact with the emitting
surface or the detecting surface. Also ensure that proper flux removal is conducted after soldering.
Some optical modules come with a protective cap. The protective cap is used to avoid malfunction
when the optical module is not in use. Note that it is not dust or waterproof.
As mentioned before, optical modules are optical components. Thus, in principle, soldering where
there may be flux residue and flux removal after soldering is not recommended. Toshiba recommend
that soldering be performed without the optical module mounted on the board. Then, after the board
has been cleaned, the optical module should be soldered on to the board manually.
If the optical module cannot be soldered manually, use non−halogen (chlorine−free) flux and make
sure, without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the
effects of flux. In such a cases, be sure to check the devices' reliability.
(3) Noise resistance
It is believed that the use of optical transfer devices improve noise resistance. In theory, optical fiber
is not affected by noise at all. However, receiving modules which handle signals whose level is
extremely small, are susceptible to noise.
TOSLINK improve noise resistance to use a conductive case. However, the current signal output by
the optical receiving modules' photodiode is extremely small. Thus, in some environments, shielding
the case may not achieve sufficient noise resistance.
For systems which incorporate TOSLINK, Toshiba recommend testing using the actual device to
check its noise resistance.
Use a simple noise filter on TOSLINK fiber optic transceiving module's power line. If the ripple in the
power supply used is significant, reinforce the filter.
The optical module is to be used in an area which is susceptible to radiated noise, increase the
shielding by covering the optical module and the power line filter with a metallic cover.
(4) Vibration and shock
This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to
vibration and shock. In actual equipment, there are sometime cases in which vibration, shock, or
stress is applied to soldered parts or connected parts, resulting in lines cut. A care must be taken in
the design of equipment which will be subject to high levels of vibration.
(5) Support pins
The TORX147(F,T) has support pins in order to fix itself to the PCB temporary. Please make the hole
for these pins in the PCB under the condition described in board layout hole pattern.
TORX147(F,T)
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(6) Panel attachment
TORX147(F,T) has hole for panel attachment. Please be sure to attach it to panel with self−tapping
screw.
(7) Solvent
When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to
pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off
using cotton tips.
(8) Protective cap
When the TORX147(F,T) is not in use, attach the protective cap.
(9) Supply voltage
Use the supply voltage within the recommended operating condition (VCC = 2.7 to 3.6V). Make sure
that supply voltage does not exceed the maximum rating value of 4.5 V, even for an instant.
(10) Output
If the receiver output is at low and is connected to the power supply, or if the output is high and is
connected to GND, the internal IC may be destroyed.
(11) Soldering condition
Solder at 260°C or less for no more than ten seconds.
(12) Precautions when disposing of devices and packing materials.
When disposing devices and packing materials, follow the procedures stipulated by local regulations
in order to protect the environment against contamination.
(13) Precautions during use
Toshiba is continually working to improve the quality and the reliability of their products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical
sensitivity and their vulnerability to physical stress. It is the responsibility of the buyer, when
utilizing Toshiba products, to observe standards of safety, and to avoid situations in which the
malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to
property.
When developing equipment, please ensure that Toshiba products are used within the specified
operating ranges set forth in the most recent product specifications. Also, please keep in mind the
precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook.
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RESTRICTIONS ON PRODUCT USE
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the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
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