Datasheet 2.7V to 5.5V Input, 3.0A Integrated MOSFET Single Synchronous Buck DC/DC Converter BD9B304QWZ General Description Key Specifications BD9B304QWZ is a synchronous buck switching regulator with built-in low on-resistance power MOSFETs. This IC, which is capable of providing current up to 3A, features fast transient response by employing constant on-time control system. It offers high oscillating frequency at low inductance. With its original constant on-time control method which operates low consumption at light load, this product is ideal for equipment and devices that demand minimal standby power consumption. Input Voltage Range: 2.7V to 5.5V Output Voltage Range: 0.8 V to VIN x 0.8 V Output Current: 3A (Max) Switching Frequency: 2MHz/1MHz (Typ) High-Side MOSFET ON Resistance: 40m (Typ) Low-Side MOSFET ON Resistance: 40m (Typ) Standby Current: 0A (Typ) Package W (Typ) x D (Typ) x H (Max) 2.00mm x 2.00mm x 0.40mm UMMP008AZ020 Features Single Synchronous Buck DC/DC Converter Constant On-time Control Suitable to Deep-SLLM Over Current Protection Short Circuit Protection Thermal Shutdown Protection Under Voltage Lockout Protection UMMP008AZ020 Package (Backside Heat Dissipation) Applications Step-down Power Supply for DSPs, FPGAs, Microprocessors, etc. Laptop PCs/Tablet PCs/Servers LCD TVs Storage Devices (HDDs/SSDs) Printers, OA Equipment Distributed Power Supplies, Secondary Power Supplies UMMP008AZ020 Typical Application Circuit BD9B304QWZ VIN VIN BOOT Enable 10F EN 0.1F 0.1F VOUT SW GND 0.47H R2 MODE CFB 22F 22F FREQ FB R1 Figure 1. Application Circuit(MODE=L, FREQ=L) Product structure : Silicon monolithic integrated circuit .www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 14 * 001 This product has no designed protection against radioactive rays 1/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Pin Configuration (TOP VIEW) VIN 1 8 GND EN 2 7 FB BOOT 3 6 FREQ SW 4 5 MODE E-PAD Figure 2. Pin Configuration Pin Descriptions Pin No. Pin Name 1 VIN Power supply terminal for the switching regulator. This terminal supply power to the output stage and control circuit of the switching regulator. Connecting 0.1F and 10F ceramic capacitors are recommended. 2 EN Enable terminal. Turning this terminal signal Low (0.8V or lower) forces the device to enter the shutdown mode. Turning this terminal signal High (2.0V or higher) enables the device. This terminal must be terminated. 3 BOOT Terminal for bootstrap. Connect a bootstrap capacitor of 0.1 F between this terminal and SW terminal. The voltage of this terminal is the gate drive voltage of the High-Side MOSFET. SW Switch node. This terminal is connected to the source of the High-Side MOSFET and drain of the Low-Side MOSFET. Connect a bootstrap capacitor of 0.1 F between this terminal and BOOT terminal. In addition, connect an inductor considering the direct current superimposition characteristic. Use an inductor of 0.47H at FREQ=L or 1.0H at FREQ=H. MODE Terminal for setting switching control mode. Connecting this terminal to VIN forces the device to operate in the fixed frequency PWM mode. Connecting this terminal to ground enables the Deep-SLLM control and the mode is automatically switched between the Deep-SLLM control and fixed frequency PWM mode. Please fix this terminal to VIN or ground. 6 FREQ Terminal for setting switching frequency. Connecting this terminal to ground makes switching to operate constant on-time corresponding to 2MHz. Connecting this terminal to VIN makes switching to operate constant on-time corresponding to 1MHz. Please fix this terminal to VIN or ground. 7 FB 8 GND Ground terminal for the output stage of the switching regulator and the control circuit. - E-Pad A backside heat dissipation exposed pad. Connecting to the internal PCB ground plane by using multiple vias provides excellent heat dissipation characteristics. 4 5 Function An inverting input node for the error amplifier and main comparator. See page 21 for how to calculate the resistance of the output voltage setting. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 2/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Block Diagram 1 EN OCP SCP UVLO 2 VIN FB 3 BOOT 7 Error Amplifier Soft Start Main Comparator On Time Modulation Control Logic + DRV On Time 4 SW VOUT VREF GND 8 TSD 6 FREQ 5 MODE Figure 3. Block Diagram www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Description of Blocks VREF The VREF block generates the internal reference voltage. UVLO The UVLO block is for under voltage lockout protection. It will shut down the IC when VIN falls to 2.45 V (Typ) or lower. The threshold voltage has a hysteresis of 100mV (Typ). TSD The TSD block is for thermal protection. The thermal protection circuit shuts down the device when the internal temperature of IC rises to 175C (Typ) or higher. Thermal protection circuit resets when the temperature falls. The circuit has a hysteresis of 25C (Typ). Soft Start The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which allows the prevention of output voltage overshoot and inrush current. The internal soft start time is set to 1ms typically. Control Logic + DRV This block is a DC/DC driver. A signal from On Time block is applied to drive the MOSFETs. OCP/SCP After soft start is completed and in condition where output voltage is below 70% (Typ) of voltage setting, it counts the number of times of which current flowing in High side FET reaches over current limit. When 512 times is counted, it stops operation for 1ms (Typ) and re-operates. Counting is reset when output voltage is above 80% (Typ) of voltage setting or when IC re-operates by EN, UVLO, SCP function. Error Amplifier Error Amplifier adjusts Main Comparator input to make internal reference voltage equal to FB terminal voltage. Main Comparator Main comparator compares Error Amplifier output and FB terminal voltage. When FB terminal voltage becomes low, it outputs High and reports to the On Time block that the output voltage has dropped below control voltage. On Time This is a block which creates On Time. Requested On Time is created when Main Comparator output becomes High. On Time is adjusted to restrict frequency change even with I/O voltage change. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 4/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Absolute Maximum Ratings (Ta = 25C) Parameter Input Voltage EN Terminal Voltage Symbol Rating Unit VIN -0.3 to +7 V VEN -0.3 to +7 V MODE Terminal Voltage VMODE -0.3 to +7 V FREQ Terminal Voltage VFREQ -0.3 to +7 V VBOOT -0.3 to +14 V VBOOT -0.3 to +7 V Voltage from GND to BOOT Voltage from SW to BOOT FB Terminal Voltage VFB -0.3 to +7 V SW Terminal Voltage VSW -0.3 to VIN + 0.3 V Output Current IOUT 3.5 A Tjmax 150 C Tstg -55 to +150 C Maximum Junction Temperature Storage Temperature Range Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. Thermal Resistance(Note 1) Parameter Symbol Thermal Resistance (Typ) 1s(Note 3) 2s2p(Note 4) Unit UMMP008AZ020 Junction to Ambient JA 376.0 67.8 C/W Junction to Top Characterization Parameter(Note 2) JT 92.0 18.0 C/W (Note 1) Based on JESD51-2A(Still-Air) (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces 70m (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board 4 Layers Thermal Via(Note 5) Material Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top 2 Internal Layers Pitch - Diameter 0.30mm Bottom Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness Footprints and Traces 70m 74.2mm x 74.2mm 35m 74.2mm x 74.2mm 70m (Note 5) This thermal via connects with the copper pattern of all layers. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 5/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Recommended Operating Conditions Parameter Symbol Min Typ Max Unit VIN 2.7 - 5.5 V Operating Temperature Range Topr -40 - +85 C Output Current IOUT 0 - 3 A VRANGE 0.8 - VIN x 0.8 V Input Voltage Output Voltage Range Electrical Characteristics (Unless otherwise specified Ta=25C, VIN = 5V, VEN = 5V, VMODE = GND) Parameter Symbol Min Typ Max Unit Conditions 0 10 A VIN Pin Standby Supply Current ISTB Operating Supply Current ICC - 40 60 A VUVLO1 2.35 2.45 2.55 V VEN=GND VFREQ=VIN, IOUT=0mA Non switching VIN falling VUVLO2 2.425 2.55 2.7 V VIN rising VUVLOHYS 50 100 200 mV UVLO Detection Threshold Voltage UVLO Release Threshold Voltage UVLO Hysteresis - Enable EN Input High Level Voltage VENH 2.0 - VIN V EN Input Low Level Voltage VENL GND - 0.8 V IEN - 5 10 A VFB 0.792 0.8 0.808 V EN Input Current VEN=5V Reference Voltage, Error Amplifier FB Terminal Voltage FB Input Current IFB - - 1 A Soft Start Time tSS 0.5 1.0 2.0 ms VFRQH VIN-0.3 - VIN V VFB=0.8V Control FREQ Input High Level Voltage FREQ Input Low Level Voltage VFRQL GND - 0.3 V MODE Input High Level Voltage VMODEH VIN-0.3 - VIN V MODE Input Low Level Voltage VMODEL GND - 0.3 V On Time1 tONT1 96 120 144 ns On Time2 tONT2 192 240 288 ns High Side FET On Resistance RONH - 40 80 m Low Side FET On Resistance RONL - 40 80 m High Side Output Leakage Current ILH - 0 10 A No switching Low Side Output Leakage Current ILL - 0 10 A No switching VOUT=1.2V, VFREQ=GND, VMODE=VIN VOUT=1.2V, VFREQ=VIN, VMODE=VIN SW www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 6/28 VBOOT - VSW=5V TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Typical Performance Curves 60 10 55 9 50 8 45 VIN=5V 7 35 ISTB[A] ICC[A] 40 30 VIN=3.3V 25 5 4 20 VIN=5V 3 15 10 2 5 1 0 -40 -20 0 20 40 Temperature[C] 60 VIN=3.3V 0 80 -40 Figure 4. Operating Supply Current vs Temperature MODE=L 90 90 80 80 0 20 40 Temperature[C] 60 80 MODE=L 70 70 Efficiency[%] VOUT=1.0V 60 VOUT=1.2V 50 40 -20 Figure 5. Standby Supply Current vs Temperature 100 100 Efficiency[%] 6 MODE=H VOUT=1.5 V VOUT=1.0V 60 VOUT=1.2V 50 40 VOUT=1.5 V MODE=H 30 30 VOUT=1.8 V VOUT=1.8 V 20 20 10 10 0 0 0.001 0.01 0.1 Load Current[A] 1 0.001 10 Figure 6. Efficiency vs Load Current (VIN=5V, L=0.47H, FREQ=L) www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 0.01 0.1 Load Current[A] 1 10 Figure 7. Efficiency vs Load Current (VIN=5V, L=1.0H, FREQ=H) 7/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Typical Performance Curves - continued 0.808 2.6 0.806 2.56 Release VIN=5V 0.802 VFB[V] VUVLO1, VUVLO2[V] 0.804 0.8 VIN=3.3V 0.798 2.52 2.48 2.44 0.796 Detect 2.4 0.794 2.36 0.792 -40 -20 0 20 40 Temperature[C] 60 -40 80 Figure 8. FB Terminal Voltage vs Temperature -20 0 20 40 Temperature[C] 60 80 Figure 9. UVLO Detection Threshold Voltage, UVLO Release Threshold Voltage vs Temperature 2 7 1.9 1.8 6 UP 1.6 VIN=5V IEN[A] VEN[V] 1.7 VIN=3.3V 1.5 1.4 5 VEN=5V 4 1.3 DOWN 1.2 3 VIN=5V VIN=3.3V 1.1 1 2 -40 -20 0 20 40 Temperature[C] 60 80 -40 Figure 10. EN Threshold Voltage vs Temperature www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 -20 0 20 40 Temperature[C] 60 80 Figure 11. EN Input Current vs Temperature 8/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Typical Performance Curves - continued 3.5 3 3 VIN=5V 2.5 2 IFREQ[A] VFREQ[V] 2.5 VIN=5V VFREQ=5V VIN=3.3V 2 1.5 1.5 1 1 0.5 0.5 0 -40 -20 0 20 40 Temperature[C] 60 -40 80 0 20 40 Temperature[C] 60 80 Figure 12. FREQ Threshold Voltage vs Temperature Figure 13. FREQ Input Current vs Temperature 3.5 6 VIN=5V 3 5.5 2.5 5 VIN=3.3V IMODE[A] VMODE[V] -20 2 4.5 1.5 4 1 3.5 0.5 3 -40 -20 0 20 40 Temperature[C] 60 80 -40 Figure 14. MODE Threshold Voltage vs Temperature www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 VIN=5V VMODE=5V -20 0 20 40 Temperature[C] 60 80 Figure 15. MODE Input Current vs Temperature 9/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ 60 60 55 55 50 50 45 45 RONL[m] RONH[m] Typical Performance Curves - continued VIN=3.3V 40 35 VIN=3.3V 40 35 30 30 VIN=5V VIN=5V 25 25 20 20 -40 -20 0 20 40 Temperature[C] 60 80 -40 Figure 16. High Side FET On Resistance vs Temperature -20 60 80 Figure 17. Low Side FET On Resistance vs Temperature 2400 1200 MODE=H MODE=H 2000 1000 1600 800 fsw[kHz] fsw[kHz] 0 20 40 Temperature[C] 1200 800 600 400 400 MODE=L VIN=5V VOUT=1.2V FREQ=L 200 MODE=L 0 VIN=5V VOUT=1.2V FREQ=H 0 0 0.5 1 1.5 2 Load Current[A] 2.5 3 0 Figure 18. Switching Frequency vs Load Current www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 0.5 1 1.5 2 Load Current[A] 2.5 3 Figure 19. Switching Frequency vs Load Current 10/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ 2400 1200 2300 1150 2200 1100 2100 1050 fsw[kHz] fsw[kHz] Typical Performance Curves - continued 2000 1900 1000 950 VOUT=1.2V MODE=H FREQ=L IOUT=3A 1800 1700 VOUT=1.2V MODE=H FREQ=H IOUT=3A 900 850 1600 800 3 3.5 4 4.5 INPUT Voltage[V] 5 5.5 3 Figure 20. Switching Frequency vs Input Voltage 3.5 4 4.5 INPUT Voltage[V] 5 5.5 Figure 21. Switching Frequency vs Input Voltage 2 1.5 tSS[ms] VIN=3.3V 1 VIN=5V 0.5 0 -40 -20 0 20 40 Temperature[C] 60 80 Figure 22. Soft Start Time vs Temperature www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 11/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Typical Performance Curves - continued VIN 5V/div VIN 5V/div EN 5V/div EN 5V/div VOUT 1V/div VOUT 1V/div Time 1ms/div Time 1ms/div SW 5V/div SW 5V/div Figure 23. Power ON Waveform (EN=0V to 5V) (VOUT=1.2V, FREQ=H, RLOAD=0.4) Figure 24. Power OFF Waveform (EN=5V to 0V) (VOUT=1.2V, FREQ=H, RLOAD=0.4) VIN 5V/div VIN 5V/div EN 5V/div EN 5V/div VOUT 1V/div VOUT 1V/div Time 1ms/div Time 1ms/div SW 5V/div SW 5V/div Figure 25. Power ON Waveform (VIN = EN) (VOUT=1.2V, FREQ=H, RLOAD=0.4) www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Figure 26. Power OFF Waveform (VIN = EN) (VOUT=1.2V, FREQ=H, RLOAD=0.4) 12/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Typical Performance Curves - continued VOUT 20mV/div SW 2V/div VOUT 20mV/div SW 2V/div Time 1s/div Figure 27. Switching Waveform (VIN=5V, VOUT=1.2V, FREQ=L, IOUT=0.2A) Figure 28. Switching Waveform (VIN=5V, VOUT=1.2V, FREQ=L, IOUT=3A) VOUT 20mV/div VOUT 20mV/div SW 2V/div Time 1s/div SW 2V/div Figure 29. Switching Waveform (VIN=5V, VOUT=1.2V, FREQ=H, IOUT=0.2A) www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 Time 1s/div Time 1s/div Figure 30. Switching Waveform (VIN=5V, VOUT=1.2V, FREQ=H, IOUT=3A) 13/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ 1 1 0.8 0.8 0.6 0.6 Output Voltage Deviation[%] Output Voltage Deviation[%] Typical Performance Curves - continued 0.4 0.2 MODE=H 0 -0.2 MODE=L -0.4 -0.6 -0.8 0.4 MODE=L 0.2 0 -0.2 MODE=H -0.4 -0.6 -0.8 -1 -1 2.5 3 3.5 4 4.5 Input Voltage[V] 5 5.5 0 Figure 31. Line Regulation (VOUT=1.2V, L=1.0H, FREQ=H) 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 Load Current[A] Figure 32. Load Regulation (VIN=5V, VOUT=1.2V. L=1.0H, FREQ=H) VOUT 100mV/div VOUT 50mV/div IOUT 1A/div IOUT 1A/div Time 1ms/div Time 1ms/div Figure 33. Load Transient Response IOUT=0.1A-3A (VIN=5V, VOUT=1.2V, FREQ=L, MODE=L, COUT=22Fx2) www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 3 Figure 34. Load Transient Response IOUT=0A-3A (VIN=5V, VOUT=1.2V, FREQ=L, MODE=H, COUT=22Fx2) 14/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Function Explanations 1. Basic Operation (1) DC/DC Converter operation BD9B304QWZ is a synchronous rectifying step-down switching regulator that achieves faster load transient response by employing constant on-time control system. It utilizes switching operation in PWM (Pulse Width Modulation) mode for heavier load, while it utilizes Deep-SLLM (Simple Light Load Mode) control for lighter load to improve efficiency. Efficiency [%] Deep-SLLM Control PWM Control Output Current [A] Figure 35. Efficiency (Deep-SLLM Control and PWM Control) PWM Control Waveform Deep-SLLM Control Waveform VOUT 20mV/div VOUT 20mV/div SW 2.0V/div SW 2.0V/div Figure 36. Switching Waveform at Deep-SLLM Control (VIN =5.0V, VOUT=1.2V, IOUT=200mA, FREQ=H) www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 15/28 Figure 37. Switching Waveform at PWM Control (VIN=5.0V, VOUT=1.2V, IOUT=3A, FREQ=H) TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ (2) Enable Control The IC shutdown can be controlled by the voltage applied to the EN terminal. When V EN reaches 2.0 V(Min), the internal circuit is activated and the IC starts up. To enable shutdown control with the EN terminal, the shutdown interval (Low level interval of EN) must be set to 100 s or longer. Startup by EN must be at the same time or after the input of power supply voltage. VEN EN terminal VENH VENL 0 t VOUT Output setting voltage 0 t Soft start 1ms (Typ) Figure 38. Start Up and Shut Down with Enable (3) Soft Start When EN terminal is turned High, Soft Start operates and output voltage gradually rises. With the Soft Start Function, over shoot of output voltage and rush current can be prevented. Rising time of output voltage is 1ms(Typ). EN VOUT 0.8Vx90% 0.8V FB 1ms(Typ) Figure 39. Soft Start Timing Chart www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 16/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ 2. Protection The protective circuits are intended for prevention of damage caused by unexpected accidents. Do not use them for continuous protective operation. (1) Over Current Protection (OCP) / Short Circuit Protection (SCP) Setting of Over current protection is 5.5A (Typ). When OCP is triggered, over current protection is realized by restricting On / Off Duty of current flowing in upper MOSFET by each switching cycle. Also, if Over current protection operates 512 cycles in a condition where FB terminal voltage reaches below 70% of internal reference voltage, Short Circuit protection (SCP) operates and stops switching for 1ms(Typ) before it initiates restart. However, during startup, Short circuit protection will not operate even if the IC is still in the SCP condition. Table 1. Over Current Protection / Short Circuit Protection Function Over current EN terminal Startup protection While start up Valid More than 2.0V Startup completed Valid Less than 0.8V Invalid Short circuit protection Invalid Valid Invalid 1ms(Typ) VOUT 70% FB High side MOSFET gate Low side MOSFET gate OCP threshold Coil current Inside IC OCP signal 512 Cycle Figure 40. Short Circuit Protection (SCP) Timing Chart www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 17/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ (2) Under Voltage Lockout Protection (UVLO) The Under Voltage Lockout Protection circuit monitors the VIN terminal voltage. The operation enters standby when the VIN terminal voltage is 2.45V (Typ) or lower. The operation starts when the VIN terminal voltage is 2.55V (Typ) or higher. VIN UVLO OFF UVLO ON 0V hys VOUT Soft start FB terminal High side MOSFET gate Low side MOSFET gate Normal operation UVLO Normal operation Figure 41. UVLO Timing Chart (3) Thermal Shutdown When the chip temperature exceeds Tj=175C(Typ), the DC/DC converter output is stopped. Thermal protection circuit resets when the temperature falls. The circuit has a hysteresis of 25C (Typ). The thermal shutdown circuit is intended for shutting down the IC from thermal runaway in an abnormal state with the temperature exceeding Tjmax=150C. It is not meant to protect or guarantee the soundness of the application. Do not use the function of this circuit for application protection design. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 18/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Application Example VIN BD9B304QWZ C1 VIN GND EN FB C2 C8 BOOT FREQ SW MODE L1 VOUT C5 C6 R2 C10 R1 Figure 42. Application Circuit Part No. 1.0V Table 2. Recommended Component Values (VIN=5V, FREQ=H) VOUT Company 1.2V 1.5V 1.8V Part name R1 300k 150k 180k 120k ROHM MCR01MZPDxxxx R2 75k 75k 160k 150k ROHM MCR01MZPDxxxx C1(Note 1) 10F 10F 10F 10F Murata GRM21BB31A106ME18 C2(Note 2) 0.1F 0.1F 0.1F 0.1F Murata GRM155B11A104MA01D C5,C6 22F 22F 22F 22F Murata GRM21BB30J226ME38L C8(Note 3) 0.1F 0.1F 0.1F 0.1F Murata GRM155B11A104MA01D C10 120pF 120pF 150pF 180pF Murata L1 1.0H 1.0H 1.0H 1.0H TOKO GRM15 series FDSD0420 DFE252012C Part No. 1.0V Table 3. Recommended Component Values (VIN=5V, FREQ=L) VOUT Company 1.2V 1.5V 1.8V Part name R1 300k 150k 180k 120k ROHM MCR01MZPDxxxx R2 75k 75k 160k 150k ROHM MCR01MZPDxxxx C1(Note 1) 10F 10F 10F 10F Murata GRM21BB31A106ME18 C2(Note 2) 0.1F 0.1F 0.1F 0.1F Murata GRM155B11A104MA01D C5,C6 22F 22F 22F 22F Murata GRM21BB30J226ME38L C8(Note 3) 0.1F 0.1F 0.1F 0.1F Murata GRM155B11A104MA01D C10 100pF 100pF 100pF 120pF Murata L1 0.47H 0.47H 0.47H 0.47H TOKO GRM15 series FDSD0420 DFE252012C (Note 1) For capacitance of input capacitor take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no less than 4.7F (Note 2) Connect a 0.1F ceramic capacitor near to VIN terminal as much as possible. (Note 3) For capacitance of bootstrap capacitor take temperature characteristics, DC bias characteristics, etc. into consideration to set minimum value to no less than 0.047F. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 19/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Selection of Components Externally Connected About the application except the recommendation, please contact us. 1. Output LC Filter Constant In order to supply a continuous current to the load, the DC/DC converter requires an LC filter for smoothing the output voltage. Use inductors of values 0.47H at FREQ=L or 1.0H at FREQ=H. VIN IL Inductor saturation current > IOUTMAX +IL /2 L IOUT IL VOUT Driver Average inductor current COUT t Figure 43. Waveform of current through inductor Figure 44. Output LC filter circuit Inductor ripple current IL I L = VOUT x (V IN -VOUT ) x 1 = 912 V IN x f SW x L mA where VIN 5 V VOUT 1.2 V L 1.0 H fsw 1 MHz (SwitchingFrequency) The saturation current of the inductor must be larger than the sum of the maximum output current and 1/2 of the inductor ripple current IL. The output capacitor COUT affects the output ripple voltage characteristics. The output capacitor COUT must satisfy the required ripple voltage characteristics. The output ripple voltage can be represented by the following equation. V RPL = I L x (R ESR + 1 8 x C OUT x f SW ) V where RESR is the Equivalent Series Resistance(ESR) of the output capacitor. * The capacitor rating must allow a sufficient margin with respect to the output voltage. The output ripple voltage is decreased with a smaller ESR. Considering temperature and DC bias characteristics, please use ceramic capacitor of about 22F to 47F. * Be careful of total capacitance value, when additional capacitor CLOAD is connected in addition to output capacitor COUT. Use maximum additional capacitor CLOAD (Max) which satisfies the following condition. Maximum starting inductor ripple current I LSTART < Over Current limit 3.7 [A](min) Maximum starting inductor ripple current ILSTART can be expressed using the following equation. I LSTART = Maximum starting output current(I OMAX ) + Charge current to output capacitor( I CAP ) + www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 20/28 I L 2 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Charge current to output capacitor ICAP can be expressed using the following equation. I CAP = (C OUT + C LOAD ) x V OUT t SS A For example, given VIN= 5V, VOUT= 1.2V, L= 1.0H, switching frequency fSW = 800kHz(Min), Output capacitor COUT= 44F, Soft Start time tSS= 0.5ms(Min), and load current during soft start IOSS= 3A, maximum CLOAD can be computed using the following equation. C LOAD (max) < (3.7 - I OSS - I L /2) x t SS - C OUT 10.2 F V OUT * CLOAD has an effect on the stability of the DC/DC converter. To ensure the stability of the DC/DC converter, make sure that a sufficient phase margin is provided. 2. Output Voltage Setting The output voltage value can be set by the feedback resistance ratio. For stable operation, use feedback resistance R2 more than 20k. VOUT VOUT = R2 Error Amplifier R1 = FB R1 0.8V R1 + R2 x 0.8 R1 0.8 x R2 VOUT - 0.8 V 0.8 V VOUT ( VIN 0.8) V Figure 45. Feedback Resistor Circuit 3. FB Capacitor Generally, in fixed ON time control, sufficient ripple voltage in FB voltage is needed to operate comparator stably. Regarding this IC, by injecting ripple voltage to FB voltage inside IC it is designed to correspond to low ESR output capacitor. Please set the FB capacitor within the range of the following expression to inject an appropriate ripple. V OUT x (1 - V OUT ) V IN f SW x 7.65 x 10 3 V OUT x (1 < C FB < V OUT ) V IN f SW x 3.3 x 10 3 F VIN : Input VoltageV VOUT : Output VoltageV fSW : SwitchingFrequency Hz 4. Bootstrap Capacitor Connect a 0.1F ceramic capacitor between SW terminal and BOOT terminal. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 21/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ PCB Layout Design In the step-down DC/DC converter, a large pulse current flows into two loops. The first loop is the one into which the current flows when the High-Side FET is turned ON. The flow starts from the input capacitor C IN, runs through the FET, inductor L and output capacitor COUT and back to GND of CIN via GND of COUT. The second loop is the one into which the current flows when the Low-Side FET is turned on. The flow starts from the Low-Side FET, runs through the inductor L and output capacitor COUT and back to GND of the Low-Side FET via GND of COUT. Route these two loops as thick and as short as possible to allow noise to be reduced for improved efficiency. It is recommended to connect the input and output capacitors directly to the GND plane. The PCB layout has a great influence on all of the heat generation, noise and efficiency characteristics. VIN VOUT L MOS FET CIN COUT Figure 46. Current Loop of Buck Converter Accordingly, design the PCB layout considering the following points. Connect an input capacitor as close as possible to the IC VIN terminal and GND terminal on the same plane as the IC. If there is any unused area on the PCB, provide a copper foil plane for the GND node to assist heat dissipation from the IC and the surrounding components. Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the coil pattern as thick and as short as possible. Provide lines connected to FB far from the SW nodes. Place the output capacitor away from the input capacitor in order to avoid the effect of harmonic noise from the input. MODE FREQ FB Input Bypass Capacitor (0.1F) GND GND SW BOOT Input Bulk Capacitor (10F) EN VIN Output Capacitor Output Inductor VIN VOUT Backside Heat Dissipation Exposed Pad Enable Control Bootstrap Capacitor Signal VIA Thermal VIA Bottom Layer Line Figure 47. Example of PCB Layout www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 22/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ I/O Equivalence Circuits 2. EN 3. BOOT VIN VIN Internal circuits EN BOOT SW 4. SW 5. MODE BOOT VIN Internal circuits MODE SW 6. FREQ 7. FB VIN FREQ Internal circuits 10k FB Please refer to page6 for electrical characteristics of internal circuits. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 23/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 6. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 7. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 8. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 9. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 24/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Operational Notes - continued 10. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 11. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Resistor Transistor (NPN) Pin A Pin B C E Pin A N P+ P N N P+ N Pin B B Parasitic Elements N P+ N P N P+ B N C E Parasitic Elements P Substrate P Substrate GND GND Parasitic Elements GND Parasitic Elements GND N Region close-by Figure 48. Example of monolithic IC structure 12. Ceramic Capacitor When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 13. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and the maximum junction temperature rating are all within the Area of Safe Operation (ASO). 14. Thermal Shutdown Circuit(TSD) This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always be within the IC's maximum junction temperature rating. If however the rating is exceeded for a continued period, the junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation. Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat damage. 15. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in applications characterized by continuous operation or transitioning of the protection circuit. 16. Disturbance light In a device where a portion of silicon is exposed to light such as in a WL-CSP, IC characteristics may be affected due to photoelectric effect. For this reason, it is recommended to come up with countermeasures that will prevent the chip from being exposed to light. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 25/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Ordering Information B D 9 B 3 0 Part Number 4 Q W Z Package UMMP008AZ020 - E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams UMMP008AZ020 (TOP VIEW) Part Number Marking D9B LOT Number 3 0 4 1PIN MARK www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 26/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 UMMP008AZ020 27/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 BD9B304QWZ Revision History Date Revision 07.Feb.2017 001 002 Changes Not Release New Release www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ22111 * 15 * 001 28/28 TSZ02201-0F3F0AC00080-1-2 07.Feb.2017 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bd9b304qwz - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bd9b304qwz UMMP008AZ020 4000 4000 Taping inquiry Yes