Multilayer Ceramic Chip Capacitors
1 of 3
Creation Date : July 14, 2019 (GMT)
CGA5L3X7R2E473K160AA
TDK item description CGA5L3X7R2E473KT****
Applications Automotive Grade
Feature Mid Mid Voltage (100 to 630V)
AEC-Q200 AEC-Q200
Series CGA5(3216) [EIA 1206]
Status Production
Size
Length(L) 3.20mm ±0.20mm
Width(W) 1.60mm ±0.20mm
Thickness(T) 1.60mm ±0.20mm
Terminal Width(B) 0.20mm Min.
Terminal Spacing(G) 1.00mm Min.
Recommended Land Pattern (PA) 2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
Recommended Land Pattern (PB) 1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PC) 1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
Capacitance 47nF ±10%
Rated Voltage 250VDC
Temperature Characteristic X7R(±15%)
Dissipation Factor (Max.) 3%
Insulation Resistance (Min.) 10000MΩ
Other
Soldering Method Wave (Flow)
Reflow
AEC-Q200 Yes
Packing Blister (Plastic)Taping [180mm Reel]
Package Quantity 2000pcs
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Multilayer Ceramic Chip Capacitors
2 of 3
Creation Date : July 14, 2019 (GMT)
CGA5L3X7R2E473K160AA
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
CGA5L3X7R2E473K160AA
ESR
CGA5L3X7R2E473K160AA
Capacitance
CGA5L3X7R2E473K160AA
DC Bias Characteristic
CGA5L3X7R2E473K160AA
Temperature Characteristic
CGA5L3X7R2E473K160AA(No
Bias)
CGA5L3X7R2E473K160AA(DC Bias
= 125V )
Ripple Temperature Rising
CGA5L3X7R2E473K160AA(100kHz) CGA5L3X7R2E473K160AA(500kHz) CGA5L3X7R2E473K160AA(1MHz)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
Multilayer Ceramic Chip Capacitors
3 of 3
Creation Date : July 14, 2019 (GMT)
CGA5L3X7R2E473K160AA
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
