Multilayer Ceramic Chip Capacitors NMC-W Series FEATURES * HIGH CAPACITANCE (22F) AND VOLTAGE (8KV) * X7R DIELECTRIC (NPO in DEVELOPMENT) * IDEAL FOR HIGH CAPACITY SMPS AND DC-DC CONVERTERS * DESIGN FOR REFLOW SOLDERING * CASE SIZES 3530 TO 6560 Temperature Coefficient Capacitance Range Capacitance Tolerance Operating Temperature Range Temperature Characteristics Rated Voltages Dissipation Factor Aging Rate insulation Resistance X7R 1000pF ~ 22F 10% (K) & 20% (M) -55C ~ +125C 15% Cap. 50Vdc ~ 8KVdc < 2.5% 2.5% per decade 10Gigohm or 100Megohm/F whichever is less @ +25C 1. Rated Voltage < 500V: 200% of Rated Voltage for 5 1 sec., 50mA max. 2. Rated Voltage > 500 < 1KV: 150% of Rated Voltage for 5 1 sec., 50mA max. Dielectric Withstanding Voltage 3. 1KV < Rated Voltage < 5KV: 120% of Rated Voltage for 5 1 sec., 50mA max. 4. 5KV < Rated Voltage < 8KV: 100% of Rated Voltage for 5 1 sec., 50mA max. (immersed in insulating fluid) Test Conditions (EIA-198-2E) 1KHz, 1.0V 0.1Vrms (ALC on) X7R DIELECTRIC - STANDARD CASE SIZES AND VALUES EIA Case Size Length (L) 0.51 Width (W) 0.51 Thickness max. (T) Termination Width min. (P) Working Voltage (VDC) 50V 100V 200V 500V 1KV 2KV 3KV 4KV 5KV 8KV 3530 8.89 7.62 5.08 0.30 3640 4540 5550 6560 9.14 11.43 13.97 16.51 10.16 10.16 12.70 15.24 5.08 5.08 5.08 5.08 0.30 0.30 0.30 0.30 Maximum Capacitance Value (F) per Case Size 6.8F 8.2F 12F 18F 22F 4.7F 5.6F 6.8F 8.2F 18F 2.2F 2.2F 2.2F 2.7F 10F 0.47F 0.56F 1.0F 1.2F 4.7F 0.22F 0.27F 0.33F 0.39F 1.0F 0.047F 0.068F 0.1F 0.12F 0.33F 0.015F 0.022F 0.068F 0.082F 0.22F 0.1F 0.0056F 0.015F 0.027F 0.033F 0.0022F 0.01F 0.022F 0.027F 0.047F 0.001F 0.0012F 0.0015F 0.0018F 0.0022F Note: Contact NIC regarding other case sizes and values not shown. PART NUMBER SYSTEM NMC-W 3530 X7R 473 J 5KV T F CONSTRUCTION RoHS compliant W T = Tray Packaging Voltage (Vdc) Capacitance Tolerance Code (see chart) Capacitance Code, expressed in pF, first 2 digits are significant, 3rd digit is no. of zeros Temperature Characteristic Size Code (see chart) Series H P P L 100% Sn over Ni barrier (R) 50 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com Multilayer Ceramic Chip Capacitors RECOMMENDED LAND PATTERN DIM. (mm) A B C 3530 1.85 8.10 8.00 Size 4540 1.85 10.70 10.55 3640 1.85 8.40 10.55 5550 1.85 13.20 13.10 RECOMMENDED REFLOW PROFILE 6560 1.85 15.80 15.65 Component Outline A 300 Temperature - Deg. C Dimension NMC-W Series Peak Temp. 260C 250 Time above 250C 10 sec. max. 200 Time above 230C 50 sec. max. 150 100 Cooling 3C/sec. max. 50 25 Time above 215C 60 sec. max. Pre-heat 3 ~ 4 minutes 2C/second 0 C Time Land Pads B PCB ASSEMBLY PROCESS NOTES * Component (MLCC) transfer (from tray to PCB surface) by plastic tip tweezers is recommended. Metal tip tweeters are not suggested, as may cause damage to MLCC chip body * Component transfer (from tray to PCB) by vacuum pencil is not recommended * Reflow soldering is recommended solder attach process (see suggested reflow soldering profile above) * Do not use forced cooling of PCB or MLCC as risk for damage or thermal cracking to MLCC * Wave - Flow soldering is not recommended as risk for thermal cracking of MLCC * Hand soldering is not recommended for mass production * If hand soldering is used for bread boarding or prototyping, suggest hand soldering user follow NIC hand soldering guideline: LINK: www.niccomp.com/help/techinfo/ceramic_caps/handsoldering.pdf (R) NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com 51 Multilayer Ceramic Chip Capacitors NMC-W Series TRAY DIMENSIONS AND QUANTITY FIFTY (50) PIECE TRAY TWENTY-FIVE (25) PIECE TRAY CASE SIZE 3530 ~ 4045 CASE SIZE 5550 ~ 6560 F D F D G G E E C C A A B B J Tray Dimension A B C D E F G I J Tray Quantity 3530 J I 3640 137 123 14 21 3.0 3.0 3.0 20 12.0 50 pieces 4540 I 5550 6560 126 171 21 30 3.5 3.5 3.5 20 12.0 25 pieces (R) 52 NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com