50
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Multilayer Ceramic Chip Capacitors NMC-W Series
Temperature Coeffi cient X7R
Capacitance Range 1000pF ~ 22μF
Capacitance Tolerance 10% (K) & 20% (M)
Operating Temperature Range -55°C ~ +125°C
Temperature Characteristics ±15% Δ Cap.
Rated Voltages 50Vdc ~ 8KVdc
Dissipation Factor < 2.5%
Aging Rate 2.5% per decade
insulation Resistance 10Gigohm or 100Megohm/μF whichever is less @ +25°C
Dielectric Withstanding Voltage 1. Rated Voltage < 500V: 200% of Rated Voltage for 5 ± 1 sec., 50mA max.
2. Rated Voltage > 500 < 1KV: 150% of Rated Voltage for 5 ± 1 sec., 50mA max.
3. 1KV < Rated Voltage < 5KV: 120% of Rated Voltage for 5 ± 1 sec., 50mA max.
4. 5KV < Rated Voltage < 8KV: 100% of Rated Voltage for 5 ± 1 sec., 50mA max. (immersed in insulating fl uid)
Test Conditions (EIA-198-2E) 1KHz, 1.0V ±0.1Vrms (ALC on)
EIA Case Size 3530 3640 4540 5550 6560
Length (L) ± 0.51 8.89 9.14 11.43 13.97 16.51
Width (W) ± 0.51 7.62 10.16 10.16 12.70 15.24
Thickness max. (T) 5.08 5.08 5.08 5.08 5.08
Termination Width min. (P) 0.30 0.30 0.30 0.30 0.30
Working Voltage (VDC) Maximum Capacitance Value (μF) per Case Size
50V 6.8μF 8.2μF12μF18μF22μF
100V 4.7μF 5.6μF 6.8μF 8.2μF18μF
200V 2.2μF 2.2μF 2.2μF 2.7μF10μF
500V 0.47μF 0.56μF 1.0μF 1.2μF 4.7μF
1KV 0.22μF 0.27μF 0.33μF 0.39μF 1.0μF
2KV 0.047μF 0.068μF 0.1μF 0.12μF 0.33μF
3KV 0.015μF 0.022μF 0.068μF 0.082μF 0.22μF
4KV 0.0056μF 0.015μF 0.027μF 0.033μF 0.1μF
5KV 0.0022μF 0.01μF 0.022μF 0.027μF 0.047μF
8KV 0.001μF 0.0012μF 0.0015μF 0.0018μF 0.0022μF
X7R DIELECTRIC - STANDARD CASE SIZES AND VALUES
Note: Contact NIC regarding other case sizes and values not shown.
FEATURES
• HIGH CAPACITANCE (22μF) AND VOLTAGE (8KV)
• X7R DIELECTRIC (NPO in DEVELOPMENT)
• IDEAL FOR HIGH CAPACITY SMPS AND DC-DC CONVERTERS
• DESIGN FOR REFLOW SOLDERING
• CASE SIZES 3530 TO 6560
NMC-W 3530 X7R 473 J 5KV T F
RoHS compliant
T = Tray Packaging
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, fi rst 2 digits are
signifi cant, 3rd digit is no. of zeros
Temperature Characteristic
Size Code (see chart)
Series
PART NUMBER SYSTEM
PP
L
W
H
100% Sn over Ni barrier
CONSTRUCTION
51
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Multilayer Ceramic Chip Capacitors NMC-W Series
Component
Outline
Land Pads
A
B
C
Dimension Size
3530 3640 4540 5550 6560
A 1.85 1.85 1.85 1.85 1.85
B 8.10 8.40 10.70 13.20 15.80
C 8.00 10.55 10.55 13.10 15.65
RECOMMENDED LAND PATTERN DIM. (mm) RECOMMENDED REFLOW PROFILE
50
100
150
200
250
300
Time
Temperature - Deg. C
Pre-heat
3 ~ 4 minutes
2°C/second
25
0
Time above 250°C
10 sec. max.
Peak Temp. 260°C
Time above
230°C
50 sec. max. Cooling
3°C/sec. max.
Time above
215°C
60 sec. max.
PCB ASSEMBLY PROCESS NOTES
• Component (MLCC) transfer (from tray to PCB surface) by plastic tip
tweezers is recommended. Metal tip tweeters are not suggested, as may
cause damage to MLCC chip body
• Component transfer (from tray to PCB) by vacuum pencil is not recom-
mended
• Reflow soldering is recommended solder attach process (see suggested
reflow soldering profile above)
• Do not use forced cooling of PCB or MLCC as risk for damage or thermal
cracking to MLCC
• Wave - Flow soldering is not recommended as risk for thermal cracking
of MLCC
• Hand soldering is not recommended for mass production
• If hand soldering is used for bread boarding or prototyping, suggest hand
soldering user follow NIC hand soldering guideline:
LINK: www.niccomp.com/help/techinfo/ceramic_caps/handsoldering.pdf
52
®
NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com www.RFpassives.com www.SMTmagnetics.com
Tray Dimension 3530 3640 4540 5550 6560
A 137 126
B 123 171
C1421
D2130
E 3.0 3.5
F 3.0 3.5
G 3.0 3.5
I2020
J 12.0 12.0
Tray Quantity 50 pieces 25 pieces
Multilayer Ceramic Chip Capacitors NMC-W Series
TRAY DIMENSIONS AND QUANTITY
C
JIJI
A
B
E
C
FD
FIFTY (50) PIECE TRAY
CASE SIZE 3530 ~ 4045 TWENTY-FIVE (25) PIECE TRAY
CASE SIZE 5550 ~ 6560
FD
E
B
A
GG
