ADVANCED (R) Ball Grid Array Socketing System INTERCONNECTIONS (R) 5EnergyWay,P .O.Box1019,WestWarwick,RI02893USATel.800-424-9850/401-823-5200*Fax401-823-8723*Emailadvintcorp@aol.com*Internet BGAAdapters BGA Ball Grid Array BGA Adapter BGA Adapter Solder Joints BGA Adapter Socket BGA Adapter Socket PCB PCB Before Soldering Features: Soldering BGA to adapter subjects BGA to less thermal stress than soldering BGA to a mother board due to the adapters lower mass. Countersink in head of pin allows easy positioning of BGA onto adapter. Head above insulator in adapter allows visual inspection for solder shorts in both X & Y axis. Custom adapters available for heat sink attachment. Extraction slot for tool #5082-2 shown on page 163. AfterSoldering StandardAdapter (Mates with Standard Socket) BGA Body + .079/(2.0) .039/(1.0) B.G.A. Detail C ExtractionSlotAdapter (Mates with Extraction Slot & Guide Box Socket) Terminals: Brass - Copper Alloy 360, ASTM-B-16 BGA Body + .157/(4.0) .079/(2.0) B.G.A. Plating: Terminal TL: Tin Lead over Nickel Terminal G: Gold over Nickel Detail A HowToOrder 1FGAXXX638X Terminals Type-638 FR-4 only FootprintDash# If Applicable Type-647 Molded only .031/(0.78) Dia. C' Sink .182 (4.62) .018/(0.45) Dia. inch/(mm) Surface Mount Sockets BodyMaterial: FR-4 Glass Epoxy, U.L. Rated 94V-O .193 (4.90) .018/(0.45) Dia. BodyType F - FR-4 M - Molded Pitch B = .059 (1.5mm) Pitch G = .050 (1.27mm) Pitch A = Standard Adapter (BGA Body + .079(2mm)) AX = Extraction Slot Adapter (BGA Body + .157(4mm)) TerminalPlating G - Gold T - Tin TerminalType See Left NumberofPins 96 - 736 See BGA Footprint pages Rev. 14-A Page155