Note: This is a summary document. A complete document
is available under NDA. For more information, please
contact your local Atmel sales office.
1. Features
• Full Trusted Computing Group (TCG) Trusted
Platform Module (TPM) Version 1.2 Compatibility
• Compliant with TCG PC Client Specific TPM
Interface Specification Version 1.2
• Single-chip Turnkey Solution
• Hardware Asymmetric Crypto Engine
• 2048-bit RSA® Sign in 200ms
• AVR® RISC Microprocessor
• Internal EEPROM Storage for RSA Keys
• 33MHz LPC (Low Pin Count) Bus for Easy PC Interface
• Secure Hardware and Firmware Design and Chip Layout
• True Random Number Generator (RNG) – FIPS 140-2 Compliant
• NV Storage space for 1280-bytes of user defined data
• 3.3V Supply Voltage
• 28-lead Thin TSSOP, Wide TSSOP or 40-lead QFN Packages
• Offered in both Commercial (0 to 70°C) and Industrial (-40 to +85°C)
Temperature Ranges
2. Description
The Atmel® AT97SC3204 is a fully integrated security module designed to be
integrated into personal computers and other embedded systems. It implements
version 1.2 of the Trusted Computing Group (TCG) specification for Trusted Platform
Modules (TPM).
The TPM includes a cryptographic accelerator capable of computing a 2048-bit RSA
signature in 200ms and a 1024-bit RSA signature in 40ms. Performance of the SHA-1
accelerator is 20µs per 64-byte block.
The chip communicates with the PC through the LPC interface. The TPM supports SIRQ
(for interrupts) and CLKRUN to permit clock stopping for power savings in mobile
computers.
Trusted Platform
Module
Atmel AT97SC3204
LPC Interface
Summary
* See the full data sheet for
detailed design information
5294BS–TPM–9/10
2 Atmel AT24C256C
5294BS–TPM–9/10
Table 1-1. Pin Configurations
Pin Name Function
VCC 3.3V Supply Voltage
SB3V Standby 3.3V Supply Voltage
GND Ground
LRESET# PCI Reset Input Active Low
LAD0 LPC Command, Address, Data Line Input/Output
LAD1 LPC Command, Address, Data Line Input/Output
LAD2 LPC Command, Address, Data Line Input/Output
LAD3 LPC Command, Address, Data Line Input/Output
LCLK 33MHz PCI Clock Input
LFRAME# LPC FRAME Input
CLKRUN# PCI Clock Run Input/Output
LPCPD# LPC Power Down Input
SERIQ Serialized Interrupt Request Input/Output
GPIO6 General Purpose Input/Output
TestI Test Input (disabled)
TestBI Test Input (disabled)
ATest Atmel Test Pin
NC No Connect
NBO Not Bounded out
Atmel AT24C256C
3
5294BS–TPM–9/10
Figure 2-1. Pinout Diagrams
ATest
ATest
ATest
GND
SB3V
GPIO6
NC
TestI
TestBI
V
CC
GND
NBO
NBO
NBO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
LPCPD#
SERIRQ
LAD0
GND
V
CC
LAD1
LFRAME#
LCLK
LAD2
V
CC
GND
LAD3
LRESET#
CLKRUN#
28-pinThin TSSOP
4.4 mm x 9.7 mm Body
0.65 mm Pitch
28-pinTSSOP
6.1 mm x 9.7 mm Body
0.65 mm Pitch
40-pin QFN
6.0 mm x 6.0 mm Body
0.50 mm Pitch
ATest
ATest
LPCPD#
SERIRQ
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
NBO
CLKRUN#
LRESET#
ATest
GND
SB3V
GPIO6
NC
TestI
TestBI
V
CC
GND
NBO
LAD0
GND
V
CC
LAD1
LFRAME#
LCLK
LAD2
V
CC
GND
LAD3
1
2
3
4
5
6
7
8
9
10
30
29
28
27
26
25
24
23
22
21
11
12
13
14
15
16
17
18
19
20
40
39
38
37
36
35
34
33
32
31
4 Atmel AT24C256C
5294BS–TPM–9/10
Figure 2-2. Atmel AT97SC3204 Block Diagram
ROM
Program
EEPROM
Program
33MHz
LPC
Interface
GPIOGPIO6
AVR
8-bit RISC
CPU
SRAM
EEPROM
Data
CRYPTO
Engine
RNG
Timer
Physical
Security
Circuitry
The TPM includes a hardware random number generator, including a FIPS-approved Pseudo Random Number
Generator that is used for key generation and TCG protocol functions. The RNG is also available to the system to
generate random numbers that may be needed during normal operation.
The chip uses a dynamic internal memory management scheme to store multiple RSA keys. Other than the standard
TCG commands (TPM_FlushSpecific, TPM_Loadkey2), no system intervention is required to manage this internal key
cache.
The TPM is offered to OEM and ODM manufacturers as a turnkey solution, including the firmware integrated on the
chip. In addition, Atmel provides the necessary device driver software for integration into certain operating systems,
along with BIOS drivers. Atmel will also provide manufacturing support software for use by OEMs and ODMs during
initialization and verification of the TPM during board assembly.
Full documentation for TCG primitives can be found in the TCG TPM Main Specification, Parts 1 to 3, on the TCG Web
site located at https://www.trustedcomputinggroup.org. TPM features specific to PC Client platforms are specified in
the “TCG PC Client Specific TPM Interface Specification, Version 1.2”, also available on the TCG web site.
Implementation guidance for 32-bit PC platforms is outlined in the “TCG PC Client Specific Implementation
Specification for Conventional BIOS for TCG Version 1.2”, also available on the TCG web site.
Atmel AT24C256C
5
5294BS–TPM–9/10
3. Ordering Information
Table 1-2. Atmel AT24C256C Ordering Information
Atmel Ordering Code Package Operating Range
AT97SC3204(1) 28A2 (28-pin Thin TSSOP) Lead-free, RoHS Commercial (0°C to 70°C)
Industrial (-40°C to 85°C)
AT97SC3204
(1)
28A3 (28-pin TSSOP) Lead-free, RoHS Commercial (0°C to 70°C)
Industrial (-40°C to 85°C)
AT97SC3204
(1)
40ML1 (40-pin QFN)
(2)
Lead-free, RoHS Commercial (0°C to 70°C)
Industrial (-40°C to 85°C)
Notes: 1. Please see the Atmel AT97SC3204 datasheet addendum for the complete catalog number ordering code
6 Atmel AT24C256C
5294BS–TPM–9/10
4. Package Drawing
28A2 – Thin TSSOP
TITLE DRAWING NO.GPC REV.
Package Drawing Contact:
packagedrawings@atmel.com 28A228A2TFL B
28A2, 28-lead, 4.4x9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP)
6/17/08
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
D9.60 9.70 9.80 1,4
E6.40 BSC
E1 4.30 4.40 4.50 2,4
A1.20
A2 0.80 1.00 1.05
b0.19 0.30 3
e0.65 BSC
L0.45 0.60 0.75
L1 1.00 REF
This drawing is for general information only. Please refer to
JEDEC Drawing MO-153,Variation AE for additional information.
1. Dimension "D" does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions and gate burrs shall not exceed
.15mm (.006 in) per side.
2. Dimension "E1" does not include inter-lead flash or protrusions.
Inter-lead flash and protrusions shall not exceed .25mm (.010 in)
per side.
3. Dimension 'b' does not include Dambar protrusion. Allowable
Dambar protrusion shall be 0.08 mm total in excess of the 'b'
dimension at maximum material condition. Dambar cannot be
located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
4. Dimension 'D' and 'E1' to be determined at Datum Plane H.
ADA2
e
b
EE1
L
L1
Atmel AT24C256C
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5294BS–TPM–9/10
28A3 – TSSOP
2325 Orchard Parkway
San Jose, CA 95131
TITLE DRAWING NO.
R
REV.
1/8/02
COMM ON DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
D9.60 9.70 9.80 2, 5
E8.10 BSC
E1 6.00 6.10 6.20 3, 5
A
– –
1.20
A2 0.80 1.00 1.05
b0.19
–
0.30 4
e0.65 BSC
L0.45 0.60 0.75
L1 1.00 REF
28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch,
Thin Shrink Small Outline Package (TSSOP) 28A3
L1
A
L
DA2
EE1
e
b
Top V iew
Side View
End View
A
1. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional
information.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall
not exceed 0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed
0.25 mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of
the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum
space between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
Note:
8 Atmel AT24C256C
5294BS–TPM–9/10
40ML1 – QFN
2325 Orchard Parkway
San Jose, CA 95131
TITLE DRAWING NO.
R
REV.
A1
A3
A
A2
0
Side V iew
C40ML1
9/27/07
COMMO N DIMENSIONS
(Unit of Measure = mm)
SYMBOL MIN NOM MAX NOTE
D6.00 BSC
E6.00 BSC
D2 3.95 4.10 4.25
E2 3.95 4.10 4.25
A -0.85 0.90
A1 0.0 0.01 0.05
A2 - 0.65 0.70
A3 0.20 REF
L0.30 0.40 0.50
e 0.50 BSC
b0.18 0.23 0.30 2
D
E
Top View
N
2
3
1
Pin 1 Indicator
L
PIN1 ID
b
N
D2
3
2
1
e
Bot t om View
E2
1. This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper
dimensions, tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal
tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be
measured in that radius area.
Note:
40ML1, , 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded
Quad Flat No Lead Package (QFN) Punched
Atmel AT24C256C
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5294BS–TPM–9/10
5. Revision History
Doc. Rev. Date Comments
5294BS 10/2010 Added Industrial Grade support detail
5294AS 01/2008 Initial document release
Product Contact
Product Line
pcsecurity@atmel.com
Sales Contact
www.atmel.com/contacts
Literature Requests
www.atmel.com/literature
Atmel Corporation
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USA
Tel: (+1)(408) 441-0311
Fax: (+1)(408) 487-2600
www.atmel.com
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© 2010 Atmel Corporation. All rights reserved. / Rev.: 5294BS
−
TPM
−
10/10
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