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DESCRIPTION
RI-TMS3705ADR
SCBS863 – NOVEMBER 2003
LF BASE STATION IC
•Digital FSK Demodulator•Low Current Consumption in Sleep Mode •High Speed Data Transmission inSynchronous Mode•Automatic Transponder FrequencyMeasurement and Adaptation •Power on Reset•Diagnosis Function •PLL•Full Bridge Antenna Driver •Short Circuit Protection•Built in Band-Pass Filter and Limiter •Support of All TI-RFid™ LF TransponderFunctions
The LF base station IC TMS3705ADR allows efficient development and production of RFID readers for lowpower hand scanners, stationary readers and vehicle immobilizers. This base station IC drives the antenna of aTI-RFid™ transponder system to send data modulated on the antenna signal, and to detect and demodulate theresponse from the transponder. It allows also minimizing the external component count.
ORDERING INFORMATION
PACKAGE
(1)
Package/Pin count SO 16 (10 mm ×6 mm)Packing/Delivery Tape on Reel, 2500 units per reel
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.TI-RFid is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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ABSOLUTE MAXIMUM RATINGS
(1)
OPERATING CHARACTERISTICS
RI-TMS3705ADR
SCBS863 – NOVEMBER 2003
over operating free-air temperature range (unless otherwise noted)
RI-TMS3705ADR UNIT
Operating Voltage 4.5 to 5.5 DC VCharge Phase (without antenna load) typical 8 mA; max. 20 mACurrent Consumption
Sleep Mode (without I/O currents) typical 15 µA; max. 0.2 mAESD Protection (MILSTD 883, HBM ) –2000 to +2000 VOperating Temperature –40 to +85 °CStorage Temperature –40 to +100 (125 up to 1000hrs over lifetime) °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under Recommended OperatingConditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
over operating free-air temperature range (unless otherwise noted)
PART NUMBERPARAMETER UNITRI-TMS3705ADR
Operating Frequency Typical 134.2, FSK kHzInterface to Micro Controller Two wire multifunctional serial interface, 15625 baudAntenna Inductivity 400–700 recommended µH
2
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PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TMS3705A1DRG4 ACTIVE 16 Green (RoHS &
no Sb/Br) CU NIPDAU Level-3-260C-168 HR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Jan-2008
Addendum-Page 1
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