RB495D
40V, 350mA, SMD Schottky Diode
Small Signal Diode
Surface device type mounting
Mositure sensitivity level 1
Matte tin (Sn) lead finishe with Nickel (Ni) underplate
Pb-free version and RoHS compliant
Green compound (Halogen free) with suffix "G" on Min Max Min Max
packing code and prefix "G" on date code. 2.80 3.00 0.110 0.118
1.20 1.40 0.047 0.055
0.30 0.50 0.012 0.020
Case : SOT- 23 small outline plastic package 1.80 2.00 0.071 0.079
2.25 2.55 0.089 0.100
0.90 1.20 0.035 0.047
0.08 0.19 0.003 0.010
Marking:D3Q
Part No. Packing Code Package Packing Marking
RB495D RF SOT-23 3K / 7" Reel D3Q
RB495D RFG SOT-23 3K / 7" Reel D3Q
Note 2: The suggested land pattern dimensions have been provided for reference only,
as actual pad layouts may vary despending on application.
V
Junction Temperature TJ℃
125
Repetitive Peak Reverse Voltage
Reverse Voltage VR350
Ordering Information
High temperature soldering guaranted: 260℃/10s
Terminal: Matte tin plated, lead free, solderable
per MIL-STD-202, Method 208 guranteed
Note 1: Mean output current per element: IO/2.
Maximum Ratings
Rating at 25°C ambient temperature unless otherwise specified.
Mean Forward Current
Non-Repetitive Peak Forward Surge Current ( Note 1)
V
Features
Mechanical Data
Unit (inch)
Dimensions
Suggested PAD Layou
t
A
0.022 REF
C
B
D
E
SOT-23
Epitaxial planar die construction
Weight: 0.008 grams (approximate)
Unit (mm)
0.550 REF
H
G
F
mW
Type Number Symbol UnitsValue
Maximum Ratings
1.5
-40 ~+125
IFSM
25
VRRM 40
PD200Power dissipation
Storage Temperature Range
IO
TSTG
mA
A
℃
2.0
0.079
0.95
0.037
0.9
0.035
0.8
0.031
A
B
C
D
F
E
G
H
12
3
Version : E10
RB495D
40V, 350mA, SMD Schottky Diode
Small Signal Diode
Electrical Characteristics
Reverse Breakdown Voltage IR=
Forward Voltage IF=
IF=
Reverse Leakage Current VR=
Junction Capacitance
Carrier & Reel specification
Dimension(mm)
Mackin
g
User direction of Feed
Note 1: A0, B0, and K0 are determined by component size. The clearance between the components and the cavity must be
within 0.05 mm min. to 0.5 mm max. The component cannot rote more than 10o within the determined cavity.
Note 2: If B1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders.
Embossment center
Overall tape thickness
Tape width
Reel width
Feed hole width
Sprocke hole position
Punch hole position
Sprocke hole pitch
Item Symbol
Sprocket hole
Reel outside diameter
Carrier depth K
14.4 Max.
P1 2.00 ±0.10
T
W
W1
0.6 Max.
8.30 Max.
Type Number 100uA
10mA
25V
200mA
V
CJ
-
VF
IR
V(BR)
uA
pF50.0
0.55
VR=0, f=1.0MHz
Symbol
-
-
40
-
Min
178 ± 1
0.32
UnitsMax
-
70
P0 4.00 ±0.10
E 13.0 ± 0.5D2
F 3.50 ±0.05
V
1.75 ±0.10
Reel inner diameter
2.40 Max.
D1 50 Min.
1.50 +0.10D
A
Top Cover Tape
Carieer Tape
Any Additional Label (If Required)
TSC label
W1
D1D2
A
Version : E10
RB495D
40V, 350mA, SMD Schottky Diode
Small Signal Diode
Rating and Characteristic Curves
Macking
FIG 1 Typical Forward Characteristics
0.01
0.1
1
10
100
1000
0 0.2 0.4 0.6 0.8
Forward Current (m A)
FIG 3 Admissible Power Dissipation Curve
0
50
100
150
200
250
0 25 50 75 100 125 150
Power Dissipat ion (mW)
Ambient Temperature (°C)
Reverse Voltage (V)
FIG 4 Typical Junction Capacitance
0
10
20
30
40
50
60
70
0 5 10 15 20 25 30 35 40
Total Capac it anc e (pF )
Reverse Voltage (V)
Instantanceous Forward Voltage (V)
FIG 2 Reverse Current vs Reverse Voltage
0.1
1
10
100
1000
0 102030405060708090100
Reverse Current (nA)
Reverse Voltage (V)
Ta=75°
Ta=25°C
Ta=25°C
Ta=75°C
Version : E10
