Metallized Polyester Capacitors (MKT) Series/Type: B32559 The following products presented in this data sheet are being withdrawn. Ordering Code B32559C8102M489 B32559C8102M389 B32559C8102M289 Substitute Product Date of Withdrawal 2017-06-09 2017-06-09 2017-06-09 Deadline Last Orders 2017-09-15 2017-09-15 2017-09-15 Last Shipments 2017-12-15 2017-12-15 2017-12-15 Ordering Code B32559C8102M189 B32559C8102M001 B32559C8102M000 B32559C8102K489 B32559C8102K389 B32559C8102K289 B32559C8102K189 B32559C8102K001 B32559C8102K000 B32559C8102J489 B32559C8102J389 B32559C8102J289 B32559C8102J189 B32559C8102J001 B32559C8102J000 Substitute Product Date of Withdrawal 2017-06-09 2017-06-09 2017-06-09 2017-06-09 2017-06-09 2017-06-09 2017-06-09 2017-06-09 2017-06-09 2017-06-09 2017-06-09 2017-06-09 2017-06-09 2017-06-09 2017-06-09 Deadline Last Orders 2017-09-15 2017-09-15 2017-09-15 2017-09-15 2017-09-15 2017-09-15 2017-09-15 2017-09-15 2017-09-15 2017-09-15 2017-09-15 2017-09-15 2017-09-15 2017-09-15 2017-09-15 Last Shipments 2017-12-15 2017-12-15 2017-12-15 2017-12-15 2017-12-15 2017-12-15 2017-12-15 2017-12-15 2017-12-15 2017-12-15 2017-12-15 2017-12-15 2017-12-15 2017-12-15 2017-12-15 For further information please contact your nearest EPCOS sales office, which will also support you in selecting a suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales. Metallized polyester film capacitors (MKT) B32559C Compact design (stacked) Typical applications Energy saving lamps Dimensional drawing Climatic Max. operating temperature: 125 C Climatic category (IEC 60068-1): 55/125/56 Construction Dielectric: polyethylene terephthalate (polyester, PET) Stacked-film technology Heat shrinkable tube standard types B32559C*: polyester 100 m, 125 C Features Very small dimensions Self-healing properties High pulse strength Terminals Lead spacing 5.0 mm Crimped wire leads, lead-free tinned, lead length (6 1) mm Straight wire leads, lead-free tinned, lead length (6 1) mm Special lead length available on request Marking Manufacturer's logo, rated capacitance (coded), capacitance tolerance (code letter), rated AC voltage, date of manufacture (coded) Delivery mode Bulk (untaped) Taped (Ammo pack or reel) For notes on taping, refer to chapter "Taping and packing". Dimensions in mm Lead spacing 0.4 5.0 Detail specifications Homologated to IEC 60384-2 Please read Cautions and warnings and Important notes at the end of this document. Page 2 of 23 Lead diameter d1 0.5 B32559C Compact design (stacked) Overview of available types Lead spacing 5.0 mm Type B32559C Lead straight / crimped configuration Page 4 VR (V DC) 63 100 250 400 630 VRMS (V AC) 40 63 160 200 400 CR (F) 0.0010 0.0015 0.0022 0.0027 0.0033 0.0047 0.0068 0.0082 0.010 0.012 0.015 0.022 0.027 0.033 0.047 0.056 0.068 0.10 0.12 0.15 0.22 0.33 0.47 0.68 1.0 Please read Cautions and warnings and Important notes at the end of this document. Page 3 of 23 B32559C Compact design (stacked) Ordering codes and packing units VR VRMS CR f 60 Hz V DC V AC F 63 40 0.22 0.33 0.47 0.68 1.0 100 63 0.033 0.047 0.056 0.068 0.10 0.12 0.15 0.22 0.33 0.47 250 160 0.022 0.027 0.033 0.047 0.056 0.068 0.10 0.12 0.15 Max. dimensions wxhxl mm 3.0 x 6.5 x 7.0 3.0 x 6.5 x 7.0 3.5 x 7.0 x 7.0 3.5 x 8.5 x 7.0 4.0 x 10.5 x 7.0 3.0 x 6.5 x 7.0 3.0 x 6.5 x 7.0 3.0 x 7.0 x 7.0 3.0 x 7.0 x 7.0 3.0 x 7.0 x 7.0 3.0 x 7.0 x 7.0 3.0 x 7.0 x 7.0 3.5 x 8.5 x 7.0 3.5 x 8.5 x 7.0 3.5 x 9.0 x 7.0 3.0 x 7.0 x 7.0 3.0 x 7.0 x 7.0 3.0 x 7.0 x 7.0 3.0 x 7.0 x 7.0 3.0 x 7.0 x 7.0 3.5 x 7.0 x 7.0 3.5 x 9.0 x 7.0 4.5 x 9.0 x 7.0 4.5 x 10.0 x 7.0 Ordering code (composition see below) B32559C0224+*** B32559C0334+*** B32559C0474+*** B32559C0684+*** B32559C0105+*** B32559C1333+*** B32559C1473+*** B32559C1563+*** B32559C1683+*** B32559C1104+*** B32559C1124+*** B32559C1154+*** B32559C1224+*** B32559C1334+*** B32559C1474+*** B32559C3223+*** B32559C3273+*** B32559C3333+*** B32559C3473+*** B32559C3563+*** B32559C3683+*** B32559C3104+*** B32559C3124+*** B32559C3154+*** Ammo pack pcs./MOQ 11200 12000 12000 9200 9200 12000 12800 12000 12800 12800 12800 12800 11600 11600 10000 12800 12800 12000 12800 10800 10800 12000 7200 7200 Reel Untaped pcs./MOQ 9600 10400 10400 7600 7600 10400 11200 10400 11200 11200 11200 11200 10000 10000 8400 11200 11200 10400 11200 9200 9200 10400 5800 5600 pcs./MOQ 10000 10000 10000 8000 8000 12000 12000 12000 12000 12000 12000 12000 12000 12000 10000 12000 12000 12000 12000 1000 1000 8000 8000 8000 MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request. Composition of ordering code + = Capacitance tolerance code: M = 20% K = 10% J = 5% Please read Cautions and warnings and Important notes at the end of this document. *** = Packaging code: 489 = Ammo pack straight 389 = Reel straight 289 = Ammo pack crimped 189 = Reel crimped 000 = Untaped crimped (lead length 6 1 mm) 001 = Untaped (lead length 6 1 mm) Page 4 of 23 B32559C Compact design (stacked) Ordering codes and packing units VR VRMS CR f 60 Hz V DC V AC F 400 200 0.0068 0.0082 0.010 0.012 0.015 0.022 0.027 0.033 0.047 0.056 0.068 0.10 0.12 630 400 0.0010 0.0015 0.0022 0.0027 0.0033 0.0047 0.0068 0.0082 0.010 Max. dimensions wxhxl mm 3.0 x 7.0 x 7.0 3.0 x 7.0 x 7.0 3.0 x 7.5 x 7.0 3.0 x 7.5 x 7.0 3.0 x 7.5 x 7.0 3.0 x 8.0 x 7.0 3.0 x 8.0 x 7.0 3.5 x 8.0 x 7.0 3.5 x 9.5 x 7.0 4.0 x 10.0 x 7.0 5.0 x 10.0 x 7.0 5.5 x 12.5 x 7.0 5.5 x 13.0 x 7.0 3.0 x 7.0 x 7.0 3.0 x 7.0 x 7.0 3.0 x 8.0 x 7.0 3.0 x 8.0 x 7.0 3.5 x 8.0 x 7.0 3.5 x 8.0 x 7.0 3.5 x 10.5 x 7.0 3.5 x 10.5 x 7.0 4.0 x 10.5 x 7.0 Ordering code (composition see below) B32559C6682+*** B32559C6822+*** B32559C6103+*** B32559C6123+*** B32559C6153+*** B32559C6223+*** B32559C6273+*** B32559C6333+*** B32559C6473+*** B32559C6563+*** B32559C6683+*** B32559C6104+*** B32559C6124+*** B32559C8102+*** B32559C8152+*** B32559C8222+*** B32559C8272+*** B32559C8332+*** B32559C8472+*** B32559C8682+*** B32559C8822+*** B32559C8103+*** Ammo pack pcs./MOQ 12800 12800 12800 12000 11200 12800 10800 9200 9200 8000 7200 6000 6000 12800 12800 12800 12800 10000 12000 12000 12000 9200 Reel Untaped pcs./MOQ 11200 11200 11200 10400 9600 11200 9200 7600 7600 6400 5600 4400 4400 11200 11200 11200 11200 8400 10400 10400 10400 7600 pcs./MOQ 12000 12000 12000 12000 12000 12000 11200 10000 8000 6000 7200 7200 4800 12000 12000 12000 12000 8000 8000 8000 8000 8800 MOQ = Minimum Order Quantity, consisting of 4 packing units. Further E series and intermediate capacitance values on request. Composition of ordering code + = Capacitance tolerance code: M = 20% K = 10% J = 5% Please read Cautions and warnings and Important notes at the end of this document. *** = Packaging code: 489 = Ammo pack straight 389 = Reel straight 289 = Ammo pack crimped 189 = Reel crimped 000 = Untaped crimped (lead length 6 1 mm) 001 = Untaped (lead length 6 1 mm) Page 5 of 23 B32559C Compact design (stacked) Technical data Max. operating temperature Top,max +125 C Upper category temperature Tmax +125 C Lower category temperature Tmin 55 C Rated temperature TR +85 C Dissipation factor tan (in 10-3) at CR 0.1 F 0.1 F < CR 1 F at 20 C 1 kHz 8 10 (upper limit values) 10 kHz 15 20 100 kHz 30 VR CR 0.33 F CR > 0.33 F Insulation resistance Rins or time constant = CR Rins 100 V DC 3750 M 1250 s at 20 C, rel. humidity 65% 250 V DC 7500 M 2500 s (minimum as-delivered values) DC test voltage 1.4 VR, 2 s TA (C) DC voltage derating AC voltage derating Category voltage VC (continuous operation with VDC TA 85 VC = VR VC,RMS = VRMS or VAC at f 60 Hz) 85<TA125 VC = VR (165TA)/80 VC,RMS=VRMS (165TA)/80 TA (C) DC voltage (max. hours) AC voltage (max. hours) Operating voltage Vop for short operating periods TA 100 Vop = 1.25 VC (2000 h) Vop = 1.0 VC,RMS (2000 h) (VDC or VAC at f 60 Hz) 100<TA125 Vop = 1.25 VC (1000 h) Vop = 1.0 VC,RMS (1000 h) Damp heat test 56 days/40 C/93% relative humidity Limit values after damp Capacitance change C/C 5% heat test Dissipation factor change tan 5 10-3 (at 1 kHz) Insulation resistance Rins 50% of minimum or time constant = CR Rins as-delivered values Reliability: Failure rate 1 fit ( 1 10-9/h) at 0.5 VR, 40 C Service life tSL 200 000 h at 1.0 VR, 85 C For conversion to other operating conditions and temperatures, refer to chapter "Quality, 2 Reliability". Failure criteria: Total failure Short circuit or open circuit Failure due to variation Capacitance change C/C > 10% of parameters Dissipation factor tan > 2 upper limit value Insulation resistance Rins < 150 M (CR 0.33 F) or time constant = CR Rins < 50 s (CR > 0.33 F) Soldering conditions Maximum solder bath temperature 260 C Maximum soldering time 4s Operating temperature range Please read Cautions and warnings and Important notes at the end of this document. Page 6 of 23 B32559C Compact design (stacked) Pulse handling capability "dV/dt" represents the maximum permissible voltage change per unit of time for non-sinusoidal voltages, expressed in V/s. "k0" represents the maximum permissible pulse characteristic of the waveform applied to the capacitor, expressed in V2/s. Note: The values of dV/dt and k0 provided below must not be exceeded in order to avoid damaging the capacitor. dV/dt and k0 values VR (V DC) VRMS (V AC) k0 in V2/s dV/dt in V/s 63 40 250 30 000 100 63 300 60 000 250 160 400 200 000 400 200 600 500 000 630 400 800 1 000 000 Please read Cautions and warnings and Important notes at the end of this document. Page 7 of 23 B32559C Compact design (stacked) Impedance Z versus frequency f (typical values) Please read Cautions and warnings and Important notes at the end of this document. Page 8 of 23 B32559C Compact design (stacked) Permissible AC voltage VRMS versus frequency f (for sinusoidal waveforms, TA 55 C) For TA >55 C, please refer to "General technical information", section 3.2.3. Lead spacing 5 mm 63 V DC/40 V AC 100 V DC/63 V AC 250 V DC/160 V AC 400 V DC/200 V AC Please read Cautions and warnings and Important notes at the end of this document. Page 9 of 23 B32559C Compact design (stacked) Permissible AC voltage VRMS versus frequency f (for sinusoidal waveforms, TA 55 C) For TA >55 C, please refer to "General technical information", section 3.2.3. Lead spacing 5 mm 630 V DC/400 V AC Please read Cautions and warnings and Important notes at the end of this document. Page 10 of 23 B32559C Compact design (stacked) Permissible AC current IRMS versus frequency f Lead spacing 5 mm 63 V DC/40 V AC 100 V DC/63 V AC 250 V DC/160 V AC 400 V DC/200 V AC Please read Cautions and warnings and Important notes at the end of this document. Page 11 of 23 B32559C Compact design (stacked) Permissible AC current IRMS versus frequency f Lead spacing 5 mm 630 V DC/400 V AC Please read Cautions and warnings and Important notes at the end of this document. Page 12 of 23 B32559C Compact design (stacked) Mounting guidelines 1 Soldering 1.1 Solderability of leads The solderability of terminal leads is tested to IEC 60068-2-20, test Ta, method 1. Before a solderability test is carried out, terminals are subjected to accelerated ageing (to IEC 60068-2-2, test Ba: 4 h exposure to dry heat at 155 C). Since the ageing temperature is far higher than the upper category temperature of the capacitors, the terminal wires should be cut off from the capacitor before the ageing procedure to prevent the solderability being impaired by the products of any capacitor decomposition that might occur. Solder bath temperature 235 5 C Soldering time 2.0 0.5 s Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane Evaluation criteria: Visual inspection Wetting of wire surface by new solder 90%, free-flowing solder 1.2 Resistance to soldering heat Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1A. Conditions: Series Solder bath temperature Soldering time MKT boxed (except 2.5 x 6.5 x 7.2 mm) 260 5 C coated uncoated (lead spacing > 10 mm) MFP MKP (lead spacing > 7.5 mm) MKT boxed (case 2.5 x 6.5 x 7.2 mm) MKP (lead spacing 7.5 mm) MKT uncoated (lead spacing 10 mm) insulated (B32559) Please read Cautions and warnings and Important notes at the end of this document. Page 13 of 23 10 1 s 5 1 s <4s recommended soldering profile for MKT uncoated (lead spacing 10 mm) and insulated (B32559) B32559C Compact design (stacked) Immersion depth 2.0 +0/0.5 mm from capacitor body or seating plane Shield Heat-absorbing board, (1.5 0.5) mm thick, between capacitor body and liquid solder Evaluation criteria: Visual inspection C/C0 tan Please read Cautions and warnings and Important notes at the end of this document. No visible damage 2% for MKT/MKP/MFP 5% for EMI suppression capacitors As specified in sectional specification Page 14 of 23 B32559C Compact design (stacked) 1.3 General notes on soldering Permissible heat exposure loads on film capacitors are primarily characterized by the upper category temperature Tmax. Long exposure to temperatures above this type-related temperature limit can lead to changes in the plastic dielectric and thus change irreversibly a capacitor's electrical characteristics. For short exposures (as in practical soldering processes) the heat load (and thus the possible effects on a capacitor) will also depend on other factors like: Pre-heating temperature and time Forced cooling immediately after soldering Terminal characteristics: diameter, length, thermal resistance, special configurations (e.g. crimping) Height of capacitor above solder bath Shadowing by neighboring components Additional heating due to heat dissipation by neighboring components Use of solder-resist coatings The overheating associated with some of these factors can usually be reduced by suitable countermeasures. For example, if a pre-heating step cannot be avoided, an additional or reinforced cooling process may possibly have to be included. EPCOS recommends the following conditions: Pre-heating with a maximum temperature of 110 C Temperature inside the capacitor should not exceed the following limits: MKP/MFP 110 C MKT 160 C When SMD components are used together with leaded ones, the leaded film capacitors should not pass into the SMD adhesive curing oven. The leaded components should be assembled after the SMD curing step. Leaded film capacitors are not suitable for reflow soldering. Uncoated capacitors For uncoated MKT capacitors with lead spacings 10 mm (B32560/B32561) the following measures are recommended: pre-heating to not more than 110 C in the preheater phase rapid cooling after soldering Please read Cautions and warnings and Important notes at the end of this document. Page 15 of 23 B32559C Compact design (stacked) 2 Cleaning To determine whether the following solvents, often used to remove flux residues and other substances, are suitable for the capacitors described, refer to the table below: Type Ethanol, isopropanol, n-propanol MKT (uncoated) MKT, MKP, MFP (coated/boxed) Suitable n-propanol-water mixtures, water with surface tension-reducing tensides (neutral) Unsuitable Solvent from table A (see next page) Suitable Suitable Solvent from table B (see next page) In part suitable Unsuitable Even when suitable solvents are used, a reversible change of the electrical characteristics may occur in uncoated capacitors immediately after they are washed. Thus it is always recommended to dry the components (e.g. 4 h at 70 C) before they are subjected to subsequent electrical testing. Table A Manufacturers' designations for trifluoro-trichloro-ethane-based cleaning solvents (selection) Trifluoro-trichloroethane Freon TF Frigen 113 TR Arklone P Kaltron 113 MDR Flugene 113 Mixtures of trifluoro-trichloro-ethane with ethanol and isopropanol Freon TE 35; Freon TP 35; Freon TES Frigen 113 TR-E; Frigen 113 TR-P; Frigen TR-E 35 Arklone A; Arklone L; Arklone K Kaltron 113 MDA; Kaltron 113 MDI; Kaltron 113 MDI 35 Flugene 113 E; Flugene 113 IPA Manufacturer Du Pont Hoechst ICI Kali-Chemie Rhone-Progil Table B (worldwide banned substances) Manufacturers' designations for unsuitable cleaning solvents (selection) Mixtures of chlorinated hydrocarbons and ketones with fluorated hydrocarbons Freon TMC; Freon TA; Freon TC Arklone E Kaltron 113 MDD; Kaltron 113 MDK Flugene 113 CM Please read Cautions and warnings and Important notes at the end of this document. Page 16 of 23 Manufacturer Du Pont ICI Kali-Chemie Rhone-Progil B32559C Compact design (stacked) 3 Embedding of capacitors in finished assemblies In many applications, finished circuit assemblies are embedded in plastic resins. In this case, both chemical and thermal influences of the embedding ("potting") and curing processes must be taken into account. Our experience has shown that the following potting materials can be recommended: non-flexible epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum curing temperature of 100 C. Caution: Consult us first if you wish to embed uncoated types! Please read Cautions and warnings and Important notes at the end of this document. Page 17 of 23 B32559C Compact design (stacked) Cautions and warnings Do not exceed the upper category temperature (UCT). Do not apply any mechanical stress to the capacitor terminals. Avoid any compressive, tensile or flexural stress. Do not move the capacitor after it has been soldered to the PC board. Do not pick up the PC board by the soldered capacitor. Do not place the capacitor on a PC board whose PTH hole spacing differs from the specified lead spacing. Do not exceed the specified time or temperature limits during soldering. Avoid external energy inputs, such as fire or electricity. Avoid overload of the capacitors. The table below summarizes the safety instructions that must always be observed. A detailed description can be found in the relevant sections of the chapters "General technical information" and "Mounting guidelines". Topic Storage conditions Flammability Resistance to vibration Safety information Reference chapter "General technical information" Make sure that capacitors are stored within the 4.5 specified range of time, temperature and humidity "Storage conditions" conditions. Avoid external energy, such as fire or electricity 5.3 (passive flammability), avoid overload of the "Flammability" capacitors (active flammability) and consider the flammability of materials. Do not exceed the tested ability to withstand 5.2 vibration. The capacitors are tested to "Resistance to vibration" IEC 60068-2-6. EPCOS offers film capacitors specially designed for operation under more severe vibration regimes such as those found in automotive applications. Consult our catalog "Film Capacitors for Automotive Electronics". Please read Cautions and warnings and Important notes at the end of this document. Page 18 of 23 B32559C Compact design (stacked) Topic Safety information Soldering Do not exceed the specified time or temperature limits during soldering. Cleaning Use only suitable solvents for cleaning capacitors. Embedding of When embedding finished circuit assemblies in capacitors in plastic resins, chemical and thermal influences finished assemblies must be taken into account. Caution: Consult us first, if you also wish to embed other uncoated component types! Please read Cautions and warnings and Important notes at the end of this document. Page 19 of 23 Reference chapter "Mounting guidelines" 1 "Soldering" 2 "Cleaning" 3 "Embedding of capacitors in finished assemblies" B32559C Compact design (stacked) Symbols and terms Symbol C A C C CR C C/C C/CR dt t T tan V dV/dt V/t E ESL ESR f f1 f2 fr FD FT i IC English Heat transfer coefficient Temperature coefficient of capacitance Capacitor surface area Humidity coefficient of capacitance Capacitance Rated capacitance Absolute capacitance change Relative capacitance change (relative deviation of actual value) Capacitance tolerance (relative deviation from rated capacitance) Time differential Time interval Absolute temperature change (self-heating) Absolute change of dissipation factor Absolute voltage change Time differential of voltage function (rate of voltage rise) Voltage change per time interval Activation energy for diffusion Self-inductance Equivalent series resistance Frequency Frequency limit for reducing permissible AC voltage due to thermal limits German Warmeubergangszahl Temperaturkoeffizient der Kapazitat Kondensatoroberflache Feuchtekoeffizient der Kapazitat Kapazitat Nennkapazitat Absolute Kapazitatsanderung Relative Kapazitatsanderung (relative Abweichung vom Ist-Wert) Kapazitatstoleranz (relative Abweichung vom Nennwert) Differentielle Zeit Zeitintervall Absolute Temperaturanderung (Selbsterwarmung) Absolute Anderung des Verlustfaktors Absolute Spannungsanderung Differentielle Spannungsanderung (Spannungsflankensteilheit) Spannungsanderung pro Zeitintervall Aktivierungsenergie zur Diffusion Eigeninduktivitat Ersatz-Serienwiderstand Frequenz Grenzfrequenz fur thermisch bedingte Reduzierung der zulassigen Wechselspannung Frequency limit for reducing permissible Grenzfrequenz fur strombedingte AC voltage due to current limit Reduzierung der zulassigen Wechselspannung Resonant frequency Resonanzfrequenz Thermal acceleration factor for diffusion Therm. Beschleunigungsfaktor zur Diffusion Derating factor Deratingfaktor Current (peak) Stromspitze Category current (max. continuous Kategoriestrom (max. Dauerstrom) current) Please read Cautions and warnings and Important notes at the end of this document. Page 20 of 23 B32559C Compact design (stacked) Symbol IRMS iz k0 LS 0 test Pdiss Pgen Q R R Ri Rins RP RS S t T tan tan D tan P tan S TA Tmax Tmin tOL Top TR Tref tSL VAC English (Sinusoidal) alternating current, root-mean-square value Capacitance drift Pulse characteristic Series inductance Failure rate Constant failure rate during useful service life Failure rate, determined by tests Dissipated power Generated power Heat energy Density of water vapor in air Universal molar constant for gases Ohmic resistance of discharge circuit Internal resistance Insulation resistance Parallel resistance Series resistance severity (humidity test) Time Temperature Time constant Dissipation factor Dielectric component of dissipation factor Parallel component of dissipation factor Series component of dissipation factor Ambient temperature Upper category temperature Lower category temperature Operating life at operating temperature and voltage Operating temperature Rated temperature Reference temperature Reference service life AC voltage Please read Cautions and warnings and Important notes at the end of this document. German (Sinusformiger) Wechselstrom Inkonstanz der Kapazitat Impulskennwert Serieninduktivitat Ausfallrate Konstante Ausfallrate in der Nutzungsphase Experimentell ermittelte Ausfallrate Abgegebene Verlustleistung Erzeugte Verlustleistung Warmeenergie Dichte von Wasserdampf in Luft Allg. Molarkonstante fur Gas Ohmscher Widerstand des Entladekreises Innenwiderstand Isolationswiderstand Parallelwiderstand Serienwiderstand Scharfegrad (Feuchtetest) Zeit Temperatur Zeitkonstante Verlustfaktor Dielektrischer Anteil des Verlustfaktors Parallelanteil des Verlfustfaktors Serienanteil des Verlustfaktors Umgebungstemperatur Obere Kategorietemperatur Untere Kategorietemperatur Betriebszeit bei Betriebstemperatur und -spannung Beriebstemperatur Nenntemperatur Referenztemperatur Referenz-Lebensdauer Wechselspannung Page 21 of 23 B32559C Compact design (stacked) Symbol VC VC,RMS English Category voltage Category AC voltage VCD Vch VDC VFB Vi Vo Vop Vp Vpp VR Corona-discharge onset voltage Charging voltage DC voltage Fly-back capacitor voltage Input voltage Output voltage Operating voltage Peak pulse voltage Peak-to-peak voltage Impedance Rated voltage Amplitude of rated AC voltage R VRMS German Kategoriespannung (Sinusformige) Kategorie-Wechselspannung Teilentlade-Einsatzspannung Ladespannung Gleichspannung Spannung (Flyback) Eingangsspannung Ausgangssspannung Betriebsspannung Impuls-Spitzenspannung Spannungshub Nennspannung Amplitude der Nenn-Wechselspannung VSC Vsn (Sinusoidal) alternating voltage, root-mean-square value S-correction voltage Snubber capacitor voltage Z Impedance Spannung bei Anwendung "S-correction" Spannung bei Anwendung "Beschaltung" Scheinwiderstand Lead spacing Rasterma Please read Cautions and warnings and Important notes at the end of this document. (Sinusformige) Wechselspannung Page 22 of 23 Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule we are either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms and Conditions of Supply. 7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard. The IATF certifications confirm our compliance with requirements regarding the quality management system in the automotive industry. Referring to customer requirements and customer specific requirements ("CSR") TDK always has and will continue to have the policy of respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of unilateral requirements, we hereby like to emphasize that only requirements mutually agreed upon can and will be implemented in our Quality Management System. For clarification purposes we like to point out that obligations from IATF 16949 shall only become legally binding if individually agreed upon. 8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS, DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks. Release 2018-10 Page 23 of 23