SPEC NO: DSAA0540 REV NO: V.5 DATE: DEC/09/2 003 PAGE: 1 OF 4
APPROVED: J. Lu CHECKED: Allen Liu DRAWN: L.L.NIE
3.0x1.0 mm RIGHT ANGLE SMD CHIP
LED LAMP
Features
3.0mmx1.0mm RIGHT ANGLE SMT LED, 2.0mm
THICKNESS.
LOW POWER CONSUMPTION.
WIDE VIEWING ANGLE.
IDEAL FOR BACK LIGHT AND INDICATOR.
PACKAGE : 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.15(0.006") unless otherwise noted.
3. Specifications are subject to change without notice.
APA3010MGCK MEGA GREEN
Description
The Mega Green source color devices are made with
DH InGaAlP on GaAs substrate Light Emitting Diode.
SPEC NO: DSAA0540 REV NO: V.5 DATE: DEC/09/2 003 PAGE: 2 OF 4
APPROVED: J. Lu CHECKED: Allen Liu DRAWN: L.L.NIE
Selection Guide
Note:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at TA=25°C
Absolute Maximum Ratings at TA=25°C
Part No. Dice Lens Type
Iv (mcd)
@ 20mA
Viewing
Angle
Min. Typ. 2θ
θθθ1/2
APA3010MGCK MEGA GREEN (InGaAlP) WATER CLEAR 36 70 120°
Symbol Parameter Device Typ. Max. Test ConditionsUnits
λpeak Peak Wavelength Mega Green 574 nm IF=20mA
λDDominate Wavelength Mega Green 570 nm IF=20mA
∆λ1/2 Spectral Line Half-width Mega Green 20 nm IF=20mA
C Capacitance Mega Green 15 pF VF=0V;f=1MHz
VFForward Voltage Mega Green 2.1 2.5 V IF=20mA
IRReverse Current Mega Green 10 uA VR = 5V
Parameter Mega Green Units
Power dissipation 105 mW
DC Forward Current 30 mA
Peak Forward Current [1] 150 mA
Reverse Voltage 5 V
Operating/Storage Temperature -40°C To +85°C
SPEC NO: DSAA0540 REV NO: V.5 DATE: DEC/09/2 003 PAGE: 3 OF 4
APPROVED: J. Lu CHECKED: Allen Liu DRAWN: L.L.NIE
Mega Green APA3010MGCK
SPEC NO: DSAA0540 REV NO: V.5 DATE: DEC/09/2 003 PAGE: 4 OF 4
APPROVED: J. Lu CHECKED: Allen Liu DRAWN: L.L.NIE
APA3010MGCK
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and second soldering
process.
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)