UC1705
UC2705, UC3705
www.ti.com
SLUS370D –JULY 1995–REVISED MARCH 2012
HIGH SPEED POWER DRIVER
Check for Samples: UC1705,UC2705,UC3705
1FEATURES
• 1.5 A Source/Sink Drive • Low Quiescent Current
• 100 nsec Delay • 5 V to 40 V Operation
• 40 nsec Rise Fall into 1000 pF • Thermal Shutdown Protection
• Inverting and Non-Inverting Inputs • Minidip and Power Packages
• Low Cross-Conduction Current Spike
DESCRIPTION
The UC1705 family of power drivers is made with a high sppeed Schottky process to interface between low-level
control functions and high-power switching devices - particularly power MOSFETs. These devices are also an
optimum choise for capacitive line drivers where up to 1.5 A may be switched in either direction. With both
inverting and non-inverting inputs available, logic signals of either polarity may be accepted, or one input can be
used to gate or strobe the other.
Supply voltages for both VSand VCcan independently range from 5 V to 40 V. For additional application details,
see the UC1707/3707 data sheet (SLUS177).
The UC1705 is packaged in an 8-pin hermetically sealed CERDIP for -55°C to 125°C operation. The UC3705 is
specified for a temperature range of 0°C to 70°C and is available in either a plastic minidip or a 5-pin, power
TO-220 package.
TRUTH TABLE(1)(2)
INV N.I OUT
H H L
L H H
H L L
LLL
(1) OUT = INV and N.I.
(2) OUT = INV and N.i.
BLOCK DIAGRAM
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1995–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
2
1
3
V + V
C S
5
4
N.I. IN
INV. IN
GND
OUT
2
1
3
VC
6
4
N.I. IN
INV. IN
LOGIC
GND
N/C
7
8
5PWR
GND
OUT
VS
2
PWR GND
20
17
1 19
16
15
11
18
14
139 1210
3
OUT
VC
N/C
N/C
5
6
7
8
4
N/C
N/C
N/C
N/C
VS
N/C
N/C
N/C
N/C
INV. IN
N/C
LOGIC GND
N/C
N/C
N.I. IN
UC1705
UC2705, UC3705
SLUS370D –JULY 1995–REVISED MARCH 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
CONNECTION DIAGRAMS
DIL-8 MINIDIP, SOIC-8 5-PIN TO-220
(TOP VIEW) (TOP VIEW)
N, JG OR D PACKAGE T PACKAGE
xxx xxx
LCCC-20
(TOP VIEW)
FK PACKAGE
xxx
2Submit Documentation Feedback Copyright © 1995–2012, Texas Instruments Incorporated
Product Folder Link(s): UC1705 UC2705 UC3705
UC1705
UC2705, UC3705
www.ti.com
SLUS370D –JULY 1995–REVISED MARCH 2012
ABSOLUTE MAXIMUM RATINGS(1)
VALUE UNIT
N-Pkg JG-Pkg T-Pkg
Supply Voltage (VIN) 40 40 40 V
Collector Supply Voltage, VC40 40 40
Output current (source or sink)
Steady-State ±500 ±500 ±1 A
Peak Transient ±1.5 ±1 ±2 A
Capacitive Discharge Energy 20 15 50 µJ
Digital Inputs (2) 5.5 5.5 5.5 V
Power Dissipation at TA= 25°C (1) 1 1 3 W
Power Dissipation at TA(Lead/Case) = 25°C (1) 3 2 25 W
Operating Temperature Range 0 to 70 –55 to 125 0 to 70 °C
Storage temperaturee –65 to 150 –65 to 150 –65 to 150 °C
(1) All currents are positive into, negative out of the specified terminal.
(2) Digital Drive can exceed 5.5 V if the input current is limited to 10 mA
ELECTRICAL CHARACTERISTICS
Unless otherwise stated, these specifications apply for TA= –55°C to +125°C for the UC1705, –25°C to +85°C for the
UC2707, and 0°C to +70°C for the UC3705; VIN = VC= 20 V. TA= TJ.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VS= 40 V, outputs high, T package 6 8 mA
VSSupply current VC= 40 V, outputs low, T package 6 12 mA
VCSupply current (N, JG Only) VC= 40 V, outputs low 2 4 mA
VCLeakage current (N, JG Only) VS= 0, VC= 30 V 0.05 0.1 mA
Digital input low level 0.8 V
Digital input high level 2.2 V
Input current VI= 0 –0.6 –1 mA
Input leakage VI= 5 V 0.05 0.1 mA
IO= –50 mA 2
VC– VOOutput high saturation V
IO= –500 mA 2.5
IO= –50 mA 0.4
VOOutput low saturation V
IO= –500 mA 2.5
Thermal shutdown 155 °C
Copyright © 1995–2012, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): UC1705 UC2705 UC3705
UC1705
UC2705, UC3705
SLUS370D –JULY 1995–REVISED MARCH 2012
www.ti.com
TYPICAL SWITCHING CHARACTERISTICS
VIN = VC= 20 V, TA= 25°C. Delays measured to 10% output change.
PARAMETER TEST CONDITIONS OUTPUT CL = UNIT
From Inv. Input to Output open 1 2.2 nF
Rise time delay 60 60 60 ns
10% to 90% rise 20 40 60 ns
Fall time delay 60 60 60 ns
90% to 10% fall 25 40 50 ns
From N.I. Input to Output
Rise time delay 90 90 90 ns
10% to 90% rise 20 40 60 ns
Fall time delay 60 60 60 ns
90% to 10% fall 25 40 50 ns
VCcross-conduction current spike duration Output rise 25 ns
Output fall 0 ns
4Submit Documentation Feedback Copyright © 1995–2012, Texas Instruments Incorporated
Product Folder Link(s): UC1705 UC2705 UC3705
D2
D2
D1
D1
UC1705
UC2705, UC3705
www.ti.com
SLUS370D –JULY 1995–REVISED MARCH 2012
APPLICATION INFORMATION
D1, D2: UC3611 Schottky Diodes
Figure 1. Power MOSFET Drive Circuit
D1, D2: UC3611 Schottky Diodes
Figure 3. Transformer Coupled MOSFET DRIVE
Circuit
D1, D2: UC3611 Schottky Diodes
Figure 2. Power MOSFET Drive Circuit Using
Negative Bias Voltage and Level Shifting to
Ground Referenced PWMs
Figure 4. Charge Pump Circuit
Copyright © 1995–2012, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): UC1705 UC2705 UC3705
UC1705
UC2705, UC3705
SLUS370D –JULY 1995–REVISED MARCH 2012
www.ti.com
REVISION HISTORY
Changes from Revision C (December, 2011) to Revision D Page
• Deleted SN54BCT373 from title for FK package image ....................................................................................................... 2
6Submit Documentation Feedback Copyright © 1995–2012, Texas Instruments Incorporated
Product Folder Link(s): UC1705 UC2705 UC3705
PACKAGE OPTION ADDENDUM
www.ti.com 9-Mar-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9579801M2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9579801MPA ACTIVE CDIP JG 8 1 TBD Call TI Call TI
5962-9579801VPA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1705J ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1705J883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1705L883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC2705D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2705DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2705N ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2705NG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3705D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3705DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3705DTR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3705DTRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3705J ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC3705N ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3705NG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3705T ACTIVE TO-220 KC 5 50 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type
UC3705TG3 ACTIVE TO-220 KC 5 50 Green (RoHS
& no Sb/Br) CU SN N / A for Pkg Type
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
www.ti.com 9-Mar-2012
Addendum-Page 2
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1705, UC1705-SP, UC3705, UC3705M :
•Catalog: UC3705, UC1705, UC3705M, UC3705
•Military: UC1705
•Space: UC1705-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UC3705DTR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UC3705DTR SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
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