128Mb DDR SDRAM DDR SDRAM Specification Version 1.31 - 1 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Revision History Version 0 (May, 1998) - First version for internal review Version 0.1(June, 1998) - Added x4 organization Version 0.2(Sep,1998) 1. Added "Issue prcharge command for all banks of the device" as the fourth step of power-up squence. 2. In power down mode timing diagram, NOP condition is added to precharge power down exit. Version 0.3(Dec,1998) - Added QFC Function. - Added DC current value - Reduce I/O capacitance values Version 0.4(Feb,1999) -Added DDR SDRAM history for reference(refer to the following page) -Added low power version DC spec Version 0.5(Apr,1999) -Revised following first showing for JEDEC standard -Added DC target current based on new DC test condition Version 0.6(July 1,1999) 1.Modified binning policy From To -Z (133Mhz) -Z (133Mhz/266Mbps@CL=2) -8 (125Mhz) -Y (133Mhz/266Mbps@CL=2.5) -0 (100Mhz) -0 (100Mhz/200Mbps@CL=2) 2.Modified the following AC spec values From. -Z -0 -Z -Y -0 tAC +/- 0.75ns +/- 1ns +/- 0.75ns +/- 0.75ns +/- 0.8ns tDQSCK +/- 0.75ns +/- 1ns +/- 0.75ns +/- 0.75ns +/- 0.8ns tDQSQ +/- 0.5ns +/- 0.75ns +/- 0.5ns +/- 0.5ns +/- 0.6ns tDS/tDH 0.5 ns 0.75 ns 0.5 ns 0.5 ns 0.6 ns tCDLR*1 2.5tCK-tDQSS 2.5tCK-tDQSS 1tCK 1tCK 1tCK tPRE *1 tRPST *1 tHZQ*1 *1 To. 1tCK +/- 0.75ns 1tCK +/- 1ns 0.9/1.1 tCK 0.9/1.1 tCK 0.9/1.1 tCK tCK/2 +/- 0.75ns tCK/2 +/- 1ns 0.4/0.6 tCK 0.4/0.6 tCK 0.4/0.6 tCK tCK/2 +/- 0.75ns tCK/2 +/- 1ns +/- 0.75ns +/- 0.75ns +/-0.8ns : Changed description method for the same functionality. This means no difference from the previous version. 3.Changed the following AC parameter symbol From. To. Output data access time from CK/CK tDQCK tAC Version 0.61(August 9,1999) - Changed the some values of "write with auto precharge" table for different bank in page 31. Asserted command For Different Bank 3 4 Old New Old New Read Legal Illegal Legal Illegal Read + AP *1 Legal Illegal Legal Illegal - 2 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Revision History(continued) Version 0.7 (March, 2000) - Changed 128Mb spec from target to Preliminary version. - Changed partnames as follows. from to KM44L32031BT-G(L)Z/Y/0 K4H280438B-TC(L)A2/B0/A0 KM48L16031BT-G(L)Z/Y/0 K4H280838B-TC(L)A2/B0/A0 KM416L8031BT-G(L)Z/Y/0 K4H281638B-TC(L)A2/B0/A0 - Changed input cap. spec. from to CK/CK 2.5pF ~ 3.5pF 2.0pF ~ 3.0pF w/ Delta Cin = 0.25pF DQ/DQS/DM 4.0pF ~ 5.5pF 4.0pF ~ 5.0pF w/ Delta Cin = 0.5pF CMD/Addr 2.5pF ~ 3.5pF 2.0pF ~ 3.0pF with Delta Cin = 0.5pF - Changed operating condition. from to Vil/Vih(ac) Vref +/- 0.35V Vref +/- 0.31V V IL /VIH (dc) Vref +/- 0.18V Vref +/- 0.15V - Added Overshoot/Undershoot spec . Vih(max) = 4.2V, the overshoot voltage duration is 3ns at VDD. . Vil(min) =- 1.5V, the overshoot voltage duration is 3ns at VSS. - Changed AC parameters as follows. from to tDQSQ +/- 0.5(PC266), +/- 0.6(PC200) +0.5(PC266), +0.6(PC200) tDV +/- 0.35tCK - tQH - tHPmin - 0.75ns(PC266) Comments Removed New Definition tHPmin - 1.0ns(PC200) tHP - tCLmin or tCHmin New Definition - Added DC spec values. Version 0.71 (April, 2000) - Corrected a typo for tRAS at 133Mhz/CL2.5 from 48ns t0 45ns. - Corrected a typo in "General Information" table from 64Mx4 to 8Mx16. Version 0.72(May,2000) - Changed DC spec item & test condition Version 0.73(June,2000) - Added updated DC spec values - Deleted tDAL in AC parameter Version 1.0(July,2000) - Eliminate "preliminary" - 3 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Version 1.1(February,2001) - Updated DC current value. - Changed V I D(DC), Input differential voltage, CK and CK inputs min. from 0.3V to 0.36V. - Added V IX (DC), Input crossing point voltage, CK and CK inputs to 1.15V ~1.35V. - Added Output high/low current(I O H,IOL ) for half strength driver. - Added Pullup current to pulldown current ratio to 0.71 ~ 1.4. - Changed V I D(AC), Input differential voltage, CK and CK inputs min. from 0.62V to 0.7V. - Changed tCK max from 15ns to 12ns for all speed binning. - Changed tDQSH/tDQSL min. from 0.4tCK to 0.35tCK. - Added tHZ/tLZ(Data-out high/Low impedence time from CK/CK) - Added tQHS(Data hold skew factor) Version 1.2(February,2001) - Added tDSS/tDSH(DQS falling edge to/from CK rising - setup/hold time) - Added overshoot/undershoot spec Version 1.21(March,2001) - Added tSL(I), tSL(IO), tSL(O) Parameter Value Definition Min. tSL(I) Unit Max. Input Slew Rate(for input only) 0.5 tSL(IO) Input Slew Rate(for I/O pins) 0.5 V/ns tSL(O) Output Slew Rate(x4,x8) 1.0 4.5 V/ns tSL(O) Output Slew Rate(x16) 0.7 5 V/ns V/ns Version 1.22(March,2001) - Changed from supporting QFC function to not supporting QFC function(Deleted all QFC function supported) - Changed name and specification from IDD7 to IDD7A Description from to Orerating current - Four bank operation IDD7(50% of data changing at every burst) IDD7(100% of data changing at every burst) Version 1.23(July,2001) - Add derating values for the specifications if the single-ended clock skew rate is less than 1.0V/ns in page 49. Version 1.24(August,2001) -Fixed incorrect value of table in page 31, 'write with auto precharge'. - 4 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Version 1.3(October,2001) - Modificated typo. - Changed pin # 17 from NC to A13 in Package pinout. - Revised "Write with autoprecharge" table in page 29. - Added tIS and tPDEX parameters in "power down" timing of page 31. - Revised "Absolute maximum rating" table in page 38. . Changed "Voltage on VDDQ supply relative to VSS" value from -0.5~3.6V to -1~3.6V . Changed "power dissipation" value from 1.0W to 1.5W. - Revised AC parameter table From DDR266A To DDR266B DDR200 DDR266A DDR266B DDR200 Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. Min. Max. tHZ(DQ) tACmin -400ps tACmax -400ps tACmin -400ps tACmax -400ps tACmin -400ps tACmax -400ps -0.75 +0.75 -0.75 +0.75 -0.8 +0.8 tLZ(DQ) tACmin -400ps tACmax -400ps tACmin -400ps tACmax -400ps tACmin -400ps tACmax -400ps -0.75 +0.75 -0.75 +0.75 -0.8 +0.8 tHZ(DQS) -0.75 +0.75 -0.75 +0.75 -0.8 +0.8 tLZ(DQS) -0.75 +0.75 -0.75 +0.75 -1.1 -0.8 0.6 0.4 0.6 0.4 0.6 tWPST (tCK) 0.25 0.25 0.25 0.4 tPDEX 10ns 10ns 10ns 7.5ns 7.5ns 10ns Version 1.31(November,2001) - Deleted tHZ/tLZ of DQS - 5 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Contents Revision History General Information 1. Key Features 1.1 Features 1.2 Operating Frequencies 2. Package Pinout & Dimension 2.1 Package Pintout 2.2 Input/Output Function Description 2.3 66 Pin TSOP(II)/MS-024FC Package Physical Dimension 3. Functional Description 3.1 Simplified State Diagram 3.2 Basic Functionality 3.2.1 Power-Up Sequence 3.2.2 Mode Register Definition 3.2.2.1 Mode Register Set(MRS) 3.2.2.2 Extended Mode Register Set(EMRS) 3.2.3 Precharge 3.2.4 No Operation(NOP) & Device Deselect 3.2.5 Row Active 3.2.6 Read Bank 3.2.7 Write Bank 3.3 Essential Functionality for DDR SDRAM 3.3.1 Burst Read Operation 3.3.2 Burst Write Operation 3.3.3 Read Interrupted by a Read 3.3.4 Read Interrupted by a Write & Burst Stop 3.3.5 Read Interrupted by a Precharge 3.3.6 Write Interrupted by a Write - 6 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3.7 Write Interrupted by a Read & DM 3.3.8 Write Interrupted by a Precharge & DM 3.3.9 Burst Stop 3.3.10 DM masking 3.3.11 Read With Auto Precharge 3.3.12 Write With Auto Precharge 3.3.13 Auto Refresh & Self Refresh 3.3.14 Power Down 4. Command Truth Table 5. Functional Truth Table 6. Absolute Maximum Rating 7. DC Operating Conditions & Specifications 7.1 DC Operating Conditions 7.2 DC Specifications 8. AC Operating Conditions & Timming Specification 8.1 AC Operating Conditions 8.2 AC Overshoot/Undershoot specification 8.1.1 Overshoot/Undershoot specification for Address and Control Pins 8.1.2 Overshoot/Undershoot specification for Data Pins 8.3 AC Timming Parameters & Specification 9. AC Operating Test Conditions 10. Input/Output Capacitance 11. IBIS: I/V Characteristics for Input and Output Buffers 11.1 Normal strength driver 11.2 Half strength driver Timing Diagram - 7 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM List of tables Table 1 : Operating frequency and DLL jitter Table 2. : Column address configurtion Table 3 : Input/Output function description Table 4 : Burst address ordering for burst length Table 5 : Bank selection for precharge by bank address bits Table 6 : Operating description when new command asserted while read with auto precharge is issued Table 7 : Operating description when new command asserted while write with auto precharge is issued Table 8 : Command truth table Table 9-1 : Functional truth table Table 9-2 : Functional truth table (contiued) Table 9-3 : Functional truth table (contiued) Table 9-4 : Functional truth table (contiued) Table 9-5 : Functional truth table (cotinued) Table 10 : Absolute maximum raings Table 11 : DC operating condtion Table 12 : DC specification Table 13 : AC operating condition Table 14 : Overshoot/Undershoot specification for Address and Control Pins Table 15 : Overshoot/Undershoot specification for Data Pins Table 16 : AC timing parameters and specifications Table 17 : AC operating test conditions Table 18 : Input/Output capacitance Table 19 : Pull down and pull up current values(For normal strength driver) Table 20 : Pull down and pull up current values(For half strength driver) - 8 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM List of figures Figure 1 : 128Mb Package Pinout Figure 2 : Package dimension Figure 3 : State digram Figure 4 : Power up and initialization sequence Figure 5 : Mode register set Figure 6 : Mode register set sequence Figure 7 : Extend mode register set Figure 8 : Bank activation command cycle timing Figure 9 : Burst read operation timing Figure 10 : Burst write operation timing Figure 11 : Read interrupted by a read timing Figure 12 : Read interrupted by a write and burst stop timing Figure 13 : Read interrupted by a precharge timing Figure 14 : Write interrupted by a write timing Figure 15 : Write interrupted by a read and DM timing Figure 16 : Write interrupted by a precharge and DM timing Figure 17 : Burst stop timing Figure 18 : DM masking timing Figure 19 : Read with auto precharge timing Figure 20 : Write with auto precharge timing Figure 21 : Auto refresh timing Figure 22 : Self refresh timing Figure 23 : Power down entry and exit timing Figure 24 : AC overshoot/Undershoot Definition Figure 25 : AC overshoot/Undershoot Definition Figure 26 : Output Load Circuit (SSTL_2) Figure 27 : I / V characteristics for input/output buffers(For normal strength driver): pull-up(above) and pull-down(below) Figure 28 : I / V characteristics for input/output buffers(For half strength driver): pull-up(above) and pull-down(below) - 9 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM General Information Organization 32Mx4 16Mx8 8Mx16 1 2 133Mhz w/ CL=2 133Mhz w/ CL=2.5 100Mhz w/ CL=2 K4H280438B-TCA2 K4H280438B-TCB0 K4H280438B-TCA0 K4H280438B-TLA2 K4H280438B-TLB0 K4H280438B-TLA0 K4H280838B-TCA2 K4H280838B-TCB0 K4H280838B-TCA0 K4H280838B-TLA2 K4H280838B-TLB0 K4H280838B-TLA0 K4H281638B-TCA2 K4H281638B-TCB0 K4H281638B-TCA0 K4H281638B-TLA2 K4H281638B-TLB0 K4H281638B-TLA0 3 4 5 6 7 8 9 10 11 K 4 H XX XX X X X - X X XX Memory Speed DRAM Temperature & Power Small Classification Package Density and Refresh Version Organization Bank Interface (VDD & VDDQ) 1. SAMSUNG Memory : K 2. DRAM : 4 3. Small Classification H : DDR SDRAM 8. Version M A B C D E 4. Density & Refresh 64 : 64M 4K/64ms 28 : 128M 4K/64ms 56 : 256M 8K/64ms 51 : 512M 8K/64ms 1G : 1G 16K/32ms : 1st Generation : 2nd Generation : 3rd Generation : 4th Generation : 5th Generation : 6th Generation 9. Package T : TSOP2 (400mil x 875mil) 5. Organization 04 : x4 08 : x8 16 : x16 32 : x32 10. Temperature & Power C : (Commercial, Normal) L : (Commercial, Low) 11. Speed 6. Bank 3 : 4 Bank A0 : 10ns@CL2 A2 : 7.5ns@CL2 B0 : 7.5ns@CL2.5 7. Interface (VDD & VDDQ) 8: SSTL-2(2.5V, 2.5V) - 10 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 1. Key Features 1.1 Features * Double-data-rate architecture; two data transfers per clock cycle * Bidirectional data strobe(DQS) * Four banks operation * Differential clock inputs(CK and CK) * DLL aligns DQ and DQS transition with CK transition * MRS cycle with address key programs -. Read latency 2, 2.5 (clock) -. Burst length (2, 4, 8) -. Burst type (sequential & interleave) * All inputs except data & DM are sampled at the positive going edge of the system clock(CK) * Data I/O transactions on both edges of data strobe * Edge aligned data output, center aligned data input * LDM,UDM/DM for write masking only * Auto & Self refresh * 15.6us refresh interval(4K/64ms refresh) * Maximum burst refresh cycle : 8 * 66pin TSOP II package 1.2 Operating Frequencies - A2(DDR266A) - B0(DDR266B) - A0(DDR200) Speed @CL2 133MHz 100MHz 100MHz Speed @CL2.5 133MHz 133MHz - DLL jitter 0.75ns 0.75ns 0.8ns *CL : Cas Latency Table 1. Operating frequency and DLL jitter - 11 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 2. Package Pinout & Dimension 2.1 Package Pinout 8Mb x 16 16Mb x 8 32Mb x 4 VD D VD D V DD 1 66 VS S VS S V SS DQ 0 DQ 0 NC 2 65 NC DQ 7 DQ 15 VD D Q VD D Q VD D Q 3 64 VS S Q VS S Q V SSQ DQ 1 NC NC 4 63 NC NC DQ 14 DQ 2 DQ 1 DQ 0 5 62 DQ3 DQ 6 DQ 13 VS S Q VS S Q VS S Q 6 61 VDDQ V DDQ VD D Q DQ 3 NC NC 7 60 NC NC DQ 12 DQ 4 DQ 2 NC 8 59 NC DQ 5 DQ 11 VD D Q VD D Q VD D Q 9 58 VS S Q VS S Q V SSQ DQ 5 NC NC 10 NC NC DQ 10 DQ 6 DQ 3 DQ 1 11 56 DQ2 DQ 4 DQ 9 VS S Q VS S Q VS S Q 12 55 VDDQ V DDQ VD D Q DQ 7 NC NC 13 66 PIN TSOP(II) (400mil x 875mil) (0.65 mm PIN PITCH) 57 54 NC NC DQ 8 NC NC NC 14 53 NC NC NC VD D Q VD D Q VD D Q 15 Bank Address BA0-BA1 52 VS S Q VS S Q V SSQ LDQS NC NC 16 51 DQS DQS UDQS A13 A13 A13 17 50 NC NC NC VD D VD D V DD 18 49 VR E F VR E F V REF NC NC NC 19 48 VS S VS S V SS LDM NC NC 20 47 DM DM UDM WE WE WE 21 46 CK CK CK CAS CAS CAS 22 45 CK CK CK RAS RAS RAS 23 44 CKE CKE CKE CS CS CS 24 43 NC NC NC NC NC NC 25 42 NC NC NC BA 0 BA 0 BA 0 26 41 A1 1 A1 1 A 11 BA 1 BA 1 BA 1 27 40 A9 A9 A9 AP/A1 0 AP/A1 0 AP/A1 0 28 39 A8 A8 A8 A0 A0 A0 29 38 A7 A7 A7 A1 A1 A1 30 37 A6 A6 A6 A2 A2 A2 31 36 A5 A5 A5 A3 A3 A3 32 35 A4 A4 A4 VD D VD D V DD 33 34 VS S VS S V SS Row Address A0-A11 Auto Precharge A10 MS-024FC FIgure 1. 128Mb package Pinout Organization Column Address 32Mx4 A0-A9, A11 16Mx8 A0-A9 8Mx16 A0-A8 DM is internally loaded to match DQ and DQS identically. Table 2. Column address configuration - 12 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 2.2 Input/Output Function Description SYMBOL TYPE DESCRIPTION CK, CK Input Clock : CK and CK are differential clock inputs. All address and control input signals are sampled on the positive edge of CK and negative edge of CK . Output (read) data is referenced to both edges of CK. Internal clock signals are derived from CK/CK. CKE Input Clock Enable : CKE HIGH activates, and CKE LOW deactivates internal clock signals, and device input buffers and output drivers. Deactivating the clock provides PRECHARGE POWER-DOWN and SELF REFRESH operation (all banks idle), or ACTIVE POWER-DOWN (row ACTIVE in any bank). CKE is synchronous for all functions except for disabling outputs, which is achieved asynchronously. Input buffers, excluding CK, CK and CKE are disabled during power-down and self refresh modes, providing low standby power. CKE will recognize an LVCMOS LOW level prior to VREF being stable on power-up. CS Input Chip Select : CS enables(registered LOW) and disables(registered HIGH) the command decoder. All commands are masked when CS is registered HIGH. CS provides for external bank selection on systems with multiple banks. CS is considered part of the command code. RAS, CAS, WE Input Command Inputs : RAS , CAS and WE (along with CS) define the command being entered. *1 LDM,(U)DM Input Input Data Mask : DM is an input mask signal for write data. Input data is masked when DM is sampled HIGH along with that input data during a WRITE access. DM is sampled on both edges of DQS. DM pins include dummy loading internally, to matches the DQ and DQS loading. For the x16, LDM corresponds to the data on DQ0-DQ7 ; UDM correspons to the data on DQ8-DQ15. BA0, BA1 Input Bank Addres Inputs : BA0 and BA1 define to which bank an ACTIVE, READ, WRITE or PRECHARGE command is being applied. A [n : 0] Input Address Inputs : Provide the row address for ACTIVE commands, and the column address and AUTO PRECHARGE bit for READ/WRITE commands, to select one location out of the memory array in the respective bank. A10 is sampled during a PRECHARGE command to determine whether the PRECHARGE applies to one bank (A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by BA0, BA1. The address inputs also provide the op-code during a MODE REGISTER SET command. BA0 and BA1 define which mode register is loaded during the MODE REGISTER SET command (MRS or EMRS). *1 DQ I/O Data Input/Output : Data bus *1 LDQS,(U)DQS I/O Data Strobe : Output with read data, input with write data. Edge-aligned with read data, centered in write data. Used to capture write data. For the x16, LDQS corresponds to the data on DQ0-DQ7 ; UDQS corresponds to the data on DQ8-DQ15. NC - No Connect : No internal electrical connection is present. V DDQ Supply DQ Power Supply : +2.5V 0.2V. V SSQ Supply DQ Ground. V DD Supply Power Supply : +2.5V 0.2V (device specific). V SS Supply Ground. V REF Input SSTL_2 reference voltage. Table 3. Input/Output Function Description *1 : DQ, DQS, DM signals may be floated to V TT when no data is being transfened. - 13 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM E. 66pin TSOP-II Package Dimension 0.30 0.08 (10 x ) NOTE 1. ( ) IS REFERENCE 2. [ ] IS ASS'Y OUT QUALITY - 14 - 0.05 MIN 0.65TYP 0.65 0.08 (10.76) [ 0.075 MAX ] (R 0. 0.10 MAX ) (R 0. 15 (0.71) 25 (0.50) ) (R (4 x) 1.20MAX (10 x ) 5) 1.000.10 0.210 0.05 0.665 0.05 22.22 0.10 (R 0 .1 0.125 +- 00 .. 00 37 55 0. 25 ) (0.80) #33 (1.50) (10 x ) 0.45~0.75 (1.50) (10x) #1 11.760.20 (0.80) #34 10.160.10 #66 (0.50) Units : Millimeters 0.25TYP 0x ~8x REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3. Functional Description 3.1 Simplified State Diagram SELF REFRESH REFS REFSX MRS MODE REGISTER SET REFA AUTO REFRESH IDLE CKEL CKEH POWER DOWN ACT POWER DOWN CKEH CKE L ROW ACTIVE BURST STOP WRITE READ WRITEA READA READ WRITEA WRITE WRITEA READ READA READA PRE WRITEA READA PRE PRE POWER APPLIED POWER ON PRE PRE CHARGE Automatic Sequence Command Sequence WRITEA : Write with autoprecharge READA : Read with autoprecharge Figure 3. State diagram - 15 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.2 Basic Functionality 3.2.1 Power-Up and Initialization Sequence The following sequence is required for POWER UP and Initialization. 1. Apply power and attempt to maintain CKE at a low state(all other inputs may be undefined.) - Apply VDD before or at the same time as VDD Q. - Apply VDD Q before or at the same time as V TT & Vref. No power sequencing is specified during power up or power down given the following criteria: * V DD and V DDQ are driven from a single power converter output, and * V TT is limited to 1.44V (reflecting VDDQ(max)/2 + 50mV V REF variation +40m V V TT variation), and * V REF tracks V DDQ/2, and * A minimum resistance of 42 ohms(22 ohm series resistor + 22 ohm parallel resistor 5% tolerance) limits the input current from the V TT supply into any pin. If the above criteria cannot be met by the system design, the following table must be adhered to during power up: Voltage Description Sequencing Voltage Relationship to avoid latch-up VDDQ After or with VDD <VDD + 0.3V VTT After or with VDDQ < VDDQ +0.3V VREF After or with VDDQ <VDDQ +0.3V 2. Start clock and maintain stable condition for a minimum of 200us. 3. The minimum of 200us after stable power and clock(CK, CK), apply NOP & take CKE high. 4. Issue precharge commands for all banks of the device. 5. Issue EMRS to enable DLL.(To issue "DLL Enable" command, provide "Low" to A0, "High" to BA0 and "Low" to all of the rest address pins, A1~A11 and BA1) 6. Issue a mode register set command for "DLL reset". The additional 200 cycles of clock input is required to lock the DLL. (To issue DLL reset command, provide "High" to A8 and "Low" to BA0) *1 7. Issue precharge commands for all banks of the device. 8. Issue 2 or more auto-refresh commands. 9. Issue a mode register set command with low to A8 to initialize device operation. *1 Sequence of 6 & 7 is regardless of the order. Power up & Initialization Sequence 4 5 6 7 8 9 precharge ALL Banks 2 Clock min. EMRS 2 Clock min. MRS DLL Reset precharge ALL Banks tR P 11 12 13 1st Auto Refresh 14 15 16 17 t RFC tRFC 2nd Auto Refresh tRP Command 10 18 19 3 min.200 Cycle 2 2 Clock min. Mode Register Set Any Command 1 0 CK CK Figure 4. Power up and initialization sequence - 16 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.2.2 Mode Register Definition 3.2.2.1 Mode Register Set(MRS) The mode register stores the data for controlling the various operating modes of DDR SDRAM. It programs CAS latency, addressing mode, burst length, test mode, DLL reset and various vendor specific options to make DDR SDRAM useful for variety of different applications. The default value of the mode register is not defined, therefore the mode register must be written after EMRS setting for proper DDR SDRAM operation. The mode register is written by asserting low on CS, RAS, CAS, WE and BA0(The DDR SDRAM should be in all bank precharge with CKE already high prior to writing into the mode register). The states of address pins A0 ~ A11 in the same cycle as CS, RAS, CAS, WE and BA0 going low are written in the mode register. Two clock cycles are requested to complete the write operation in the mode register. The mode register contents can be changed using the same command and clock cycle requirements during operation as long as all banks are in the idle state. The mode register is divided into various fields depending on functionality. The burst length uses A0 ~ A2, addressing mode uses A3, CAS latency(read latency from column address) uses A4 ~ A6. A7 is used for test mode. A8 is used for DLL reset. A7 must be set to low for normal MRS operation. Refer to the table for specific codes for various burst lengths, addressing modes and CAS latencies. BA 1 BA 0 RFU 0 A 11 A 10 A9 RFU A8 A7 DLL TM A6 A5 A4 CAS Latency A3 A2 BT A1 A0 Burst Length A7 mode A3 Burst Type 0 No 0 Normal 0 Sequential 1 Yes 1 Test 1 Interleave A8 DLL Reset Address Bus Mode Register Burst Length CAS Latency BA 0 An ~ A 0 0 (Existing)MRS Cycle 1 Extended Funtions(EMRS) * RFU(Reserved for future use) should stay "0" during MRS cycle. A2 A1 A0 Reserved 0 0 Reserved 0 0 0 2 0 1 1 Reserved 0 0 Reserved 1 0 1 1 1 0 1 1 1 A6 A5 A4 Latency 0 0 0 0 0 1 0 1 0 1 Burst Length Sequential Interleave 0 Reserve Reserve 1 2 2 1 0 4 4 0 1 1 8 8 1 0 0 Reserve Reserve Reserved 1 0 1 Reserve Reserve 2.5 1 1 0 Reserve Reserve Reserved 1 1 1 Reserve Reserve Figure 5. Mode Register Set - 17 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Burst Address Ordering for Burst Length Burst Length Starting Address(A2, A1, A0) 2 4 8 Sequential Mode Interleave Mode xx0 0, 1 0, 1 xx1 1, 0 1, 0 x00 0, 1, 2, 3 0, 1, 2, 3 x01 1, 2, 3, 0 1, 0, 3, 2 x10 2, 3, 0, 1 2, 3, 0, 1 x11 3, 0, 1, 2 3, 2, 1, 0 000 0, 1, 2, 3, 4, 5, 6, 7 0, 1, 2, 3, 4, 5, 6, 7 001 1, 2, 3, 4, 5, 6, 7, 0 1, 0, 3, 2, 5, 4, 7, 6 010 2, 3, 4, 5, 6, 7, 0, 1 2, 3, 0, 1, 6, 7, 4, 5 011 3, 4, 5, 6, 7, 0, 1, 2 3, 2, 1, 0, 7, 6, 5, 4 100 4, 5, 6, 7, 0, 1, 2, 3 4, 5, 6, 7, 0, 1, 2, 3 101 5, 6, 7, 0, 1, 2, 3, 4 5, 4, 7, 6, 1, 0, 3, 2 110 6, 7, 0, 1, 2, 3, 4, 5 6, 7, 4, 5, 2, 3, 0, 1 111 7, 0, 1, 2, 3, 4, 5, 6 7, 6, 5, 4, 3, 2, 1, 0 Table 4. Burst address ordering for burst length DLL Enable/Disable The DLL must be enabled for normal operation. DLL enable is required during power-up initialization, and upon returing to normal operation after having disabled the DLL for the purpose of debug or evaluation (upon exiting Self Refresh Mode, the DLL is enabled automatically). Any time the DLL is enabled, 200 clock cycles must occur before a READ command can be issued. Output Drive Strength The normal drive strength for all outputs is specified to be SSTL_2, Class II. Some vendors might also support a weak driver strength option, intended for lighter load and/or point-to-point environments. I-V curves for the normal drive strength and weak drive strength will be included in a future revision of this document. Mode Register Set 0 1 2 3 4 5 6 7 8 CK CK *1 Mode Register Set Precharge All Banks Command t CK t RP*2 Any Command 2 Clock min. *1 : MRS can be issued only at all bank precharge state. *2 : Minimum tRP is required to issue MRS command. Figure 6. Mode Register Set sequence - 18 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.2.2.2 Extended Mode Register Set(EMRS) The extended mode register stores the data for enabling or disabling DLL, QFC and selecting output driver size. The default value of the extended mode register is not defined, therefore the extened mode register must be written after power up for enabling or disabling DLL. The extended mode register is written by asserting low on CS, RAS, CAS, WE and high on BA0(The DDR SDRAM should be in all bank precharge with CKE already high prior to writing into the extended mode register). The state of address pins A0 ~ A11 and BA1 in the same cycle as CS, RAS, CAS and WE going low are written in the extended mode register. Two clock cycles are required to complete the write operation in the extended mode register. The mode register contents can be changed using the same command and clock cycle requirements during operation as long as all banks are in the idle state. A0 is used for DLL enable or disable. "High" on BA0 is used for EMRS. All the other address pins except A0 and BA0 must be set to low for proper EMRS operation. Refer to the table for specific codes. BA 1 BA 0 RFU 1 BA 0 A 11 A1 0 A9 A8 A7 A6 A5 A4 A3 A2 RFU : Must be set "0" A1 A0 D.I.C DLL Address Bus Extended Mode Register Output Driver Impedence Control A0 DLL Enable 0 Normal 0 Enable 1 Weak 1 Disable An ~ A0 0 (Existing)MRS Cycle 1 Extended Funtions(EMRS) Figure 7. Extend Mode Register set - 19 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.2.3 Precharge The precharge command is used to precharge or close a bank that has been activated. The precharge command is issued when CS, RAS and WE are low and CAS is high at the rising edge of the clock. The precharge command can be used to precharge each bank respectively or all banks simultaneously. The bank select addresses(BA0, BA1) are used to define which bank is precharged when the command is initiated. For write cycle, tWR(min.) must be satisfied until the precharge command can be issued. After tRP from the precharge, an active command to the same bank can be initiated. Bank Selection for Precharge by Bank address bits A10/AP BA1 BA0 Precharge 0 0 0 Bank A Only 0 0 1 Bank B Only 0 1 0 Bank C Only 0 1 1 Bank D Only 1 X X All Banks Table 5. Bank selection for precharge by Bank address bits 3.2.4 No Operation(NOP) & Device Deselect The device should be deselected by deactivating the CS signal. In this mode DDR SDRAM should ignore all the control inputs. The DDR SDRAMs are put in NOP mode when CS is active and by deactivating RAS, CAS and WE. For both Deselect and NOP the device should finish the current operation when this command is issued. - 20 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.2.5 Row Active The Bank Activation command is issued by holding CAS and WE high with CS and RAS low at the rising edge of the clock(CK). The DDR SDRAM has four independent banks, so two Bank Select addresses(BA0, BA1) are required. The Bank Activation command must be applied before any Read or Write operation is executed. The delay from the Bank Activation command to the first read or write command must meet or exceed the minimum of RAS to CAS delay time(tRCD min). Once a bank has been activated, it must be precharged before another Bank Activation command can be applied to the same bank. The minimum time interval between interleaved Bank Activation commands(Bank A to Bank B and vice versa) is the Bank to Bank delay time(tRRD min). Bank Activation Command Cycle ( CAS Latency = 2) 0 1 Tn 2 Tn+1 Tn+2 CK CK Address Bank A Row Addr. Bank A Col. Addr. Bank B Row Addr. RAS-CAS delay(tRCD) Command Bank A Activate NOP Bank A Row. Addr. RAS-RAS delay time(tRRD) Write A with Auto Precharge Bank B Activate NOP Bank A Activate : Don t care ROW Cycle Time( tRC ) Figure 8. Bank activation command cycle timing 3.2.6 Read Bank This command is used after the row activate command to initiate the burst read of data. The read command is initiated by activating RAS, CS, CAS, and deasserting WE at the same clock sampling(rising) edge as described in the command truth table. The length of the burst and the CAS latency time will be determined by the values programmed during the MRS command. 3.2.7 Write Bank This command is used after the row activate command to initiate the burst write of data. The write command is initiated by activating RAS, CS, CAS, and WE at the same clock sampling(rising) edge as described in the command truth table. The length of the burst will be determined by the values programmed during the MRS command. - 21 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3 Essential Functionality for DDR SDRAM The essential functionality that is required for the DDR SDRAM device is described in this chapter 3.3.1 Burst Read Operation Burst Read operation in DDR SDRAM is in the same manner as the current SDRAM such that the Burst read command is issued by asserting CS and CAS low while holding RAS and WE high at the rising edge of the clock(CK) after tRCD from the bank activation. The address inputs (A0~A9) determine the starting address for the Burst. The Mode Register sets type of burst(Sequential or interleave) and burst length(2, 4, 8). The first output data is available after the CAS Latency from the READ command, and the consecutive data are presented on the falling and rising edge of Data Strobe(DQS) adopted by DDR SDRAM until the burst length is completed. < Burst Length=4, CAS Latency= 2, 2.5 > 0 1 2 3 4 5 6 7 8 NOP NOP NOP NOP NOP NOP NOP CK CK Command READ A DQS NOP t RPRE t RPST CAS Latency=2 DQ s Dout 0 Dout 1 Dout 2 Dout 3 DQS CAS Latency=2.5 DQ s Dout 0 Dout 1 Dout 2 Dout 3 Figure 9. Burst read operation timing - 22 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3.2 Burst Write Operation The Burst Write command is issued by having CS, CAS, and WE low while holding RAS high at the rising edge of the clock(CK). The address inputs determine the starting column address. There is no write latency relative to DQS required for burst write cycle. The first data of a burst write cycle must be applied on the DQ pins tDS(Data-in setup time) prior to data strobe edge enabled after tDQSS from the rising edge of the clock(CK) that the write command is issued. The remaining data inputs must be supplied on each subsequent falling and rising edge of Data Strobe until the burst length is completed. When the burst has been finished, any additional data supplied to the DQ pins will be ignored. < Burst Length=4 > 0 1 *1 2 3 4 5 6 7 8 NOP NOP NOP NOP CK CK Command DQS NOP WRITE A NOP WRITEB tDQSSmax NOP *1 t WPRES*1 DQ s Din 0 Din 1 Din 2 Din 3 Din 0 Din 1 Din 2 Din 3 Figure 10. Burst write operation timing 1. The specific requirement is that DQS be valid(High or Low) on or before this CK edge. The case shown (DQS going from High_Z to logic Low) applies when no writes were previously in progress on the bus. If a previous write was in progress, DQS could be High at this time, depending on tDQSS. - 23 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3.3 Read Interrupted by a Read A Burst Read can be interrupted before completion of the burst by new Read command of any bank. When the previous burst is interrupted, the remaining addresses are overridden by the new address with the full burst length. The data from the first Read command continues to appear on the outputs until the CAS latency from the interrupting Read command is satisfied. At this point the data from the interrupting Read command appears. Read to Read interval is minimum 1 Clock. < Burst Length=4, CAS Latency=2 > 0 1 2 3 4 5 6 7 8 NOP NOP NOP NOP NOP NOP CK CK Command READ A READ B NOP DQS CAS Latency=2 DQ s Dout A0 D out A 1 D out B 0 Dout B 1 Dout B2 Dout B 3 Figure 11. Read interrupted by a read timing 3.3.4 Read Interrupted by a Write & Burst Stop To interrupt a burst read with a write command, Burst Stop command must be asserted to avoid data contention on the I/O bus by placing the DQ's(Output drivers) in a high impedance state. To insure the DQ's are tristated one cycle before the beginning the write operation, Burst stop command must be applied at least 2 clock cycles for CL=2 and at least 3 clock cycles for CL=2.5 before the Write command. < Burst Length=4, CAS Latency=2 > 0 1 2 3 4 5 6 7 8 NOP NOP CK CK Command READ Burst Stop NOP WRITE NOP NOP NOP DQS CAS Latency=2 DQ s Dout 0 Dout 1 Din 0 Din 1 Din 2 Din 3 Figure 12. Read interrupted by a write and burst stop timing. The following functionality establishes how a Write command may interrupt a Read burst. 1. For Write commands interrupting a Read burst, a Burst Terminate command is required to stop the read burst and tristate the DQ bus prior to valid input write data. Once the Burst Terminate command has been issued, the minimum delay to a Write command = RU(CL) [CL is the CAS Latency and RU means round up to the nearest integer]. 2. It is illegal for a Write command to interrupt a Read with autoprecharge command. - 24 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3.5 Read Interrupted by a Precharge A Burst Read operation can be interrupted by precharge of the same bank. The minimum 1 clock is required for the read to precharge intervals. A precharge command to output disable latency is equivalent to the CAS latency. < Burst Length=8, CAS Latency=2 > 0 CK CK Command 1 2 3 4 5 6 7 8 1tCK READ Precharge NOP NOP NOP NOP NOP NOP NOP DQS CAS Latency=2 DQ s Dout 0 Dout 1 Dout 2 Dout 3 Dout 4 Dout 5 Dout 6 Dout 7 Interrupted by precharge Figure 13. Read interrupted by a precharge timing When a burst Read command is issued to a DDR SDRAM, a Precharge command may be issued to the same bank before the Read burst is complete. The following functionality determines when a Precharge command may be given during a Read burst and when a new Bank Activate command may be issued to the same bank. 1. For the earliest possible Precharge command without interrupting a Read burst, the Precharge command may be given on the rising clock edge which is CL clock cycles before the end of the Read burst where CL is the CAS Latency. A new Bank Activate command may be issued to the same bank after tRP (RAS Precharge time). 2. When a Precharge command interrupts a Read burst operation, the Precharge command may be given on the rising clock edge which is CL clock cycles before the last data from the interrupted Read burst where CL is the CAS Latency. Once the last data word has been output, the output buffers are tristated. A new Bank Activate command may be issued to the same bank after tRP. 3. For a Read with autoprecharge command, a new Bank Activate command may be issued to the same bank after tRP where tRP begins on the rising clock edge which is CL clock cycles before the end of the Read burst where CL is the CAS Latency. During Read with autoprecharge, the initiation of the internal precharge occurs at the same time as the earliest possible external Precharge command would initiate a precharge operation without interrupting the Read burst as described in 1 above. 4. For all cases above, tRP is an analog delay that needs to be converted into clock cycles. The number of clock cycles between a Precharge command and a new Bank Activate command to the same bank equals tRP/tCK (where tCK is the clock cycle time) with the result rounded up to the nearest integer number of clock cycles. (Note that rounding to X.5 is not possible since the Precharge and Bank Activate commands can only be given on a rising clock edge). In all cases, a Precharge operation cannot be initiated unless tRAS(min) [minimum Bank Activate to Precharge time] has been satisfied. This includes Read with autoprecharge commands where tRAS(min) must still be satisfied such that a Read with autoprecharge command has the same timing as a Read command followed by the earliest possible Precharge command which does not interrupt the burst. - 25 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3.6 Write Interrupted by a Write A Burst Write can be interrupted before completion of the burst by a new Write command, with the only restriction that the interval that separates the commands must be at least one clock cycle. When the previous burst is interrupted, the remaining addresses are overridden by the new address and data will be written into the device until the programmed burst length is satisfied. < Burst Length=4 > CK CK 0 1 2 3 4 5 6 7 8 NOP NOP NOP NOP NOP NOP 1tCK Command NOP WRITE A WRITE b DQS DQ s Din A0 Din A1 Din B0 Din B1 Din B2 Din B3 Figure 14. Write interrupted by a write timing - 26 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3.7 Write Interrupted by a Read & DM A burst write can be interrupted by a read command of any bank. The DQ's must be in the high impedance state at least one clock cycle before the interrupting read data appear on the outputs to avoid data contention. When the read command is registered, any residual data from the burst write cycle must be masked by DM. The delay from the last data to read command (tCDLR) is required to avoid the data contention DRAM inside. Data that are presented on the DQ pins before the read command is initiated will actually be written to the memory. Read command interrupting write can not be issued at the next clock edge of that of write command. < Burst Length=8, CAS Latency=2 > 0 1 2 3 4 5 6 7 8 READ NOP NOP NOP CK CK Command NOP WRITE NOP NOP NOP t CDLR tDQSSmax DQS CAS Latency=2 tWPRES* 5 DQ s Din 0 Din 1 Din 2 Din 3 t DQSSmin Din 4 Din 5 Din 6 Din 6 Din 7 Din 7 Dout 0 Dout 1 Dout 2 Do Dout 0 Dout 1 Dout 2 Do t CDLR DQS tWPRES* 5 CAS Latency=2 DQ s Din 0 Din 1 Din 2 Din 3 Din 4 Din 5 DM Figure 15. Write interrupted by a read and DM timing The following function established how a Read command may interrupt a Write burst and which input data is not written into the memory. 1. For Read commands interrupting a Write burst, the minimum Write to Read command delay is 2 clock cycles. The case where the Write to Read delay is 1 clock cycle is disallowed 2. For Read commands interrupting a Write burst, the DM pin must be used to mask the input data words whcich immediately precede the interrupting Read operation and the input data word which immediately follows the interrupting Read operation 3. For all cases of a Read interrupting a Write, the DQ and DQS buses must be released by the driving chip (i.e., the memory controller) in time to allow the buses to turn around before the DDR SDRAM drives them during a read operation. 4. If input Write data is masked by the Read command, the DQS input is ignored by the DDR SDRAM. 5. Refer to "3.3.2 Burst write operation" - 27 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3.8 Write Interrupted by a Precharge & DM A burst write operation can be interrupted before completion of the burst by a precharge of the same bank. Random column access is allowed. A write recovery time(tWR) is required from the last data to precharge command. When precharge command is asserted, any residual data from the burst write cycle must be masked by DM. < Burst Length=8 > CK CK Command 0 NOP 1 2 WRITE A NOP 3 4 NOP 5 NOP NOP 6 Precharge 7 WRITEB 8 NOP t DQSSmax DQS t WR tWPRES* 5 DQ s Dina0 Dina1 Dina2 Dina3 Dina4 Dina5 Dina6 Dina1 Dina2 Dina3 Dina4 Dina5 Dina6 Dina 7 Dina7 Dinb0 tDQSSmin DQS DQ s tWPRES* 5 Dina0 Dinb0 Dinb1 DM Figure 16. Write interrupted by a precharge and DM timing Precharge timing for Write operations in DRAMs requires enough time to allow "write recovery" which is the time required by a DRAM core to properly store a full "0" or "1" level before a Precharge operation. For DDR SDRAM, a timing parameter, tWR, is used to indicate the required amount of time between the last valid write operation and a Precharge command to the same bank. The precharge timing for writes is a complex definition since the write data is sampled by the data strobe and the address is sampled by the input clock. Inside the SDRAM, the data path is eventually synchronized with the address path by switching clock domains from the data strobe clock domain to the input clock domain. This makes the definition of when a precharge operation can be initiated after a write very complex since the write recovery parameter must reference only the clock domain that is used to time the internal write operation, i.e., the input clock domain. tWR starts on the rising clock edge after the last possible DQS edge that strobed in the last valid data and ends on the rising clock edge that strobes in the precharge command. 1. For the earliest possible Precharge command following a Write burst without interrupting the burst, the minimum time for write recovery is defined by tWR. 2. When a precharge command interrupts a Write burst operation, the data mask pin, DM, is used to mask input data during the time between the last valid write data and the rising clock edge on which the Precharge command is given. During this time, the DQS input is still required to strobe in the state of DM. The minimum time for write recovery is defined by tWR. - 28 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3. For a Write with autoprecharge command, a new Bank Activate command may be issued to the same bank after tWR+tRP where tWR+tRP starts on the rising DQS edge that strobed in the last valid data and ends on the rising clock edge that strobes in the Bank Activate command. During write with autoprecharge, the initiation of the internal precharge occurs at the same time as the earliest possible external Precharge command without interrupting the Write burst as described in 1 above. 4. In all cases, a Precharge operation cannot be initiated unless tRAS(min) [minimum Bank Activate to Precharge time] has been satisfied. This includes Write with autoprecharge commands where tRAS(min) must still be satisfied such that a Write with autoprecharge command has the same timing as a Write command followed by the earliest possible Precharge command which does not interrupt the burst. 5. Refer to "3.3.2 Burst write operation" 3.3.9 Burst Stop The burst stop command is initiated by having RAS and CAS high with CS and WE low at the rising edge of the clock(CK). The burst stop command has the fewest restrictions making it the easiest method to use when terminating a burst read operation before it has been completed. When the burst stop command is issued during a burst read cycle, the pair of data and DQS(Data Strobe) go to a high impedance state after a delay which is equal to the CAS latency set in the mode register. The burst stop command, however, is not supported during a write burst operation. < Burst Length=4, CAS Latency= 2, 2.5 > 0 1 2 3 4 5 6 NOP NOP NOP NOP 7 8 CK CK Command READ A Burst Stop NOP NOP NOP DQS CAS Latency=2 DQ s The burst ends after a delay equal to the CAS latency. Dout 0 Dout 1 DQS CAS Latency=2.5 DQ s Dout 0 Dout 1 Figure 17. Burst stop timing The Burst Stop command is a mandatory feature for DDR SDRAMs. The following functionality is required: 1. 2. 3. 4. 5. The BST command may only be issued on the rising edge of the input clock, CK. BST is only a valid command during Read bursts. BST during a Write burst is undefined and shall not be used. BST applies to all burst lengths. BST is an undefined command during Read with autoprecharge and shall not be used. - 29 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 6. When terminating a burst Read command, the BST command must be issued LBST ("BST Latency") clock cycles before the clock edge at which the output buffers are tristated, where L BST equals the CAS latency for read operations. This is shown in previous page Figure with examples for CAS latency (CL) of 1.5, 2, 2.5, 3 and 3.5 (only selected CAS latencies are required by the DDR SDRAM standards, the others are optional). 7. When the burst terminates, the DQ and DQS pins are tristated. The BST command is not byte controllable and applies to all bits in the DQ data word and the(all) DQS pin(s). 3.3.10 DM masking The DDR SDRAM has a data mask function that can be used in conjunction with data write cycle, not read cycle. When the data mask is activated (DM high) during write operation, DDR SDRAM does not accept the corresponding data.(DM to data-mask latency is zero). DM must be issued at the rising or falling edge of data strobe. < Burst Length=8 > CK CK Command 0 1 WRITE NOP 2 3 NOP NOP 4 5 6 7 8 NOP NOP NOP NOP NOP t DQSS DQS DQ s Din 0 Din 1 Din 2 Din 3 Din 4 Din 5 Din 6 Din7 DM masked by DM=H Figure 18. DM masking timing - 30 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3.11 Read With Auto Precharge If a read with auto-precharge command is initiated, the DDR SDRAM automatically enters the precharge operation BL/2 clock later from a read with auto-precharge command when tRAS(min) is satisfied. If not, the start point of precharge operation will be delayed until tRAS(min) is satisfied. Once the precharge operation has started the bank cannot be reactivated and the new command can not be asserted until the precharge time(tRP) has been satisfied. < Burst Length=4, CAS Latency= 2, 2.5> 0 1 2 3 4 5 6 7 8 NOP NOP NOP NOP NOP NOP CK CK BANK A ACTIVE Command READ A Auto Precharge NOP t RAS(min.) DQS CAS Latency=2 DQ s Dout 0 Dout 1 Dout 2 Dout 3 * Bank can be reactivated at the completion of precharge t RP DQS CAS Latency=2.5 DQ s Dout 0 Dout 1 Dout 2 Dout 3 Begin Auto-Precharge Figure 19. Read with auto precharge timing When the Read with Auto precharge command is issued, new command can be asserted at 3,4 and 5 respectively as follows, Asserted command For same Bank For Different Bank 3 4 5 3 4 5 READ READ + No AP *1 READ+ No AP Illegal Legal Legal Legal READ+AP READ + AP READ + AP Illegal Legal Legal Legal Active Illegal Illegal Illegal Legal Legal Legal Precharge Legal Legal Illegal Legal Legal Legal *1 : AP = Auto Precharge Table 6. Operating description when new command asserted while read with auto precharge is issued - 31 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3.12 Write with Auto Precharge If A10 is high when write command is issued , the write with auto-precharge function is performed. Any new command to the same bank should not be issued until the internal precharge is completed. The internal precharge begins after keeping tWR(min). < Burst Length=4 > 0 1 2 3 4 5 6 7 8 CK CK BANK A ACTIVE Command NOP WRITE A Auto Precharge NOP NOP NOP NOP NOP NOP DQS DQ s Din 0 Din 1 Din 2 * Bank can be reactivated at completion of t RP Din 3 t WR tRP Internal precharge start Figure 20. Write with auto precharge timing Burst length = 4 Asserted command For same Bank For Different Bank 3 4 5 6 7 8 3 4 5 6 7 WRITE+ WRITE No AP *1 WRITE+ No AP Illegal Illegal Illegal Illegal Legal Legal Legal Legal Legal WRITE+ AP WRITE+ AP WRITE+ AP Illegal Illegal Illegal Illegal Legal Legal Legal Legal Legal READ Illegal AP+DM *2 READ+NO AP+DM READ+ NO AP Illegal Illegal Illegal Illegal Illegal Legal Legal READ+AP Illegal READ + AP+DM READ + AP+DM READ + AP Illegal Illegal Illegal Illegal Illegal Legal Legal Active Illegal Illegal Illegal Illegal Illegal Illegal Legal Legal Legal Legal Legal Precharge Illegal Illegal Illegal Illegal Illegal Illegal Legal Legal Legal Legal Legal READ+NO *1 : AP = Auto Precharge *2 : DM : Refer to " 3.3.7 Write Interrupted by a Read & DM " in page 25. Table 7. Operating description when new command asserted while write with auto precharge is issued - 32 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3.13 Auto Refresh & Self Refresh Auto Refresh An auto refresh command is issued by having CS, RAS and CAS held low with CKE and WE high at the rising edge of the clock(CK). All banks must be precharged and idle for tRP(min) before the auto refresh command is applied. No control of the external address pins is required once this cycle has started because of the internal address counter. When the refresh cycle has completed, all banks will be in the idle state. A delay between the auto refresh command and the next activate command or subsequent auto refresh command must be greater than or equal to the tRFC(min). Auto Refresh PRE CMD Command CK CK CKE = High t RP t RFC Figure 21. Auto refresh timing Self Refresh Active Read CKE Self Refresh Command CK CK A self refresh command is defined by having CS, RAS, CAS and CKE held low with WE high at the rising edge of the clock(CK). Once the self refresh command is initiated, CKE must be held low to keep the device in self refresh mode. During the self refresh operation, all inputs except CKE are ignored. The clock is internally disabled during self refresh operation to reduce power consumption. The self refresh is exited by supplying stable clock input before returning CKE high, asserting deselect or NOP command and then asserting CKE high for longer than tXSR for locking of DLL. tXSA *1 t XSR*2 Figure 22. Self refresh timing 1. Exit self refresh to bank active command, a write command can be applied as far as tRCD is satisfied after any bank active command. 2. Exit self refresh to read command - 33 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 3.3.14 Power down The power down mode is entered when CKE is low and exited when CKE is high. Once the power down mode is initiated, all of the receiver circuits except clock, CKE and DLL circuit tree are gated off to reduce power consumption. All banks should be in idle state prior to entering the precharge power down mode and CKE should be set high at least 1tck+tIS prior to row active command . During power down mode, refresh operations cannot be performed, therefore the device cannot be remained in power down mode longer than the refresh period(Data retension time) of the device. Precharge power down Entry Active Active power down Entry Precharge Command CK CK Active power down Exit Read tIS CKE tP D E X Figure 23. Power down entry and exit timing - 34 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 4. Command Truth Table COMMAND CKEn CS RAS CAS WE X L L L L OP CODE 1, 2 X L L L L OP CODE 1, 2 L L L H X L H H H Register Extended MRS H Register Mode Register Set H Auto Refresh Refresh H Entry Self Refresh Exit H BA0,1 A 10/AP 3 3 H Bank Active & Row Addr. H Read & Column Address Auto Precharge Disable H Auto Precharge Enable H Write & Column Address Auto Precharge Disable L Burst Stop Precharge Bank Selection X X X X L L H H V X L H L H V X L H L L H X L H H L X L L H L All Banks Active Power Down Entry H L Exit L H Entry H L Precharge Power Down Mode Exit DM No operation (NOP) : Not defined L H H X X X L V V V X X X X H X X X L H H H H X X X L V V V H H X H H H X X Note 3 L L Auto Precharge Enable A 11, A 9 ~ A0 CKEn-1 Row Address L H X X X L H H H Column Address (A 0~A 9) 4 Column Address (A 0~A 9) 4 X V L X H 4 4, 6 7 X 5 X X X H Table 8. Command truth table V 3 X 8 9 9 (V=Valid, X=Don t Care, H=Logic High, L=Logic Low) 1. OP Code : Operand Code. A 0 ~ A 11 & BA 0 ~ BA1 : Program keys. (@EMRS/MRS) 2.EMRS/ MRS can be issued only at all banks precharge state. A new command can be issued 2 clock cycles after EMRS or MRS. 3. Auto refresh functions are same as the CBR refresh of DRAM. The automatical precharge without row precharge command is meant by "Auto". Auto/self refresh can be issued only at all banks precharge state. 4. BA0 ~ BA 1 : Bank select addresses. If both BA0 and BA1 are "Low" at read, write, row active and precharge, bank A is selected. If both BA0 is "High" and BA 1 is "Low" at read, write, row active and precharge, bank B is selected. If both BA0 is "Low" and BA 1 is "High" at read, write, row active and precharge, bank C is selected. If both BA0 and BA1 are "High" at read, write, row active and precharge, bank D is selected. 5. If A 10 /AP is "High" at row precharge, BA 0 and BA 1 are ignored and all banks are selected. 6. During burst write with auto precharge, new read/write command can not be issued. Another bank read/write command can be issued after the end of burst. New row active of the associated bank can be issued at t RP after the end of burst. 7. Burst stop command is valid at every burst length. 8. DM sampled at the rising and falling edges of the DQS and Data-in are masked at the both edges (Write DM latency is 0). 9. This combination is not defined for any function, which means "No Operation(NOP)" in DDR SDRAM. - 35 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 5. Functional Truth Table Current State CS PRECHARGE STANDBY L H H L X Burst Stop ILLEGAL*2 L H L X BA, CA, A 1 0 READ/WRITE ILLEGAL*2 L L H H BA, RA Active Bank Active, Latch RA L L H L BA, A 10 PRE/PREA ILLEGAL*4 L L L H X Refresh AUTO-Refresh*5 L L L L Op-Code, Mode-Add MRS Mode Register Set*5 L H H L X Burst Stop NOP L H L H BA, CA, A 1 0 READ/READA Begin Read, Latch CA, Determine Auto-Precharge L H L L BA, CA, A 1 0 WRITE/WRITEA Begin Write, Latch CA, Determine Auto-Precharge L L H H BA, RA Active Bank Active/ILLEGAL*2 L L H L BA, A 10 PRE/PREA Precharge/Precharge All L L L H X Refresh ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL L H H L X Burst Stop Terminate Burst L H L H BA, CA, A 1 0 READ/READA Terminate Burst, Latch CA, Begin New Read, Determine Auto-Precharge*3 L H L L BA, CA, A 1 0 WRITE/WRITEA ILLEGAL L L H H BA, RA Active Bank Active/ILLEGAL*2 L L H L BA, A 10 PRE/PREA Terminate Burst, Precharge L L L H X Refresh ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL ACTIVE STANDBY READ RAS CAS WE Address Command Action Table 9-1. Functional truth table - 36 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Current State CS WRITE L H H L X Burst Stop ILLEGAL L H L H BA, CA, A 1 0 READ/READA Terminate Burst With DM=High, Latch CA, Begin Read, Determine Auto-Precharge*3 L H L L BA, CA, A 1 0 WRITE/WRITEA Terminate Burst, Latch CA, Begin new Write, Determine Auto-Precharge*3 L L H H BA, RA Active Bank Active/ILLEGAL*2 L L H L BA, A 10 PRE/PREA Terminate Burst With DM=High, Precharge L L L H X Refresh ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL L H H L X Burst Stop ILLEGAL L H L H BA, CA, A 1 0 READ/READA *6 L H L L BA, CA, A 1 0 WRITE/WRITEA ILLEGAL L L H H BA, RA Active *6 L L H L BA, A 10 PRE/PREA *6 L L L H X Refresh ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL L H H L X Burst Stop ILLEGAL L H L H BA, CA, A 1 0 READ/READA *7 L H L L BA, CA, A 1 0 WRITE/WRITEA *7 L L H H BA, RA Active *7 L L H L BA, A 10 PRE/PREA *7 L L L H X Refresh ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL READ with AUTO PRECHARGE *6 (READA) WRITE with AUTO RECHARGE *7 (WRITEA) RAS CAS WE Address Command Action Table 9-2. Functional truth table - 37 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Current State CS RAS CAS WE PRECHARGING (DURING tRP) L H H L X Burst Stop ILLEGAL*2 L H L X BA, CA, A 10 READ/WRITE ILLEGAL*2 L L H H BA, RA Active ILLEGAL*2 L L H L BA, A 1 0 PRE/PREA NOP*4(Idle after t RP) L L L H X Refresh ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL L H H L X Burst Stop ILLEGAL*2 L H L X BA, CA, A 10 READ/WRITE ILLEGAL*2 L L H H BA, RA Active ILLEGAL*2 L L H L BA, A 1 0 PRE/PREA ILLEGAL*2 L L L H X Refresh ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL L H H L X Burst Stop ILLEGAL*2 L H L H BA, CA, A 10 READ ILLEGAL*2 L H L L BA, CA, A 10 WRITE WRITE L L H H BA, RA Active ILLEGAL*2 L L H L BA, A 1 0 PRE/PREA ILLEGAL*2 L L L H X Refresh ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL ROW ACTIVATING (FROM ROW Address Command Action ACTIVE TO tRCD) WRITE RECOVERING (DURING tWR OR tCDLR) Table 9-3. Functional truth table - 38 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Current State CS RAS CAS WE REFRESHING L H H L X Burst Stop ILLEGAL L H L X BA, CA, A 10 READ/WRITE ILLEGAL L L H H BA, RA Active ILLEGAL L L H L BA, A 1 0 PRE/PREA ILLEGAL L L L H X Refresh ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL L H H L X Burst Stop ILLEGAL L H L X BA, CA, A 10 READ/WRITE ILLEGAL L L H H BA, RA Active ILLEGAL L L H L BA, A 1 0 PRE/PREA ILLEGAL L L L H X Refresh ILLEGAL L L L L Op-Code, Mode-Add MRS ILLEGAL MODE REGISTER SETTING Address Command Action Table 9-4. Functional truth table - 39 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Current State CKE n-1 CKE n CS RAS CAS WE SELF- L H H X X X X Exit Self-Refresh L H L H H H X Exit Self-Refresh L H L H H L X ILLEGAL L H L H L X X ILLEGAL L H L L X X X ILLEGAL L L X X X X X NOPeration(Maintain Self-Refresh) POWER DOWN L H X X X X X Exit Power Down(Idle after tPDEX) L L X X X X X NOPeration(Maintain Power Down) ALL BANKS H H X X X X X Refer to Function True Table IDLE *9 H L L L L H X Enter Self-Refresh H L H X X X X Enter Power Down H L L H H H X Enter Power Down H L L H H L X ILLEGAL H L L H L X X ILLEGAL H L L L X X X ILLEGAL L X X X X X X Refer to Current State=Power Down H H X X X X X Refer to Function Truth Table *8 REFRESHING ANY STATE Add Action other than listed above Table 9-5. Functional truth table ABBREVIATIONS : H=High Level, L=Low level, X=Dont Care Note : 1. All entries assume that CKE was High during the preceding clock cycle and the current clock cycle. 2. ILLEGAL to bank in specified state ; function may be legal in the bank indicated by BA, depending on the state of that bank. 3. Must satisfy bus contention, bus turn around and write recovery requirements. 4. NOP to bank precharging or in idle sate. May precharge bank indicated by BA. 5. ILLEGAL if any bank is not idle. 6. Refer to "3.3.11 Read with Auto Precharge" in page 29 for detailed information. 7. Refer to "3.3.12 Write with Auto Precharge" in page 30 for detailed information. 8. CKE Low to High transition will re-enable CK, CK and other inputs asynchronously. A minimum setup time must be satisfied before issuing any command other than EXIT. 9. Power-Down and Self-Refresh can be entered only from All Bank Idle state. ILLEGAL = Device operation and/or data integrity are not guaranteed. - 40 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 6. Absolute Maximum Rating Parameter Symbol Value Unit Voltage on any pin relative to V SS V I N, VOUT -0.5 ~ 3.6 V Voltage on VDD & V DDQ supply relative to V SS V DD, V DDQ -1.0 ~ 3.6 V Storage temperature TSTG -55 ~ +150 C Power dissipation PD 1.5 W Short circuit current IOS 50 mA Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to recommend operation condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. Table 10. Absolute maximum ratings 7. DC Operating Conditions & Specifications 7.1 DC Operating Conditions Recommended operating conditions(Voltage referenced to V SS=0V, T A=0 to 70C) Parameter Symbol Min Max Supply voltage(for device with a nominal V DD of 2.5V) V DD 2.3 2.7 I/O Supply voltage V DDQ 2.3 2.7 V I/O Reference voltage V REF VDDQ/2-50mV VDDQ/2+50mV V 1 I/O Termination voltage(system) VT T V REF-0.04 V REF +0.04 V 2 V IH (DC) V REF +0.15 V DDQ +0.3 V 4 Input logic low voltage V IL (DC) -0.3 V REF-0.15 V 4 Input Voltage Level, CK and CK inputs V IN (DC) -0.3 V DDQ +0.3 V Input Differential Voltage, CK and CK inputs V ID (DC) 0.3 V DDQ +0.6 V 3 Input crossing point voltage, CK and CK inputs V IX(DC) 1.15 1.35 V 5 II -2 2 uA Output leakage current IOZ -5 5 uA Output High Current(Normal strengh driver) ;VOUT = VTT + 0.84V IO H -16.8 mA Output High Current(Normal strengh driver) ;VOUT = VTT - 0.84V IOL 16.8 mA Output High Current(Half strengh driver) ;VOUT = V TT + 0.45V IO H -9 mA Output High Current(Half strengh driver) ;VOUT = VTT - 0.45V IOL 9 mA Input logic high voltage Input leakage current Unit Note Table 11. DC operating condition - 41 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Notes 1. Includes 25mV margin for DC offset on V REF, and a combined total of 50mV margin for all AC noise and DC offset on V REF, bandwidth limited to 20MHz. The DRAM must accommodate DRAM current spikes on V REF and internal DRAM noise coupled TO V REF , both of which may result in V REF noise. V REF should be de-coupled with an inductance of 3nH. 2.V TT is not applied directly to the device. V TT is a system supply for signal termination resistors, is expected to be set equal to V REF , and must track variations in the DC level of V REF 3. V ID is the magnitude of the difference between the input level on CK and the input level on CK. 4. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in simulation. The AC and DC input specifications are relative to a VREF envelop that has been bandwidth limited to 200MHZ. 5. The value of V IX is expected to equal 0.5*V DDQ of the transmitting device and must track variations in the dc level of the same. 7.2 DDR SDRAM SPEC Items and Test Conditions Conditions Symbol Typical Worst Operating current - One bank Active-Precharge; tRC=tRCmin;tCK=100Mhz for DDR200, 133Mhz for DDR266A & DDR266B; DQ,DM and DQS inputs changing twice per clock cycle; address and control inputs changing once per clock cycle IDD0 - - Operating current - One bank operation ; One bank open, BL=4, Reads - Refer to the following page for detailed test condition IDD1 - - Percharge power-down standby current; All banks idle; power - down mode; CKE = <VIL(max); tCK=100Mhz for DDR200, 133Mhz for DDR266A & DDR266B; Vin = Vref for DQ,DQS and DM IDD2P - - Precharge Floating standby current; CS# > =VIH(min);All banks idle; CKE > = VIH(min); tCK=100Mhz for DDR200, 133Mhz for DDR266A & DDR266B; Address and other control inputs changing once per clock cycle; Vin = Vref for DQ,DQS and DM IDD2F - - Precharge Quiet standby current; CS# > = VIH(min); All banks idle; CKE > = VIH(min); tCK = 100Mhz for DDR200, 133Mhz for DDR266A & DDR266B; Address and other control inputs stable with keeping >= VIH(min) or =<VIL(max); Vin = Vref for DQ ,DQS and DM IDD2Q - - Active power - down standby current ; one bank active; power-down mode; CKE=< VIL (max); tCK = 100Mhz for DDR200, 133Mhz for DDR266A & DDR266B; Vin = Vref for DQ,DQS and DM IDD3P - - Active standby current; CS# >= VIH(min); CKE>=VIH(min); one bank active; active - precharge; tRC=tRASmax; tCK = 100Mhz for DDR200, 133Mhz for DDR266A & DDR266B; DQ, DQS and DM inputs changing twice per clock cycle; address and other control inputs changing once per clock cycle IDD3N - - Operating current - burst read; Burst length = 2; reads; continguous burst; One bank active; address and control inputs changing once per clock cycle; CL=2 at tCK = 100Mhz for DDR200, CL=2 at tCK = 133Mhz for DDR266A, CL=2.5 at tCK = 133Mhz for DDR266B ; 50% of data changing at every burst; lout = 0 m A IDD4R - - Operating current - burst write; Burst length = 2; writes; continuous burst; One bank active address and control inputs changing once per clock cycle; CL=2 at tCK = 100Mhz for DDR200, CL=2 at tCK = 133Mhz for DDR266A, CL=2.5 at tCK = 133Mhz for DDR266B ; DQ, DM and DQS inputs changing twice per clock cycle, 50% of input data changing at every burst IDD4W - - Auto refresh current; tRC = tRFC(min) - 8*tCK for DDR200 at 100Mhz, 10*tCK for DDR266A & DDR266B at 133Mhz; distributed refresh IDD5 - - Self refresh current; CKE =< 0.2V; External clock should be on; tCK = 100Mhz for DDR200, 133Mhz for DDR266A & DDR266B IDD6 - - Orerating current - Four bank operation ; Four bank interleaving with BL=4 -Refer to the following page for detailed test condition IDD7A - - Typical case: VDD = 2.5V, T = 25'C Worst case : VDD = 2.7V, T = 10'C - 42 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 7.3 DDR SDRAM IDD spec table 32Mx4 K4H280438B-TCA2 (DDR266A) K4H280438B-TCB0 (DDR266B) K4H280438B-TCA0 (DDR200) typical worst typical worst typical IDD0 100 110 100 110 80 90 mA IDD1 125 140 125 140 110 115 mA IDD2P 25 30 25 30 20 25 mA Symbol Unit IDD2F 45 55 45 55 40 45 mA IDD2Q 35 40 35 40 30 35 mA IDD3P 25 30 25 30 25 30 mA IDD3N 50 55 50 55 40 45 mA IDD4R 165 180 165 180 120 145 mA IDD4W 170 195 170 195 135 155 mA IDD5 185 215 185 215 150 170 mA 2 2 2 2 2 2 mA IDD6 Normal Low power IDD7A Notes worst 1 1 1 1 1 1 mA 300 350 300 350 255 295 mA Optional 16Mx8 K4H280838BT-CA2 (DDR266A) K4H280838B-TCB0 (DDR266B) K4H280838B-TCA0 (DDR200) typical worst typical worst typical IDD0 100 110 100 110 80 90 mA IDD1 125 140 125 140 100 115 mA IDD2P 25 30 25 30 20 25 mA IDD2F 45 55 45 55 40 45 mA IDD2Q 35 40 35 40 30 35 mA IDD3P 30 35 30 35 25 30 mA IDD3N 50 60 50 60 40 50 mA IDD4R 170 200 170 200 140 165 mA IDD4W 185 215 185 215 150 170 mA IDD5 Symbol IDD6 Unit 185 215 185 215 150 170 mA Normal 2 2 2 2 2 2 mA Low power 1 1 1 1 1 1 mA 325 375 325 375 265 310 mA IDD7A - 43 - Notes worst Optional REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 8Mx16 Symbol IDD6 K4H281638B-TCA2 (DDR266A) K4H281638B-TCB0 (DDR266B) K4H281638B-TCA0 (DDR200) typical typical typical worst worst Unit IDD0 100 115 100 115 90 100 mA IDD1 125 145 125 145 115 135 mA IDD2P 25 30 25 30 20 25 mA IDD2F 50 60 50 60 45 50 mA IDD2Q 40 45 40 45 35 40 mA IDD3P 35 40 35 40 30 35 mA IDD3N 55 65 55 65 45 55 mA IDD4R 180 210 180 210 150 185 mA IDD4W 190 225 190 225 160 200 mA IDD5 190 215 190 215 180 200 mA 2 2 2 2 2 2 mA Normal Low power IDD7A Notes worst 1 1 1 1 1 1 mA 345 400 345 400 280 330 mA Optional Table 12. 128Mb DDR SDRAM IDD SPEC Table < Detailed test conditions for DDR SDRAM IDD1 & IDD7A > IDD1 : Operating current: One bank operation 1. Typical Case : Vdd = 2.5V, T=25' C 2. Worst Case : Vdd = 2.7V, T= 10' C 3. Only one bank is accessed with tRC(min), Burst Mode, Address and Control inputs on NOP edge are changing once per clock cycle. lout = 0mA 4. Timing patterns - DDR200(100Mhz, CL=2) : tCK = 10ns, CL2, BL=4, tRCD = 2*tCK, tRAS = 5*tCK Read : A0 N R0 N N P0 N A0 N - repeat the same timing with random address changing *50% of data changing at every burst - DDR266B(133Mhz, CL=2.5) : tCK = 7.5ns, CL=2.5, BL=4, tRCD = 3*tCK, tRC = 9*tCK, tRAS = 5*tCK Read : A0 N N R0 N P0 N N N A0 N - repeat the same timing with random address changing *50% of data changing at every burst - DDR266A (133Mhz, CL=2) : tCK = 7.5ns, CL=2, BL=4, tRCD = 3*tCK, tRC = 9*tCK, tRAS = 5*tCK Read : A0 N N R0 N P0 N N N A0 N - repeat the same timing with random address changing *50% of data changing at every burst Legend : A=Activate, R=Read, W=Write, P=Precharge, N=NOP - 44 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM IDD7A : Operating current: Four bank operation 1. Typical Case : Vdd = 2.5V, T=25' C 2. Worst Case : Vdd = 2.7V, T= 10' C 3. Four banks are being interleaved with tRC(min), Burst Mode, Address and Control inputs on NOP edge are not changing. lout = 0mA 4. Timing patterns - DDR200(100Mhz, CL=2) : tCK = 10ns, CL2, BL=4, tRRD = 2*tCK, tRCD= 3*tCK, Read with autoprecharge Read : A0 N A1 R0 A2 R1 A3 R2 A0 R3 A1 R0 - repeat the same timing with random address changing *100% of data changing at every burst - DDR266B(133Mhz, CL=2.5) : tCK = 7.5ns, CL=2.5, BL=4, tRRD = 2*tCK, tRCD = 3*tCK Read with autoprecharge Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1 R0 - repeat the same timing with random address changing *100% of data changing at every burst - DDR266A (133Mhz, CL=2) : tCK = 7.5ns, CL2=2, BL=4, tRRD = 2*tCK, tRCD = 3*tCK Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1 R0 - repeat the same timing with random address changing *100% of data changing at every burst Legend : A=Activate, R=Read, W=Write, P=Precharge, N=NOP 8. AC Operating Conditions & Timming Specification 8.1 AC Operating Conditions Parameter/Condition Symbol Min Input High (Logic 1) Voltage, DQ, DQS and DM signals VIH(AC) Input Low (Logic 0) Voltage, DQ, DQS and DM signals. VIL(AC) Input Differential Voltage, CK and CK inputs VID(AC) 0.7 Input Crossing Point Voltage, CK and CK inputs VIX(AC) 0.5*VDDQ-0.2 Max VREF + 0.31 Unit Note V 3 VREF - 0.31 V 3 VDDQ+0.6 V 1 0.5*VDDQ+0.2 V 2 Note 1. VID is the magnitude of the difference between the input level on CK and the input on CK. 2. The value of VIX is expected to equal 0.5*V DDQ of the transmitting device and must track variations in the DC level of the same. 3. These parameters should be tested at the pim on actual components and may be checked at either the pin or the pad in simulation. the AC and DC input specificatims are refation to a Vref envelope that has been bandwidth limited 20MHz. Table 13. AC operating conditions - 45 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 8.2 AC Overshoot/Undershoot specification 8.2.1 Overshoot/Undershoot specification for Address and Control Pins Parameter Specification Notes Maximum peak amplitude allowed for overshoot (See Figure 1): 1.6 V 1,2,3 Maximum peak amplitude allowed for undershoot (See Figure 1): 1.6 V 1,2,3 The area between the overshoot signal and VDD must be less than or equal to (See Figure 1): 4.5 V-ns 1,2,3 The area between the undershoot signal and GND must be less than or 4.5 V-ns equal to (See Figure 1): 1,2,3 Table 14. Overshoot/Undershoot specification for Address and Control Pins VDD Overshoot 5 Maximum Amplitude = 1.6V 4 3 Volts (V) 2 Area = 4.5V-ns 1 0 -1 -2 -3 Maximum Amplitude = 1.6V GND -4 -5 0 0.6875 1.5 2.5 3.5 4.5 5.5 6.3125 7.0 0.5 1.0 2.0 3.0 4.0 5.0 6.0 6.5 Tims(ns) undershoot Figure 24. AC overshoot/Undershoot Definition Notes: 1. This specification is intended for only DDR200, DDR266A and DDR266B devices. 2. This specification is intended for only devices with NO clamp protection 3. This compliance is to be verified by design only. - 46 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 8.2.2 Overshoot/Undershoot specification for Data Pins Parameter Specification Notes Maximum peak amplitude allowed for overshoot (See Figure 2): 1.2 V 1,2,3 Maximum peak amplitude allowed for undershoot (See Figure 2): 1.2 V 1,2,3 The area between the overshoot signal and VDD must be less than or 2.5 V-ns equal to (See Figure 2): 1,2,3 The area between the undershoot signal and GND must be less than or 2.5 V-ns equal to (See Figure 2): 1,2,3 Table 15. Overshoot/Undershoot specification for Data Pins VDDQ Overshoot 5 Maximum Amplitude = 1.2V 4 3 Volts (V) 2 Area = 2.5V-ns 1 0 -1 -2 -3 Maximum Amplitude = 1.2V GND -4 -5 0 0.5 1.0 1.42 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 5.68 6.0 6.5 7.0 Tims(ns) undershoot Figure 25. AC overshoot/Undershoot Definition Notes: 1. This specification is intended for only DDR200, DDR266A and DDR266B devices. 2. This specification is intended for only devices with NO clamp protection 3. This compliance is to be verified by design only. - 47 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 8.3 AC Timming Parameters & Specifications Parameter Symbol -TCA2(DDR266A) -TCB0(DDR266B) Min Max Min Max -TCA0 (DDR200) Min Max Unit Row cycle time tRC 65 65 70 Refresh row cycle time tRFC 75 75 80 Row active time tRAS 45 RAS to CAS delay tRCD 20 20 20 ns tRP 20 20 20 ns tRRD 15 15 15 ns tWR 2 2 2 tCK tCDLR 1 1 1 tCK Row precharge time Row active to Row active delay Write recovery time Last data in to Read command Col. address to Col. address delay Clock cycle time tCCD CL=2.0 CL=2.5 tCK 120K 1 45 120K 1 48 ns ns 120K 1 7.5 12 10 12 7.5 12 7.5 12 10 ns tCK 12 ns 5 12 ns 5 Clock high level width tCH 0.45 0.55 0.45 0.55 0.45 0.55 tCK Clock low level width tCL 0.45 0.55 0.45 0.55 0.45 0.55 tCK tDQSCK -0.75 +0.75 -0.75 +0.75 -0.8 +0.8 ns Output data access time from CK/ CK tAC -0.75 +0.75 -0.75 +0.75 -0.8 +0.8 ns Data strobe edge to ouput data edge tDQSQ - +0.5 - +0.5 - +0.6 ns Read Preamble tRPRE 0.9 1.1 0.9 1.1 0.9 1.1 tCK Read Postamble tRPST 0.4 0.6 0.4 0.6 0.4 0.6 tCK CK to valid DQS-in tDQSS 0.75 1.25 0.75 1.25 0.75 1.25 tCK DQS-in setup time tWPRES 0 0 0 ns DQS-in hold time tWPREH 0.25 0.25 0.25 tCK tDSS 0.2 0.2 0.2 tCK DQS-out access time from CK/CK DQS falling edge to CK rising-setup time DQS falling edge from CK rising-hold time Note 5 2 tDSH 0.2 0.2 0.2 tCK DQS-in high level width tDQSH 0.35 0.35 0.35 tCK DQS-in low level width tDQSL 0.35 DQS-in cycle time tDSC 0.9 Address and Control Input setup time tIS 0.9 0.9 1.1 ns 6 Address and Control Input hold time tIH 0.9 0.9 1.1 ns 6 Data-out high impedence time from CK/CK tHZ -0.75 +0.75 -0.75 +0.75 -0.75 +0.75 ns Data-out low impedence time from CK/CK tLZ -0.75 +0.75 -0.75 +0.75 -0.75 +0.75 ns Input Slew Rate(for input only pins) 0.35 1.1 0.9 0.35 1.1 0.9 tCK 1.1 tCK tSL(I) 0.5 0.5 0.5 V/ns Input Slew Rate(for I/O pins) tSL(IO) 0.5 0.5 0.5 V/ns 7 Output Slew Rate(x4,x8) tSL(O) 1.0 4.5 1.0 4.5 1.0 4.5 V/ns 10 Output Slew Rate(x16) tSL(O) 0.7 5 0.7 5 0.7 5 V/ns 10 - 48 - 6 REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Parameter Symbol -TCA2(DDR266A) -TCB0(DDR266B) -TCA0 (DDR200) Min Max Min Max Min Max 0.67 1.5 0.67 1.5 0.67 1.5 Unit Note Output Slew Rate Matching Ratio (rise to fall) tSLMR Mode register set cycle time tMRD 15 15 16 ns DQ & DM setup time to DQS tDS 0.5 0.5 0.6 ns 7,8,9 DQ & DM hold time to DQS tDH 0.5 0.5 0.6 ns 7,8,9 DQ & DM input pulse width tDIPW 1.75 1.75 2 ns Power down exit time tPDEX 7.5 7.5 10 ns Exit self refresh to write command tXSW 95 116 ns Exit self refresh to bank active command tXSA 75 75 80 ns Exit self refresh to read command tXSR 200 200 200 Cycle tREF 15.6 15.6 15.6 us 1 7.8 7.8 7.8 us 1 Output DQS valid window tQH tHPmin -tQHS - tHPmin -tQHS - tHPmin -tQHS - ns 5 Clock half period tHP tCLmin or tCHmin - tCLmin or tCHmin - tCLmin or tCHmin - ns Refresh interval time 64Mb, 128Mb 256Mb Data hold skew factor tQHS DQS write postamble time tWPST 0.75 0.4 0.6 0.75 0.4 0.6 0.4 0.8 ns 0.6 tCK 4 3 1. Maximum burst refresh of 8 2. The specific requirement is that DQS be valid(High or Low) on or before this CK edge. The case shown(DQS going from High_Z to logic Low) applies when no writes were previously in progress on the bus. If a previous write was in progress, DQS could be High at this time, depending on tDQSS. 3. The maximum limit for this parameter is not a device limit. The device will operate with a great value for this parameter, but system performance (bus turnaround) will degrade accordingly. 4. A write command can be applied with t RCD satisfied after this command. 5. For registered DINNs, t CL and t CH are 45% of the period including both the half period jitter (t JIT(HP)) of the PLL and the half period jitter due to crosstalk (t JIT(crosstalk)) on the DIMM. Table 16. AC timing parameters and specifications - 49 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 6. Input Setup/Hold Slew Rate Derating Input Setup/Hold Slew Rate tIS tIH (V/ns) (ps) (ps) 0.5 0 0 0.4 +50 +50 0.3 +100 +100 This derating table is used to increase t IS /tIH in the case where the input slew rate is below 0.5V/ns. Input setup/hold slew rate based on the lesser of AC-AC slew rate and DC-DC slew rate. 7. I/O Setup/Hold Slew Rate Derating I/O Setup/Hold Slew Rate tDS tDH (V/ns) (ps) (ps) 0.5 0 0 0.4 +75 +75 0.3 +150 +150 This derating table is used to increase t DS /tDH in the case where the I/O slew rate is below 0.5V/ns. I/O setup/hold slew rate based on the lesser of AC-AC slew rate and DC-DC slew rate. 8. I/O Setup/Hold Plateau Derating I/O Input Level tDS tDH (mV) (ps) (ps) 280 +50 +50 This derating table is used to increase tDS/tDH in the case where the input level is flat below VREF 310mV for a duration of up to 2ns. 9. I/O Delta Rise/Fall Rate(1/slew-rate) Derating Delta Rise/Fall Rate tDS tDH (ns/V) (ps) (ps) 0 0 0 0.25 +50 +50 0.5 +100 +100 This derating table is used to increase t DS /tDH in the case where the DQ and DQS slew rates differ. The Delta Rise/Fall Rate is calated as 1/SlewRate1-1/SlewRate2. For example, if slew rate 1 = 5V/ns and slew rate 2 =.4V/ns then the Delta Rise/Fall Rate =-0/5ns/V. Input S/H slew rate based on larger of AC-AC delta rise/fall rate and DC-DC delta rise/fall rate. 10. This parameter is fir system simulation purpose. It is guranteed by design. <Note> The following table specifies derating values for the specifications listed if the single-ended clock skew rate is less than 1.0V/ns. CK slew rate (Single ended) tIH/tIS (ps) tDSS/tDSH (ps) tAC/tDQSCK (ps) tLZ(min) (ps) tHZ(max) (ps) 1.0V/ns 0 0 0 0 0 0.75V/ns +50 +50 +50 -50 +50 0.5V/ns +100 +100 +100 -100 +100 - 50 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 9. AC Operating Test Conditions (V DD =2.5V, VDDQ=2.5V, T A= 0 to 70C ) Parameter Value Unit 0.5 * V DDQ V 1.5 V V REF +0.31/V REF -0.31 V V REF V V tt V Input reference voltage for Clock Input signal maximum peak swing Input Levels(V IH /V IL) Input timing measurement reference level Output timing measurement reference level Output load condition Note See Load Circuit Table 17. AC operating test conditions V tt =0.5*V DDQ R T=50 Output Z0=50 C LOAD =30pF V REF =0.5*V DDQ Figure 26. Output Load Circuit (SSTL_2) 10. Input/Output Capacitance (V DD =2.5, V DDQ=2.5V, TA = 25C, f=1MHz) Parameter Symbol Min Max Delta Cap(max) Unit Input capacitance (A 0 ~ A 1 1, BA 0 ~ BA 1, CKE, CS, RAS,CAS, WE) C IN1 2 3.0 0.5 pF Input capacitance( CK, CK ) C IN2 2 3.0 0.25 pF Data & DQS input/output capacitance COUT 4.0 5.0 Input capacitance(DM) C IN3 4.0 5.0 0.5 pF pF Table 18. Input/output capacitance - 51 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 11. IBIS: I/V Characteristics for Input and Output Buffers 11.1 Normal strength driver 1. The full variation in driver pulldown current from minimum to maximum process, temperature, and voltage will lie within the outer bounding lines of the V-I curve of Figure a. 2. The full variation in driver pulldown current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines the of the V-I curve of Figure a. Maximum 160 140 Iout(mA) 120 Typical High 100 80 60 Typical Low 40 Minimum 20 0 0.0 0.5 1.0 1.5 2.0 2.5 Vout(V) 3. The full variation in driver pullup current from minimum to maximun process, temperature, and voltage will lie within the outer bounding lines of the V-I curve of Figure b. 4. The variation in the driver pullup current at nominal temperature and voltage is expected, but not guaranteed, to lie within the inner boungding lines of the V-I curve of Figure b as 0.0 0.5 1.0 1.5 2.0 2.5 0 Minumum -20 Iout(mA) -40 Typical Low -60 -80 -100 -120 -140 -160 Typical High -180 -200 -220 Maximum Vout(V) 5. The full variation in the ratio of the maximum to minimum pullup and pulldown current will not exceed 1.7, for device drain to source voltage from 0 to VDDQ/2 6. The Full variation in the ratio of the nominal pullup to pulldown current should be unity 10%, for device drain to source voltages from 0 to VDDQ/2 Figure 27. I/V characteristics for input/output buffers:Pull up(above) and pull down(below) - 52 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Pulldown Current (mA) Voltage (V) Typical Typical Low High 0.1 6.0 6.8 0.2 12.2 0.3 18.1 0.4 0.5 pullup Current (mA) Typical Typical Low High 9.6 -6.1 -7.6 9.2 18.2 -12.2 13.8 26.0 -18.1 18.4 33.9 23.0 41.8 39.1 27.7 39.4 44.2 43.7 49.8 0.9 47.5 1.0 1.1 Minimum Maximum Minimum Maximum 4.6 -4.6 -10.0 13.5 20.1 -14.5 -9.2 -20.0 -21.2 -13.8 -29.8 24.1 26.6 29.8 33.0 -24.0 -27.7 -18.4 -38.8 -29.8 -34.1 -23.0 0.6 34.6 -46.8 49.4 -34.3 -40.5 -27.7 -54.4 0.7 0.8 32.2 56.8 -38.1 -46.9 -32.2 -61.8 36.8 63.2 -41.1 -53.1 -36.0 -69.5 55.2 39.6 69.9 -41.8 -59.4 -38.2 -77.3 51.3 60.3 42.6 76.3 -46.0 -65.5 -38.7 -85.2 54.1 65.2 44.8 82.5 -47.8 -71.6 -39.0 -93.0 1.2 56.2 69.9 46.2 88.3 -49.2 -77.6 -39.2 -100.6 1.3 57.9 74.2 47.1 93.8 -50.0 -83.6 -39.4 -108.1 1.4 59.3 78.4 47.4 99.1 -50.5 -89.7 -39.6 -115.5 1.5 60.1 82.3 47.7 103.8 -50.7 -95.5 -39.9 -123.0 1.6 60.5 85.9 48.0 108.4 -51.0 -101.3 -40.1 -130.4 1.7 61.0 89.1 48.4 112.1 -51.1 -107.1 -40.2 -136.7 1.8 61.5 92.2 48.9 115.9 -51.3 -112.4 -40.3 -144.2 1.9 62.0 95.3 49.1 119.6 -51.5 -118.7 -40.4 -150.5 2.0 62.5 97.2 49.4 123.3 -51.6 -124.0 -40.5 -156.9 2.1 62.9 99.1 49.6 126.5 -51.8 -129.3 -40.6 -163.2 2.2 63.3 100.9 49.8 129.5 -52.0 -134.6 -40.7 -169.6 2.3 63.8 101.9 49.9 132.4 -52.2 -139.9 -40.8 -176.0 2.4 64.1 102.8 50.0 135.0 -52.3 -145.2 -40.9 -181.3 2.5 64.6 103.8 50.2 137.3 -52.5 -150.5 -41.0 -187.6 2.6 64.8 104.6 50.4 139.2 -52.7 -155.3 -41.1 -192.9 2.7 65.0 105.4 50.5 140.8 -52.8 -160.1 -41.2 -198.2 Table 19. Pull down and pull up current values Temperature (Tambient) Typical Minimum Maximum 25C 70C 0C Vdd/Vddq Typical Minimum Maximum 2.5V 2.3V 2.7V - 53 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM 11.2 Half strength driver 1. The nominal pulldown V-I curve for DDR SDRAM devices will be within the inner bounding lines of the V-I curve of Figure a. 2. The full variation in driver pulldown current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines the of the V-I curve of Figure a. 90 Maximum 80 70 Typical High 50 Iout(mA) Iout(mA) 60 40 Typical Low Minimum 30 20 10 0 0.0 1.0 2.0 Vout(V) 3. Thenominal pullup V-I curve for DDR SDRAM devices will be within the inner bounding lines of the V-I curve of below Figure b. 4. The Full variation in driver pullup current from minimum to maximum process, temperature and voltage will lie within the outer bounding lines of the V-I curve of Figrue b. 0.0 0.5 1.0 1.5 2.0 2.5 0 -10 Iout(mA) -20 Minumum Typical Low -30 -40 -50 -60 Typical High -70 -80 Maximum -90 Vout(V) 5. The full variation in the ratio of the maximum to minimum pullup and pulldown current will not exceed 1.7, for device drain to source voltage from 0 to VDDQ/2 6. The Full variation in the ratio of the nominal pullup to pulldown current should be unity 10%, for device drain to source voltages from 0 to VDDQ/2 Figure 28. I/V characteristics for input/output buffers:Pull up(above) and pull down(below) - 54 - REV. 1.31 Nov. 3. 2001 128Mb DDR SDRAM Pulldown Current (mA) Voltage (V) Typical Typical Low High 0.1 3.4 pullup Current (mA) Minimum Maximum 3.8 2.6 5.0 Typical Typical Low High -3.5 Minimum Maximum -4.3 -2.6 -5.0 0.2 6.9 7.6 5.2 9.9 -6.9 -8.2 -5.2 -9.9 0.3 10.3 11.4 7.8 14.6 -10.3 -12.0 -7.8 -14.6 0.4 13.6 15.1 10.4 19.2 -13.6 -15.7 -10.4 -19.2 0.5 16.9 18.7 13.0 23.6 -16.9 -19.3 -13.0 -23.6 0.6 19.6 22.1 15.7 28.0 -19.4 -22.9 -15.7 -28.0 0.7 22.3 25.0 18.2 32.2 -21.5 -26.5 -18.2 -32.2 0.8 24.7 28.2 20.8 35.8 -23.3 -30.1 -20.4 -35.8 0.9 26.9 31.3 22.4 39.5 -24.8 -33.6 -21.6 -39.5 1.0 29.0 34.1 24.1 43.2 -26.0 -37.1 -21.9 -43.2 1.1 30.6 36.9 25.4 46.7 -27.1 -40.3 -22.1 -46.7 1.2 31.8 39.5 26.2 50.0 -27.8 -43.1 -22.2 -50.0 1.3 32.8 42.0 26.6 53.1 -28.3 -45.8 -22.3 -53.1 1.4 33.5 44.4 26.8 56.1 -28.6 -48.4 -22.4 -56.1 1.5 34.0 46.6 27.0 58.7 -28.7 -50.7 -22.6 -58.7 1.6 34.3 48.6 27.2 61.4 -28.9 -52.9 -22.7 -61.4 1.7 34.5 50.5 27.4 63.5 -28.9 -55.0 -22.7 -63.5 1.8 34.8 52.2 27.7 65.6 -29.0 -56.8 -22.8 -65.6 1.9 35.1 53.9 27.8 67.7 -29.2 -58.7 -22.9 -67.7 2.0 35.4 55.0 28.0 69.8 -29.2 -60.0 -22.9 -69.8 2.1 35.6 56.1 28.1 71.6 -29.3 -61.2 -23.0 -71.6 2.2 35.8 57.1 28.2 73.3 -29.5 -62.4 -23.0 -73.3 2.3 36.1 57.7 28.3 74.9 -29.5 -63.1 -23.1 -74.9 2.4 36.3 58.2 28.3 76.4 -29.6 -63.8 -23.2 -76.4 2.5 36.5 58.7 28.4 77.7 -29.7 -64.4 -23.2 -77.7 2.6 36.7 59.2 28.5 78.8 -29.8 -65.1 -23.3 -78.8 2.7 36.8 59.6 28.6 79.7 -29.9 -65.8 -23.3 -79.7 Table 20. Pull down and pull up current values Temperature (Tambient) Typical Minimum Maximum 25C 70C 0C Vdd/Vddq Typical Minimum Maximum 2.5V 2.3V 2.7V The above characteristics are specified under best, worst and normal process variation/conditions - 55 - REV. 1.31 Nov. 3. 2001