L
T
B
W
Operating/Storage
Temp. Range:
-55°C to +125°C
DIMENSIONS: millimeters (inches) 0603 0805
L 1.6±0.10 2.11±0.10
(0.063±0.004) (0.083±0.004)
W 0.81±0.10 1.5±0.10
(0.032±0.004) (0.059±0.004)
T 0.61±0.10 0.91±0.13
(0.024±0.004) (0.036±0.005)
top: 0.0 +0.3/-0.0 0.25±0.15
B (0.0+0.012) (0.010±0.006)
bottom: 0.35±0.20
(0.014±0.008)
28
2
Accu-L®
SMD High-Q RF Inductor
ACCU-L®TECHNOLOGY
The Accu-L®SMD Inductor is based on thin-film mul ti lay er
technology. This technology provides a level of control on the
elec tri cal and physical characteristics of the com po nent which
gives consistent characteristics within a lot and lot-to-lot.
The original design provides small size, excellent high-
frequency performance and rugged construction for re li able
automatic assembly.
FEATURES
• High Q
• RF Power Capability
• High SRF
• Low DC Resistance
• Ultra-Tight Tolerance on Inductance
• Standard 0603 and 0805 Chip Size
• Low Profile
• Rugged Construction
• Taped and Reeled
The Accu-L®inductor is particularly suited for the tele com -
mu ni ca tions industry where there is a continuing trend
towards miniaturization and in creas ing frequencies. The
Accu-L®inductor meets both the per for mance and tolerance
requirements of present cellular frequencies 450MHz and
900MHz and of future fre quen cies, such as 1700MHz,
1900MHz and 2400MHz.
APPLICATIONS
• Mobile Communications
• Satellite TV Receivers
• GPS
• Vehicle Locations Systems
• Filters
• Matching Networks
10 nH Inductor (Top View)
Not RoHS Compliant
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,
please select correct termination style.
29
2
Accu-L® 0603 and 0805
SMD High-Q RF Inductor
HOW TO ORDER
450 MHz 900 MHz 1900 MHz 2400 MHz IDC max
Test Frequency Test Frequency Test Frequency Test Frequency SRF min RDC max (mA)
Inductance Available QL (nH) QL (nH) QL (nH) Q(MHz) (Ω)
L (nH) Inductance Tolerance Typical Typical Typical Typical (1)
1.2 ±0.1, ±0.2nH 49 1.2 70 1.2 134 1.2 170 10000 0.04 1000
1.5 ±0.1, ±0.2nH 26 1.54 39 1.52 63 1.52 76 10000 0.06 1000
1.8 ±0.1, ±0.2nH 20 1.74 30 1.73 50 1.72 59 10000 0.07 1000
2.2 ±0.1, ±0.2nH 20 2.2 30 2.24 49 2.24 56 10000 0.08 1000
2.7 ±0.1, ±0.2nH 21 2.7 30 2.75 48 2.79 54 9000 0.08 750
3.3 ±0.1, ±0.2, ±0.5nH 24 3.33 35 3.39 56 3.47 64 8400 0.08 750
3.9 ±0.1, ±0.2, ±0.5nH 25 3.9 57 4.06 60 4.21 69 6500 0.12 500
4.7 ±0.1, ±0.2, ±0.5nH 23 4.68 32 4.92 46 5.2 49 5500 0.15 500
5.6 ±0.2, ±0.5nH 26 5.65 36 5.94 54 6.23 60 5000 0.25 300
6.8 ±0.2, ±0.5nH 23 6.9 33 7.3 47 8.1 39 4500 0.30 300
8.2 ±0.2, ±0.5nH 23 8.4 31 10 35 12.1 31 3800 0.35 300
10.0 ±2%, ±5% 28 10 39 11.8 47 14.1 41 3500 0.45 300
12.0 ±2%, ±5% 28 13.2 38 14.1 30 17.2 20 3000 0.50 300
15.0 ±2%, ±5% 28 16.2 38 25.9 30 49.8 15 2500 0.60 300
(1) IDC measured for 15°C rise at 25°C ambient temperature
(2) IDC measured for 70°C rise at 25°C ambient temperature
L, Q, SRF measured on HP 4291A, Boonton 34A and Wiltron 360
Vector Analyzer, RDC measured on Keithley 580 micro-ohmmeter.
ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L®0603
450 MHz 900 MHz 1700 MHz 2400 MHz IDC max
Test Frequency Test Frequency Test Frequency Test Frequency SRF min RDC max (mA)
Inductance Available QL (nH) QL (nH) QL (nH) Q(MHz) (Ω) ΔT = 15°C ΔT = 70°C
L (nH) Inductance Tolerance Typical Typical Typical Typical (1) (2)
1.2 ±0.1nH, ±0.2nH, ±0.5nH 60 1.2 92 1.2 122 1.2 92 10000 0.05 1000 2000
1.5 ±0.1nH, ±0.2nH, ±0.5nH 50 1.5 74 1.5 102 1.5 84 10000 0.05 1000 2000
1.8 ±0.1nH, ±0.2nH, ±0.5nH 50 1.8 72 1.8 88 1.9 73 10000 0.06 1000 2000
2.2 ±0.1nH, ±0.2nH, ±0.5nH 42 2.2 62 2.2 82 2.3 72 10000 0.07 1000 2000
2.7 ±0.1nH, ±0.2nH, ±0.5nH 42 2.7 62 2.8 80 2.9 70 10000 0.08 1000 2000
3.3 ±0.1nH, ±0.2nH, ±0.5nH 38 3.3 46 3.4 48 3.5 57 10000 0.11 750 1500
3.9 ±0.1nH, ±0.2nH, ±0.5nH 27 3.9 36 4.0 38 4.1 42 10000 0.20 750 1500
4.7 ±0.1nH, ±0.2nH, ±0.5nH 43 4.8 62 5.3 76 5.8 60 5500 0.10 750 1500
5.6 ±0.5nH 50 5.7 68 6.3 73 7.6 62 4600 0.10 750 1500
6.8 ±0.5nH 43 7.0 62 7.7 71 9.4 50 4500 0.11 750 1500
8.2 ±0.5nH 43 8.5 56 10.0 55 15.2 32 3500 0.12 750 1500
10 ±2%, ±5% 46 10.6 60 13.4 52 – – 2500 0.13 750 1500
12 ±2%, ±5% 40 12.9 50 17.3 40 – – 2400 0.20 750 1500
15 ±2%, ±5% 36 16.7 46 27 23 – – 2200 0.20 750 1000
18 ±2%, ±5% 30 21.9 27 – – – – 1700 0.35 500 1000
22 ±2%, ±5% 36 27.5 33 – – – – 1400 0.40 500 1000
ELECTRICAL SPECIFICATIONS TABLE FOR ACCU-L®0805
(1) IDC measured for 15°C rise at 25°C ambient temperature when soldered to FR-4 board. Inductance and Q measured on Agilent 4291B / 4287 using the 16196A test fixture.
Engineering Kits Available
see pages 90-91
L
Product
Inductor
0805
Size
0603
0805
4R7
Inductance
Expressed in nH
(2 significant digits +
number of zeros)
for
values <10nH,
letter R denotes
decimal point.
Example:
22nH = 220
4.7nH = 4R7
D
Tolerance
for
L ≤4.7nH,
B = ±0.1nH
C = ±0.2nH
D = ±0.5nH
4.7nH<L<10nH,
C = ±0.2nH
D = ±0.5nH
L ≥ 10nH,
G = ±2%
J = ±5%
E
Specification
Code
E = Accu-L®0805
technology
G = Accu-L®0603
technology
S
Termination
Code
W = Nickel/
solder coated
(Sn 63, Pb 37)
**S = Nickel/
Lead Free
Solder coated
(Sn100)
TR
Packaging
Code
TR = Tape and Reel
(3,000/reel)
**RoHS compliant
30
2
Typical Inductance vs. Frequency
L0805
Measured on HP4291A and
Wiltron 360 Vector Analyzer
100
10
Inductance (nH)
1
22nH
15nH
10nH
5.6nH
1.8nH
0.01 0.1
Frequency (GHz)
110
200
100
10
103.532.521.510.5
15nH 10nH 6.8nH 4.7nH2.7nH
Current (A)
Temperature rise will typically be no higher than shown by the graph
ΔT (°C)
Maximum Temperature Rise
at 25°C ambient temperature (on FR-4)
L0805
Accu-L® 0603 and 0805
SMD High-Q RF Inductor
Typical Q vs. Frequency
L0805
Measured on HP4291A and
Boonton 34A Coaxial Line
0.1
0
20
40
Q
60
100
120
140
80
1
22nH
15nH
10nH
5.6nH
1.8nH
1.5nH
1.2nH
10
Frequency (GHz)
Typical Inductance vs. Frequency
L0603
15nH
8.2nH
6.8nH
4.7nH
3.3nH
2.2nH
1.8nH
1.2nH
100
10
10 0.5 1 1.5
Frequency (GHz)
L (nH)
2 2.5 3
180
160
140
120
100
80
60
40
20
0012
Frequency (GHz)
Q
3
1.2nH
1.5nH
5.6nH
8.2nH
15nH
Typical Q vs. Frequency
L0603
Measured on AGILENT 4291B/4287
using the 16196A test fixture
Measured on AGILENT 4291B/4287
using the 16196A test fixture
L0805
L0603
31
2
Accu-L® 0603 and 0805
SMD High-Q RF Inductor
TEST CONDITIONS REQUIREMENT
Solderability Components completely immersed in Terminations to be well tinned.
a solder bath at 235 ± 5°C for 2 secs. No visible damage.
Leach Resistance Components completely immersed in Dissolution of termination faces
a solder bath at 260 ±5°C for 60 secs. ≤ 15% of area.
Dissolution of termination edges
≤ 25% of length.
Storage 12 months minimum with components Good solderability
stored in “as received” packaging.
Shear Components mounted to a substrate. No visible damage
A force of 5N applied normal to the
line joining the terminations and in
a line parallel to the substrate.
Rapid Change of Components mounted to a substrate. No visible damage
Temperature 5 cycles -55°C to +125°C.
Tested as shown in diagram
Bend Strength No visible damage
Temperature Component placed in +0 to +125 ppm/°C
Coefficient of environmental chamber (typical)
Inductance -55°C to +125°C.
(TCL) T1= 25°C
FINAL QUALITY INSPECTION
Finished parts are tested for electrical parameters and visual/
mechanical characteristics. Parts are 100% tested for inductance at 450MHz. Parts are
100% tested for RDC. Each pro duc tion lot is eval u at ed on a
sample basis for:
• Q at test frequency
• Static Humidity Resistance: 85°C, 85% RH, 160 hours
• Endurance: 125°C, IR, 4 hours
1mm
deflection
45mm 45mm
TCL = • 106
L2-L1
L1(T2-T1)
ENVIRONMENTAL CHARACTERISTICS
32
2
32
Accu-L® 0805
Application Notes
HANDLING
SMD chips should be handled with care to avoid dam age or
contamination from perspiration and skin oils. The use of
plastic tipped tweezers or vacuum pick-ups is strongly
recommended for individual components. Bulk handling
should ensure that abrasion and mechanical shock are min-
imized. For automatic equipment, taped and reeled product
is the ideal medium for direct presentation to the placement
machine.
CIRCUIT BOARD TYPE
All flexible types of circuit boards may be used (e.g. FR-4,
G-10) and also alumina.
For other circuit board materials, please consult factory.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good joints
and minimize component movement during sol der ing.
Pad designs are given below for both wave and reflow
soldering.
The basis of these designs is:
a. Pad width equal to component width. It is per mis si ble
to decrease this to as low as 85% of component width
but it is not advisable to go be low this.
b. Pad overlap about 0.3mm.
c. Pad extension about 0.3mm for reflow.
Pad ex ten sion about 0.8mm for wave soldering.
PREHEAT & SOLDERING
The rate of preheat in production should not exceed
4°C/second. It is recommended not to exceed 2°C/
sec ond.
Temperature differential from preheat to soldering should not
exceed 150°C.
For further specific application or process advice, please
consult AVX.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 100°C
is required. The most preferable technique is to use hot air
soldering tools. Where a soldering iron is used, a tem per a -
ture controlled model not exceeding 30 watts should be
used and set to not more than 260°C. Max i mum al lowed
time at temperature is 1 minute. When hand sol der ing, the
base side (white side) must be sol dered to the board.
COOLING
After soldering, the assembly should preferably be al lowed to
cool naturally. In the event of assisted cool ing, similar condi-
tions to those rec om mend ed for pre heat ing should be used.
CLEANING RECOMMENDATIONS
Care should be taken to ensure that the devices are thor -
ough ly cleaned of flux residues, especially the space be neath
the device. Such residues may otherwise be come conduc-
tive and effectively offer a lossy bypass to the de vice. Various
recommended cleaning conditions (which must be optimized
for the flux system being used) are as follows:
Cleaning liquids . . . . . . i-propanol, ethanol, acetylace-
tone, water, and other standard
PCB cleaning liquids.
Ultrasonic conditions . . power – 20w/liter max.
frequency – 20kHz to 45kHz.
Temperature . . . . . . . . . 80°C maximum (if not oth er wise
limited by chosen sol vent system).
Time. . . . . . . . . . . . . . . 5 minutes max.
STORAGE CONDITIONS
Recommended storage conditions for Accu-L®prior to use
are as follows:
Temperature. . . . . . . . . 15°C to 35°C
Humidity . . . . . . . . . . . ≤65%
Air Pressure . . . . . . . . . 860mbar to 1060mbar
RECOMMENDED SOLDERING
PROFILE
For recommended soldering profile see page 23
REFLOW SOLDERING
DIMENSIONS: millimeters (inches)
WAVE SOLDERING
DIMENSIONS: millimeters (inches)
1.2
(0.047)
1.2
(0.047)
1.4
(0.055)
3.8
(0.150)
1.5
(0.059)
0805
Accu-L®
0.7
(0.028)
0.7
(0.028)
1.4
(0.055)
2.8
(0.110)
1.5
(0.059)
0805
Accu-L®
1.30
(0.051)
1.30
(0.051)
0.50
(0.020)
3.1
(0.122)
0.8
(0.031)
0603
Accu-L®
0
.
90
(0.035
)
0
.
90
(
0.035
)
0
.
50
(
0.020
)
2.
3
(
0.091
)
0
.
8
(
0.031
)
0603
Accu-L®
