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©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-12414-2 │www.psemi.com
ESD
The PE423641 is a HaRP™ technology-enhanced
reflective SP4T RF switch. It has received AEC-Q100
Grade 2 certification and meets the quality and
performance standards that makes it suitable for use in
harsh automotive environments. It is designed to cover a
wide range of wireless applications from 50 MHz through
3 GHz such as cellular antenna band switching,
automotive infotainment and traffic safety applications.
No blocking capacitors are required if DC voltage is not
present on the RF ports.
The PE423641 is manufactured on Peregrine’s
UltraCMOS® process, a patented variation of silicon-on-
insulator (SOI) technology on a sapphire substrate,
offering excellent RF performance.
Peregrine’s HaRP™ technology enhancements deliver
high linearity and excellent harmonics performance. It is
an innovative feature of the UltraCMOS process, offering
the performance of GaAS with the economy and
integration of conventional CMOS.
Product Specification
UltraCMOS® SP4T RF Switch
50–3000 MHz
Product Description
PE423641
Features
AEC-Q100 Grade 2 certified
Supports operating temperature up to
+105°C
HaRPTM technology enhancements
provide excellent linearity
Low harmonics of 2fo = –83 dBc
and 3fo = –77 dBc @ +35 dBm
IMD3 of –111 dBm @ WCDMA
band 1
IIP3 of 68 dBm
Low insertion loss
0.50 dB @ 1000 MHz
0.65 dB @ 2200 MHz
High isolation
32 dB @ 1000 MHz
25 dB @ 2200 MHz
High ESD performance
2 kV HBM on all pins
100V MM on all pins
1 kV CDM on all pins
Integrated decoder for 2-pin control
Accepts 1.8V and 2.75V levels
Figure 1. Functional Diagram
Figure 2. Package Type
16-lead 3 x 3 mm QFN
71-0094
Product Specification
PE423641
Page 2 of 11
©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-12414-2 │ UltraCMOS® RFIC Solutions
Table 1. Electrical Specifications @ +25°C, VDD = 2.75V (ZS = ZL = 50Ω)
Parameter Path Condition Min Typ Max Unit
Operational frequency 50 3000 MHz
Insertion loss
(symmetric ports) RFC–RFX
50–1000 MHz 0.50 0.60 dB
1000–2200 MHz 0.65 0.75 dB
2200–2700 MHz 0.80 0.95 dB
2700–3000 MHz 0.95 1.15 dB
Isolation RFC–RFX
50–1000 MHz 30 32 dB
1000–2200 MHz 23 25 dB
2200–2700 MHz 21 23 dB
2700–3000 MHz 20 22 dB
Return loss (active ports) RFC–RFX
50–1000 MHz 24 dB
1000–2200 MHz 19 dB
2200–2700 MHz 16 dB
2700–3000 MHz 14 dB
Return loss (common ports) RFC–RFX
50–1000 MHz 23 dB
1000–2200 MHz 16 dB
2200–2700 MHz 14 dB
2700–3000 MHz 13 dB
2nd harmonic RFX
+35 dBm output power, 850/900 MHz –83 –80 dBc
+33 dBm output power, 1800/1900 MHz –85 –78 dBc
3rd harmonic RFX +35 dBm output power, 850/900 MHz –77 –73.5 dBc
+33 dBm output power, 1800/1900 MHz –78 –72.5 dBc
IMD3 RF Measured at 2.14 GHz at ANT port, input +20 dBm CW
signal at 1.95 GHz and –15 dBm CW signal at 1.76 GHz –111 dBm
Input IP2 RFC–RFX 50–3000 MHz 115 dBm
Input IP3 RFC–RFX 50–3000 MHz 68 dBm
Input 0.1 dB compression point1 RFC–RFX 50–3000 MHz 37 dBm
Switching time 50% CTRL to 90% or 10% RF 1 2 μs
Note 1: Input 0.1 dB compression point is a linearity figure of merit. Refer to Table 3 for the operating RF input power (50Ω).
Product Specification
PE423641
Page 3 of 11
©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-12414-2 │www.psemi.com
Table 1A. Electrical Specifications @ –40 to +105°C, VDD = 2.75V (ZS = ZL = 50Ω)
Note 1: Input 0.1 dB compression point is a linearity figure of merit. Refer to Table 3 for the operating RF input power (50Ω).
Parameter Path Condition Min Typ Max Unit
Operational frequency 50 3000 MHz
Insertion loss
(symmetric ports) RFC–RFX
50–1000 MHz 0.50 0.75 dB
1000–2200 MHz 0.65 0.90 dB
2200–2700 MHz 0.80 1.10 dB
2700–3000 MHz 0.95 1.30 dB
Isolation RFC–RFX
50–1000 MHz 30 32 dB
1000–2200 MHz 23 25 dB
2200–2700 MHz 21 23 dB
2700–3000 MHz 20 22 dB
Return loss (active ports) RFC–RFX
50–1000 MHz 24 dB
1000–2200 MHz 19 dB
2200–2700 MHz 16 dB
2700–3000 MHz 14 dB
Return loss (common ports) RFC–RFX
50–1000 MHz 23 dB
1000–2200 MHz 16 dB
2200–2700 MHz 14 dB
2700–3000 MHz 13 dB
2nd harmonic RFX
+35 dBm output power, 850/900 MHz –83 –76 dBc
+33 dBm output power, 1800/1900 MHz –85 –74 dBc
3rd harmonic RFX +35 dBm output power, 850/900 MHz –77 –69.5 dBc
+33 dBm output power, 1800/1900 MHz –78 –68.5 dBc
IMD3 RF Measured at 2.14 GHz at ANT port, input +20 dBm CW
signal at 1.95 GHz and –15 dBm CW signal at 1.76 GHz –111 dBm
Input IP2 RFC–RFX 50–3000 MHz 115 dBm
Input IP3 RFC–RFX 50–3000 MHz 68 dBm
Input 0.1 dB compression point1 RFC–RFX 50–3000 MHz 37 dBm
Switching time 50% CTRL to 90% or 10% RF 1 2 μs
Product Specification
PE423641
Page 4 of 11
©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-12414-2 │ UltraCMOS® RFIC Solutions
Figure 3. Pin Configuration (Top View)
Table 2. Pin Descriptions
Pin # Pin Name Description
1, 5, 7, 9,
10, 12, 14,
16
N/C No connect
2 VDD Supply voltage
3 V2 Digital control logic input 2
4 V1 Digital control logic input 1
6 RF41 RF port
8 RF31 RF port
11 RFC1 RF common
13 RF11 RF port
15 RF21 RF port
Pad GND Exposed pad: Ground for proper operation
Note 1: RF pins 6, 8, 13, and 15 must be at 0 VDC. The RF pins do not require
DC blocking capacitors for proper operation if the 0 VDC requirement
is met.
Table 3. Operating Ranges
Note 1: 100% duty cycle, all bands, 50Ω
Parameter Symbol Min Typ Max Unit
Supply voltage VDD 2.65 2.75 3.3 V
Supply current
(VDD = 2.75V, +25°C only) IDD 13 50 µA
Digital input high (V1, V2) VIH 1.4 VDD V
Digital input low (V1, V2) VIL 0 0.4 V
RF input power, CW1 P
MAX,CW +35 dBm
Operating temperature
range TOP –40 +25 +105 °C
Table 4. Absolute Maximum Ratings
Notes: 1. Human Body Model (MIL-STD-883 Method 3015)
2. Machine Model (JEDEC JESD22-A115)
3. Charged Device Model (JEDEC JESD22-C101)
Exceeding absolute maximum ratings may cause
permanent damage. Operation should be restricted
to the limits in the Operating Ranges table.
Operation between operating range maximum and
absolute maximum for extended periods may
reduce reliability.
Parameter/Condition Symbol Min Max Unit
Supply voltage VDD –0.3 3.7 V
Digital input voltage (V1, V2) VI –0.3 3.7 V
RF input power, max PMAX,ABS +37 dBm
Storage temperature range TST -65 +150 °C
ESD voltage HBM1, all pins VESD ,HBM 2000 V
ESD voltage MM2, all pins VESD,MM 100 V
ESD voltage CDM3, all pins VESD,CDM 1000 V
Product Specification
PE423641
Page 5 of 11
©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-12414-2 │www.psemi.com
Table 5. Truth Table
Path V2 V1
RFC–RF1 0 0
RFC–RF2 1 0
RFC–RF3 0 1
RFC–RF4 1 1
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS device, observe
the same precautions that you would use with
other ESD-sensitive devices. Although this device
contains circuitry to protect it from damage due to
ESD, precautions should be taken to avoid
exceeding the specified rating.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS
devices are immune to latch-up.
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the
PE423641 in the 16-lead 3x3 mm QFN package is
MSL1.
Switching Frequency
The PE423641 has a maximum 25 kHz switching
frequency.
Switching frequency describes the time duration
between switching events. Switching time is the
time duration between the point the control signal
reaches 50% of the final value and the point the
output signal reaches within 10% or 90% of its
target value. Switching time is provided in Table 1
and Table 1A.
Product Specification
PE423641
Page 6 of 11
©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-12414-2 │ UltraCMOS® RFIC Solutions
Figure 5. Insertion Loss vs VDD (RFC–RFX) Figure 4. Insertion Loss vs Temp (RFC–RFX)
Figure 7. Return Loss vs VDD (Active Port) Figure 6. Return Loss vs Temp (Active Port)
Typical Performance Data @ +25°C and VDD = 2.75V, unless otherwise specified
Figure 8. Return Loss vs Temp (Common Port) Figure 9. Return Loss vs VDD (Common Port)
Product Specification
PE423641
Page 7 of 11
©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-12414-2 │www.psemi.com
Figure 11. Isolation vs VDD (RFC–RFX) Figure 10. Isolation vs Temp (RFC–RFX)
Typical Performance Data @ +25°C and VDD = 2.75V, unless otherwise specified
Product Specification
PE423641
Page 8 of 11
©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-12414-2 │ UltraCMOS® RFIC Solutions
Evaluation Kit
The SP4T switch evaluation board was designed
to ease customer evaluation of Peregrine’s
PE423641. The RF common port is connected
through a 50Ω transmission line via the top SMA
connector, J1. RF1, RF2, RF3 and RF4 are
connected through 50Ω transmission lines via
SMA connectors J3, J5, J2 and J4, respectively.
A through 50Ω transmission is available via SMA
connectors J6 and J7. This transmission line can
be used to estimate the loss of the PCB over the
environmental conditions being evaluated.
The board is constructed of a four metal layer
FR4 material with a total thickness of 62 mils.
The middle layers provide ground for the
transmission lines. The transmission lines were
designed using a coplanar waveguide with
ground plane model using a trace width of
32 mils, trace gaps of 25 mils, and metal
thickness of 2.1 mils.
Figure 12. Evaluation Board Layouts
PRT-50900
Product Specification
PE423641
Page 9 of 11
©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-12414-2 │www.psemi.com
Through Li ne
50 Ohm
50 Ohm
50 Ohm
50 Ohm
50 Ohm
50 Ohm
C3
DNI
1
1
3
3
5
5
7
7
22
44
66
88
10 10
12 12
14 14 13
13
9
9
11
11
J8
HEADER 14
J1
C4
DNI
C2
DNI
R2
1M
13 RF1
14 N/C
15 RF2
16 N/C
1N/C
2VDD
3V2
4V1
5
N/C
7
N/C
6
RF4
8
RF3
9
N/C
10
N/C
12
N/C
11
RFC
U1
PE423641
C1
DNI
J2J3
J4J5
J6 J7
R1
1M
RF1
V2
V1
RF2
VDD
RF4
RF3
ANT
Figure 13. Evaluation Board Schematic
DOC-12427
Caution: Contains parts and assemblies susceptible to damage by electrostatic discharge (ESD).
Product Specification
PE423641
Page 10 of 11
©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-12414-2 │ UltraCMOS® RFIC Solutions
Figure 14. Package Drawing
16-lead 3x3 mm QFN
DOC-01881
Figure 15. Top Marking Specification
423641
YYWW
ZZZZZZ
DOC-51207
= Pin 1 designator
YYWW = Date code, last two digits of the year and work week
ZZZZZZ = Last six characters of the assembly lot code
TOP VIEW
SIDE VIEW
BOTTOM VIEW
3.00
3.00
Pin #1 Corner
1.70±0.05
0.75±0.05
0.05
0.203
RECOMMENDED LAND PATTERN
13
16
1
4
5
9
8
12
1.70±0.05
0.50
0.23±0.05
(X16)
1.50
0.375±0.05
(X16)
1.75
3.40
3.40
0.10 C A B
0.05 C
A
0.10 C
(2X)
C
0.10 C
0.05 C
SEATING PLANE
B
ALL FEATURES
0.10 C
(2X)
0.575
(X16)
0.28
(X16) 0.50
1.75
(X12)
Product Specification
PE423641
Page 11 of 11
©2013-2014 Peregrine Semiconductor Corp. All rights reserved. Document No. DOC-12414-2 │www.psemi.com
Device Orientation in Tape
Top of
Device
Pin 1
Tape Feed Direction
Figure 16. Tape and Reel Specifications
Table 6. Ordering Information
Order Code Description Package Shipping Method
PE423641MLAA-Z PE423641 SP4T RF switch Green 16-lead 3 x 3 mm QFN 3000 units / T&R
EK423641-01 PE423641 Evaluation kit Evaluation kit 1 / Box
Advance Information:
The product is in a formative or design stage. The datasheet contains design target
specifications for product development. Specifications and features may change in any manner without notice.
Preliminary Specification:
The datasheet contains preliminary data. Additional data may be added at a later
date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best
possible product.
Product Specification:
The datasheet contains final data. In the event Peregrine decides to
change the specifications, Peregrine will notify customers of the intended changes by issuing a CNF (Customer
Notification Form).
The information in this datasheet is believed to be reliable. However, Peregrine assumes no liability for the use
of this information. Use shall be entirely at the user’s own risk.
No patent rights or licenses to any circuits described in this datasheet are implied or granted to any third party.
Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant,
or in other applications intended to support or sustain life, or in any application in which the failure of the
Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no
liability for damages, including consequential or incidental damages, arising out of the use of its products in
such applications.
The Peregrine name, logo, UltraCMOS and UTSi are registered trademarks and HaRP, MultiSwitch and DuNE
are trademarks of Peregrine Semiconductor Corp. Peregrine products are protected under one or more of the
following U.S. Patents: http://patents.psemi.com.
Sales Contact and Information
For sales and contact information please visit www.psemi.com.
