Chip EMI Filters Chip EMI Filters Type: EXCCET Features Rated current (2 A max.) Eight capacitance values in a wide range, related to the noise frequency Suitable for narrow pitch insertion Suitable for applications requiring thin design RoHS compliant Recommended Applications Digital equipment such as PCs, word processors, printers, HDD, PPC, and communication equipment. Digital audio and video equipment. AC adapters, and switching power supplies. Electronic musical instruments, and other digital equipment. Explanation of Part Numbers 1 2 3 4 5 6 7 8 9 10 E X C C E T 1 0 3 U Product Code Noise Filter Type Circuit T-circuit Chip type EMI filter Construction Nominal Capacitance Value The first two digits are significant figures of capacitance value and the third one denotes the number of zeros following. Form Code Packing U Embossed Carrier Taping Dimensions in mm (not to scale) 2.70.3 Ferrite core 0.50.2 0.50.2 4.50.4 1.80.2 Chip capacitor 1.00.2 Adhesive Electrode Size : 1807 inch Mass (Weight) : 92.5 mg/pc. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. - 252 - 01 Feb. 2011 Chip EMI Filters Ratings Part Number Rated Voltage (V DC) Capacitance (pF) EXCCET220U EXCCET470U EXCCET101U EXCCET271U EXCCET471U EXCCET102U EXCCET222U EXCCET103U 50 50 50 50 50 50 50 50 22 47 100 270 470 1000 2200 10000 (1) Rated DC 25 dB Attenuate 15 dB Attenuate (2) Tolerance Frequency Frequency Characteristics Current Resistance (%) (A DC) (m) (MHz) (MHz) 20 20 20 20 20 20 20 20 YB YB YB YB YB YB YB YB 2 2 2 2 2 2 2 2 50 max. 50 max. 50 max. 50 max. 50 max. 50 max. 50 max. 50 max. 800 to 1000 450 to 550 300 to 450 200 to 300 100 to 220 65 to 200 35 to 180 15 to 120 600 to 1000 350 to 1000 200 to 900 80 to 700 50 to 700 30 to 700 15 to 700 15 to 700 (1) Please inquire to us about the particular capacitance value, on a range of 22 to 10000 pF. (2) Characteristics YB: Maximum capacitance is 10 % over the temperature range of -25 C to +85 C in reference to +20 C. Category Temperature Range -40 C to +85 C Attenuation Characteristics (Reference Data) Measurement Circuit 10 20 50 30 Sample 101 471271 40 222 102 50 470 220 ~ 50 Attenuation(dB) 0 103 60 1M 10M 100M 1G Frequency (Hz) Packaging Methods (Taping) Standard Quantity Part Number Kind of Taping Pitch (P1) Quantity EXCCETU Embossed Carrier Taping 4 mm 1000 pcs./reel Embossed Carrier Taping Taping Reel T Sprocket hole D0 Compartment E C D B t2 B F W A P1 P2 P0 Tape running direction Chip component A Dimensions (mm) Dimensions (mm) A B W F P1 2.20.2 4.90.2 12.00.2 5.500.05 4.00.1 P2 P0 D0 t2 2.00.1 4.00.1 A Dimensions (mm) 0 180.0-3.0 E Dimensions (mm) 1.50.1 3.5 max. 2.00.5 W B C D 60.01.0 13.00.5 21.00.8 W T 13.01.0 16.5 max. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. - 253 - 01 Feb. 2011 Chip EMI Filters Recommended Land Pattern Design(mm) For High Density Mounting Resist 1.0 2.54 1.4 1.4 1.15 Copper foil 1.15 1.0 0.2 Resist Copper foil 0.2 For Single Mounting Resist 1.4 1.3 1.3 5.4 Using the land pattern which we do not recommend, or mounting by the solder under 180m, verify the performance, reliability, etc. thoroughly. 1.3 1.3 5.4 Recommended Soldering Conditions Recommendations and precautions are described below. Recommended soldering conditions for reflow * Reflow soldering shall be performed a maximum of two times. * Please contact us for additional information when used in conditions other than those specified. * Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability before actual use. For soldering (Example : Sn-37Pb) Preheating Main heating Peak Temperature Peak Preheating Heating Temperature 140 C to 160 C Above 200 C 235 10 C Time 60 s to 120 s 30 s to 40 s max. 10 s For lead-free soldering (Example : Sn/3Ag/0.5Cu) Temperature Time Preheating 150 C to 170 C 60 s to 120 s Main heating Above 230 C 30 s to 40 s Peak max. 260 C max. 10 s Time Flow soldering * Chip EMI Filters cannot be mounted on a printed circuit board by flow soldering. Mount them by reflow soldering. <Repair with hand soldering> Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 C or less. Solder each electrode for 3 seconds or less. Never touch this product with the tip of a soldering iron. Safety Precautions The following are precautions for individual products. Please also refer to the common precautions shown on page 4 of this catalog. 1. Use rosin-based flux or halogen-free flux. 2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person in advance. 3. Do not apply shock to Chip EMI Filters (hereafter called the filters) or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress may damage the filters. Handle with care. 4. Avoid applying static electricity to the filters. 5. The performance of the filters deteriorates in a circuit that is susceptible to surges or other abnormal voltages. Carefully check the circuit operations before use. 6. Store the filters in a location with a temperature ranging from -5 C to +40 C and a relative humidity of 40 % to 60 %, where there are no rapid changes in temperature or humidity. 7. Use the filters within a year after the date of the outgoing inspection indicated on the packages. Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use. Should a safety concern arise regarding this product, please be sure to contact us immediately. - 254 - 00 Sep. 2010