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Class-AB Speaker Amplifiers
1W+1W Stereo
Speaker / Headphone Amplifier
BH7884EFV
●Description
The BH7884EFV is a low voltage, low noise, high output speaker and headphone amplifier drive, in which a Bi-CMOS
process is used. This IC supports: headphone amplifier gain adjustment, active/suspend switching, speaker amplifier
stereo/monaural switching, and amplifier mute switching. All functions are controllable from a microcontroller. Built-in digital
noise reduction circuits eliminate digital noise and BEEP sounds.
●Features
1) Built-in 1W+1W stereo speaker amplifier (Vcc=5V, RL=8, THD=10%)
2) Built-in stereo headphone amplifier
3) Built-in bass boost function for speaker amplifier
4) Built-in low noise VCA (electronic volume) for headphone
5) Built-in mute circuit
6) Built-in standby circuit
7) Low current consumption specifications (9 mA TYP. in ACTIVE mode, 0.2 A TYP. in SUSPEND mode)
●Applications
Notebook computers, LCD TVs, etc.
●Absolute maximum ratings(Ta=25℃)
Parameter Ratings Unit
Supply voltage +6.0 V
Power dissipation 1100 *1 mW
Storage temperature -55 ~ +125 ℃
Operating temperature -10 ~ +70 ℃
*1 Reduced by 11 mW/℃ at 25℃ or higher, when mounting on a 70mmX70mmX1.6mm PCB board).
●Operating Conditions (Ta=25℃)
Parameter Ratings Unit
Supply voltage +3.0~+5.5 V
* This IC is not designed to be radiation-resistant.
No.14077EBT06
Technical Note
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BH7884EFV
●Electrical characteristics (Unless otherwise noted, VCC=3.3V, Ta=25℃, f=1kHz)
Parameter Symbol Limits Unit Condition
Min. Typ. Max.
■1 CHIP
Circuit current ACTV IA - 9.0 18.0 mA No signal ACTIVE
Circuit current SPND Is - 0.2 10.0 µA No signal SUSPEND
■SP AMP
Voltage gain1 GSP1 9.0 12.0 15.0 dB SE, Vin=-18dBV,RL=8
Voltage gain2 GSP2 15.2 18.2 21.2 dB BTL, Vin=-18dBV
Distortion DSP - 0.1 1.0 % BTL, Vin=-18dBV
Maximum output level VOSP 2.2 5.2 - dBV BTL, DSP=1%
Output noise level VNSP - -97 -80 dBV SE, DIN-Audio
Cross talk CTSP - -90 -80 dBV SE, Vin=-18dBV, DIN-Audio
Output level on mute MTSP - -102 -80 dBV BTL, Vin=-18dBV
■HP AMP
Voltage gain 3 GHP 2.6 5.6 8.6 dB VOL:MAX, RL=10k,Vin=-12dBV
Voltage gain 4 GHP -10 -7 -4 dB VOL:MAX, RL=32,Vin=-12dBV
Distortion DHP - 0.025 0.1 % VOL:MAX, RL=32,Vin=-8dBV
Variable width of volume GHP 70 100 - dB VOL:MIN ~ MAX, RL=3 2
Maximum output level VOHP -2.0 1.0 - dBV VOL:MAX, DHP=1%, RL=10k
Output noise level VNHP - -98 -80 dBV VOL:MAX, RL=32, DIN-Audio
Cross talk CTHP - -98 -80 dBV VOL:MAX, RL=32,Vin=-12dBV
DIN-Audio
Output level on mute MTHP - -110 -80 dBV VOL:MAX, RL=32,Vin=-12dBV
DIN-Audio
■BEEP AMP
Output voltage level VBP 0.8 1.25 - Vpp Vin=1.3dBV, f=1kHz, 20MHzLPF
■BIAS
Output voltage level VBIAS 1.4 1.7 2.0 V No Signal
■CTRL
ACTIVE mode V11H V
CC-0.3 - VCC V
Active mode.
Hold Voltage of 11pi n.
SUSPEND mode V11L GND - 0.3 V
Suspend mode.
Hold Voltage of 11pi n.
SP/ON mode V2H V
CC-0.3 - VCC V
SP
/
ON mode.
Hold Voltage of 2pin.
SP/OFF mode V2L GND - 0.3 V
SP/OFF mode.
Hold Voltage of 2pin.
BASS-BOOST/ON mode V4H V
CC-0.7 - VCC V
SP
/
Bass Boost mode.
Hold Voltage of 4pin.
BASS-BOOST/OFF mode V4L GND - 0.7 V
SP
/
Non Boost mode.
Hold Voltage of 4pin.
STEREO mode V3H V
CC-0.7 - VCC V
SP
/
STEREO mode.
Hold Voltage of 3pin.
MONO mode V3L GND - 0.7 V
SP
/
MONO mode.
Hold Voltage of 3pin.
ACTIVE mode V10H V
CC-0.7 - VCC V
HP
/
Active mode.
Hold Voltage of 10pin.
MUTE mode V10L GND - 0.7 V
HP
/
MUTE mode.
Hold Voltage of 10pin.
■PSRR
Ripple rejection ratio GPR - -64 - dBV f=100Hz, 0.3Vpp, SIN Input
SPOUT monitor, DIN-Audio
Technical Note
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BH7884EFV
●Block diagram
Fig.1
Technical Note
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BH7884EFV
●Control pin settings
SP MUTE PIN:2PIN
H SP ACTIVE SPAMP is in active state
L SP MUTE SPAMP is in suspend state
STEREO/MONO PIN:3PIN
H STEREO For SPAMP, LCH and RCH both are in active state
L MONO For SPAMP, LCH is in active state and RCH is in suspend state
BASSBOOST PIN:4PIN
H BASS BOOST For SPAMP, bass is boosted
L NON -BOOST For SPAMP, bass is not boosted
MUTE PIN:10PIN
H ACTIVE HPAMP is in active state
L MUTE HPAMP is in mute state
SUSPEND PIN:11PIN
H ACTIVE The IC is in active state
L SUSPEND The IC is in suspend state
Technical Note
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BH7884EFV
●Equivalent circuit
PIN1 SP_IN_LCH PIN2 SP_MUTE PIN3 ST/MN PIN4 BASS BOOST
PIN5 LINE_IN_LCH PIN6 BIAS PIN7 BEEP_IN PIN8 LINE_IN_RCH
PIN9 HP_VOL PIN10 HP_MUTE PIN11 SUSPEND PIN12 SP_IN_RCH
27k
60k
16k
47k
Technical Note
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BH7884EFV
PIN13 HP_OUT_RCH PIN14 VCC_RCH PIN15 BOOST_R_RCH PIN16 SPOUT1_RCH
25k
5k
PIN17 SPOUT2_RCH PIN18 GND_RCH PIN19 GND_LCH PIN20 SPOUT2_LCH
25k
5k
25k
5k
PIN21 SPOUT1_LCH PIN22 BOOST_R_LCH PIN23 VCC_LCH PIN24 HP_OUT_LCH
25k
5k
Technical Note
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BH7884EFV
●Applic at ion c ircuit
Fig.2
Technical Note
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BH7884EFV
●Description of operations
1) LINEIN (5,8PIN) ~ HPOUT (13,24PIN) voltage gain
The voltage gain at EVRMAX is generally calculated by the following equati on:
（dB）
R5(or R8)
GHP = 20 × log 40k
The above gain attenuates accordi ng to the DC voltage of the VOL pin (9PIN).
By connecting multiple resistances (R), mixing input can be handled.
2) BEEPIN (7PIN) ~ HPOUT (13,24PIN)
When a pulse waveform is input at the BEEPIN pin, a pulse wave is output at HPOUT (24,13PIN).
The output level, determined by the resistance of 7PIN, has default val ues as follows:
HP OUT level Vcc=5V Vcc=4V Vcc=3.3V
1Vpp< <56k <91k <120k
0.5Vpp 68k 110k 160k
0.25Vpp 75k 130k 200k
*(Unit: )
To obtain the default setting output (approx. 1.2 Vpp output), make R7=10 k.
The variation in output levels is small.
Signals below a certain level are determined to be noise, by IC internals, and are not output at HPOUT.
3) SP IN (1,12PIN) ~ SP OUT (21, 20, 16, 17PIN) voltage gain
The voltage gain in BASSBOOST is generally calcul ated by the following equation:
GSPB = 20×log R1(or R12)
40k + R21-20(or R16-15)(dB)
The cut-off frequency in BASSBOOST is generally calculated by the following equation:
1
fCB=2πC21～22(or C16～15)×R21～20(or R16～15)
The voltage gain in NONBOOST is generally calcul ated by the following equation:
GSP=20×log 40k
R1(or R12)(dB)
4) EVR control characteristic
HP AMP gain is controlled by the ratio of voltage to resistance between VCC and GND.
Note: A resistance (RN), shown above, is the resistance that is connected to pin N.
A capacitance (CN), shown above, is the capacitance that is connected to pin N.
The numeric values above are design reference values, whose values are not guaranteed.
Technical Note
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BH7884EFV
●Operation Notes
1. Numbers and data in entries are representative design values and are not guaranteed values of the items.
2. Although ROHM is confident that the example application circuit reflects the best possible recommendations, be sure to
verify circuit characteristics f or your particular appl ication. Modif ication of c onstants for other externally connect ed circui ts
may cause variations in both static and transient characteristics for external components as well as this Rohm IC. Allow for
sufficient margins when determining circuit constants.
3. Absolute maximum ratings
Use of the IC in excess of a bsolute maximu m ratings, such as t he applied voltage or op erating temp erature range (Top r),
may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when
such damage is suffered. A physical saf ety measure, such as a f use, should be implement ed when using the IC at t imes
where the absolut e maximum ratings may b e exceeded.
4. GND potential
Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the GND at
any time, regardless of whether it is a tr ansient signal or not.
5. Thermal design
Perform thermal design, in which there are adequate margins, by taking into account the permissible dissipation (Pd) in
actual states of use.
6. Short circuit between terminals and erroneous mounting
Pay attention t o the assembly direction of the ICs. Wrong mounting direction or shorts between t erminals, GND, or other
components on the circuits, can damage the IC.
7. Operation in strong electromagnetic field
Using the ICs in a strong el ectromagnetic field can cause operation malfunction.
8. Pop noise when switching power ON/OFF
To prevent pop noise when switching VCC ON/OFF or switching SUSPEND ON/OFF, use SUSPEND (11PIN=L), HP
MUTE (10PIN=L), and SUSPEND (2PIN=L) for noise control, as shown below.
(VCC OFFON) (VCC ONOFF)
VCC SPND HPMT SPMT VCC SPND HPMT SPMT
1) OFF L L L 1) OFF H H H
2) ON L L L 2) ON H H L
3) ON H L L 3) ON H L L
4) ON H H L 4) ON L L L
5) ON H H H 5) ON L L L
9. Power supply bypass capacitor
Place the bypass capacitor close to the VCC ~ GND pins.
10. Mode switching
Do not apply a voltage that exceeds VCC or a voltage that is less than GN D, at a control pin.
11. Power package
Ensure heat dissipation by connecting the heatsink to the back of the IC and to the GND board. Ensure that the GND area
is large.
12. HPOUT
Connect resistance (100 is recommended) to the output for SPAMP input level adjustment and to prevent HPAMP
oscillation.
13. Capacitive load
Do not connect a capacitive load t o SPAMP or HPAMP output as it may cause oscillation.
14. Startup time at low temperature and reduced power
Use the following methods to eliminate longer start up time at low temperatures (less than about -10℃) and reduced
power (less than about 3.0 V):
1) Start in SPMUTE state and then cancel SPMUTE.
2) Add to transistor and resistance, as shown in the appl ication circuit diagram.
Technical Note
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BH7884EFV
●Ordering p art number
B H 7 8 8 4 E F V - E 2
Part No. Part No.
Package
EFV: HTSSOP-B24 Packaging and forming specification
E2: Embossed tape and reel
(Unit : mm)
HTSSOP-B24
0.65
1.0MAX
0.85±0.05
0.08±0.05
0.24 +0.05
-
0.04 0.08
M
S
0.08
1.0±0.2
0.53±0.15
0.17 +0.05
-
0.03
4°
+
6°
−
4°
S
24 13
112
0.325
(3.4)
(5.0)
7.8±0.1
7.6±0.2
5.6±0.1
(MAX 8.15 include BURR)
1PIN MARK
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tape (with dry pack)Tape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2000pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y el ec tronic equip ments (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
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accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parti es arising from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
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product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-produci ng comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding nor mal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) dependi ng on Ambient temp erature (T a). When used i n sealed area, co nfirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range d escribed in the product specification.
9. ROHM shall n ot be in any way responsible or liable for failure induce d under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromin e, etc.) flux is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specificati on
Datasheet
Datasheet
Notice - GE Rev.002
© 2014 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own indepe ndent verificati on and judgme nt in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry con dition (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostati c
2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidit y barrier bag. Baking is re quired before using Products of
which storage time is exceeding the recommended storage time period.
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QR code printed on ROHM Products label is for ROHM’s internal use only.
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When disposing Products pl ease dispose them properly using an authorized industr y waste company.
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Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
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third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
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3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limit ed to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
