Data Sheet 1 V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
High-side switch
Short-circuit protection
Input protection
Overtemperature protection with hysteresis
Overload protection
Overvoltage protection
Switching inductive load
Clamp of negative output voltage with inductive loads
Undervoltage shutdown
Maximum current internally limited
Electrostatic discharge (ESD) protection
Reverse battery protection1)
Package: SOT 223
Type Ordering code
BSP 452
Q67000-S271
Application
µC compatible power switch for 12 V DC grounded loads
All types of resistive, inductive and capacitive loads
Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET with charge pump, ground referenced CMOS compatible input,monolithically
integrated in Smart SIPMOS technology. Fully protected by embedded protection functions.
Blockdiagramm:
IN
3
Rin
+ Vbb
Signal GND
ESD
miniPROFET
OUT
GND
Logic
Voltage
sensor
Voltage
source
Charge pump
Level shifter
Temperature
sensor
Rectifier
Limit for
unclamped
ind. loads
Gate
protection
Current
limit
2
4
1
Load GND
Load
V
Logic
Overvoltage
protection
ESD-
Diode
1
) With resistor RGND=150 in GND connection, resistor in series with IN connections reverse load current
limited by connected load.
SOT-223
SOT-223
1
PG-SOT-223
AEC qualified
Green product (RoHS compliant)
Data Sheet 2 V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Pin Symbol Function
1 OUT O Output to the load
2 GND - Logic ground
3 IN I Input, activates the power switch in case of logical high signal
4 Vbb + Positive power supply voltage
Maximum Ratings at
T
j = 25 °C unless otherwise specified
Parameter Symbol Values Unit
Supply voltage
V
bb 40 V
Load current self-limited
I
L
I
L
(
SC
)
A
Maximum input voltage2)
V
IN -5.0...
V
bb V
Maximum input current
I
IN ±5 mA
Inductive load switch-off energy dissipation,
single pulse
I
L = 0.5A ,
T
A = 150°C
(not tested, specified by design)
E
AS 0.5 J
Load dump protection3)
V
LoadDump=
U
A+
V
s
R
L= 24
R
I=2 ,
t
d=400ms, IN= low or high,
U
A=13,5V
R
L= 80
(not tested, specified by design)
V
Load dump4)60
80
V
Electrostatic discharge capability (ESD)5)PIN 3
PIN 1,2,4
V
ESD ±1
±2
kV
Operating temperature range
Storage temperature range
T
j
T
stg
-40 ...+150
-55 ...+150
°C
Max. power dissipation (DC)6)
T
A = 25 °C
P
tot 1.8 W
Thermal resistance chip - soldering point:
chip - ambient:6)
R
thJS
R
thJA
7
70
K/W
2) At VIN > Vbb, the input current is not allowed to exceed ±5 mA.
3)Supply voltages higher than Vbb(AZ) require an external current limit for the GND pin, e.g. with a 150 resistor in the GND connection
A resistor for the protection of the input is integrated.
4)VLoad dump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839
5)HBM according to MIL-STD 883D, Methode 3015.7
6)BSP 452 on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm2 copper area for Vbb connection
Data Sheet 3 V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
at
T
j = 25 °C,
V
bb = 13.5V unless otherwise specified
min typ max
Load Switching Capabilities and Characteristics
On-state resistance (pin 4 to 1)
I
L = 0.5 A,
V
in = high
T
j = 25°C
T
j = 150°C
R
ON --
--
0.16
--
0.2
0.4
Nominal load current (pin 4 to 1)7)
ISO Standard:
V
ON =
V
bb -
V
OUT = 0.5 V
T
S= 85 °C
I
L(ISO) 0.7 -- -- A
Turn-on time to 90%
V
OUT
Turn-off time to 10%
V
OUT
R
L = 24
t
on
t
off
--
--
60
60
100
150
µs
Slew rate on
10 to 30%
V
OUT
,
R
L= 24
d
V
/dton -- 2 4 V/µs
Slew rate off
70 to 40%
V
OUT,
R
L= 24
-d
V
/dtoff -- 2 4 V/µs
Input
Allowable input voltage range, (pin 3 to 2)
V
IN -3.0 --
V
bb V
Input turn-on threshold voltage
T
j= -40...+150°C
V
IN(T+) -- -- 3.5 V
Input turn-off threshold voltage
T
j= -40...+150°C
V
IN(T-) 1.5 -- -- V
Input threshold hysteresis
V
IN(T) -- 0.5 -- V
Off state input current (pin 3)
V
IN(off) = 1.2 V
T
j= -40...+150°C
I
IN(off) 10 -- 60 µA
On state input current (pin 3)
V
IN(on) = 3.0 V to
V
bb
T
j= -40...+150°C
I
IN(on) 10 -- 100 µA
Input resistance
R
IN 1.5 2.8 3.5 k
7
)I
L(ISO) is limited by current limitation, see
I
L(SC), next page
Data Sheet 4 V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Parameter and Conditions Symbol Values Unit
at
T
j = 25 °C,
V
bb = 13.5V unless otherwise specified min typ max
Operating Parameters
Operating voltage8)
T
j =-40...+150°C
V
bb(on) 5.0 -- 34 V
Undervoltage shutdown
T
j =-40...+150°C
V
bb(under) 3.5 -- 5 V
Undervolta
g
e restart
T
j
=-40...+25°C
T
j =+150°C
V
bb(u rst) -- -- 6.5
7.0
V
Undervolta
g
e restart of char
g
e pumpe
see diagram page 7
V
bb(ucp) -- 5.6 7 V
Undervoltage hysteresis
V
bb(under) =
V
bb(u rst) -
V
bb(under)
V
bb(under) -- 0.3 -- V
Overvoltage shutdown
T
j =-40...+150°C
V
bb(over) 34 -- 42 V
Overvoltage restart
T
j =-40...+150°C
V
bb(o rst) 33 -- -- V
Overvoltage hysteresis
T
j =-40...+150°C
V
bb(over) -- 0.7 -- V
Standby current (pin 4),
V
in = low
T
j =-40...+150°C
I
bb(off) -- 10 25 µA
Operating current (pin 2),
V
in = 5 V
I
GND -- 1 1.6 mA
leakage current (pin 1)
V
in = low
T
j =-40...+25°C
T
j =150°C
I
L(off) -- 2 5
7
µA
Protection Functions
Current limit (pin 4 to 1)
T
j= 25°C
V
bb = 20V
T
j= -40...+150°C
I
L(SC) 0.7
0.7
1.5
--
2
2.4
A
Overvoltage protection
I
bb=4mA
T
j =-40...+150°C
V
bb(AZ) 41 -- -- V
Output clamp (ind. load switch off)
at
V
OUT=
V
bb-
V
ON(CL),
I
bb = 4mA
V
ON(CL) 41 47 -- V
Thermal overload trip temperature
T
jt 150 -- -- °C
Thermal hysteresis
T
jt -- 10 -- K
Inductive load switch-off energy dissipation9)
T
j Start = 150 °C, single pulse,
I
L = 0.5 A,
V
bb = 12 V
(not tested, specified by design)
E
AS -- -- 0.5 J
Reverse battery (pin 4 to 2) 10)
(not tested, specified by design)
-
V
bb -- -- 30 V
8)At supply voltage increase up to
V
bb= 5.6 V typ without charge pump,
V
OUT
V
bb - 2 V
9)While demagnetizing load inductance, dissipated energy in PROFET is
E
AS=
V
ON(CL) *
i
L(t) dt, approx.
E
AS=1/2*
L
*
I
2
L* (
V
ON(CL)
V
ON(CL) -
V
bb )
10)Requires 150 resistor in GND connection. Reverse load current (through intrinsic drain-source diode) is normally limited by the
connected load.
7
Data Sheet 5 V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Data Book 5 200896
Max. allowable power dissipation
Ptot = f (TA,TSP)
Ptot [W]
0
2
4
6
8
10
12
14
16
18
0 25 50 75 100 125 150
T
A
T
SP
TA, TSP[°C]
On state resistance (Vbb-pin to OUT-pin)
RON = f (Tj); Vbb = 13.5 V; IL = 0.5 A
RON []
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
-50 -25 0 25 50 75 100 125 150
98%
Tj [°C]
Current limit characteristic
IL(SC) = f (Von); (Von see testcircuit)
IL(SC) [A]
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
02468101214
25°C
150°C
-40°C
Von [V]
Typ. input current
IIN = f (VIN); Vbb = 13,5 V
IIN [µA]
0
5
10
15
20
25
30
35
40
45
50
02468101214
-40°C
+150°C
+25°C
VIN [V]
Data Sheet 6 V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Typ. operating current
IGND = f (Tj); Vbb = 13,5 V; VIN = high
IGND [mA]
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
-50 -25 0 25 50 75 100 125 150
Tj [°C]
Typ. standby current
Ibb(off) = f (Tj); Vbb = 13,5 V; VIN = low
Ibb(off)A]
0
1
2
3
4
5
6
7
8
-50 -25 0 25 50 75 100 125 150
Tj [°C]
Typ. overload current
IL(lim) = f (t); Vbb = 13,5 V, no heatsink, Param.: Tjstart
IL(lim) [A]
0
0.2
0.4
0.6
0.8
1
1.2
1.4
-50 0 50 100 150 200 250 300 350 400
-40°C
+150°C +25°C
t [ms]
Short circuit current
IL(SC) = f (Tj); Vbb = 13,5 V
IL(SC) [A]
0
0.2
0.4
0.6
0.8
1
1.2
1.4
-50 -25 0 25 50 75 100 125 150
Tj [°C]
Data Sheet 7 V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Typ. input turn on voltage threshold
VIN(T+) = f (Tj);
VIN(T+) [V]
0
0.5
1
1.5
2
2.5
3
-50 -25 0 25 50 75 100 125 150
13V
Tj [°C]
Typ. on-state resistance (Vbb-Pin to Out-Pin)
RON = f (Vbb,IL);IL=0.5A, Tj = 25°C
RON [m]
0
50
100
150
200
250
300
0 5 10 15 20 25
Vbb [V]
Figure 6: Undervoltage restart of charge pumpe
VON [V]
Vbb(under)
Vbb(u rst)
Vbb(over)
Vbb(o rst)
Vbb(u cp)
V
bb
[V]
charge pump starts at Vbb(ucp) about 7 V typ.
Test circuit
Data Sheet 8 V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Package Outlines
Figure 1 PG-SOT-223 (Plastic Dual Small Outline Package) (RoHS-compliant)
To meet the world-wide customer requirements for environmentally friendly products and to be compliant with
government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-
free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
Please specify the package needed (e.g. green package) when placing an order
±0.1
±0.2
±0.1
0.7
4
3
21
6.5
3
acc. to
+0.2
DIN 6784
1.6
±0.1
15˚max
±0.04
0.28
7±0.3
±0.2
3.5
0.5
0.1 max
min
B
M
0.25
B
A
2.3
4.6
A
M
0.25
You can find all of our packages, sorts of packing and others in our
Infineon Internet Page “Products”: http://www.infineon.com/products.Dimensions in mm
Data Sheet 9 V1.0, 2007-05-25
Smart High-Side Power Switch
BSP452
Revision History
Version Date Changes
1.0 2007-05-25 Creation of the green datasheet.
First page :
Adding the green logo and the AEC qualified
Adding the bullet AEC qualified and the RoHS compliant features
Package page
Modification of the package to be green.
Edition 2007-05-25
Published by
Infineon Technologies AG
81726 Munich, Germany
© Infineon Technologies AG 5/29/07.
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values
stated herein and/or any information regarding the application of the device, Infineon Technologies hereby
disclaims any and all warranties and liabilities of any kind, including without limitation warranties of
non-infringement of intellectual property rights of any third party.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements components may contain dangerous substances. For information on the types in
question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.