82
Revised: July 29, 2010 12:24 PM
©2010 Littelfuse, Inc
Teccor® brand Thyristors
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
8 Amp Sensitive, Standard & Alternistor (High Commutation) Triacs
Lxx08xx & Qxx08xx & Qxx08xHx Series
Soldering Parameters
Reflow Condition 1Co'SFFBTTFNCMZ
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)oTFDT
Average ramp up rate (Liquidus Temp)
(TL) to peak ¡$TFDPOENBY
TS(max) to TL - Ramp-up Rate ¡$TFDPOENBY
Reflow - Temperature (TL) (Liquidus) ¡$
- Temperature (tL)oTFDPOET
Peak Temperature (TP)+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)oTFDPOET
Ramp-down Rate ¡$TFDPOENBY
Time 25°C to peak Temperature (TP)NJOVUFT.BY
Do not exceed 280°C
Physical Specifications Environmental Specifications
Test Specifications and Conditions
AC Blocking (VDRM).*-45%.$POE""QQMJFE
Peak AC voltage @ 125°C for 1008 hours
Temperature Cycling
.*-45%.
100 cycles; -40°C to +150°C; 15-min
dwell-time
Temperature/
Humidity
&*"+&%&$+&4%"
IPVST7%$¡$
rel humidity
High Temp Storage .*-45%.
1008 hours; 150°C
Low-Temp Storage 1008 hours; -40°C
Thermal Shock
.*-45%.
10 cycles; 0°C to 100°C; 5-min dwell-
UJNFBUFBDIUFNQFSBUVSFTFDNBY
transfer time between temperature
Autoclave
&*"+&%&$+&4%"
IPVST¡$BU"5.TBOE
3)
Resistance to
Solder Heat .*-45%.FUIPE
Solderability "/4*+45%DBUFHPSZ5FTU"
Lead Bend .*-45%.$POE&
Terminal Finish .BUUF5JOQMBUFE
Body Material 6-SFDPHOJ[FEFQPYZNFFUJOHnBNNBCJMJUZ
DMBTTJmDBUJPO7
Terminal Material Copper Alloy
Design Considerations
Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
UPXBSEFYUFOEJOHUIFPQFSBUJOHMJGFPGUIF5IZSJTUPS(PPE
EFTJHOQSBDUJDFTIPVMEMJNJUUIFNBYJNVNDPOUJOVPVT
DVSSFOUUISPVHIUIFNBJOUFSNJOBMTUPPGUIFEFWJDF
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
reheat
Ramp-up
Ramp-up
Ramp-down
amp-