THIRD ANGLE PROJ.
DATEDESCRIPTIONREV
REVISIONS
ECO APPR
CAD FILE REV
DWG SIZE
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN METRIC AND TOLERANCES ARE:
#0.1mm #0.2mm
6 - 30mm
0.5 - 6mm
30 - 120mm
# 0.3mm
ANGLES
#1$
<0.5mm
# 0.05mm
10.16
5.08
5.08
2.54
TYP(2)
2
TYP(2)
0.9
13.1#0.3
14.5#0.3
2.9#0.3
4.1#0.3
8.9#0.3 7.37#0.3
0.76 REF
1.73 REF
12#0.3
0.72 REF
5.08
6.17
0.76
12.83
11.7
34.7 REF
A RELEASE TO MFG. 5/20/98 42490 CPM/DR
B UPDATED FORMAT AND NOMINAL ENVELOPE DIMENSIONS 11/29/12 49278 EW
B
B
REFERENCE
CONFIGURATION LEVEL:
NOTICE - These drawings, specifications, or other data (1) are, and remain the
property of Amphenol corp. (2) must be returned upon requiest; and (3) arre
confidential and not to be disclosed to any person other than those to whom they
are given by Amphenol Corp. the funishing of these drawings, specifications, or
other data by Amphenol Corp., or to any other person to anyone for any purpose is
not to be regarded by implicatioin or otherwise in any manner licensing, granting
rights to permitting such holder or any other sperson to manufacture, use or sell any
product, process or design, patented or otherwsie, that may in any way be related to
or disclosed by said drawings, specifications, or other data.
SHEET 2 OF 2
SCALE: 4.0:1.06/4/98 D. ROYCE
TITLE
75 OHM BNC
R/A JACK, ISOLATED
LOW PROFILE
DATEAPPROVED
Amphenol RF
www.amphenolrf.com
DATE
5/13/98
ENGINEER
D ROYCE
MATERIAL
-
-
DATE
26-Jun-12
DRAWN
ERIC WANKOFF
FINISH
DRAWING NO. 31-71053
ITEM NO. 31-71053
PART NO. 31-71053
NOTES:
1. MATERIALS AND FINISHES:
BODY - ZINC DIE CAST, NICKEL PLATING
CONTACT - PHOSPHOR BRONZE, GOLD PLATING (.000003 THICK)
@ CONTACT AREA ONLY, TIN PLATING AT TAIL, NICKEL PLATED OVERALL
INSULATOR - POLYPROPYLENE
HOUSING - PBT, BLACK
ROUND PIN - BRASS, TIN PLATING
GROUNDNG TERMINAL - STEEL, TIN PLATING
2. ELECTRICAL:
A. IMPEDANCE: 75 OHM
B. FREQUENCY RANGE: DC - 1 GHz
C. DIELECTRIC WITHSTANDING VOLTAGE: 1500 VRMS, MIN.
3. MECHANICAL:
A. DURABILITY: 500 CYCLES MIN.
B. TEMPERATURE RANGE: -55 $ C TO 85 $ C
4. PACKAGING:
A. PACKAGED IN PACKING TRAYS
B. QUANTITY PER TRAY: 40
5. SEPERATELY SUPPLIED MOUNTNG HARDWARE TO BE
TIGHTENED TO 10 IN-LBS MIN/15 IN-LBS MAX
WHEN ASSEMBLING TO PANEL
PANEL CUTOUT
RECOMMENDED PCB LAYOUT
GROUND SIGNAL
1/2"-28UNEF-THREAD
BNC PER MIL-STD-348
GROUND
SIGNAL
SCALE 1.000
