SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1988, Texas Instruments Incorporated
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SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
SDLS119 − DECEMBER 1983 − REVISED MARCH 1988
6POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
JM38510/00205BCA OBSOLETE CDIP J 14 TBD Call TI Call TI -55 to 125
JM38510/00205BDA OBSOLETE CFP W 14 TBD Call TI Call TI -55 to 125
JM38510/07101BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07101BCA
JM38510/07101BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07101BDA
JM38510/30102B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30102B2A
JM38510/30102BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BCA
JM38510/30102BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BDA
JM38510/30102SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
CA
JM38510/30102SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
DA
M38510/07101BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07101BCA
M38510/07101BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
07101BDA
M38510/30102B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30102B2A
M38510/30102BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BCA
M38510/30102BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/
30102BDA
M38510/30102SCA ACTIVE CDIP J 14 25 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
CA
M38510/30102SDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 JM38510/30102S
DA
SN5474J OBSOLETE CDIP J 14 TBD Call TI Call TI -55 to 125
SN54LS74AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54LS74AJ
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
SN54S74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SN54S74J
SN7474DR OBSOLETE SOIC D 14 TBD Call TI Call TI 0 to 70
SN7474N OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN7474N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN74LS74AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADBR ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LS74A
SN74LS74AJ OBSOLETE CDIP J 14 TBD Call TI Call TI 0 to 70
SN74LS74AN ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS74AN
SN74LS74AN3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN74LS74ANE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74LS74AN
SN74LS74ANSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS74A
SN74LS74ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74LS74A
SN74S74D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S74
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
SN74S74DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S74
SN74S74DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 S74
SN74S74N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S74N
SN74S74N3 OBSOLETE PDIP N 14 TBD Call TI Call TI 0 to 70
SN74S74NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 SN74S74N
SN74S74NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74S74
SN74S74NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74S74
SN74S74NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 74S74
SNJ5474J OBSOLETE CDIP J 14 TBD Call TI Call TI -55 to 125
SNJ5474W OBSOLETE CFP W 14 TBD Call TI Call TI -55 to 125
SNJ54LS74AFK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54LS
74AFK
SNJ54LS74AJ ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS74AJ
SNJ54LS74AW ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54LS74AW
SNJ54S74FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 SNJ54S
74FK
SNJ54S74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S74J
SNJ54S74W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type -55 to 125 SNJ54S74W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Jan-2013
Addendum-Page 4
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Only one of markings shown within the brackets will appear on the physical device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN5474, SN54LS74A, SN54LS74A-SP, SN54S74, SN7474, SN74LS74A, SN74S74 :
•Catalog: SN7474, SN74LS74A, SN54LS74A, SN74S74
•Military: SN5474, SN54LS74A, SN54S74
•Space: SN54LS74A-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS74ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LS74ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74S74NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS74ADBR SSOP DB 14 2000 367.0 367.0 38.0
SN74LS74ADR SOIC D 14 2500 367.0 367.0 38.0
SN74S74NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 8-Apr-2013
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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