© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 7 1Publication Order Number:
MC74AC245/D
MC74AC245, MC74ACT245
Octal Bidirectional
Transceiver with 3−State
Inputs/Outputs
The MC74AC245/74ACT245 contains eight non−inverting
bidirectional buffers with 3−state outputs and is intended for
bus−oriented applications. Current sinking capability is 24 m A at both
the A and B ports. The Transmit/Receive (T/R) input determines the
direction of data flow through the bidirectional transceiver. Transmit
(active−HIGH) enables data from A ports to B ports; Receive
(active−LOW) enables data from B ports to A ports. The Output
Enable input, when HIGH, disables both A and B ports by placing
them in a High Z condition.
Features
•Noninverting Buffers
•Bidirectional Data Path
•A and B Outputs Source/Sink 24 mA
•′ACT245 has TTL Compatible Inputs
•Pb−Free Packages are Available
PIN ASSIGNMENT
PIN FUNCTION
OE Output Enable Input
T/R Transmit/Receive Input
A0−A7Side A 3−State Inputs or 3−State Outputs
B0−B7Side B 3−State Inputs or 3−State Outputs
TRUTH TABLES
Inputs Outputs
OE T/R
L L Bus B Data to Bus A
L H Bus A Data to Bus B
H X High Z State
H = HIGH Voltage Level
L = LOW Voltage Level
X = Immaterial
Figure 1.
1920 18 17 16 15 14
21 34567
VCC
13
8
12
9
11
10
OE B0B1B2B3B4B5B6B7
T/R A0A1A2A3A4A5A6A7GND
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SOIC−20W
DW SUFFIX
CASE 751D
TSSOP−20
DT SUFFIX
CASE 948E
SOEIAJ−20
M SUFFIX
CASE 967
1
1
1
PDIP−20
N SUFFIX
CASE 738
1
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
See general marking information in the device marking
section on page 7 of this data sheet.
DEVICE MARKING INFORMATION
MC74AC245, MC74ACT245
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2
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage (Referenced to GND) −0.5 to +7.0 V
VIN DC Input Voltage (Referenced to GND) −0.5 to VCC +0.5 V
VOUT DC Output Voltage (Referenced to GND) −0.5 to VCC +0.5 V
IIN DC Input Current, per Pin ±20 mA
IOUT DC Output Sink/Source Current, per Pin ±50 mA
ICC DC VCC or GND Current per Output Pin ±50 mA
Tstg Storage Temperature −65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
VCC Supply Voltage ′AC 2.0 5.0 6.0 V
′ACT 4.5 5.0 5.5
VIN, VOUT DC Input Voltage, Output Voltage (Ref. to GND) 0 − VCC V
tr, tfInput Rise and Fall Time (Note 1)
′AC Devices except Schmitt Inputs
VCC @ 3.0 V − 150 −
VCC @ 4.5 V − 40 − ns/V
VCC @ 5.5 V − 25 −
tr, tfInput Rise and Fall Time (Note 2)
′ACT Devices except Schmitt Inputs VCC @ 4.5 V − 10 − ns/V
VCC @ 5.5 V − 8.0 −
TJJunction Temperature (PDIP) − − 140 °C
TAOperating Ambient Temperature Range −40 25 85 °C
IOH Output Current − High − − −24 mA
IOL Output Current − Low − − 24 mA
1. VIN from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.
2. VIN from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
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3
DC CHARACTERISTICS
Symbol Parameter VCC
(V)
74AC 74AC
Unit Conditions
TA = +25°CTA =
−40°C to
+85°C
Typ Guaranteed Limits
VIH Minimum High Level
Input Voltage 3.0 1.5 2.1 2.1 VOUT = 0.1 V
4.5 2.25 3.15 3.15 V or VCC − 0.1 V
5.5 2.75 3.85 3.85
VIL Maximum Low Level
Input Voltage 3.0 1.5 0.9 0.9 VOUT = 0.1 V
4.5 2.25 1.35 1.35 V or VCC − 0.1 V
5.5 2.75 1.65 1.65
VOH Minimum High Level
Output Voltage 3.0 2.99 2.9 2.9 IOUT = −50 mA
4.5 4.49 4.4 4.4 V
5.5 5.49 5.4 5.4
V
*VIN = VIL or VIH
3.0 − 2.56 2.46 −12 mA
4.5 − 3.86 3.76 IOH −24 mA
5.5 − 4.86 4.76 −24 mA
VOL Maximum Low Level
Output Voltage 3.0 0.002 0.1 0.1 IOUT = 50 mA
4.5 0.001 0.1 0.1 V
5.5 0.001 0.1 0.1
V
*VIN = VIL or VIH
3.0 − 0.36 0.44 12 mA
4.5 − 0.36 0.44 IOL 24 mA
5.5 − 0.36 0.44 24 mA
IIN Maximum Input
Leakage Current 5.5 − ±0.1 ±1.0 mAVI = VCC, GND
IOZT Maximum
3-State
Current
VI (OE) = VIL, VIH
5.5 − ±0.6 ±6.0 mAVI = VCC, GND
VO = VCC, GND
IOLD †Minimum Dynamic
Output Current 5.5 − − 75 mA VOLD = 1.65 V Max
IOHD 5.5 − − −75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
Supply Current 5.5 − 8.0 80.0 mAVIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
† Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
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4
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
Symbol Parameter VCC*
(V)
74AC 74AC
Unit Fig.
No.
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min Typ Max Min Max
tPLH Propagation Delay 3.3 1.5 5.0 8.5 1.0 9.0 ns 3−5
An to Bn or Bn to An5.0 1.5 3.5 6.5 1.0 7.0
tPHL Propagation Delay 3.3 1.5 5.0 8.5 1.0 9.0 ns 3−5
An to Bn or Bn to An5.0 1.5 3.5 6.0 1.0 7.0
tPZH Output Enable Time 3.3 2.5 7.0 11.5 2.0 12.5 ns 3−7
5.0 1.5 5.0 8.5 1.0 9.0
tPZL Output Enable Time 3.3 2.5 7.5 12.0 2.0 13.5 ns 3−8
5.0 1.5 5.5 9.0 1.0 9.5
tPHZ Output Disable Time 3.3 2.0 6.5 12.0 1.0 12.5 ns 3−7
5.0 1.5 5.5 9.0 1.0 10.0
tPLZ Output Disable Time 3.3 2.0 7.0 11.5 1.5 13.0 ns 3−8
5.0 1.5 5.5 9.0 1.0 10.0
*Voltage Range 3.3 V is 3.3 V ±0.3 V.
Voltage Range 5.0 V is 5.0 V ±0.5 V.
DC CHARACTERISTICS
Symbol Parameter VCC
(V)
74ACT 74ACT
Unit Conditions
TA = +25°CTA =
−40°C to
+85°C
Typ Guaranteed Limits
VIH Minimum High Level
Input Voltage 4.5 1.5 2.0 2.0 VVOUT = 0.1 V
5.5 1.5 2.0 2.0 or VCC − 0.1 V
VIL Maximum Low Level
Input Voltage 4.5 1.5 0.8 0.8 VVOUT = 0.1 V
5.5 1.5 0.8 0.8 or VCC − 0.1 V
VOH Minimum High Level
Output Voltage 4.5 4.49 4.4 4.4 VIOUT = −50 mA
5.5 5.49 5.4 5.4
*VIN = VIL or VIH
4.5 − 3.86 3.76 V IOH −24 mA
5.5 − 4.86 4.76 −24 mA
VOL Maximum Low Level
Output Voltage 4.5 0.001 0.1 0.1 VIOUT = 50 mA
5.5 0.001 0.1 0.1
*VIN = VIL or VIH
4.5 − 0.36 0.44 V IOL 24 mA
5.5 − 0.36 0.44 24 mA
IIN Maximum Input
Leakage Current 5.5 − ±0.1 ±1.0 mAVI = VCC, GND
DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V
IOZT Maximum
3−State
Current
VI (OE) = VIL, VIH
5.5 − ±0.6 ±6.0 mAVI = VCC, GND
VO = VCC, GND
IOLD †Minimum Dynamic
Output Current 5.5 − − 75 mA VOLD = 1.65 V Max
IOHD 5.5 − − −75 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
Supply Current 5.5 − 8.0 80.0 mAVIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
† Maximum test duration 2.0 ms, one output loaded at a time.
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5
AC CHARACTERISTICS (For Figures and Waveforms − See AND8277/D at www.onsemi.com)
Symbol Parameter VCC*
(V)
74ACT 74ACT
Unit Fig.
No.
TA = +25°C
CL = 50 pF
TA = −40°C
to +85°C
CL = 50 pF
Min Typ Max Min Max
tPLH Propagation Delay, An to Bn or Bn to An5.0 1.5 4.0 7.5 1.5 8.0 ns 3−5
tPHL Propagation Delay, An to Bn or Bn to An5.0 1.5 4.0 8.0 1.0 9.0 ns 3−5
tPZH Output Enable Time 5.0 1.5 5.0 10 1.5 11.0 ns 3−7
tPZL Output Enable Time 5.0 1.5 5.5 10 1.5 12.0 ns 3−8
tPHZ Output Disable Time 5.0 1.5 5.5 10 1.0 11.0 ns 3−7
tPLZ Output Disable Time 5.0 2.0 5.0 10 1.5 11.0 ns 3−8
*Voltage Range 5.0 V is 5.0 V ±0.5 V.
CAPACITANCE
Symbol Parameter Value
Typ Unit Test Conditions
CIN Input Capacitance 4.5 pF VCC = 5.0 V
CI/O Input/Output Capacitance 15 pF VCC = 5.0 V
CPD Power Dissipation Capacitance 45 pF VCC = 5.0 V
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6
ORDERING INFORMATION
Device Package Shipping†
MC74AC245N PDIP−20
18 Units / Rail
MC74AC245NG PDIP−20
(Pb−Free)
MC74ACT245N PDIP−20
MC74ACT245NG PDIP−20
(Pb−Free)
MC74AC245DW SOIC−20 38 Units / Rail
MC74AC245DWG SOIC−20
(Pb−Free)
MC74AC245DWR2 SOIC−20 1000 / Tape & Reel
MC74AC245DWR2G SOIC−20
(Pb−Free)
MC74ACT245DW SOIC−20 38 Units / Rail
MC74ACT245DWG SOIC−20
(Pb−Free)
MC74ACT245DWR2 SOIC−20 1000 / Tape & Reel
MC74ACT245DWR2G SOIC−20
(Pb−Free)
MC74AC245DT TSSOP−20* 75 Units / Rail
MC74AC245DTG TSSOP−20*
MC74AC245DTR2 TSSOP−20* 2500 / Tape & Reel
MC74AC245DTR2G TSSOP−20*
MC74ACT245DT TSSOP−20* 75 Units / Rail
MC74ACT245DTG TSSOP−20*
MC74ACT245DTR2 TSSOP−20* 2500 / Tape & Reel
MC74ACT245DTR2G TSSOP−20*
MC74AC245M SOEIAJ−20 40 Units / Rail
MC74AC245MG SOEIAJ−20
(Pb−Free)
MC74AC245MEL SOEIAJ−20 2000 / Tape & Reel
MC74AC245MELG SOEIAJ−20
(Pb−Free)
MC74ACT245M SOEIAJ−20 40 Units / Rail
MC74ACT245MG SOEIAJ−20
(Pb−Free)
MC74ACT245MEL SOEIAJ−20 2000 / Tape & Reel
MC74ACT245MELG SOEIAJ−20
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*These packages are inherently Pb−Free.
MC74AC245, MC74ACT245
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7
MARKING DIAGRAMS
PDIP−20 SOIC−20W TSSOP−20 SOEIAJ−20
20
1
1
20
AC
245
ALYWG
G
74ACT245
AWLYWWG
1
20 MC74AC245N
AWLYYWWG
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G= Pb−Free Package
(Note: Microdot may be in either location)
20
1
74AC245
AWLYWWG
1
20
ACT
245
ALYWG
G
20
1
ACT245
AWLYYWWG
1
20 MC74ACT245N
AWLYYWWG
20
1
AC245
AWLYYWWG
MC74AC245, MC74ACT245
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8
PACKAGE DIMENSIONS
PDIP−20
N SUFFIX
PLASTIC DIP PACKAGE
CASE 738−03
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
M
L
J20 PL
M
B
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A25.66 27.171.010 1.070
B6.10 6.600.240 0.260
C3.81 4.570.150 0.180
D0.39 0.550.015 0.022
G2.54 BSC0.100 BSC
J0.21 0.380.008 0.015
K2.80 3.550.110 0.140
L7.62 BSC0.300 BSC
M0 15 0 15
N0.51 1.010.020 0.040
____
E
1.27 1.770.050 0.070
1
11
10
20
−A−
SEATING
PLANE
K
N
FG
D20 PL
−T−
M
A
M
0.25 (0.010) T
E
B
C
F
1.27 BSC0.050 BSC
SOIC−20W
DW SUFFIX
CASE 751D−05
ISSUE G
20
1
11
10
B20X
H10X
C
L
18X A1
A
SEATING
PLANE
q
hX 45_
E
D
M
0.25 M
B
M
0.25 S
AS
B
T
eT
B
A
DIM MIN MAX
MILLIMETERS
A2.35 2.65
A1 0.10 0.25
B0.35 0.49
C0.23 0.32
D12.65 12.95
E7.40 7.60
e1.27 BSC
H10.05 10.55
h0.25 0.75
L0.50 0.90
q0 7
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
__
MC74AC245, MC74ACT245
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9
PACKAGE DIMENSIONS
TSSOP−20
DT SUFFIX
CASE 948E−02
ISSUE C
DIM
A
MIN MAX MIN MAX
INCHES
6.60 0.260
MILLIMETERS
B4.30 4.50 0.169 0.177
C1.20 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.27 0.37 0.011 0.015
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
____
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
ÍÍÍÍ
ÍÍÍÍ
ÍÍÍÍ
110
1120
PIN 1
IDENT
A
B
−T−
0.100 (0.004)
C
DGH
SECTION N−N
K
K1
JJ1
N
N
M
F
−W−
SEATING
PLANE
−V−
−U−
S
U
M
0.10 (0.004) V S
T
20X REFK
L
L/22X
S
U0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
6.40 0.252
−−− −−−
S
U0.15 (0.006) T
7.06
16X
0.36 16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MC74AC245, MC74ACT245
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10
PACKAGE DIMENSIONS
SOEIAJ−20
M SUFFIX
CASE 967−01
ISSUE A
DIM MIN MAX MIN MAX
INCHES
−−− 2.05 −−− 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.15 0.25 0.006 0.010
12.35 12.80 0.486 0.504
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
−−− 0.81 −−− 0.032
A1
HE
Q1
LE
_10
_0
_10
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
HE
A1
LEQ1
_
c
A
ZD
E
20
110
11
b
M
0.13 (0.005)
e
0.10 (0.004)
VIEW P
DETAIL P
M
L
A
b
c
D
E
e
L
M
Z
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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PUBLICATION ORDERING INFORMATION
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
MC74AC245/D
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P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
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