SKCD 20 C 120 I4 Absolute Maximum Ratings Symbol Conditions Values Unit VRRM Tj = 25 C, IR = 0.06 mA IF(AV) Tc = 80 C, Tj = 175 C, Fi=PI/2 1200 V 21 A IFSM 10 ms sin 180 Tj = 25 C 170 A Tj = 150 C 170 A 175 C Tjmax CAL-DIODE Electrical Characteristics Symbol Conditions IF = 35 A i2t Tj = 150 C, sin 180, 10 ms VRRM = 1200 V IR Size: 4,47 mm x 4,47 mm SKCD 20 C 120 I4 min. Tj = 25 C, VRRM = 1200 V Tj = 150 C, VRRM = 1200 V VF typ. 2.70 max. Unit 145 A2s 0.06 mA 5.50 mA Tj = 25 C, IF = 35 A 2.30 2.62 V Tj = 150 C, IF = 35 A 2.29 2.62 V Tj = 175 C, IF = 35 A 2.14 2.46 V V(TO) Tj = 150 C 0.90 1.10 V m rT Tj = 150 C 39.8 43.40 Features V(TO) Tj = 175 C 0.82 0.98 V * * * * rT Tj = 175 C 37.80 42.40 m typ. max. Unit max. junction 175 C very low forward voltage drop positive temperature coefficient extreme soft recovery Dynamic Characteristics Symbol Conditions min. Typical Applications* * freewheeling diode for IGBT trr Tj = 150 C, 35 A, 600 V, 600 A/s 0.59 s Err Tj = 150 C, 35 A, 600 V, 600 A/s 1.6 mJ Irrm Tj = 150 C, 35 A, 600 V, 600 A/s 22.8 A Thermal Characteristics Symbol Conditions min. typ. max. Unit C Tj -40 175 Tstg -40 175 C 250 C Tsolder 10 min. Tsolder 5 min. Rth(j-c) Semitrans Assembly 320 C 1.48 K/W Values Unit 4.47 x 4.47 mm2 20 mm2 Mechanical Characteristics Symbol Conditions Raster size Area total Anode Metallization bondable (Al) Cathode Metallization solderable (Ag/Ni) Wire bond Al, typ. diameter = 300 m Package wafer frame Chips / Package 746 pcs SKCD (c) by SEMIKRON Rev. 1 - 19.02.2010 1 SKCD 20 C 120 I4 This is an electrostatic discharge sensitive device (ESDS), international standard IEC 60747-1, Chapter IX * The specifications of our components may not be considered as an assurance of component characteristics. Components have to be tested for the respective application. Adjustments may be necessary. The use of SEMIKRON products in life support appliances and systems is subject to prior specification and written approval by SEMIKRON. We therefore strongly recommend prior consultation of our personal. 2 Rev. 1 - 19.02.2010 (c) by SEMIKRON