GE Data Sheet
October 2, 2015 ©2012 General Electric Company. All rights reserved.
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Features
Compliant to RoHS EU Directive 2011/65/EU (Z versions)
Compliant to RoHS EU Directive 2011/65/EU under
exemption 7b (Lead solder exemption). Exemption 7b
will expire after June 1, 2016 at which time this produc
twill no longer be RoHS compliant (non-Z versions)
Delivers up to 6A Output current
5V (4A), 3.3V (5A), 2.5V – 1.0V (6A each)
High efficiency – 89% at 5.0V full load
Low Output voltage- supports migration to future IC
supply voltages down to 1.0V
Low output ripple and noise
Small Size and low profile
47.2mm x 29.5mm x 8.5mm
(1.86 x 1.16 x 0.335 in)
Surface mount or Through hole (TH)
Remote On/Off
Output overcurrent/Over voltage protection
Over temperature protection
Single Tightly regulated output
Output voltage adjustment trim 10%
Wide operating temperature range (-40°C to 85°C)
Meets the voltage insulation requirements for ETSI 300-
132-2 and complies with and is Licensed for Basic
Insulation rating per EN 60950
CE mark meets 73/23/EEC and 93/68/EEC directives§
UL* 60950-1Recognized, CSA† C22.2 No. 60950-1-03
Certified, and VDE‡ 0805:2001-12 (EN60950-1) Licensed
ISO** 9001 and ISO 14001 certified manufacturing
facilities
Applications
Wireless Networks
Distributed power architectures
Optical and Access Network Equipment
Enterprise Networks
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Options
Remote On/Off logic (positive or negative)
Surface Mount (-S Suffix)
Additional Vout+ pin (-3 Suffix)
Description
The HW/HC series power modules are isolated dc-dc converters that operate over a wide input voltage range of 18 to 36
Vdc (HC) or 36 to 75 Vdc (HW) and provide one precisely regulated output. The output is fully isolated from the input,
allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency, e.g. typical
efficiency of 87% 3.3V/5A, 86% at 2.5V/6A. Built-in filtering for both input and output minimizes the need for external
filtering. These open frame modules are available either in surface-mount (-S) or in through-hole form.
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
RoHS Compliant
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage HC VIN -0.3 50 Vdc
Continuous HW VIN -0.3 80 Vdc
Transient (100ms) HW VIN, trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation Voltage (100% factory tested) All 2250 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage HC VIN 18 24 36 Vdc
HW VIN 36 54 75 Vdc
Maximum Input Current HC IIN,max 1.75 Adc
(VIN=0V to 75V, IO=IO, max) HW IIN,max 0.85 Adc
Inrush Transient All I2t 1 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12μH source impedance; VIN=0V to 75V,
IO= IOmax ; see Figure 9)
All 5 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
EMC, EN55022 See EMC Considerations section
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part
of complex power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve
maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with
a maximum rating of 3A (see Safety Considerations section). Based on the information provided in this data sheet on inrush
energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse
manufacturer’s data sheet for further information.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point
5V, 3.3V
2.5V, 2.0V,
1.8V, 1.5V
VO, set -1.0 +1.0 % VO, nom
(VIN=VIN,nom, IO=IO, max, Tref=25°C) 1.2V, 1.0V VO, set -1.25 +1.25 % VO, nom
Output Voltage All VO -3.0 +3.0 % VO, nom
(Over all operating input voltage, resistive load,
and temperature conditions until end of life)
Adjustment Range All VO -10.0 +10.0 % VO, nom
Selected by external resistor
Output Regulation
Line (VIN=VIN, min to VIN, max) All
10 mV
Load (IO=IO, min to IO, max) All
15 mV
Temperature (Tref=TA, min to TA, max) All
1.00 %
Output Ripple and Noise on nominal output
(VIN=VIN, nom and IO=IO, min to IO, max)
RMS (5Hz to 20MHz bandwidth) All 8 15 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All 25 50 mVpk-pk
External Capacitance All CO, max 470 μF
Output Current 5V Io 0 4.0 Adc
3.3V Io 0 5.0 Adc
2.5V, 2.0,
1.8V, 1.5V,
1.2V, 1.0V
Io 0 6.0 Adc
Output Current Limit Inception 5V IO, lim 6.5 Adc
( Hiccup Mode ) 3.3V IO, lim 7 Adc
2.5V, 2.0V,
1.8V, 1.5V,
1.2V, 1.0V
IO, lim 8.5 Adc
Output Short-Circuit Current 5V IO, s/c 2.4 A rms
(VO≤250mV) ( Hiccup Mode ) 3.3V IO, s/c 2.4 A rms
2.5V, 2.0V,
1.8V, 1.5V,
1.2V, 1.0V
IO, s/c 2.8 A rms
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 4
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
HW 5V η 89.0 %
Efficiency HW 3.3V η 87.0 %
VIN=VIN, nom, TA=25°C HW 2.5V η 86.0 %
IO=IO, max , VO= VO,set HW 2.0V η 82.0 %
HW 1.8V η 82.0 %
HW 1.5V η 80.0 %
HW 1.2V η 77.0 %
HW 1.0V η 75.0 %
HC 5V η 88.0 %
HC 3.3V η 86.0 %
Switching Frequency All HW fsw 300 kHz
All HC fsw 380 kHz
Dynamic Load Response
(Io/t=1A/s; Vin=Vin,nom; TA=25°C) 5V, 3.3V Vpk 100 mV
Load Change from Io= 50% to 75% of Io,max:
2.5V, 2.0V,
1.8V, 1.5V,
1.2V, 1.0V
Vpk 80 mV
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts 100 s
Dynamic Line Response
(Vin / t0.5V/s; Vin=Vin,nom; TA=25°C)
Peak Deviation All Vpk 0.6 2 %Vo, set
Settling Time (Vo<10% peak deviation) All ts 150 1000 s
Isolation Specifications
Parameter Symbol Min Typ Max Unit
Isolation Capacitance Ciso 200 pF
Isolation Resistance Riso 10 MΩ
General Specifications
Parameter Min Typ Max Unit
Calculated MTBF (for HW005A0F1-S in accordance with Lucent RIN 6:
IO=80% of IO, max, TA=25°C, airflow=1m/s) >4,000,000 Hours
Weight 13 g (oz.)
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 5
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions.
See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low Specification
Remote On/Off Current – Logic Low All Ion/off 0.15 1.0 mA
On/Off Voltage:
Logic Low All Von/off 0.0 1.2 V
Logic High – (Typ = Open Collector) All Von/off 5.8 15 V
Logic High maximum allowable leakage current All Ion/off 10 μA
Turn-On Delay and Rise Times
(IO=IO, max)
Tdelay = Time until VO = 10% of VO,set from either
application of Vin with Remote On/Off set to On or
operation of Remote On/Off from Off to On with Vin
already applied for at least one second.
5V, 3.3V Tdelay 100 ms
Trise 40 ms
2.5V, 2.0V,
1.8V, 1.5V,
1.2V, 1.0V
Tdelay 12 ms
Trise = time for VO to rise from 10% of VO,set to 90% of
VO,set. Trise 3 ms
5V VO, limit 7.0 V
Output Overvoltage Protection# 3.3V 4.6 V
2.5V
3.5 V
Values are the same for HW and HC codes 2.0V 3.2 V
1.8V
2.8 V
1.5V
2.5 V
1.2V
2.0 V
1.0V
1.8 V
Overtemperature Protection
All Tref 125 °C
(See Feature Descriptions)
Input Undervoltage Lockout
Turn-on Threshold All HW 33 36 V
Turn-off Threshold All HW 27 30 V
Turn-on Threshold All HC 17 18 V
Turn-off Threshold All HC 13.5 15 V
# More accurate Overvoltage protection can be accomplished externally by means of the remote On/Off pin.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 6
Characteristic Curves
The following figures provide typical characteristics for the HW004A0A (5.0V, 4A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
EFFICIENCY, (%)
70
72
74
76
78
80
82
84
86
88
90
01234
VI
= 3 6V
VI = 54 V
VI
= 75V
OUTPUT CURRENT, Io (A)
0
1
2
3
4
5
0 10 20304050 60708090100110
3 .0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/ s (200 f t ./ min.)
NATURAL CONVECTION
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 1. Converter Efficiency versus Output Current Figure 4. Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE,
VO (V) (20mV/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (50V/div) VO (V) (2V/div)
TIME, t (1s/div) TIME, t (20ms/div)
Figure 2. Typical Output Ripple and Noise.
Figure 5. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (1A/div) VO (V) (50mV/div)
On/Off VOLTAGE OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (2V/div)
TIME, t (50s/div) TIME, t (20ms/div)
Figure 3. Transient Response to Dynamic Load Change
from 50% to 75% to 50% of full load.
Figure 6. Typical Start-Up Using Remote On/Off, negative
logic version shown.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 7
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW005A0F (3.3V, 5A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
EFFICIENCY, (%)
70
72
74
76
78
80
82
84
86
88
90
012345
VI
= 36V
VI = 54 V
VI
= 75V
OUTPUT CURRENT, Io (A)
0
1
2
3
4
5
6
0 10 203040 5060 708090100110
3.0 m/s (6 00 f t ./min.)
2.0 m/s (4 00 f t ./min.)
1.0 m/s (2 00 f t ./min.)
NATURAL CONVECTION
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 7. Converter Efficiency versus Output Current Figure 10. Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE,
VO (V) (20mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
VIN (V) (50V/div) VO (V) (1V/div)
TIME, t (1s/div) TIME, t (20ms/div)
Figure 8. Typical Output Ripple and Noise.
Figu
r
e 11. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
On/Off VOLTAGE OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (1V/div)
TIME, t (50s/div) TIME, t (20ms/div)
Figure 9. Transient Response to Dynamic Load Change
from 50% to 75% to 50% of full load.
Figure 12. Typical Start-Up Using Remote On/Off, negative
logic version shown.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 8
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0G (2.5V, 6A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
EFFICIENCY, (%)
68
70
72
74
76
78
80
82
84
86
88
0 1234 56
VI
= 3 6 V
VI = 54 V
VI
= 75V
OUTPUT CURRENT, Io (A)
0
1
2
3
4
5
6
7
0 10 2030405060708090100110
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
NATURAL CONVECTION
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 13. Converter Efficiency versus Output Current. Figure 16. Derating Output Current versus Local Ambient
Temperature and Airflow.
OUTPUT VOLTAGE,
VO (V) (20mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
VIN (V) (50V/div) VO (V) (1V/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 14. Typical Output Ripple and Noise.
Figure 17. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
On/Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (1V/div)
TIME, t (50s/div) TIME, t (5ms/div)
Figure 15. Transient Response to Dynamic Load Change
from 50% to 75% to 50% of full load.
Figure 18. Typical Start-Up Using Remote On/Off, negative
logic version shown.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 9
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0D (2.0V, 6A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
EFFICIENCY, (%)
68
70
72
74
76
78
80
82
84
86
88
0 1234 56
VI
= 3 6 V
VI = 54 V
VI
= 75V
OUTPUT CURRENT, Io (A)
0
1
2
3
4
5
6
7
0 10 203040 50 60 708090100110
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
NATURAL CONVECTION
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 13. Converter Efficiency versus Output Current. Figure 16. Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE,
VO (V) (20mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
VIN (V) (50V/div) VO (V) (1V/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 14. Typical Output Ripple and Noise.
Figure 17. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
On/Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (1V/div)
TIME, t (50s/div) TIME, t (5ms/div)
Figure 15. Transient Response to Dynamic Load Change
from 50% to 75% to 50% of full load.
Figure 18. Typical Start-Up Using Remote On/Off, negative
logic version shown.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 10
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0Y (1.8V, 6A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
EFFICIENCY, (%)
66
68
70
72
74
76
78
80
82
84
86
0 1234 56
VI = 3 6 V
VI = 54 V
VI = 75V
OUTPUT CURRENT, Io (A)
0
1
2
3
4
5
6
7
0 10 203040 50 60 708090100110
2.0 m/s (4 0 0 f t ./ min.)
1.0 m/s (20 0 f t ./ min.)
NATURAL CONVECTION
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 25. Converter Efficiency versus Output Current Figure 28. Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE,
VO (V) (20mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
VIN (V) (25V/div) VO (V) (500mV/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 26. Typical Output Ripple and Noise.
Figure 29. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
On/Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (500mV/div)
TIME, t (50s/div) TIME, t (5ms/div)
Figure 27. Transient Response to Dynamic Load Change
from 50% to 75% to 50% of full load.
Figure 30. Typical Start-Up Using Remote On/Off, negative
logic version shown.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 11
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0M (1.5V, 6A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
EFFICIENCY, (%)
66
68
70
72
74
76
78
80
82
84
86
0 1234 56
VI = 3 6 V
VI = 54 V
VI = 75V
OUTPUT CURRENT, Io (A)
0
1
2
3
4
5
6
7
0 10 203040 50 60 708090100110
2.0 m/s (4 0 0 f t ./ min.)
1.0 m/s (20 0 f t ./ min.)
NATURAL CONVECTION
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 31. Converter Efficiency versus Output Current. Figure 34. Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE,
VO (V) (20mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
VIN (V) (25V/div) VO (V) (500mV/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 32. Typical Output Ripple and Noise.
Figure 35. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
On/Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (500mV/div)
TIME, t (50s/div) TIME, t (5ms/div)
Figure 33. Transient Response to Dynamic Load Change
from 50% to 75% to 50% of full load.
Figure 36. Typical Start-Up Using Remote On/Off, negative
logic version shown.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 12
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0P (1.2V, 6A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
EFFICIENCY, (%)
60
62
64
66
68
70
72
74
76
78
80
0 1234 56
V I
= 3 6 V
V I = 54 V
V I
= 75V
OUTPUT CURRENT, Io (A)
0
1
2
3
4
5
6
7
0 10 2030405060708090100110
3.0 m/s (600 f t ./ min.)
2.0 m/s (400 f t ./ min.)
1.0 m/s (200 ft./min.)
NATURAL CONVECTION
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 37. Converter Efficiency versus Output Current. Figure 40. Derating Output Current versus Local Ambient
Temperature and Airflow
OUTPUT VOLTAGE,
VO (V) (20mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
VIN (V) (50V/div) VO (V) (500mV/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 38. Typical Output Ripple and Noise.
Figure 41. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
On/Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (500mV/div)
TIME, t (50s/div) TIME, t (5ms/div)
Figure 39. Transient Response to Dynamic Load Change
from 50% to 75% to 50% of full load.
Figure 42. Typical Start-Up Using Remote On/Off, negative
logic version shown.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 13
Characteristic Curves (continued)
The following figures provide typical characteristics for the HW006A0S1R0 (1.0V, 6A) at 25ºC. The figures are identical for
either positive or negative Remote On/Off logic.
EFFICIENCY, (%)
60
62
64
66
68
70
72
74
76
78
80
0 1234 56
VI = 36V
VI = 54V
VI = 75V
OUTPUT CURRENT, Io (A)
0
1
2
3
4
5
6
7
0 10 203040 50 60 708090100110
3.0 m/s (600 f t ./ min.)
2.0 m/s (400 ft./ min.)
1.0 m/s (20 0 f t ./min.)
NATURAL CONVECTION
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 43. Converter Efficiency versus Output Current. Figure 46. Derating Output Current versus Local Ambient
Temperature and Airflow.
OUTPUT VOLTAGE,
VO (V) (20mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
VIN (V) (50V/div) VO (V) (500mV/div)
TIME, t (1s/div) TIME, t (5ms/div)
Figure 44. Typical Output Ripple and Noise.
Figure 47. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
On/Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (500mV/div)
TIME, t (50s/div) TIME, t (5ms/div)
Figure 45. Transient Response to Dynamic Load Change
from 50% to 75% to 50% of full load.
Figure 48. Typical Start-Up Using Remote On/Off, negative
logic version shown.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 14
Characteristic Curves (continued)
The following figures provide typical characteristics for the HC004A0A (5.0V, 4A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
EFFICIENCY, (%)
OUTPUT CURRENT, Io (A)
0
1
2
3
4
5
0 10 203040 50 60 708090100110
3.0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/ s ( 2 0 0 f t ./ min.)
Nat ural Co nvect io n
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 49. Converter Efficiency versus Output Current. Figure 52. Derating Output Current versus Local Ambient
Temperature and Airflow.
OUTPUT VOLTAGE,
VO (V) (20mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
VIN (V) (25V/div) VO (V) (2V/div)
TIME, t (1s/div) TIME, t (20ms/div)
Figure 50. Typical Output Ripple and Noise.
Figure 53. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (1A/div) VO (V) (50mV/div)
On/Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (2V/div)
TIME, t (50s/div) TIME, t (20ms/div)
Figure 51. Transient Response to Dynamic Load Change
from 50% to 75% to 50% of full load.
Figure 54. Typical Start-Up Using Remote On/Off, negative
logic version shown.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 15
Characteristic Curves (continued)
The following figures provide typical characteristics for the HC005A0F (3.3V, 5A) at 25ºC. The figures are identical for either
positive or negative Remote On/Off logic.
EFFICIENCY, (%)
OUTPUT CURRENT, Io (A)
0
1
2
3
4
5
6
0 10 203040 50 60 708090100110
3.0 m/s (600 ft./min.)
2.0 m/s (400 ft./min.)
1.0 m/s (200 ft./min.)
Natural Convection
OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA OC
Figure 55. Converter Efficiency versus Output Current. Figure 58. Derating Output Current versus Local Ambient
Temperature and Airflow.
OUTPUT VOLTAGE,
VO (V) (20mV/div)
INPUT VOLTAGE, OUTPUT VOLTAGE
VIN (V) (25V/div) VO (V) (1V/div)
TIME, t (1s/div) TIME, t (20ms/div)
Figure 56. Typical Output Ripple and Noise.
Figure 59. Typical Start-Up with application of Vin.
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
On
/
Off VOLTAGE, OUTPUT VOLTAGE
VON/OFF(V) (5V/div) VO (V) (1V/div)
TIME, t (50s/div) TIME, t (20ms/div)
Figure 57. Transient Response to Dynamic Load Change
from 50% to 75% to 50% of full load.
Figure 60. Typical Start-Up Using Remote On/Off, negative
logic version shown.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 16
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1
@ 20°C 100kHz
33μF
Vin+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 61. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
V
O
(
–
)
1uF
.
RESI STI V E
LO A D
SC O PE
COPPER STRIP
GROUND PLANE
10uF
Figure 62. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 63. Output Voltage and Efficiency Test Setup.
=
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance source. A highly inductive source impedance
can affect the stability of the power module. For the test
configuration in Figure 61, a 33μF electrolytic capacitor
(ESR<0.7 at 100kHz), mounted close to the power module
helps ensure the stability of the unit. Consult the factory for
further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be installed
in compliance with the spacing and separation
requirements of the end-use safety agency standard, i.e.,
UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE
0805:2001-12 (IEC60950-1).
If the input source is non-SELV (ELV or a hazardous voltage
greater than 60 Vdc and less than or equal to 75Vdc), for
the module’s output to be considered as meeting the
requirements for safety extra-low voltage (SELV), all of the
following must be true:
The input source is to be provided with reinforced insulation
from any other hazardous voltages, including the ac mains.
One VIN pin and one VOUT pin are to be grounded, or both the
input and output pins are to be kept floating.
The input pins of the module are not operator accessible.
Another SELV reliability test is conducted on the whole system
(combination of supply source and subject module), as
required by the safety agencies, to verify that under a single
fault, hazardous voltages do not appear at the module’s
output.
Note: Do not ground either of the input pins of the module
without grounding one of the output pins. This may
allow a non-SELV voltage to appear between the
output pins and ground.
The power module has extra-low voltage (ELV) outputs
when all inputs are ELV.
For input voltages exceeding –60 Vdc but less than or equal
to –75 Vdc, these converters have been evaluated to the
applicable requirements of BASIC INSULATION between
secondary DC MAINS DISTRIBUTION input (classified as
TNV-2 in Europe) and unearthed SELV outputs.
"All flammable materials used in the manufacturing of
these modules are rated 94V-0 and UL60950 A.2 for
reduced thicknesses.
The input to these units is to be provided with a maximum
3A fast-acting fuse in the unearthed lead."
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic turns
the module on during a logic high voltage on the ON/OFF
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 17
pin, and off during a logic low. Negative logic remote
On/Off, device code suffix “1”, turns the module off during a
logic high and on during a logic low.
To maintain compatibility with LW series power modules
the Remote On/Off pin is optional for the TH (through hole)
version. Standard TH modules have no On/Off pin fitted. TH
modules ordered with device code suffix “1” are negative
logic with the On/Off pin fitted.
ON/OFF
VIN
(
+
)
VIN
(
-
)
Ion/off
Von/off
VO
COM
Figure 64. Remote On/Off Implementation.
To turn the power module on and off, the user must supply
a switch (open collector or equivalent) to control the voltage
(Von/off) between the ON/OFF terminal and the VIN(-) terminal.
Logic low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a
logic low is 1mA, the switch should be maintain a logic low
level whilst sinking this current.
During a logic high, the typical Von/off generated by the
module is 5.8V, and the maximum allowable leakage
current at Von/off = 5.8V is 10μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Overcurrent Protection
To provide protection in a fault (output overload) condition,
the unit is equipped with internal current-limiting circuitry
and can endure current limiting continuously. At the point
of current-limit inception, the unit enters hiccup mode. The
unit operates normally once the output current is brought
back into its specified range. The average output current
during hiccup is 10% IO, max.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module will only
begin to operate once the input voltage is raised above the
undervoltage lockout turn-on threshold, VUV/ON.
Once operating, the module will continue to operate until
the input voltage is taken below the undervoltage turn-off
threshold, VUV/OFF.
Over Voltage Protection
The output overvoltage protection consists of circuitry that
internally clamps the output voltage. If a more accurate
output overvoltage protection scheme is required then this
should be implemented externally via use of the remote
on/off pin.
Over Temperature Protection
To provide protection in a fault condition, the unit is
equipped with a thermal shutdown circuit. The unit will
shutdown if the overtemperature threshold of 125 oC is
exceeded at the thermal reference point Tref . Once the unit
goes into thermal shutdown it will then wait to cool before
attempting to restart.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by connecting
an external resistor between the TRIM pin and either the
VO(+) pin or the VO(-) pin (COM pin) .
VO(+)
VOTRIM
COM
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figure 65. Circuit Configuration to Trim Output Voltage.
Connecting an external resistor (Rtrim-down) between the TRIM
pin and the COM pin decreases the output voltage set point.
To maintain set point accuracy, the trim resistor tolerance
should be ±0.1%.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 18
Feature Descriptions (continued)
The relationship between the output voltage and the trim
resistor value for a ∆% reduction in output voltage is:
Nominal 5V, 3.3V, 2.5V, 2.0V, 1.8V, & 1.5V modules:
Nominal 1.2V module:
Nominal 1.0V module:
Connecting an external resistor (Rtrim-up) between the TRIM
pin and the VO(+) pin increases the output voltage set point.
To maintain set point accuracy, the trim resistor tolerance
should be ±0.5%.
The relationship between the output voltage and the trim
resistor value for a ∆% increase in output voltage is:
Nominal 5V, 3.3V, 2.5V, 2.0V, 1.8V, & 1.5V modules:
Nominal 1.2V module:
Nominal 1.0V module:
(VO refers to the nominal output voltage, i.e. 5.0V for VO on
an HW004A0A. ∆% is the required % change in output
voltage, i.e. to trim a 5.0V module to 5.10V the ∆% value is
2).
Examples:
To trim down the output of a nominal 5.0V module
(HW004A0A) to 4.90V
∆% = 2
Rtrim-down = 249.39 k
To trim up the output of a nominal 3.3V module
(HW005A0F) to 3.63V
∆% = 10
Rtrim-up =94.2 k
Rtrim-down = - 6.11 k
511
%
Rtrim-down = - 4.46 k
346
%
Rtrim-down = - 4.90 k
390
%
Rtrim-up = - - 6.11 k
5.11VO(100+%)
1.225%
511
%
Rtrim-up = - - 4.46 k
5.11VO(100+%)
1.225%
346
%
Rtrim-up = - - 6.11 k
5.11x3.3(100+10)
1.225x10
511
Rtrim-down = - 6.11 k
511
Rtrim-up = - - 4.90 k
5.11VO(100+%)
1.225%
390
%
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 19
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The thermal
data presented here is based on physical measurements
taken in a wind tunnel.
The thermal reference point, Tref used in the specifications
is shown in Figure 66. For reliable operation this
temperature should not exceed 115 oC.
Figure 66. Tref Temperature Measurement Location.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-Mounted
Power Modules” for a detailed discussion of thermal
aspects including maximum device temperatures.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating figures showing the
maximum output current that can be delivered by each
module versus local ambient temperature (TA) for natural
convection and up to 3m/s (600 ft./min) are shown in the
respective Characteristics Curves section.
EMC Considerations
The figure 67 shows a suggested configuration to meet the
conducted emission limits of EN55022 Class B.
Vin+
HW005
Vin-
Vout+
Vout-
L1 - CMC
C6 56nF
C5 56nF
C1
0.68uF
C4
33uF
100V
C2
0.68uF
Pulse P0354
C3
0.68uF
L2
10uH
Figure 67. Suggested Configuration for EN55022 Class
B.
100K 500K 1M 5M 10M 30M
Frequency(Hz)
10
20
30
40
50
60
70
80
90
Level (dBµV)
EN 55022 Class B Conducted Average dBuV
Figure 68. EMC signature using above filter, HW005A0F.
For further information on designing for EMC compliance,
please refer to the FLTR100V10 data sheet (FDS01-043EPS).
Layout Considerations
The HW/HC005 power module series are low profile in order
to be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the
power module. Also avoid placing via interconnects
underneath the power module.
For additional layout guide-lines, refer to FLTR100V10 data
sheet.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 20
Mechanical Outline for HW/HC Surface-Mount Module
Dimensions are in millimeters and (inches).
Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated]
x.xx mm 0.25 mm (x.xxx in 0.010 in.)
Top View
47.2
(1.860)
(1.162)
29.5
Side View
8.50
(0.335)
MAX
height
min stand-off
(0.100)
2.54
0.5
(.020)
max
compliance
Bottom View
40.00
(1.576)
(0.394)
(1.031)
(0.065) (0.197)
(0.143) (1.379)
1.65
3.63
1239
11
1718
PIN 3
OPTIONAL
35.00
5.00
26.16
10.00
Pin Function
1 Vout +
2 Vout -
3 Standard = No Pin
Optional = Vout +
9 Trim
11 On/Of
f
17 Vin -
18 Vin +
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 21
Mechanical Outline for HW/HC Through Hole Module
Dimensions are in millimeters and (inches).
Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated]
x.xx mm 0.25 mm (x.xxx in 0.010 in.)
Top View
47.2
(1.860)
(1.162)
29.5
Side View
1.05
0.99
(0.041)
(0.039)
9.0
(0.35)
MIN
8.50
(0.335)
MAX
Bottom View
1.65
3.63
129
11
1718
35.00
5.00
26.16
40.00
(1.576)
(1.031)
(0.065) (0.197)
(0.143) (1.379)
Pin Function
1 Vout +
2 Vout -
9 Trim
11 On/Of
f
17 Vin -
18 Vin +
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 22
Recommended Pad Layout for Surface Mount and Through Hole Module
Dimensions are in millimeters and (inches).
Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [unless otherwise indicated]
x.xx mm 0.25 mm (x.xxx in 0.010 in.)
47.2
29.5
18 17 11
9
3
2
1
1.65
3.63
10.00
26.16
IN 7 POSITIONS
PAD Ø 2.8mm
40.00
(1.860)
(1.576)
(1.379)
(0.394)
(0.197)
(0.143)
(0.065)
(1.162)
(1.031)
5.00
35.00
Pin Function
1 Vout +
2 Vout -
3 Standard = No Pin
Optional = Vout +
9 Trim
11 On/Of
f
17 Vin -
18 Vin +
Surface Mount Pad Layout –
Component side view
47.2
29.5
18 17 11
9
2
1
1.65
3.63
26.16
IN 6 POSITIONS
40.00
(1.860)
(1.576)
(1.379)
(0.197)
(0.143)
(0.065)
(1.162)
(1.031)
5.00
35.00
PAD Ø4.0mm
HOLE Ø1.5mm
INSULATIVE
SPACER IN 3
POSITIONS
Pin Function
1 Vout +
2 Vout -
9 Trim
11 On/Of
f
17 Vin -
18 Vin +
Through-Hole Pad Layout –
Component side view
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 23
Packaging Details
The surface mount versions of the HW005 family are also available in tape & reel (suffix –SR) as an option. Detailed of tape
dimensions are shown below. Modules are shipped in quantities of 115 per reel.
Tape Dimensions
Dimensions are in millimeters and (inches).
40.00
(1.575)
4.00
(0.157)
(1.346)
34.20
PICK POINT
(2.692)
68.40
FEED
DIRECTION (2.834)
72.00
9.02
(0.355)
TOP COVER TAPE EMBOSSED CARRIER
NOTE: CONFORMS TO EAI-481 REV. A STANDARD
(2.692)
66.50
Reel Dimensions
Outside diameter: 330.2 mm (13.00”)
Inside diameter: 177.8 mm (7.00”)
Tape Width: 72.00 mm (2.834”)
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 24
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes. A
maximum preheat rate of 3C/s is suggested. The wave
preheat process should be such that the temperature of
the power module board is kept below 210C. For Pb
solder, the recommended pot temperature is 260C,
while the Pb-free solder pot is 270C max. Not all RoHS-
compliant through-hole products can be processed with
paste-through-hole Pb or Pb-free reflow process. If
additional information is needed, please consult with
your GE representative for more details.
Surface Mount Information
Packaging Details
The surface mount versions of the HW005 family (suffix –
S) are supplied as standard in the plastic tray shown in
Figure 69. The tray has external dimensions of
135.1mm (W) x 321.8mm (L) x 12.4mm (H) or 5.319in (W) x
12.669in (L) x 0.489in (H).
Surface mount versions of the HW005 family are also
available as an option packaged in Tape and Reel. For
further information on this please contact your local GE
Technical Sales Representative.
Figure 69. Surface Mount Packaging Tray
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012/sq
Color Clear
Capacity 15 power modules
Min order quantity 60 pcs (1 box of 4 full trays)
Each tray contains a total of 15 power modules. The
trays are self-stacking and each shipping box will
contain 4 full trays plus one empty hold down tray giving
a total number of 60 power modules.
Pick and Place
The HW005-S series of DC-to-DC power converters use
an open-frame construction and are designed for
surface mount assembly within a fully automated
manufacturing process.
The HW005-S series modules are fitted with a Kapton
label designed to provide a large flat surface for pick and
placing. The label is located covering the Centre of
Gravity of the power module. The label meets all the
requirements for surface-mount processing, as well as
meeting UL safety agency standards. The label will
withstand reflow temperatures up to 300C. The label
also carries product information such as product code,
date and location of manufacture.
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 25
Surface Mount Information (continued)
24.2
14.7
COG
9.519.0
12.7
8.0
Note: All dimensions in mm.
Figure 70. Pick and Place Location.
Z Plane Height
The ‘Z’ plane height of the pick and place location is
7.50mm nominal with an RSS tolerance of +/-0.25 mm.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, they have a
relatively large mass when compared with conventional
SMT components. Variables such as nozzle size, tip style,
vacuum pressure and placement speed should be
considered to optimize this process.
The minimum recommended nozzle diameter for reliable
operation is 6mm. The maximum nozzle outer diameter,
which will safely fit within the allowable component
spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
For further information please contact your local GE
Technical Sales Representative.
Reflow Soldering Information
The HW005 family of power modules is available for
either Through-Hole (TH) or Surface Mount (SMT)
soldering. These power modules are large mass, low
thermal resistance devices and typically heat up slower
than other SMT components. It is recommended that
the customer review data sheets in order to customize
the solder reflow profile for each application board
assembly.
The following instructions must be observed when SMT
soldering these units. Failure to observe these
instructions may result in the failure of or cause damage
to the modules, and can adversely affect long-term
reliability.
The surface mountable modules in the HW005 family
use our newest SMT technology called “Column Pin” (CP)
connectors. Fig 71 shows the new CP connector before
and after reflow soldering onto the end-board assembly.
HW005 Board
Insulator
Solder Ball
End assembly PCB
Figure 71. Column Pin Connector Before and After
Reflow Soldering.
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn/Pb) solder. The CP connector design is able
to compensate for large amounts of co-planarity and
still ensure a reliable SMT solder joint.
Typically, the eutectic solder melts at 183oC, wets the
land, and subsequently wicks the device connection.
Sufficient time must be allowed to fuse the plating on the
connection to ensure a reliable solder joint. There are
several types of SMT reflow technologies currently used
in the industry. These surface mount power modules
can be reliably soldered using natural forced convection,
IR (radiant infrared), or a combination of convection/IR.
For reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
REFLOW TEMP (C)
0
50
10 0
15 0
200
250
300
Preheat zone
max 4
o
Cs
-1
Soak zone
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Cooling
zo ne
1- 4
o
Cs
-1
Tlim above
205oC
REFLOW TIME (S)
Figure 72. Recommended Reflow Profile
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 26
Surface Mount Information (continued)
MAX TEMP SOLDER (C)
200
205
210
215
220
225
230
235
240
0 102030405060
TIME LIMIT (S)
Figure 73. Time Limit Curve Above 205oC Reflow .
Lead Free Soldering
The –Z version SMT modules of the HW/HC series are
lead-free (Pb-free) and RoHS compliant and are
compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the failure
of or cause damage to the modules and can adversely
affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for both
Pb-free solder profiles and MSL classification procedures.
This standard provides a recommended forced-air-
convection reflow profile based on the volume and
thickness of the package (table 4-2). The suggested Pb-
free solder paste is Sn/Ag/Cu (SAC). The recommended
linear reflow profile using Sn/Ag/Cu solder is shown in
Figure. 74.
MSL Rating
The HW/HC series SMT modules have a MSL rating of 2A.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow Sensitive
Surface Mount Devices). Moisture barrier bags (MBB)
with desiccant are required for MSL ratings of 2 or
greater. These sealed packages should not be broken
until time of use. Once the original package is broken,
the floor life of the product at conditions of 30°C and
60% relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed SMT
packages will be a minimum of 12 months from the bag
seal date, when stored at the following conditions: < 40°
C, < 90% relative humidity.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect both
the reliability of a power module and the testability of
the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to GE Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
Pe r J-STD-020 Re v. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Heating Zone
1°C/Second
Pe ak Temp 260°C
* Min. Time Above 235°C
15 Seco nds
*Time Above 217°C
60 Sec o nds
Cooling
Zone
Figure 74. Recommended linear reflow profile using
Sn/Ag/Cu solder.
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will
meet the solder ball requirements per J-STD-001B. These
requirements state that solder balls must neither be
loose nor violate the power module minimum electrical
spacing.
The cleanliness designator of the open frame power
module is C00 (per J specification).
GE Data Sheet
HW006/010/012 Series Power Modules; dc-dc Converters
36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A
Contact Us
For more information, call us at
USA/Canada:
+1 877 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
www.gecriticalpower.com
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no
liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such
product(s) or information.
October 2, 2015 ©2012 General Electric Company. All International rights reserved. Version 1.22
Ordering Information
Please contact your GE Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Input Voltage Output
Voltage
Output
Current Efficiency Connector
Type Device Code Comcodes
36 – 75 Vdc 3.3V 10A Through-Hole HW010A0F1 108967985
36 – 75 Vdc 3.3V 10A Through-Hole HW010A0F1Z CC109107141
36 – 75 Vdc 3.3V 10A Through-Hole HW010A0F1-43Z 150035318
36 – 75 Vdc 5.0V 6.6A Through-Hole HW006A6A1 108968355
36 – 75 Vdc 5.0V 6.6A Through-Hole HW006A6A1Z CC109107133
36 – 75 Vdc 1.2V 12A SMT HW012A0Y1-S 108968405
36 – 75 Vdc 2.5V 10A SMT HW010A0G1-S 108968421
36 – 75 Vdc 2.5V 5A SMT HW010A0G1-SZ CC109113602
36 – 75 Vdc 3.3V 10A SMT HW010A0F1-S 108965625
36 – 75 Vdc 3.3V 10A SMT HW010A0F1-SZ 108995214
36 – 75 Vdc 3.3V 10A SMT HW010A0F1-SR 108997656
36 – 75 Vdc 3.3V 10A SMT (tape & reel) HW010A0F1-SRZ CC109107158
36 – 75 Vdc 3.3V 10A SMT (tape & reel) HW010A0F1-55SR CC109124822
36 – 75 Vdc 5.0V 6.6A SMT HW006A6A-S CC109142155
36 – 75 Vdc 5.0V 6.6A SMT HW006A6A1-S 108968363
36 – 75 Vdc 5.0V 6.6A SMT HW006A6A1-SZ 109100352
Table 2. Device Options
Option Suffix
Negative remote on/off logic 1
Customer specific -43
Customer specific -55
Tape & Reel -R
Surface mount connections -S
RoHS Compliant -Z
* Please contact GE for availability of these options, samples, minimum order quantity and lead times
