Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200835B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 19, 2008 1
ADVANCE DATA SHEET
SKY77185 Power Amplifier Module for WCDMA / HSDPA
(1920–1980 MHz)
Applications
• WCDMA handsets
• HSDPA
Features
• Low voltage positive bias
supply
- 3.2 V to 4.2 V
• Good linearity
• High efficiency
- 40% @ 26.5 dBm
• Large dynamic range
• 10-pad package
- 3 x 3 x 0.85 mm
• Power down control
• InGaP
• Supports low collector
voltage operation
• Digital Enable
• No VREF required
• CMOS compatible control
signals
The SKY77185 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount module
developed for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficient
module packs full 1920–1980 MHz bandwidth coverage into a single compact package. Because of
high efficiencies attained throughout the entire power range, the SKY77185 delivers unsurpassed
talk-time advantages. The SKY77185 meets the stringent spectral linearity requirements of High
Speed Downlink Packet Access (HSDPA) data transmission with high power added efficiency. A
directional coupler is integrated into the module thus eliminating the need for any external coupler.
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active
circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage
matching circuits. Output match into a 50-ohm load is realized off-chip within the module package to
optimize efficiency and power performance.
The SKY77185 PAM is manufactured with Skyworks’ InGaP GaAs Heterojunction Bipolar Transistor
(HBT) BiFET process that provides for all positive voltage DC supply operation while maintaining high
efficiency and good linearity. Primary bias to the SKY77185 is supplied directly from any three-cell
Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range. No
VREF voltage is required. Power down is accomplished by setting the voltage on VENABLE to zero
volts. No external supply side switch is needed as typical “off” leakage is a few microamperes with
full primary voltage supplied from the battery.
Figure 1. Functional Block Diagram
ADVANCE DATA SHEET SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA
(1920–1980 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
2 May 19, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200835B
Electrical Specifications
The following tables list the electrical characteristics of the
SKY77185 Power Amplifier. Table 1 lists the absolute maximum
ratings, while Table 2 shows the recommended operating
conditions to achieve WCDMA and HSDPA performance
characteristics listed in Table 4. Table 3 presents a truth table for
the power settings.
Table 1. Absolute Maximum Ratings 1
Parameter Symbol Minimum Nominal Maximum Unit
RF Input Power PIN — 0 10 dBm
Supply Voltage VCC1, VCC2 — 3.4 6.0 Volts
Control Voltage VEN
VMODE_0
VMODE_1
— 1.8 4.2 Volts
Operating TC –30 25 +110 Case Temperature 2
Storage TSTG –55 — +125
°C
1 No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value.
2 Case Operating Temperature (TC) refers to the temperature of the GROUND PAD at the underside of the package.
Table 2. Recommended Operating Conditions
Parameter Symbol Minimum Nominal Maximum Unit
Linear Power Output PO — — 26.5
Maximum Power Output PO — — 28.0
dBm
Operating Frequency FO 1920.0 1950.0 1980.0 MHz
Supply Voltage VCC1, VCC2 3.2 1 3.4 4.2 Volts
Low VEN_L 0.0 — 0.5 Enable Control Voltage
High VEN_H 1.35 — 3.1
Volts
Low VMODE_0
VMODE_1
0.0 — 0.5
Control Voltage
High VMODE_0
VMODE_1
1.35 — 3.1
Volts
Case Operating Temperature TC –30 +25 +85 °C
1 Recommended minimum VCC for maximum power output is indicated. VCC2 down to 0.5 V may be used for backed-off power when using DC/DC converter to conserve battery current.
Table 3. Modes of Operation
Power Setting ENABLE VMODE_0 VMODE_1 VCC
Power Down Low Low Low On
Standby Mode Low X X On
High-Power Mode (17.0 dBm ≤ POUT ≤ 26.5 dBm High Low Low On
Medium-Power Mode (7.0 dBm ≤ POUT ≤ 17.0 dBm) High High Low On
Low-Power Mode (POUT ≤ 7.0 dBm) High High High On
Optional Lower VCC in Low-Power Mode (POUT ≤ 7.0 dBm) High Low Low 1.5 V
Note: Two pads are available for PA control that allow for a total of four states.
SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA ADVANCE DATA SHEET
(1920–1980 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200835B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 19, 2008 3
Table 4. Electrical Specifications for Nominal Operating Conditions 1
Characteristics Symbol Condition Minimum Typical Maximum Unit
GLOW PO = 0 dBm — TBD —
GMID PO = 17.0 dBm — 20 —
Gain Conditions
GHIGH PO = 26.5 dBm — 27 —
dB
PAELOW PO = 0 dBm — TBD —
PAEMID PO = 17.0 dBm — 20 —
Power Added Efficiency
PAEHIGH PO = 26.5 dBm — 40 —
%
ICC_LOW PO = 0 dBm — TBD —
ICC_MID PO = 17.0 dBm — 55 —
Total Supply Current
ICC_HIGH PO = 26.5 dBm — 330 —
mA
IQ_MID Medium Power Mode — 25 — Quiescent Current
IQ_HIGH High Power Mode — 90 —
mA
Enable Current IEN — — — 1.0 mA
Total Supply Current in Power-down Mode IPD VCC = 3.4 V
VEN = Low
— — 20 μA
PO = 0 dBm — –42 –34
PO = 17.0 dBm — –46 –34
5 MHz offset ACLR5
PO = 26.5 dBm — –40 –34
PO = 0 dBm — –65 –44
PO = 17.0 dBm — –60 –44
Adjacent Channel Leakage power Ratio 2
10 MHz offset ACLR10
PO = 26.5 dBm — –55 –44
dBc
Second f02 — –45 –30 Harmonic Suppression
Third f03
PO ≤ 26.5 dBm
— –35 –30
dBc
Noise Power in RX Band 2110-2170 MHz RxBN PO ≤ 26.5 dBm — –140 –138 dBm/Hz
Input Voltage Standing Wave Ratio (VSWR) VSWR — — 1.5:1 2.5:1 —
Coupling Factor P_CPL PO = 26.5 dBm — 17 — dB
Stability (Spurious output) S 5:1 VSWR All phases — — –70 dBc
Ruggedness 3 Ru PO ≤ 28.0 dBm 10:1 — — VSWR
1 Unless specified otherwise: VCC = +3.4 V, Temp = +25 °C; Freq. = 1950 MHz for Voice and HSDPA.
2 ACLR is expressed as a ratio of total adjacent power to WCDMA modulated in-band, both measured in 3.84 MHz bandwidth at specified offsets.
3 All phases, time = 10 seconds.
ADVANCE DATA SHEET SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA
(1920–1980 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
4 May 19, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200835B
Table 5. Modulation
STC1 = General Test Conditions (Voice)
Modulation HPSK modulated carrier in 3.8 MHz BW
UL ref. meas. Chan. (12.2 kbps) from 3GPP TS 25.101 Annex A sec. A.2.1.
1 DPCCH @ 15 ksps, Spread Code = 0, Relative Power = –6.547 dB
1 DPDCH @ 60 ksps, Spread Code = 16, Relative Power = –1.087 dB.
Pulse Rate CW testing (not pulsed).
Input Power Adjusted to meet output power requirement.
STC2 = General Test Conditions (HSDPA)
Modulation HPSK modulated carrier in 3.8 MHz BW
1 DPCCH @ 15 ksps, Spread Code = 0, Relative Power = –7.095 dB
1 DPCCH @ 60 ksps, Spread Code = 16 Relative Power = –5.157 dB
1 DPDCH @ 15 ksps, Spread Code = 64, Relative Power = –3.012 dB.
Pulse Rate CW testing (not pulsed).
Input Power Adjusted to meet output power requirement.
NOTES:
Measure the power in the 99% bandwidth channel for the ULTRA/FDD UL reference with a root-raised cosine (RRC) filter response of alpha 0.22 and a bandwidth of 3.84 MHz.
Measure emission power at ±X MHz offset, P±x MHz, in a Y kHz bandwidth with a root-raised cosine (RRC) filter response of alpha 0.22 and a bandwidth of 3.84 MHz.
Efficiency and idle current numbers include current consumption of any control voltages like VEN, VMODE_0 and VMODE_1.
SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA ADVANCE DATA SHEET
(1920–1980 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200835B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 19, 2008 5
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
SKY77185, the evaluation board schematic and assembly
diagrams are included for preliminary analysis and design.
Figure 2 shows the basic schematic of the board for the 1920
MHz to 1980 MHz range.
Figure 2. Evaluation Board Schematic
ADVANCE DATA SHEET SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA
(1920–1980 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
6 May 19, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200835B
Figure 3. Evaluation Board Assembly Diagram
SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA ADVANCE DATA SHEET
(1920–1980 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200835B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 19, 2008 7
Package Dimensions
The SKY77185 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board. Figure 4 is a mechanical
drawing of the pad layout for this package. Figure 5 provides a
recommended phone board layout footprint for the PAM to help
the designer attain optimum thermal conductivity, good
grounding, and minimum RF discontinuity for the 50-ohm
terminals.
Figure 4. Dimensional Diagram for 3 mm x 3 mm x 0.85 mm Package – SKY77185
PRELIMINARY DATA SHEET SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA
(1920–1980 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
8 May 19, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200835B
Figure 5. Phone PCB Layout Diagram – 3 mm x 3 mm x 0.85 mm Package – SKY77185
SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA ADVANCE DATA SHEET
(1920–1980 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
200835B • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • May 19, 2008 9
Package Description
Figure 6 shows the pad functions and the pad numbering
convention, which starts with pad 1 in the upper left and
increments counter-clockwise around the package. Typical case
markings are illustrated in Figure 7.
Figure 6. SKY77185 Pad Names and Configuration (Top View)
Figure 7. Typical Case Markings
Package Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SKY77185 is capable of withstanding an MSL3/260 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 3 °C per second; maximum temperature
should not exceed 260 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 260 °C for more than 10 seconds. For
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD-020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information – RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
The ESD testing was performed in compliance with MIL-STD-
883E Method 3015.7 using the Human Body Model. If ESD
damage threshold magnitude is found to consistently exceed
2000 volts on a given pad, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards,
which fail devices only after “the pad fails the electrical
specification limits” or “the pad becomes completely non-
functional”. Skyworks employs most stringent criteria and fails
devices as soon as the pad begins to show any degradation on a
curve tracer.
PRELIMINARY DATA SHEET SKY77185 POWER AMPLIFIER MODULE FOR WCDMA / HSDPA
(1920–1980 MHz)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
10 May 19, 2008 • Skyworks Proprietary and Confidential Information. • Products and product information are subject to change without notice. • 200835B
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas follow the Class 1 ESD
handling precautions listed below.
• Personnel Grounding • Facility
- Wrist Straps - Relative Humidity Control and Air Ionizers
- Conductive Smocks, Gloves and Finger Cots - Dissipative Floors (less than 109 Ω to GND)
- Antistatic ID Badges
• Protective Workstation • Protective Packaging and Transportation
- Dissipative Table Top - Bags and Pouches (Faraday Shield)
- Protective Test Equipment (Properly Grounded) - Protective Tote Boxes (Conductive Static Shielding)
- Grounded Tip Soldering Irons - Protective Trays
- Solder Conductive Suckers - Grounded Carts
- Static Sensors - Protective Work Order Holders
Ordering Information
Model Number Manufacturing Part Number Product Revision Package Operating Temperature
SKY77185 SKY77185 MCM 3 x 3 x 0.85 mm –30 °C to +85 °C
Revision History
Revision Date Description
A February 28, 2008 Initial Release – Preliminary Information
B May 19, 2008 Revise: Tables 1–5; Figures 1–6
Add: Skyworks Green tag (p1)
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.
Application Note: Tape and Reel Information – RF Modules, Document Number 101568
Standard SMT Reflow Profiles: JEDEC Standard J–STD–020
Copyright © 2008, Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products. These materials are provided by Skyworks as a service to its customers and may be
used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials. Skyworks may make changes to its documentation, products,
specifications and product descriptions at any time, without notice. Skyworks makes no commitment to update the information and shall have no responsibility whatsoever for conflicts,
incompatibilities, or other difficulties arising from future changes to its documentation, products, specifications and product descriptions.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by or under this document. Except as may be provided in Skyworks’ Terms and Conditions of
Sale for such products, Skyworks assumes no liability whatsoever in association with its documentation, products, specifications and product descriptions.
THESE MATERIALS ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED OR OTHERWISE, RELATING TO SALE AND/OR USE OF SKYWORKS PRODUCTS
INCLUDING WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT. SKYWORKS FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST
REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THESE MATERIALS WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH
DAMAGE.
Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications. Skyworks’ customers using or selling Skyworks products for use in such applications do so at their
own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.
The following are trademarks of Skyworks Solutions, Inc.: Skyworks®, the Skyworks logo®, and Breakthrough Simplicity®. Product names or services listed in this publication are for identification
purposes only, and may be trademarks of Skyworks or other third parties. Third-party brands and names are the property of their respective owners. Additional information, posted at
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